CN207305053U - It is a kind of to facilitate silk-screen multilayer wire wiring board - Google Patents
It is a kind of to facilitate silk-screen multilayer wire wiring board Download PDFInfo
- Publication number
- CN207305053U CN207305053U CN201721256859.4U CN201721256859U CN207305053U CN 207305053 U CN207305053 U CN 207305053U CN 201721256859 U CN201721256859 U CN 201721256859U CN 207305053 U CN207305053 U CN 207305053U
- Authority
- CN
- China
- Prior art keywords
- silk
- screen
- wiring board
- alignment rods
- wire wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Facilitate silk-screen multilayer wire wiring board the utility model discloses a kind of, including via, the side of the via is provided with top layer, the side of the top layer is provided with middle basic unit, ground plane is provided with the inside of the middle basic unit, the side of the ground plane is provided with bus plane, the side of the middle basic unit is provided with bottom, the side of the bottom is provided with silk-screen film, the side of the silk-screen film is provided with bottom copper mold conducting wire, alignment rods are provided with the inside of the bottom, the alignment rods are internally provided with holddown spring；By the alignment rods of design when multilayer wire wiring board is installed in production, the position of mounting hole of each laminate can be directed at, prevent each mounting hole misalignment after multilayer is installed, cause wiring board can not use and scrap, and as long as silk-screen is stamped to taking silk-screen film off during wiring board silk-screen by the silk-screen film of design, then each electric elements are installed again, prevented in the unsharp phenomenon of silk-screen.
Description
Technical field
The utility model belongs to wiring board technology field, and in particular to a kind of to facilitate silk-screen multilayer wire wiring board.
Background technology
The production method of multilayer circuit board is generally first done by inner figure, is then made single or double to print etching method
Substrate, and including in the interlayer specified, then it is heated, pressurize and bonded, as the drilling then plating with dual platen afterwards
Through hole method is identical.Advantage：Packaging density is high, small, light weight since packaging density is high, between each component (including component)
Line is reduced, therefore improves reliability；The wiring number of plies can be increased, so as to increase design flexibility；Can form has one
The circuit of constant impedance；High speed transmission circuit can be formed；Circuit, magnetic circuit shielded layer can be set, can also set metal core heat dissipating layer with
Meet the features needs such as shielding, heat dissipation；Installation is simple, and reliability is high.Shortcoming：Cost is high；Cycle is grown；Need high reliability
Detection means.Multilayer printed circuit is the product that electronic technology develops to high speed, multi-functional, large capacity, small size direction.
With the continuous development of electronic technology, especially extensive and super large-scale integration extensively and profoundly application is multilayered printed
Circuit just develops t to high density, high accuracy, high-layer direction rapidly and fine lines occurs, small-bore is run through, blind hole is buried
The technologies such as hole, high plate thickness aperture ratio are to meet the needs in market.
For existing multilayer wire wiring board when making, always some identifies silk-screen not when to wiring board silk-screen
On, or the unclear phenomenon of print, and when being assembled to multilayer wire wiring board, via and some fixed installations
Hole misalignment, the problem of causing multilayer wire wiring board can not use after fabrication, for this it is proposed that a kind of facilitate silk-screen more
Layer line wiring board.
Utility model content
Facilitate silk-screen multilayer wire wiring board the purpose of this utility model is to provide a kind of, to solve in above-mentioned background technology
For the existing multilayer wire wiring board proposed when making, always some identifies silk-screen not when to wiring board silk-screen
On, or the unclear phenomenon of print, and when being assembled to multilayer wire wiring board, via and some fixed installations
Hole misalignment, the problem of causing multilayer wire wiring board can not use after fabrication.
To achieve the above object, the utility model provides following technical solution：It is a kind of to facilitate silk-screen multilayer wire wiring board, bag
Via is included, the side of the via is provided with top layer, and the side of the top layer is provided with middle basic unit, is set on the inside of the middle basic unit
Ground plane is equipped with, the side of the ground plane is provided with bus plane, and the side of the middle basic unit is provided with bottom, the bottom
Side is provided with silk-screen film, and the side of the silk-screen film is provided with bottom copper mold conducting wire, alignment is provided with the inside of the bottom
Bar, the alignment rods are internally provided with holddown spring, and one end of the holddown spring is provided with compression convex block, and the compression is convex
One end of block is provided with roller, and one end of the alignment rods is provided with limiting plate.
Preferably, the surface of the top layer and bottom is both provided with silk-screen film.
Preferably, the holddown spring is fixedly connected with alignment rods by screw.
Preferably, the inside of the alignment rods is hollow.
Preferably, the alignment rods run through top layer, middle basic unit, bottom and silk-screen film.
Preferably, the alignment rods are fixedly connected with the electric welding of limiting plate isomorphism.
Compared with prior art, the beneficial effects of the utility model are：Multilayer is installed in production by the alignment rods of design
When line wiring board, the position of mounting hole of each laminate can be directed at, prevents each mounting hole misalignment after multilayer installation,
Cause wiring board can not use and scrap, and silk-screen can directly be used when to wiring board silk-screen by the silk-screen film of design
Film, silk-screen can be stamped by taking silk-screen film off, then install each electric elements again, be prevented unsharp existing in silk-screen
As.
