CN203466190U - COB light source based on light conversion body - Google Patents
COB light source based on light conversion body Download PDFInfo
- Publication number
- CN203466190U CN203466190U CN201320531654.8U CN201320531654U CN203466190U CN 203466190 U CN203466190 U CN 203466190U CN 201320531654 U CN201320531654 U CN 201320531654U CN 203466190 U CN203466190 U CN 203466190U
- Authority
- CN
- China
- Prior art keywords
- conversion body
- light conversion
- light source
- cob
- source based
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
A COB light source based on a light conversion body comprises an LED support, a plurality of LED chips located in the LED support, and the light conversion body installed on the LED support. The COB light source is characterized in that: the light conversion body comprises two layers of efficient light-transmission pieces which are respectively located at an upper part and a lower part of the light conversion body, and a Phosphor layer which is located between the two efficient light-transmission pieces. A remote fluorescent power excitation technology is employed, the temperature is lowered to a certain extent, and direct contact with a high-temperature chip is avoided; the Phosphor layer is prevented from contact with air, moisture and the like, oxidation, hydrolysis and other reactions in high temperature and other processes are prevented, so attenuation of phosphor and chromaticity drift are reduced; and photoelectric color discreteness between the chips and discreteness of chip fluorescent coating can also be reduced due to light mixing, so light color is more uniform and comfortable.
Description
Technical field
The utility model relates to a kind of LED lighting device, relates in particular to a kind of COB light source based on light conversion body.
Background technology
LED(Light Emitting Diode, be called for short LED, Chinese light-emitting diode by name) lamp be called as the 4th generation lighting source or green light source, have that energy-saving and environmental protection, volume are little, reliability high, be widely used in the fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape.Along with improving constantly of the integral level of LED wafer, the whole light efficiency of LED lamp constantly promotes, and makes the continuous expanded of application of its lighting field.
At present, LED illumination market still be take COB integrated optical source as main, and the making of COB integrated optical source trend is that power is done height, and volume is done little, and light efficiency also needs relative raising with aobvious finger simultaneously.But at present there is following problem in COB multichip LED encapsulation structure: 1, because the luminous intensity of each angle of LED chip is different, two phosphor gel are directly filled and made the fluorescent material concentration of each angle inconsistent and have a hot spot; 2, owing to directly pouring into phosphor gel, make the excessive luminous flux that causes of phosphor gel thickness not high; 3, because fluorescent material is directly contaminated with extraneous contact; 4, fluorescent material, under high temperature aerobic environment, produces the phenomenon of decay and colourity drift.Therefore, be necessary to propose a kind of new COB light source that can address the above problem.
The purpose of this utility model is, proposes a kind of light extraction efficiency strong, and bright dipping is even, and can prevent from reducing the decay of fluorescent material and the COB light source that colourity is drifted about.
Summary of the invention
The purpose of this utility model is, proposes a kind of light extraction efficiency strong, and bright dipping is even, and can reduce the COB light source of decay and the colourity drift of fluorescent material.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A COB light source based on light conversion body, comprising:
A COB light source based on light conversion body, comprising: a LED support, and several are positioned at the LED chip of described LED support inside, a light conversion body that is installed on described LED support top; It is characterized in that, described light conversion body comprises two-layer high effective transparent sheet and the phosphor powder layer between two-layer high effective transparent sheet that lays respectively at light conversion body top and bottom.
Preferably, on described LED support, be also provided with the box dam around described LED chip, described box dam carrying light conversion body.
Preferably, described described LED support also arranges a plastic frame, and a fixed frame matching with described plastic frame.
Preferably, also comprise the transparent encapsulating body being filled between described LED support and light conversion body.
Preferably, described transparent encapsulating body carrying light conversion body.
Preferably, described LED support comprises metal substrate or ceramic substrate.
Preferably, described high effective transparent sheet is sheet glass.
Preferably, the thickness of described phosphor powder layer is less than 0.1mm.
Preferably, the side of described light conversion body plating layer of transparent film.
Compared with prior art, the utlity model has following advantage:
(1) eliminate hot spot: a kind of COB light source based on light conversion body that the utility model provides, phosphor powder layer in sandwich structure, consistency of thickness everywhere; Eliminated in traditional C OB light source, fluorescent glue is directly filled in COB device, and the variable thickness of fluorescent material everywhere causes, and the hot spot phenomenon existing.
