CN207053775U - A kind of MEMS microphone chip and MEMS microphone module - Google Patents
A kind of MEMS microphone chip and MEMS microphone module Download PDFInfo
- Publication number
- CN207053775U CN207053775U CN201720751404.3U CN201720751404U CN207053775U CN 207053775 U CN207053775 U CN 207053775U CN 201720751404 U CN201720751404 U CN 201720751404U CN 207053775 U CN207053775 U CN 207053775U
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- CN
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- Prior art keywords
- vibrating diaphragm
- mems microphone
- backplane
- limited post
- microphone chip
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- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 230000004308 accommodation Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
Abstract
It the utility model is related to a kind of MEMS microphone chip and MEMS microphone module.The chip includes backplane, vibrating diaphragm and the substrate with back of the body chamber, substrate links together to form receiving space between them with backplane, vibrating diaphragm is freely arranged in receiving space, vibrating diaphragm is relative with back of the body chamber, limited post is provided with receiving space, limited post passes through vibrating diaphragm, to limit the direction of vibration of vibrating diaphragm, is provided between backplane and vibrating diaphragm for preventing backplane and the first projection of vibrating diaphragm adhesion.A technical problem to be solved in the utility model is that the vibrating diaphragm of existing MEMS microphone chip can be swung laterally in vibration.One purposes of utility model is to be used for MEMS microphone module.
Description
Technical field
Field of micro electromechanical technology is the utility model is related to, more specifically, the utility model is related to a kind of MEMS microphone core
Piece and MEMS microphone module.
Background technology
Traditional MEMS microphone chip includes substrate and the vibrating diaphragm and backplane that are fixed on substrate, vibrating diaphragm and backplane phase
Interval.Two pole plates of vibrating diaphragm and backplane respectively as electric capacity.This vibrating diaphragm is full membrane structure, i.e. vibrating diaphragm is fixedly connected with backplane
Together, gap and is left therebetween.Because vibrating diaphragm and backplane are fixed together, it is strong that its elasticity can have influence on structure
Degree.When being impacted (such as blow, mechanical shock and fall), vibrating diaphragm is easily bent deformation, causes breakage.
In order to solve the technical problem, there has been proposed be freely arranged on vibrating diaphragm to enclose what is formed by backplane and substrate
In accommodation space.In this way, vibrating diaphragm is no longer influenced by tensile force.When by foreign impacts, the deformation of vibrating diaphragm subtracts significantly
It is small, improve durability.
However, because the size of vibrating diaphragm is less than the cross-sectional area of accommodation space, therefore vibrating diaphragm easily swings in vibration,
It can so cause vibrating effect poor, and vibrating diaphragm is easily distorted under large amplitude, or even fall into back of the body chamber.
In addition, in vibration processes, vibrating diaphragm easily sticks together with backplane, leads to not vibrate.
Utility model content
A purpose of the present utility model is the new solution of MEMS microphone chip.
According to one side of the present utility model, there is provided a kind of MEMS microphone chip.The chip include backplane, vibrating diaphragm and
Substrate with back of the body chamber, the substrate link together to form receiving space, the vibrating diaphragm between them with the backplane
Freely it is arranged in the receiving space, the vibrating diaphragm is relative with the back of the body chamber, and limited location is set in the receiving space
Post, the limited post pass through the vibrating diaphragm, to limit the direction of vibration of the vibrating diaphragm, set between the backplane and the vibrating diaphragm
It is equipped with for preventing the backplane and the first projection of the vibrating diaphragm adhesion.
Alternatively, the quantity of the limited post is more than or equal to 2 and less than or equal to 32, and the limited post surrounds the back of the body
Chamber is equably arranged.
Alternatively, the material of the limited post is monocrystalline silicon, polysilicon, silica or silicon nitride.
Alternatively, the via for passing through the limited post is provided with the vibrating diaphragm.
Alternatively, it is recessed from the center position of the edge of the vibrating diaphragm to the vibrating diaphragm and is formed for wearing the limited post
The breach crossed.
Alternatively, described first it is raised be integrally formed with the vibrating diaphragm or described first raised connects with the backplane
It is connected together.
Alternatively, it is provided between the vibrating diaphragm and the substrate for preventing the vibrating diaphragm and the substrate phase adhesion
It is second raised.
Alternatively, the vibrating diaphragm and second projection are integrally formed or described second raised and substrate companies
It is connected together.
Alternatively, bleeder port is provided with the backplane, it is discrete that the described first raised and described second projection, which is,
The salient point of setting.
