CN207082546U - A kind of light emitting diode and backlight module - Google Patents
A kind of light emitting diode and backlight module Download PDFInfo
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- CN207082546U CN207082546U CN201721046315.5U CN201721046315U CN207082546U CN 207082546 U CN207082546 U CN 207082546U CN 201721046315 U CN201721046315 U CN 201721046315U CN 207082546 U CN207082546 U CN 207082546U
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- emitting diode
- light emitting
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- zener diode
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Abstract
The utility model discloses a kind of light emitting diode and backlight module, including at least one LED chip, support and bi-directional zener diode, the support is supporting fixed LED chip；The support is provided with heat conduction middleware, and the heat conduction middleware is used to connect outside conductive structure；The bottom basal surface or lower side surfaces of the support open up storage tank to accommodate bi-directional zener diode, the bi-directional zener diode face-down bonding is arranged in storage tank, bonding line need not be welded, the bi-directional zener diode is connected in parallel with LED chip, electrostatic can be discharged by the positive and negative both direction of bi-directional zener diode, it greatly strengthen the anti-static electrictity release performance of LED chip, and the setting of heat conduction middleware to light emitting diode radiating.
Description
Technical field
Technical field of liquid crystal display is the utility model is related to, relates more specifically to a kind of light emitting diode and backlight module.
Background technology
Liquid crystal display is a kind of panel display apparatus come display image using the characteristic of liquid crystal material, and it is compared to it
More frivolous, low driving voltage and the advantages that low-power consumption for his display device, has become the main flow on whole consumption market
Product.However, the liquid crystal material of liquid crystal display can not be from main light emission, it is necessary to by external offer light source, therefore liquid crystal display
Backlight module is additionally provided with to provide required light source again in device.
In general, backlight module can be divided into two kinds of forms of side-entering type backlight module and direct type backlight module.The known back of the body
Optical module is mainly using cathode fluorescent tube, thermal cathode fluorescent tube and semiconductor luminous assembly as light source, and semiconductor
Luminescence component is mainly again lighted using light emitting diode, and it is compared to cathode-luminescence fluorescent tube more power and energy saving, use
Life-span is longer, and volume is more light and handy, thus has the trend of gradually substitution cathode-luminescence fluorescent tube, and light emitting diode will be liquid crystal
Show following principal light source of the backlight module of device.
But light emitting diode need to use under specified Current Voltage, as overtension can cause LED chip to be burnt.
Driving generally in the product to light emitting diode may be driven using IC to ensure to provide constant electricity for light emitting diode
Stream or constant voltage, but because power supply improper use may result in particularly during assembling thread-changing in assembling process
Overtension.In addition overtension is also resulted in when IC appearance is abnormal, power supply appearance is abnormal.
It is, therefore, desirable to provide a kind of light emitting diode overvoltage protection, is not only avoided that when abnormal protection LED core occurs in power supply
Piece is injury-free, and can also protect can also protect LED chip when light emitting diode is by electrostatic not by damage by static electricity.
Utility model content
In order to solve the deficiencies in the prior art, the utility model provides one kind and is easy to radiating and two-way has voltage stabilizing
The light emitting diode and backlight module of effect.
The utility model technique effect to be reached is realized by following scheme：A kind of light emitting diode, including at least
One LED chip, support and bi-directional zener diode, the support is supporting fixed LED chip；The support is provided with heat conduction
Middleware, the heat conduction middleware are used to connect outside conductive structure；The bottom basal surface or lower side surfaces of the support
Storage tank is opened up to accommodate bi-directional zener diode, the bi-directional zener diode face-down bonding is arranged in storage tank, nothing
Bonding line need to be welded, the bi-directional zener diode is connected in parallel with LED chip.
Preferably, bi-directional zener diode is two Zener diode differential concatenations, and described two Zener diodes are born
Pole is connected in parallel respectively at the both positive and negative polarity of LED chip.
Preferably, the light emitting diode is light emitting diode with LED chip or with least one LED
The light-emitting diode light bar of chip.
Preferably, increase drop glue is described two-way neat with fixed protection in storage tank after the bi-directional zener diode welding
Receive diode.