(2) light extraction efficiency: a kind of COB light source based on light conversion body that the utility model provides, can effectively control the thickness of phosphor powder layer, avoided traditional C OB light source directly the fluorescent glue that contains fluorescent material to be poured in to COB device inside, make phosphor gel thickness excessive, cause luminous flux not strong.
(3) stability of fluorescent material: a kind of COB light source based on light conversion body that the utility model provides, used the light conversion body of sandwich structure, and fluorescent material is sealed in sandwich structure, reduce to a certain extent temperature, avoid directly contacting with the chip of high temperature; And can avoid phosphor powder layer to contact with air, moisture etc., prevent the reactions such as oxidation in the processes such as high temperature, hydrolysis, thereby reduce decay and the colourity drift of fluorescent material.
(4) remote excitation fluorescent material: a kind of COB light source based on light conversion body that the utility model provides, used remote excitation fluorescent material, prevent that fluorescent material is subject to the impact of the heat that LED chip sends, cause the aging relaxation phenomenon of fluorescent material under high-temperature condition, also can reduce the photoelectric color discreteness of chip chamber and the discreteness that chip fluorescence applies because of mixed light simultaneously, thereby make photochromic more evenly comfortable.
(5) cost-saving: a kind of COB light source based on light conversion body that the utility model provides, adopt ceramics bracket, simplified the production technology of LED support, reduced cost.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the COB light source based on light conversion body of the utility model embodiment mono-;
Fig. 2 is the structural representation that the COB light source based on light conversion body of the utility model embodiment mono-is not installed light conversion body;
Fig. 3 is the cross-sectional view of the COB light source based on light conversion body of the utility model embodiment bis-.
Embodiment
For making the technical solution of the utility model clearer, below by specific embodiment, the utility model is elaborated.
Below the structure of 1 to Fig. 3 a kind of COB light source based on light conversion body that the utility model is provided is with reference to the accompanying drawings described in detail.
embodiment mono-
As shown in Figure 1, a kind of COB light source based on light conversion body that the present embodiment provides, comprising: a LED support 1, several are positioned at the LED chip 2 on LED support 1 surface, and a light conversion body 3 that is installed on described support 1 top.
Wherein, described smooth conversion body 3 is sandwich structure, and skin is high effective transparent material 31, and intermediate course is phosphor powder layer 32, and phosphor powder layer 32 is sealed in sandwich structure.In the present embodiment, described smooth conversion body 3 comprises two-layer high effective transparent sheet and the phosphor powder layer between two-layer high effective transparent sheet that lays respectively at light conversion body top and bottom.
Described LED support 1 is metal substrate, and this metal substrate comprises chip mount portion 14 that at least one is arranged to blind hole structure and around the box dam 13 of chip mount portion.Wherein, the bottom of chip mount portion is metal level 11, in order to direct carrying LED chip 2; The upper surface of described metal substrate is provided with line layer 12.
In other embodiments, described support can be also ceramic substrate, is not limited to the present embodiment.
As illustrated in fig. 1 and 2, the material that described box dam 13 is used is silica gel.Its profile is circular, square or other are regular or irregular figure, and in the present embodiment, described box dam 13 be circle.
The shape of described smooth conversion body 3 is consistent with described box dam 13, is circle, and the radius of light conversion body 3 equates with described box dam 13 outer radius.Described light conversion body 3 is placed on described box dam 13, and described box dam 13 can support described smooth conversion body 3, by bonding mode by being tightly connected between light conversion body 3 and box dam 13.
Described smooth conversion body 3 is sandwich structure, and skin is high effective transparent material 31, and in the present embodiment, described high effective transparent material is sheet glass; Described phosphor powder layer is clipped between two blocks of sheet glass, forms sandwich structure, and due to phosphor powder layer consistency of thickness everywhere, and its thickness is less than 0.1mm; To reduce the total reflection light loss problem between sandwich construction.So can effectively eliminate in conventional package technique and directly fluorescent glue is filled in to the hot spot problem causing in COB device.
In the present embodiment, between fluorescent material and LED chip, there is certain distance, realized remote excitation fluorescent material, reduced the impact that fluorescent material is subject to the heat that LED chip sends, cause the aging light decay phenomenon of fluorescent material.Fluorescent material in described phosphor powder layer is nano-phosphor, and can effectively control the thickness of phosphor powder layer, has improved the light extraction efficiency of COB light source; Avoid traditional C OB light source directly the fluorescent glue that contains fluorescent material to be poured in to COB device inside, made fluorescent glue thickness excessive, caused luminous flux not strong.