According to another aspect of the present utility model, there is provided a kind of MEMS microphone module.It is new that the module includes this practicality
The MEMS microphone chip that type provides.
One of the present utility model is had technical effect that, by the setting of limited post, vibrating diaphragm can be carried out along limited post
Lower vibration, and limited post can effectively prevent horizontal swing of the vibrating diaphragm in vibration processes, prevent vibrating diaphragm from being sent out because amplitude is excessive
Raw distortion is fallen down even into back of the body chamber or from back of the body chamber.Improve the service life of MEMS microphone chip.
It is of the present utility model other by referring to the drawings to the detailed description of exemplary embodiment of the present utility model
Feature and its advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing of a part for constitution instruction describes embodiment of the present utility model, and uses together with the description
In explanation principle of the present utility model.
Fig. 1 is the sectional view according to the MEMS microphone chip of the utility model embodiment.
Fig. 2 is the sectional view according to the MEMS microphone chip of the utility model another embodiment.
Fig. 3 is the sectional view according to the MEMS microphone chip of the utility model another embodiment.
Fig. 4 is the sectional view according to the MEMS microphone chip of the utility model another embodiment.
Fig. 5-8 is the top view according to the vibrating diaphragm of the utility model embodiment.
Description of reference numerals：
11：Substrate；12：Carry on the back chamber；13：Vibrating diaphragm；14：Backplane；15：First salient point；16：Second salient point；17：Limited post；18：
Via；19：Breach.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：It is unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
The description only actually at least one exemplary embodiment is illustrative to be never used as to this practicality below
New and its application or any restrictions used.
It may be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but in appropriate situation
Under, the technology and equipment should be considered as part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
According to the utility model embodiment, there is provided a kind of MEMS microphone chip.As Figure 1-4, the chip includes
Backplane 14, vibrating diaphragm 13 and the substrate 11 with back of the body chamber 12.Substrate 11 links together to form appearance between them with backplane 14
Receive space, receiving space connects with back of the body chamber 12.Vibrating diaphragm 13 is freely arranged in receiving space, and vibrating diaphragm 13 is with carrying on the back the phase of chamber 12
It is right, in order to which external vibration is traveled on vibrating diaphragm 13.Freely set and refer to that vibrating diaphragm 13 is placed directly into receiving space, vibrating diaphragm 13
Do not formed a fixed connection between substrate 11 and vibrating diaphragm 13 and backplane 14, so that vibrating diaphragm 13 can be in receiving space up and down
Vibration.For example, vibrating diaphragm 13 is circle, receiving space is cylinder.The diameter of vibrating diaphragm 13 is less than or equal to the transversal of receiving space
The diameter in face, and more than the diameter of back of the body chamber 12, to prevent vibrating diaphragm 13 from falling into back of the body chamber 12 or be fallen down via back of the body chamber 12.
The vibration of circular membrane 13 is more balanced.The shape of vibrating diaphragm 13 can be, but not limited to, circular and regular polygon.
At work, extraneous sound wave is entered by back of the body chamber 12, drives vibrating diaphragm 13 to be vibrated in receiving space, vibrating diaphragm 13
Interacted with backplane 14 and produce electric signal, realize sound-electric conversion.Vibrating diaphragm 13, substrate 11 and backplane 14 can use ability
The conventional material in domain and preparation method are formed.
Limited post 17 is provided with receiving space, limited post 17 passes through vibrating diaphragm 13, to limit the direction of vibration of vibrating diaphragm 13.
For example, the both ends of limited post 17 link together with substrate 11 and backplane 14 respectively, limited post 17 is through vibrating diaphragm 13 and with shaking
Film 13 does not form connection.For example, limited post 17 is perpendicular to substrate 11 and backplane 14.In this way, vibrating diaphragm 13 can be along limit
Position post 17 carries out up-down vibration, and limited post 17 can effectively prevent horizontal swing of the vibrating diaphragm 13 in vibration processes, prevent from shaking
Film 13 because amplitude is excessive be distorted even into the back of the body chamber 12 in or from the back of the body chamber 12 fall down.The setting of limited post 17 carries
The high service life of MEMS microphone chip, and make the vibration of vibrating diaphragm 13 more accurate, improve the sound effect of chip.