Preferably, the LED chip of the light-emitting diode light bar by pad solder on support, the surface of the pad
Provided with insulating materials.
Preferably, the insulating materials is the white high-temperature-resistant insulating paint of high reflectance.
Preferably, the bottom basal surface of the support be further opened with offering at least one strip groove or bottom to
Few two air-vents being randomly distributed.
Preferably, the strip groove surface is provided with graphite.
A kind of backlight module, including light emitting diode described above.
The utility model has advantages below：
1st, by the way that the bottom basal surface or lower side surfaces of support are opened up into storage tank accommodating the two-way pole of Zener two
Pipe, the bi-directional zener diode face-down bonding is arranged in storage tank, without welding bonding line, the bi-directional zener diode with
LED chip is connected in parallel, and electrostatic can be discharged by the positive and negative both direction of bi-directional zener diode, greatly strengthen
The anti-static electrictity release performance of LED chip, and make the space of the LED chip more by the way that bi-directional zener diode is arranged on into bottom
Greatly, flatness is good, and brightness greatly improves；
2nd, by the way that support is provided with into heat conduction middleware, the heat conduction middleware is used to connect outside conductive structure, so as to right
Light emitting diode is radiated.
Brief description of the drawings
Fig. 1 is the product structure figure of light emitting diode embodiment one in the utility model；
Fig. 2 is the product structure figure of light emitting diode embodiment two in the utility model；
Fig. 3 is the circuit structure diagram of light emitting diode embodiment one in the utility model；
Fig. 4 is the circuit structure diagram of light emitting diode embodiment two in the utility model.
Embodiment
The utility model is described in detail with reference to the accompanying drawings and examples.
The utility model discloses a kind of light emitting diode, including at least one LED chip, support and the pole of two-way Zener two
Pipe, for the support to support fixed LED chip, the bottom basal surface or lower side surfaces of the support open up storage tank use
To accommodate bi-directional zener diode, the bi-directional zener diode face-down bonding is arranged in storage tank, without welding bonding line, institute
Bi-directional zener diode is stated to be connected in parallel with LED chip.The support is provided with heat conduction middleware, and the heat conduction middleware is used to connect
Outside conductive structure is connect, to be radiated to light emitting diode.The bi-directional zener diode has trigger action, when voltage height
Turned on during to certain threshold value, it is low just rapid to close.The positive and negative both direction of the bi-directional zener diode has voltage stabilizing work
With just as two Zener diode differential concatenations, no matter which positive and negative direction of the both ends of the bi-directional zener diode reaches
Burning voltage（I.e. one of Zener）Breakdown reverse voltage the voltage at its both ends can be caused to be held essentially constant（
Its current range allowed）.
Embodiment one
As shown in figure 1, the light emitting diode that the present embodiment one provides, including a support 1, LED chip 2 and two-way Zener two
Pole pipe 3, the support 1 include top 11 and bottom 12, and the top 11 of the support 1 is in indent openning shape, the indent opening
Basal surface form support 13, the LED chip 2 is arranged on support 13, and the positive and negative electrode of the LED chip 2 passes through bonding line
4 with support 13 on metal pins 5 positive and negative electrode weld.Fluorescent colloid 7 is filled to incite somebody to action in the indent open area of top 11
LED chip 2 encapsulates.In order to prevent LED chip 2 from being punctured by electrostatic or reverse current, the basal surface of bottom 12 of the support 1 or
Lower side surfaces open up storage tank 6, and the face-down bonding of bi-directional zener diode 3 is arranged in storage tank 6, are bonded without welding
Line, two negative poles of the bi-directional zener diode 3 are welded with the positive and negative electrode of metal pins 5 and LED chip 2 and two-way Zener
Diode 3 is in parallel, and the bi-directional zener diode 3 can be released electrostatic by the positive and negative both direction of bi-directional zener diode 3
Run out, greatly strengthen the anti-static electrictity release performance of LED chip 2, and by the way that bi-directional zener diode 3 is arranged on into bottom 12
Make that the space of the LED chip 2 is bigger, and flatness is good, and brightness greatly improves.
