CN106996827A - One kind sensing diaphragm and MEMS microphone - Google Patents
One kind sensing diaphragm and MEMS microphone Download PDFInfo
- Publication number
- CN106996827A CN106996827A CN201710297168.7A CN201710297168A CN106996827A CN 106996827 A CN106996827 A CN 106996827A CN 201710297168 A CN201710297168 A CN 201710297168A CN 106996827 A CN106996827 A CN 106996827A
- Authority
- CN
- China
- Prior art keywords
- sensing diaphragm
- sensitive portion
- sensitive
- maintaining part
- fixed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000035945 sensitivity Effects 0.000 claims abstract description 20
- 238000006073 displacement reaction Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
Abstract
The invention discloses one kind sensing diaphragm and MEMS microphone, including positioned at the sensitive portion of central region, and positioned at sensitive portion's outer ledge and with the sensitive integrally formed fixed part in portion；Also include extending to the gap portion of sensitive portion's marginal position and non-close from fixed part, the gap portion defined on sensing diaphragm root on fixed part, free end extend to the maintaining part of sensitive portion's upper marginal position；The sensitive portion is configured as being subjected to displacement relative to maintaining part when being impacted, to form air flow passage between maintaining part and sensitivity portion.The sensing diaphragm of the present invention, different from traditional pressure-relief valve structure, the vibration characteristics influence on sensitive portion is smaller, and the dynamic stability in sensitive portion is more preferable.
Description
Technical field
Diaphragm, more particularly to a kind of vibrating diaphragm suitable for sounding are sensed the present invention relates to one kind；The invention further relates to one kind
MEMS microphone.
Background technology
The application popularization of MEMS sensing components is in consumption electronic products, and it is current for how accelerating product processes
Produced dust is broken during spare part supplier's focus of attention, such as mobile phone production and assembly cuts directly clear by air gun
Reason, is the minimum scheme of current cost.Therefore the anti-air blowing improvement side of big acoustic pressure or atmospheric pressure must be proposed to MEMS sensor
Case, it is to avoid in assembling process, because air gun cleaning causes microphone to occur fracture failure.
For example in microphone field, current improving countermeasure is that relief hole is set on the vibrating diaphragm of MEMS microphone or is let out
Valve structure.But the structure of relief hole can reduce the effective area of vibrating diaphragm；The pressure-relief valve structure set on vibrating diaphragm can be direct
The vibration characteristics of vibrating diaphragm is influenceed, the low frequency characteristic of vibrating diaphragm is especially influenceed, and the dynamic stability of vibrating diaphragm is poor.
The content of the invention
It is an object of the present invention to provide a kind of new solution for sensing diaphragm.
Diaphragm is sensed there is provided one kind according to the first aspect of the invention, including positioned at the sensitive portion of central region, and
Positioned at sensitive portion's outer ledge and with the sensitive integrally formed fixed part in portion；Also include extending to sensitive portion side from fixed part
Edge position and the gap portion of non-close, the gap portion defined on sensing diaphragm root on the fixed part, free end prolongs
Extend the maintaining part of sensitive portion's upper marginal position；The sensitive portion is configured as occurring position relative to maintaining part when being impacted
Move, to form air flow passage between maintaining part and sensitivity portion.
Alternatively, the maintaining part is at least provided with one.
Alternatively, the maintaining part is at least provided with three, in the circumference for being evenly distributed on sensitive portion edge.
Alternatively, the gap portion includes the first paragraph that is extended to from fixed part in sensitive portion, and from first paragraph termination
The roundabout second segment for extending to fixed part.
Alternatively, the first paragraph, second segment are symmetrical along its center axis.
Alternatively, gap portion overall U-shaped, square, semicircle or half elliptic.
Alternatively, the extension for deviateing itself bearing of trend is provided with the free termination of the first paragraph, second segment.
Alternatively, the ratio of the area that the gap portion extends in sensitive portion and sensitivity portion area is 5%-50%.
Alternatively, the gap portion is formed by way of corroding or etching.
According to another aspect of the present invention, a kind of MEMS microphone, including backplane and above-mentioned sensing film are additionally provided
Piece.
The sensing diaphragm of the present invention, different from traditional pressure-relief valve structure, the air flow passage of pressure release passes through sensitive portion
Itself compressive deformation amount and produce, and the chi that air flow passage is led to can be adjusted according to the external and internal pressure difference in sensitivity portion in real time
Very little (deformation quantity being pressurized by itself adjusts pressure release opening speed in real time) thereby protects sensing diaphragm there is provided pressure release path.This
The sensing diaphragm of invention, because air flow passage is located at the marginal position in sensitivity portion, and passes through the displacement of itself of sensitive portion
Formed, this is allowed for, and vibration characteristics influence of the air flow passage on sensitive portion is smaller, and the dynamic stability in sensitive portion is more preferable.