It is provided between backplane 14 and vibrating diaphragm 13 for preventing backplane 14 and the first projection of the adhesion of vibrating diaphragm 13.For example,
The first raised ring-type to be arranged concentrically with back of the body chamber 12 or discrete point-like, due to the first raised setting, in vibration
Vibrating diaphragm 13 is in contact with backplane 14, also can be only formed contact or a linear contact lay, rather than face contact, point contact causes vibrating diaphragm
13 can be easily separated with backplane 14.Adhesion therebetween so can be effectively prevented, so that vibrating effect is more preferably.
In one example, the quantity of limited post 17 is more than or equal to 2 and less than or equal to 32, and limited post 17 is around back of the body chamber
12 equably arrange.The quantitative range can effectively prevent the transverse shifting of vibrating diaphragm 13, and and can effectively avoids the knot to vibrating diaphragm 13
Structure intensity adversely affects.
The material of limited post 17 can be, but not limited to, monocrystalline silicon, polysilicon, silica or silicon nitride.Above-mentioned material
Matter and the material of vibrating diaphragm 13, substrate 11 and backplane 14 are similar, are easy to process.For example, using the method for vapour deposition in substrate
Deposition forms limited post 17 on 11.
Correspondingly, vibrating diaphragm 13 has the part for being used for avoiding limited post 17.For example, as illustrated in figs. 5-7, can be in vibrating diaphragm 13
Edge punched 18 with formed avoid, for example, via 18 be 3,4 etc..For example, as shown in figure 8, it can also be by vibrating diaphragm
The center position of 13 edge to vibrating diaphragm 13 is recessed the breach 19 to be formed for passing through limited post 17, this structure be easy to plus
Work, the high yield rate of vibrating diaphragm 13.
Via 18 or breach 19 can etch to be formed using etching liquid, can also use the method shape of ion beam etching
Into.The shape of via 18 or breach 19 and the shape of limited post 17 match.Such as circular, square, triangle, ellipse
Deng.For example, back of the body chamber 12 is circle, limited post 17 is set on the substrate 11 around back of the body chamber 12.
It is raised that those skilled in the art can use technological means commonly used in the art to form first.Preferably, first
Raised material is identical with the material of backplane 14 or vibrating diaphragm 13.So it is easy to process, and the first projection can use and the back of the body
Pole 14 or the identical forming method of vibrating diaphragm 13 are molded.
In one example, the first projection is integrally formed with vibrating diaphragm 13.Either, as shown in figure 1, first it is raised with
Backplane 14 links together.Both modes are avoided that vibrating diaphragm 13 is sticked together with backplane 14.
In one example, it is provided between vibrating diaphragm 13 and substrate 11 for preventing vibrating diaphragm 13 and the phase adhesion of substrate 11
Second is raised.For example, the second raised ring-type to be arranged concentrically with back of the body chamber 12 or discrete point-like.Due to setting for the second projection
Put, even if vibrating diaphragm 13 is in contact with substrate 11 in vibration, also can be only formed contact or a linear contact lay, rather than face contact.
Adhesion therebetween so can be effectively prevented, so that vibrating effect is more preferably.
For example, as shown in figure 3, vibrating diaphragm 13 with the second projection is integrally formed.For example, the second projection is connected with substrate 11
Together.Both modes are avoided that vibrating diaphragm 13 is sticked together with backplane 14.
In one example, bleeder port, the first projection and the second projection are provided with backplane 14 to be discrete setting
Salient point.For example, first raised the first salient point 15 for discrete setting, the first salient point 15 link together with backplane 14.Second
Projection is the second salient point 16 of discrete setting, and the second salient point 16 is integrally formed with vibrating diaphragm 13.For example, when external pressure makes vibrating diaphragm 13
Move up, when the first salient point 15 is contacted with vibrating diaphragm 13, gap and relief hole between the first salient point 15 form pressure release together
Path, so that the rapid pressure release of partial high pressure between vibrating diaphragm 13 and backplane 14.By the gas that back of the body chamber 12 enters via substrate 11
Gap, the edge of vibrating diaphragm 13 and relief hole between vibrating diaphragm 13 and rapid pressure release.When external pressure moves down vibrating diaphragm 13,
When the second salient point 16 is contacted with substrate 11, gap and relief hole between the second salient point 16 form pressure release path together, so as to
Make the rapid pressure release of partial high pressure between vibrating diaphragm 13 and substrate 11.This setup efficiently avoid vibrating diaphragm 13 because of local height
Press and sustain damage.
According to embodiment of the present utility model, there is provided a kind of MEMS microphone module.The module includes the utility model
The MEMS microphone chip of offer.The module has the characteristics of sound effect is good, service life is long.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that above example merely to illustrate, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case of, to above example
Modify.The scope of the utility model is defined by the following claims.