Further, by high-temperature calcination or in described light conversion body side, plate layer of transparent film (not indicating), phosphor powder layer 32 is sealed in sandwich structure, protected the stability of fluorescent material in high temperature aerobic environment.
In other embodiments, between LED support and light conversion body, be also filled with transparent encapsulating body; Specifically, between light conversion body and substrate, except laying LED chip, other parts are all filled the transparent encapsulating body of refractive index between 1.4-1.6, are not limited to the present embodiment.Because the refractive index difference between air and LED chip surface or glass is larger, therefore fill the comparatively approaching transparent encapsulating body of refractive index and glass or LED chip surface refractive index in the middle of adopting, be used for reducing the total reflection of COB device, improve the light extraction efficiency of COB device.In the present embodiment, described transparent encapsulating body is epoxy resin or silica gel.
embodiment bis-
A kind of COB light source based on light conversion body described in the present embodiment is similar to embodiment mono-, and distinctive points is:
As shown in Figure 3, described box dam is a plastic frame 16, and at described plastic frame 16, at least two fixing holes 161 are set, in the present embodiment, described plastic frame is square, described plastic frame contains external diameter and internal diameter, and described fixing hole quantity is four, is separately positioned on four angles of described plastic frame.
Described COB light source also comprises a fixed frame 4 matching with described plastic frame 16, and described fixed frame contains external diameter and internal diameter, for the light conversion body 3 that is positioned at described plastic frame 16 upper surfaces is fixing.
Concrete, the shape of the shape of described smooth conversion body 3 and described plastic frame 16 matches, it is the external diameter that the bore of described smooth conversion body is less than described plastic frame and fixed frame, be greater than the internal diameter of described plastic frame and fixed frame, therefore described light conversion body can be placed on to described plastic frame 16 upper surfaces.Further, described fixed frame 4 profiles and described plastic frame 16 match, on four angles of described fixed frame 4, be provided with the protuberance 41 matching with described fixing hole, described protuberance 41 is inserted to described fixing hole 161 and can complete the combination of described plastic frame 16 and fixed frame 4, thereby described smooth conversion body 3 is fixed between the two.
In other embodiments, between LED support and light conversion body, be also filled with transparent encapsulating body; Specifically, between described smooth conversion body and substrate except laying LED chip, other parts are all filled the transparent encapsulating body of refractive index between 1.4-1.6, the bore of described smooth conversion body is less than the internal diameter of described plastic frame, be greater than the internal diameter of described fixed frame, by described transparent encapsulating body, as supporting body, described light conversion body is supported on to described LED chip top, is not limited to the present embodiment.
A kind of COB light source based on light conversion body that the utility model provides, compared to existing technology, has following beneficial effect:
(1) eliminate hot spot: a kind of COB light source based on light conversion body that the utility model provides, phosphor powder layer in sandwich structure, consistency of thickness everywhere; Eliminated in traditional C OB light source, fluorescent glue is directly filled in COB device, and the variable thickness of fluorescent material everywhere causes, and the hot spot phenomenon existing.
(2) light extraction efficiency: a kind of COB light source based on light conversion body that the utility model provides, can effectively control the thickness of phosphor powder layer, avoided traditional C OB light source directly the fluorescent glue that contains fluorescent material to be poured in to COB device inside, make phosphor gel thickness excessive, cause luminous flux not strong.
(3) stability of fluorescent material: a kind of COB light source based on light conversion body that the utility model provides, used the light conversion body of sandwich structure, and fluorescent material is sealed in sandwich structure, reduce to a certain extent temperature, avoid directly contacting with the chip of high temperature; And can avoid phosphor powder layer to contact with air, moisture etc., prevent the reactions such as oxidation in the processes such as high temperature, hydrolysis, thereby reduce decay and the colourity drift of fluorescent material.
(4) remote excitation fluorescent material: a kind of COB light source based on light conversion body that the utility model provides, used remote excitation fluorescent material, prevent that fluorescent material is subject to the impact of the heat that LED chip sends, cause the aging relaxation phenomenon of fluorescent material under high-temperature condition, also can reduce the photoelectric color discreteness of chip chamber and the discreteness that chip fluorescence applies because of mixed light simultaneously, thereby make photochromic more evenly comfortable.
(5) cost-saving: a kind of COB light source based on light conversion body that the utility model provides, adopt ceramics bracket, simplified the production technology of LED support, reduced cost.
Above the utility model is described in detail, applies specific case principle of the present utility model and execution mode are set forth in literary composition, the explanation of above embodiment is just for helping to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.