As a further improvement, the bottom 12 of the support 1 is provided with heat conduction middleware 8 or the metal pins 5 are provided with
Heat conduction middleware 8, the heat conduction middleware 8 is used to connect outside conductive structure, to be radiated to light emitting diode.
As a further improvement, the as shown in figure 3, circuit knot of the preferred embodiment one for the utility model light emitting diode
Structure schematic diagram.Wherein light emitting diode also includes bi-directional zener diode 3, and the bi-directional zener diode 3 is used to prevent from lighting
Forward and reverse overvoltage of diode, two negative poles of the bi-directional zener diode 3 are connected with the both positive and negative polarity of LED chip 2.
As a further improvement, the bi-directional zener diode 3 can be protected increase drop glue after welding in storage tank 6 with fixed
Protect the bi-directional zener diode 3.
As a further improvement, the bottom 12 of the support 1 is additionally provided with least one strip groove 121 or inside opens up
At least two air-vents 122 being randomly distributed, can effectively accelerate the radiating of light emitting diode.
As a further improvement, the surface of strip groove 121 is provided with graphite.Because the thermal conductivity factor of graphite can be with temperature
The rise of degree and increase, or even heat guard can be turned at very high temperatures, therefore graphite has very high thermal conductivity, Neng Gouzeng
Add the radiating effect of support 1.
As a further improvement, the bonding line 4 can be gold thread, silver wire or other wires.
Embodiment two
As shown in Fig. 2 the light-emitting diode light bar that the present embodiment one provides, including at least one LED chip 100, fluorescence
Film 200, support 300 and bi-directional zener diode 400, the fluorescent film 200 are encapsulated in LED chip 100 to by LED chip
100 encapsulation, the support 300 include line layer 310 and the supporting layer 320 being located under line layer 310, and the line layer 310 wraps
Several pads 311 and circuit trace are included, each LED chip 100 is welded on support 300 by a pair of pads 311.
In order to prevent LED chip 100 from being punctured by electrostatic or reverse current, the bottom basal surface of the supporting layer 320 or
Lower side surfaces open up storage tank 321, and the face-down bonding of bi-directional zener diode 400 is arranged in storage tank 321, without weldering
Bonding line, the LED chip 100 is in parallel with bi-directional zener diode 400, and the bi-directional zener diode 400 can be by electrostatic
Discharged by bi-directional zener diode, greatly strengthen the anti-static electrictity release performance of LED chip 100, and by will be two-way
Zener diode 400, which is arranged on supporting layer 320, makes that the space of the LED chip 100 is bigger, and flatness is good, and brightness greatly improves.
As a further improvement, the pair of pad 311 is positive terminal pad and negative terminal pad, the LED chip 100 is just
Pole is welded in positive terminal pad, and the negative pole of the LED chip 100 is welded in negative terminal pad.In the positive terminal pad and negative pole
The surface of pad is provided with insulating materials 500 to clad anode pad and the surface of negative terminal pad, can also improve light-emitting diodes
The anti-static ability of spot bar.The insulating materials 500 can be high emissivity insulating materials, such as white solder mask or the resistance to height of white
Warm coatings, it is preferred to use the white high-temperature-resistant insulating paint of high reflectance, the resistant to elevated temperatures characteristic of one side avoid LED core
Influence of the heating of the positive and negative electrode of piece 100 to light-emitting diode light bar reliability, the characteristic of another aspect high reflectance improve
The light utilization efficiency of LED chip 100.
As a further improvement, the supporting layer 320 of the support 300, which also extends, is provided with heat conduction middleware 300, the heat conduction
Middleware 300 is used to connect outside conductive structure, to be radiated to light-emitting diode light bar.
As a further improvement, the as shown in figure 4, electricity of the preferred embodiment two for the utility model light-emitting diode light bar
Line structure schematic diagram.Wherein light-emitting diode light bar also includes bi-directional zener diode, and the bi-directional zener diode 400 is used for
Prevent forward and reverse overvoltage of light-emitting diode light bar, two negative poles and all LED chips of the bi-directional zener diode 400
100 both positive and negative polarity connection, all LED chips 100 pass through series connection and/or formation light-emitting diode light bar in parallel.