Claims (10)
1. a kind of MEMS microphone chip, it is characterised in that including backplane (14), vibrating diaphragm (13) and with the substrate for carrying on the back chamber (12)
(11), the substrate (11) links together to form receiving space, the vibrating diaphragm between them with the backplane (14)
(13) freely it is arranged in the receiving space, the vibrating diaphragm (13) carries on the back chamber (12) relatively with described, in the receiving space
Limited post (17) is inside provided with, the limited post (17) passes through the vibrating diaphragm (13), to limit the vibration side of the vibrating diaphragm (13)
To being provided between the backplane (14) and the vibrating diaphragm (13) for preventing that the backplane (14) and the vibrating diaphragm (13) are viscous
First even is raised.
2. MEMS microphone chip according to claim 1, it is characterised in that the quantity of the limited post (17) be more than etc.
In 2 and less than or equal to 32, the limited post (17) is equably arranged around the back of the body chamber (12).
3. MEMS microphone chip according to claim 1, it is characterised in that the material of the limited post (17) is monocrystalline
Silicon, polysilicon, silica or silicon nitride.
4. the MEMS microphone chip according to claims 1 or 2, it is characterised in that set on the vibrating diaphragm (13)
There is the via (18) for passing through the limited post (17).
5. the MEMS microphone chip according to claims 1 or 2, it is characterised in that by the edge of the vibrating diaphragm (13)
Be recessed the breach (19) to be formed and be used for passing through the limited post (17) to the center position of the vibrating diaphragm (13).
6. MEMS microphone chip according to claim 1, it is characterised in that the described first raised and vibrating diaphragm (13)
It is integrally formed or described first raised links together with the backplane (14).
7. MEMS microphone chip according to claim 1, it is characterised in that in the vibrating diaphragm (13) and the substrate
(11) it is provided between for preventing the vibrating diaphragm (13) and second projection of the substrate (11) phase adhesion.
8. according to the MEMS microphone chip described in claim 7, it is characterised in that the vibrating diaphragm (13) and described second convex
It is integrally formed to rise or described second raised links together with the substrate (11).
9. according to the MEMS microphone chip described in claim 7, it is characterised in that be provided with and let out on the backplane (14)
Stomata, the described first raised and described second raised salient point to be discrete setting.
10. a kind of MEMS microphone module, it is characterised in that including the MEMS as described in any one in claim 1-9
Microphone chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720227623 | 2017-03-09 | ||
| CN2017202276231 | 2017-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207053775U true CN207053775U (en) | 2018-02-27 |
Family
ID=60013537
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720752030.7U Active CN207124763U (en) | 2017-03-09 | 2017-06-26 | A kind of MEMS chip |
| CN201710493758.7A Active CN107244646B (en) | 2017-03-09 | 2017-06-26 | MEMS chip |
| CN201720751404.3U Active CN207053775U (en) | 2017-03-09 | 2017-06-26 | A kind of MEMS microphone chip and MEMS microphone module |
| CN201720748389.7U Withdrawn - After Issue CN207061862U (en) | 2017-03-09 | 2017-06-26 | A kind of MEMS chip |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720752030.7U Active CN207124763U (en) | 2017-03-09 | 2017-06-26 | A kind of MEMS chip |
| CN201710493758.7A Active CN107244646B (en) | 2017-03-09 | 2017-06-26 | MEMS chip |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720748389.7U Withdrawn - After Issue CN207061862U (en) | 2017-03-09 | 2017-06-26 | A kind of MEMS chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (4) | CN207124763U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110611851A (en) * | 2019-10-25 | 2019-12-24 | 歌尔科技有限公司 | Single-directional microphone |
| CN111757223A (en) * | 2020-06-30 | 2020-10-09 | 瑞声声学科技(深圳)有限公司 | MEMS microphone chip |
