CN207282682U - A kind of composite ceramic-based microstrip isolator - Google Patents
A kind of composite ceramic-based microstrip isolator Download PDFInfo
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- CN207282682U CN207282682U CN201721389807.4U CN201721389807U CN207282682U CN 207282682 U CN207282682 U CN 207282682U CN 201721389807 U CN201721389807 U CN 201721389807U CN 207282682 U CN207282682 U CN 207282682U
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Abstract
The utility model discloses a kind of high power capacity, wide working band, reliability is high, composite ceramic-based microstrip isolator simple in structure, including substrate, the microstrip circuit and load resistance being arranged on substrate, substrate includes dielectric ceramic substrate, dielectric ceramic substrate is equipped with containing groove, ferrite substrate is equipped with containing groove, ferrite substrate is flushed with dielectric ceramic substrate surface, microstrip circuit includes the central metal knot being arranged on ferrite substrate, dielectric ceramic substrate is equipped with three signal transmssion lines, signal transmssion line is connected by metallized dielectric bridge with central metal knot, wherein a signal transmssion line is connected with load resistance.
Description
Technical field
It the utility model is related to a kind of composite ceramic-based microstrip isolator.
Background technology
With the development of modern science and technology, microwave integrated circuit is toward integrated level is high, small, light weight, working band
The directions such as width are developed, this is to key element therein --- and microstrip isolator proposes the requirement of higher.
The microstrip isolator of existing mainstream mainly by making microstrip circuit and load in full-scale ferrite surfaces, due to
The characteristic limitation of Ferrite Material in itself, the microstrip isolator working frequency range made is relatively narrow and power capacity is smaller,
Through the development need that can not meet future microwave integrated circuit.
Utility model content
Technical problem to be solved in the utility model is：A kind of high power capacity, wide working band, reliability are provided
Composite ceramic-based microstrip isolator high, simple in structure.
In order to solve the above technical problems, technical solution is used by the utility model：Composite ceramic-based microstrip isolator,
Including substrate, the microstrip circuit and load resistance that are arranged on substrate, substrate includes dielectric ceramic substrate, on dielectric ceramic substrate
Equipped with containing groove, containing groove is equipped with ferrite substrate, and ferrite substrate is flushed with dielectric ceramic substrate surface, microstrip circuit
Including the central metal knot being arranged on ferrite substrate, dielectric ceramic substrate is equipped with three signal transmssion lines, signal transmission
Line is connected by metallized dielectric bridge with central metal knot, wherein a signal transmssion line is connected with load resistance.
As a preferred solution, the ferrite substrate sintering is in dielectric ceramic substrate upper groove.
As a preferred solution, the ceramic substrate be aluminium nitride ceramic substrate or alumina ceramic substrate or
High Resistivity Si ceramic substrate.
As a preferred solution, the metallized dielectric bridge is metallized polyimide or metallization aluminium nitride or gold
Categoryization silica dioxide medium bridge.
As a preferred solution, the load resistance is semicircle or rectangle or fan-shaped membrane resistance.
As a preferred solution, the microstrip circuit passes through vacuum coating or plating or photoetching or etch process
It is made in substrate front.
The beneficial effects of the utility model are：The composite ceramics substrate is using the sintering insertion of middle ferrite circular substrate
In outer shroud aluminium nitride media ceramic, and microstrip circuit circular flat metal center knot is mainly made in middle ferrite circular substrate
On, signal transmssion line is mainly made in the mode on outer shroud aluminium nitride dielectric ceramic substrate, which can effectively increase whole
Body device working frequency range bandwidth；
The circular flat metal center knot and three signal transmssion lines are respectively by three metallized polyimide medium bridges
Connection conducting, relative to the connection mode of traditional gold wire bonding, greatly improves reliability, simplifies postorder encapsulation operation；
The load resistance is made on the aluminium nitride base material with high thermal conductivity coefficient, relative to traditional full-scale ferrite structure device
Part, the power capacity of integral device have obtained great lifting.Device integrally has high power capacity, wide working band, reliable
The features such as property is high, simple in structure.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model.
In Fig. 1：1. dielectric ceramic substrate, 2. ferrite substrates, 3. signal transmssion lines, 4. central metal knots, 5. metallization
Medium bridge, 6. load resistances.
Embodiment
Below in conjunction with the accompanying drawings, the specific embodiment of the utility model is described in detail.
As shown in Figure 1, composite ceramic-based microstrip isolator, including substrate, the microstrip circuit that is arranged on substrate and load
Resistance 6.The load resistance 6 is semicircle film resistor.