As a further improvement, the line layer 310 is heat-conducting layer, the supporting layer 320 is heat dissipating layer.By the circuit
The support of layer 310 uses aluminium material, because aluminium has stronger heat conductivility.The bottom of supporting layer 320 is provided with least one
Individual strip groove 322 or inside open up at least two air-vents 323 being randomly distributed, and can effectively accelerate LED light lamp
The radiating of bar.
As a further improvement, the surface of strip groove 322 is provided with graphite.Because the thermal conductivity factor of graphite can be with temperature
The rise of degree and increase, or even heat guard can be turned at very high temperatures, therefore graphite has very high thermal conductivity, Neng Gouzeng
Add the radiating effect of supporting layer 320.
Embodiment three
Difference of the present embodiment compared with embodiment one and embodiment two is that the bi-directional zener diode is arranged on luminous two
In circuit beyond pole pipe, as increased bi-directional zener diode on backlight FPC, it can equally play a part of protection circuit.
A kind of backlight module, the backlight module include light emitting diode and bi-directional zener diode described above, institute
Backlight module is stated to provide light source for display device.
It is last it should be noted that above example is only illustrating the technical scheme of the embodiment of the present invention rather than it is entered
Row limitation, although the embodiment of the present invention is described in detail with reference to preferred embodiment, one of ordinary skill in the art
It should be understood that can still be modified to the technical scheme of the embodiment of the present invention or equivalent substitution, and these modifications or wait
The scope of amended technical scheme disengaging technical scheme of the embodiment of the present invention can not also be made with replacement.
Claims (9)
1. a kind of light emitting diode, it is characterised in that described including at least one LED chip, support and bi-directional zener diode
Support is supporting fixed LED chip；The support is provided with heat conduction middleware, and the heat conduction middleware is used to connect outside heat conduction
Structure；The bottom basal surface or lower side surfaces of the support open up storage tank to accommodate bi-directional zener diode, described
Bi-directional zener diode face-down bonding is arranged in storage tank, without welding bonding line, the bi-directional zener diode and LED chip
It is connected in parallel.
2. a kind of light emitting diode as claimed in claim 1, it is characterised in that bi-directional zener diode is two poles of Zener two
Pipe differential concatenation, the negative pole of described two Zener diodes are connected in parallel respectively at the both positive and negative polarity of LED chip.
3. a kind of light emitting diode as claimed in claim 2, it is characterised in that the light emitting diode is with a LED
The light emitting diode of chip or the light-emitting diode light bar with least one LED chip.
4. a kind of light emitting diode as claimed in claim 3, it is characterised in that holding after the bi-directional zener diode welding
Put increase drop glue in groove and protect the bi-directional zener diode with fixed.
A kind of 5. light emitting diode as claimed in claim 3, it is characterised in that the LED chip of the light-emitting diode light bar
By pad solder on support, the surface of the pad is provided with insulating materials.
6. a kind of light emitting diode as claimed in claim 5, it is characterised in that the insulating materials is the white of high reflectance
High-temperature-resistant insulating paint.
7. a kind of light emitting diode as claimed in claim 3, it is characterised in that the bottom basal surface of the support is further opened with
At least two air-vents being randomly distributed are offered at least one strip groove or bottom.
8. a kind of light emitting diode as claimed in claim 7, it is characterised in that the strip groove surface is provided with graphite.
9. a kind of backlight module, it is characterised in that including the light emitting diode as described in claim 1-8 is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721046315.5U CN207082546U (en) | 2017-08-21 | 2017-08-21 | A kind of light emitting diode and backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721046315.5U CN207082546U (en) | 2017-08-21 | 2017-08-21 | A kind of light emitting diode and backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207082546U true CN207082546U (en) | 2018-03-09 |
Family
ID=61420751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721046315.5U Active CN207082546U (en) | 2017-08-21 | 2017-08-21 | A kind of light emitting diode and backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207082546U (en) |
-
2017
- 2017-08-21 CN CN201721046315.5U patent/CN207082546U/en active Active
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