| CN111885473A (en) * | 2020-06-24 | 2020-11-03 | 歌尔微电子有限公司 | Capacitive micro-electro-mechanical system microphone, microphone monomer and electronic equipment |
| CN112492487A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| CN112584282A (en) * | 2020-11-30 | 2021-03-30 | 瑞声新能源发展(常州)有限公司科教城分公司 | Silicon microphone and processing method thereof |
| WO2021189585A1 (en) * | 2020-03-24 | 2021-09-30 | 瑞声声学科技(深圳)有限公司 | Microelectromechanical systems microphone chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN207124763U (en) * | 2017-03-09 | 2018-03-20 | 歌尔科技有限公司 | A kind of MEMS chip |
| CN108616799A (en) * | 2018-04-26 | 2018-10-02 | 七色堇电子科技（上海）有限公司 | A kind of semiconductor devices and preparation method thereof and electronic device |
| CN211209929U (en) * | 2019-11-04 | 2020-08-07 | 歌尔微电子有限公司 | Dustproof anti-blowing micro-electromechanical microphone chip |
| WO2021134334A1 (en) * | 2019-12-30 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
| CN111732072B (en) * | 2020-08-04 | 2020-12-22 | 共达电声股份有限公司 | MEMS chip and MEMS sensor |
| CN214177565U (en) * | 2020-11-17 | 2021-09-10 | 瑞声声学科技(深圳)有限公司 | MEMS microphone chip |
| CN113365197B (en) * | 2021-06-29 | 2023-08-01 | 歌尔微电子股份有限公司 | MEMS microphone and manufacturing method thereof |
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| CN114520947B (en) * | 2022-04-20 | 2022-07-08 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
| CN114513731B (en) * | 2022-04-20 | 2022-06-21 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
| CN115159439A (en) * | 2022-05-26 | 2022-10-11 | 歌尔微电子股份有限公司 | MEMS device and electronic apparatus |
| CN115656548B (en) * | 2022-11-09 | 2023-07-21 | 湖南大学 | MEMS airflow sensor |
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| JP3401405B2 (en) * | 1997-06-06 | 2003-04-28 | 富士通テン株式会社 | Speaker |
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| CN201742550U (en) * | 2009-10-29 | 2011-02-09 | 苏州敏芯微电子技术有限公司 | Capacitance minitype silicon microphone |
| KR102056287B1 (en) * | 2013-11-27 | 2019-12-16 | 한국전자통신연구원 | Microphone |
| CN104507014B (en) * | 2014-12-26 | 2018-08-28 | 上海集成电路研发中心有限公司 | A kind of MEMS microphone and its manufacturing method with fold-type vibrating membrane |
| CN205510403U (en) * | 2016-01-25 | 2016-08-24 | 歌尔声学股份有限公司 | MEMS microphone chip and MEMS microphone |
| CN205491150U (en) * | 2016-01-27 | 2016-08-17 | 瑞声声学科技(深圳)有限公司 | MEMS (Micro -electromechanical system) microphone |
| CN205841125U (en) * | 2016-05-31 | 2016-12-28 | 宁波派锐森液压有限公司 | A kind of return plate of pluger type hydraulic pump |
| CN207124763U (en) * | 2017-03-09 | 2018-03-20 | 歌尔科技有限公司 | A kind of MEMS chip |
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2017
- 2017-06-26 CN CN201720752030.7U patent/CN207124763U/en active Active
- 2017-06-26 CN CN201710493758.7A patent/CN107244646B/en active Active
- 2017-06-26 CN CN201720751404.3U patent/CN207053775U/en active Active
- 2017-06-26 CN CN201720748389.7U patent/CN207061862U/en not_active Withdrawn - After Issue
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110611851A (en) * | 2019-10-25 | 2019-12-24 | 歌尔科技有限公司 | Single-directional microphone |
| CN110611851B (en) * | 2019-10-25 | 2021-06-01 | 歌尔科技有限公司 | Single-directional microphone |
| WO2021189585A1 (en) * | 2020-03-24 | 2021-09-30 | 瑞声声学科技(深圳)有限公司 | Microelectromechanical systems microphone chip |
| CN111885473A (en) * | 2020-06-24 | 2020-11-03 | 歌尔微电子有限公司 | Capacitive micro-electro-mechanical system microphone, microphone monomer and electronic equipment |
| CN111885473B (en) * | 2020-06-24 | 2021-11-16 | 歌尔微电子有限公司 | Capacitive micro-electro-mechanical system microphone, microphone monomer and electronic equipment |
| CN111757223A (en) * | 2020-06-30 | 2020-10-09 | 瑞声声学科技(深圳)有限公司 | MEMS microphone chip |
| CN112584282A (en) * | 2020-11-30 | 2021-03-30 | 瑞声新能源发展(常州)有限公司科教城分公司 | Silicon microphone and processing method thereof |
| CN112492487A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN207061862U (en) | 2018-03-02 |
| CN207124763U (en) | 2018-03-20 |
| CN107244646B (en) | 2023-11-17 |
| CN107244646A (en) | 2017-10-13 |
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