Substrate includes aluminium nitride dielectric ceramic substrate 1, and aluminium nitride dielectric ceramic substrate 1 is equipped with containing groove, houses recessed
Ferrite substrate 2 is equipped with groove, ferrite substrate 2 is flushed with 1 surface of aluminium nitride dielectric ceramic substrate, and microstrip circuit includes setting
Central metal knot 4 on ferrite substrate 2, aluminium nitride dielectric ceramic substrate 1 are equipped with three signal transmssion lines 3, and signal passes
Defeated line 3 is connected by metallized polyimide medium bridge 5 with central metal knot 4.A wherein signal transmssion line 3 and load electricity
Resistance 6 is connected.
The microstrip circuit is made in substrate front by vacuum coating or plating or photoetching or etch process.
The principles and effects of the invention, and the implementation that part uses only is illustrated in the above embodiments
Example, rather than limits the present invention；It should be pointed out that for those of ordinary skill in the art, this hair is not being departed from
On the premise of bright creation design, various modifications and improvements can be made, these belong to the scope of protection of the utility model.
Claims (6)
1. composite ceramic-based microstrip isolator, including substrate, the microstrip circuit and load resistance that are arranged on substrate, its feature exist
In：The substrate includes dielectric ceramic substrate, and dielectric ceramic substrate is equipped with containing groove, ferrite base is equipped with containing groove
Piece, ferrite substrate are flushed with dielectric ceramic substrate surface, and microstrip circuit includes the central metal being arranged on ferrite substrate
Knot, dielectric ceramic substrate are equipped with three signal transmssion lines, and signal transmssion line passes through metallized dielectric bridge and central metal knot phase
Connection a, wherein signal transmssion line is connected with load resistance.
2. composite ceramic-based microstrip isolator as claimed in claim 1, it is characterised in that：The ferrite substrate sintering is being situated between
In matter ceramic substrate upper groove.
3. composite ceramic-based microstrip isolator as claimed in claim 1, it is characterised in that：The dielectric ceramic substrate is nitridation
Aluminium ceramic substrate or alumina ceramic substrate or High Resistivity Si ceramic substrate.
4. composite ceramic-based microstrip isolator as claimed in claim 1, it is characterised in that：The metallized dielectric bridge is metal
Change polyimides or metallization aluminium nitride or metallization silica dioxide medium bridge.
5. the composite ceramic-based microstrip isolator as any one of claim 1-4, it is characterised in that：The load resistance
For semicircle or rectangle or fan-shaped membrane resistance.
6. the composite ceramic-based microstrip isolator as any one of claim 1-4, it is characterised in that：The microstrip circuit
Substrate front is made in by vacuum coating or plating or photoetching or etch process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721389807.4U CN207282682U8 (en) | 2017-10-26 | 2017-10-26 | A kind of composite ceramic-based microstrip isolator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721389807.4U CN207282682U8 (en) | 2017-10-26 | 2017-10-26 | A kind of composite ceramic-based microstrip isolator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN207282682U true CN207282682U (en) | 2018-04-27 |
| CN207282682U8 CN207282682U8 (en) | 2018-06-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721389807.4U Active CN207282682U8 (en) | 2017-10-26 | 2017-10-26 | A kind of composite ceramic-based microstrip isolator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207282682U8 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107834138A (en) * | 2017-10-26 | 2018-03-23 | 苏州华博电子科技有限公司 | A kind of composite ceramic-based microstrip isolator |
| CN114955977A (en) * | 2021-07-23 | 2022-08-30 | 苏州华勤源微电子科技有限公司 | Preparation process and application of silicon-based microstrip circulator |
-
2017
- 2017-10-26 CN CN201721389807.4U patent/CN207282682U8/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107834138A (en) * | 2017-10-26 | 2018-03-23 | 苏州华博电子科技有限公司 | A kind of composite ceramic-based microstrip isolator |
| CN114955977A (en) * | 2021-07-23 | 2022-08-30 | 苏州华勤源微电子科技有限公司 | Preparation process and application of silicon-based microstrip circulator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN207282682U8 (en) | 2018-06-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CU01 | Correction of utility model patent |
Correction item: Patentee Correct: Suzhou Huabo Electronic Technology Co., Ltd. False: Suzhou Hua Bo Electronic Technology Co., Ltd. Number: 17-02 Page: The title page Volume: 34 Correction item: Patentee Correct: Suzhou Huabo Electronic Technology Co., Ltd. Correct: Suzhou Huabo Electronic Technology Co., Ltd. False: Suzhou Hua Bo Electronic Technology Co., Ltd. False: Suzhou Hua Bo Electronic Technology Co., Ltd. Number: 17-02 Number: 17-02 Volume: 34 |
|
| CU01 | Correction of utility model patent |