Brief description of the drawings
Fig. 1 is the multilayer wire circuit board structure schematic diagram of the utility model；
Fig. 2 is that the multilayer wire wiring board of the utility model installs align structures schematic diagram；
In figure：Basic unit, 5- bottoms, 6- silk-screen films, 7- bottom copper molds in 1- top layer copper molds conducting wire, 2- vias, 3- top layers, 4-
Conducting wire, 8- ground planes, 9- bus planes, 10- alignment rods, 11- holddown springs, 12- compress convex block, 13- rollers, 14- limiting plates.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained, shall fall within the protection scope of the present invention.
Please refer to Fig.1 and Fig. 2, the utility model provide a kind of technical solution：It is a kind of to facilitate silk-screen multilayer wire wiring board, bag
Via 2 is included, the side of via 2 is provided with top layer 3, and the side of top layer 3 is provided with middle basic unit 4, and the inner side of middle basic unit 4 is provided with ground
Line layer 8, the side of ground plane 8 are provided with bus plane 9, and the side of middle basic unit 4 is provided with bottom 5, and the side of bottom 5 is provided with silk
Die 6, the side of silk-screen film 6 are provided with bottom copper mold conducting wire 7, and the inner side of bottom 5 is provided with alignment rods 10, alignment rods 10 it is interior
Portion is provided with holddown spring 11, and one end of holddown spring 11, which is provided with, compresses convex block 12, and the one end for compressing convex block 12 is provided with rolling
Wheel 13, one end of alignment rods 10 is provided with limiting plate 14.
In order to facilitate the silk-screen of wiring board, in the present embodiment, the surface of preferable top layer 3 and bottom 5 is both provided with silk-screen
Film 6.
In order to make holddown spring 11 and alignment rods 10 easy to connect, in the present embodiment, preferable holddown spring 11 is with being aligned
Bar 10 is fixedly connected by screw.
In order to make holddown spring 11 easy to use, in the present embodiment, the inside of preferable alignment rods 10 is hollow.
In order to make 10 effect of alignment rods more preferable, in the present embodiment, preferable alignment rods 10 are through top layer 3, middle basic unit 4, bottom
Layer 5 and silk-screen film 6.
In order to make alignment rods 10 and 14 stable connection of limiting plate, in the present embodiment, preferable alignment rods 10 and limiting plate 14
Isomorphism electric welding is fixedly connected.
The operation principle and process for using of the utility model：After the utility model installs, it is new to first check for this practicality
The installation fixation and security protection of type, then can use, top layer 3, middle basic unit 4, bottom 5, silk-screen film 6 according to suitable
Sequence is placed in alignment rods 10, after the completion of start to connect, then via 2 and top layer copper mold conducting wire 1, bottom copper mold conducting wire 7 are installed
Into silk-screen film 6 is taken off again, silk-screen is imprinted on top layer 3 and bottom 5, this completes the use process to the utility model,
The utility model is simple in structure, safe and convenient to use.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from the principle of the utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of facilitate silk-screen multilayer wire wiring board, including via (2), it is characterised in that：The side of the via (2) is provided with
Top layer (3), the side of the top layer (3) are provided with middle basic unit (4), ground plane (8) are provided with the inside of the middle basic unit (4),
The side of the ground plane (8) is provided with bus plane (9), and the side of the middle basic unit (4) is provided with bottom (5), the bottom
(5) side is provided with silk-screen film (6), and the side of the silk-screen film (6) is provided with bottom copper mold conducting wire (7), the bottom (5)
Inner side be provided with alignment rods (10), the alignment rods (10) are internally provided with holddown spring (11), the holddown spring
(11) one end, which is provided with, compresses convex block (12), and described one end for compressing convex block (12) is provided with roller (13), the alignment rods
(10) one end is provided with limiting plate (14).
A kind of facilitate silk-screen multilayer wire wiring board 2. according to claim 1, it is characterised in that：The top layer (3) and bottom
The surface of layer (5) is both provided with silk-screen film (6).
A kind of facilitate silk-screen multilayer wire wiring board 3. according to claim 1, it is characterised in that：The holddown spring (11)
It is fixedly connected with alignment rods (10) by screw.
A kind of facilitate silk-screen multilayer wire wiring board 4. according to claim 1, it is characterised in that：The alignment rods (10)
Inside is hollow.
A kind of facilitate silk-screen multilayer wire wiring board 5. according to claim 1, it is characterised in that：The alignment rods (10) are passed through
Wear top layer (3), middle basic unit (4), bottom (5) and silk-screen film (6).
A kind of facilitate silk-screen multilayer wire wiring board 6. according to claim 1, it is characterised in that：The alignment rods (10) with
The electric welding of limiting plate (14) isomorphism is fixedly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721256859.4U CN207305053U (en) | 2017-09-27 | 2017-09-27 | It is a kind of to facilitate silk-screen multilayer wire wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721256859.4U CN207305053U (en) | 2017-09-27 | 2017-09-27 | It is a kind of to facilitate silk-screen multilayer wire wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207305053U true CN207305053U (en) | 2018-05-01 |
Family
ID=62440090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721256859.4U Expired - Fee Related CN207305053U (en) | 2017-09-27 | 2017-09-27 | It is a kind of to facilitate silk-screen multilayer wire wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207305053U (en) |
-
2017
- 2017-09-27 CN CN201721256859.4U patent/CN207305053U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180501 Termination date: 20180927 |