Claims (9)
1. the COB light source based on light conversion body, comprising: a LED support, and several are positioned at the LED chip of described LED support inside, a light conversion body that is installed on described LED support top; It is characterized in that, described light conversion body comprises two-layer high effective transparent sheet and the phosphor powder layer between two-layer high effective transparent sheet that lays respectively at light conversion body top and bottom.
2. a kind of COB light source based on light conversion body according to claim 1, is characterized in that, is also provided with the box dam around described LED chip on described LED support, described box dam carrying light conversion body.
3. a kind of COB light source based on light conversion body according to claim 1, is characterized in that, described described LED support also arranges a plastic frame, and a fixed frame matching with described plastic frame.
4. a kind of COB light source based on light conversion body according to claim 1, is characterized in that, also comprises the transparent encapsulating body being filled between described LED support and light conversion body.
5. a kind of COB light source based on light conversion body according to claim 4, is characterized in that, described transparent encapsulating body carrying light conversion body.
6. a kind of COB light source based on light conversion body according to claim 1, is characterized in that, described LED support comprises metal substrate or ceramic substrate.
7. a kind of COB light source based on light conversion body according to claim 1, is characterized in that, described high effective transparent sheet is sheet glass.
8. a kind of COB light source based on light conversion body according to claim 1, is characterized in that, the thickness of described phosphor powder layer is less than 0.1mm.
9. a kind of COB light source based on light conversion body according to claim 1, is characterized in that, the side plating layer of transparent film of described light conversion body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320531654.8U CN203466190U (en) | 2013-08-29 | 2013-08-29 | COB light source based on light conversion body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320531654.8U CN203466190U (en) | 2013-08-29 | 2013-08-29 | COB light source based on light conversion body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203466190U true CN203466190U (en) | 2014-03-05 |
Family
ID=50178535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320531654.8U Expired - Lifetime CN203466190U (en) | 2013-08-29 | 2013-08-29 | COB light source based on light conversion body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203466190U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107248547A (en) * | 2017-06-21 | 2017-10-13 | 鸿宝科技股份有限公司 | A kind of high-power LED integrated chip encapsulating structure and its method for packing |
| CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
-
2013
- 2013-08-29 CN CN201320531654.8U patent/CN203466190U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107248547A (en) * | 2017-06-21 | 2017-10-13 | 鸿宝科技股份有限公司 | A kind of high-power LED integrated chip encapsulating structure and its method for packing |
| CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102509759B (en) | Light emitting device and light source module | |
| CN203932049U (en) | A kind of LED device of full angle bright dipping | |
| CN201430161Y (en) | LED device package structure | |
| CN103872224A (en) | Novel LED (Light Emitting Diode) illuminating element | |
| CN103050615B (en) | A kind of White LED with high color rendering property device | |
| CN102664229B (en) | Light emitting diode light source structure | |
| CN101338865A (en) | Low attenuation high light efficiency LED illuminating apparatus and preparation method | |
| CN203466190U (en) | COB light source based on light conversion body | |
| CN202712264U (en) | Light emitting diode | |
| CN203950834U (en) | A kind of support, adopting surface mounted LED and backlight module of adopting surface mounted LED | |
| CN208538903U (en) | A kind of encapsulating structure of high-luminous-efficiency LED wafer | |
| CN103413884B (en) | LED encapsulation method | |
| CN207134381U (en) | A kind of novel light-emitting diode | |
| CN201681927U (en) | High-power LED chip integrated encapsulating structure | |
| CN202203701U (en) | White-light LED (Light Emitting Diode) flat lamp | |
| CN206480644U (en) | A kind of multilayer gradually changed refractive index silica gel packaging light emitting diode | |
| CN103411153A (en) | LED lamp tube | |
| CN103956357A (en) | Manufacturing method of LED lamp filament | |
| CN201228951Y (en) | Low absorption and high light effect LED illuminating apparatus | |
| CN108006540A (en) | Intelligent led street lamp | |
| CN202049995U (en) | Surface mounted light emitting diode bracket and surface mounted light emitting diode using same | |
| CN203312357U (en) | Patch type LED light source with all-angle lighting | |
| CN204927347U (en) | LED encapsulation of yellow circle of lamp pearl structure is improved | |
| CN202205809U (en) | Plug-in type LED lamp bead | |
| CN203250781U (en) | LED encapsulation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140305 |
|
| CX01 | Expiry of patent term |