It was found by the inventors of the present invention that in the prior art, the pressure-relief valve structure set on vibrating diaphragm, which can be directly affected, to shake
Vibration of membrane characteristic, especially influences the low frequency characteristic of vibrating diaphragm, and the dynamic stability of vibrating diaphragm is poor.Therefore, institute of the present invention
The technical assignment or technical problem to be solved to be realized be it is that those skilled in the art never expect or it is not anticipated that
Arrive, therefore the present invention is a kind of new technical scheme.
By referring to the drawings to the detailed description of the exemplary embodiment of the present invention, further feature of the invention and its
Advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiments of the invention, and even
It is used for the principle for explaining the present invention together with its explanation.
Fig. 1 is the structural representation of MEMS microphone of the present invention.
Fig. 2 is the top view of present invention sensing diaphragm.
Fig. 3 is the structural representation in gap portion in Fig. 2.
Fig. 4 is the schematic diagram that sensing diaphragm is subjected to displacement when being impacted in Fig. 1.
Fig. 5 is the structural representation of another embodiment in gap portion of the present invention.
Embodiment
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should be noted that：Unless had in addition
Body illustrates that the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments does not limit this
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its any limitation applied or used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
A kind of sensing diaphragm that the present invention is provided, it can be applied the vibrating diaphragm in microphone structure or answer
Sensitive film layer in sensitive membrane in other sensor constructions, such as pressure sensor, gas sensor.These sensing films
Structure, material, the application environment of piece belong to the common knowledge of each sensor field, no longer illustrate herein.
For the ease of stating, exemplified by present microphone, technical scheme is described in detail, it should be understood that
, for a person skilled in the art, it can also be each sensor of other structures.
A kind of MEMS microphone provided with reference to Fig. 1, the present invention, it includes substrate 1, and forms electricity on substrate 1
Structure of container, the capacitor arrangement includes sensing diaphragm (vibrating diaphragm), backplane 6；Pass through one between the sensing diaphragm and backplane 6
Support part 7 is supported so that have certain gap between sensing diaphragm and backplane 6.The capacitor arrangement can be backplane 6
In upper, structure of the sensing diaphragm under, as shown in Figure 1；For a person skilled in the art, can also be backplane 6 under,
Diaphragm is sensed in upper structure, is no longer illustrated herein.
The sensing diaphragm of the present invention, with reference to Fig. 2, including positioned at the sensitive portion 2 of central region, and outside sensitive portion 2
Lateral edges and with the sensitive integrally formed fixed part 5 in portion 2；The sensitive portion 2 is as the vibration section of microphone, and microphone picks up
Sound relies primarily on the vibration characteristics in sensitive portion 2.Fixed part 5 is used to entirely sense diaphragm connection on substrate 1, so that quick
Sense portion 2 can be vacantly above the back cavity of substrate 1.In specific manufacturing process, first on substrate 1 or above substrate 1
Insulating barrier on deposition thin film layer, afterwards by etch or corrode technique formation positioned at outside fixed part 5 and
Positioned at the sensitive portion 2 of central region.
Certainly, for a person skilled in the art, in order to improve the vibration characteristics in sensitive portion 2, in the sensitive portion 2
Ring portion (view is not provided) is additionally provided between fixed part 5, can significantly improve what sensitive portion 2 vibrated by the ring portion
Sensitivity.
The sensing diaphragm of the present invention, in addition to extend to from fixed part 5 the gap portion 4 of the sensitive marginal position of portion 2, the gap
Portion 4 is non-close, and maintaining part 3, the root position of the maintaining part are defined on sensing diaphragm by the gap portion 4 of the non-close
In on fixed part 5, its free end extends to the marginal position in sensitive portion 2, with reference to Fig. 1, Fig. 2.Maintaining part 3 is the one of sensing diaphragm
Part, the shape of maintaining part 3 is depending on the shape in gap portion 4., for example can be by corroding or etching silicon when shaping
The mode of film layer forms the gap portion 4.
Because the root of maintaining part 3 is located at the position of fixed part 5 of sensing diaphragm, free end is located at the edge in sensitivity portion 2
Position, when sense diaphragm be connected on substrate after, when being impacted by big acoustic pressure or big air-flow, the sensitive portion 2 due to
By larger impact, it can occur displacement upwardly or downwardly relative to maintaining part 3, so that in maintaining part 3 and sensitivity portion 2
Between form can be with the air flow passage of pressure release.
In a specific embodiment of the invention, with reference to Fig. 3, the gap portion 4 is quick including being extended to from fixed part 5
First paragraph 40 in sense portion 2, and from the roundabout second segment 41 for extending to fixed part 5 of first paragraph 40.That is, gap portion 4
Openend be located at the position of fixed part 5, its blind end surrounded by first paragraph 40, second segment 41 is located in sensitivity portion 2 so that
The root of the maintaining part 3 surrounded by first paragraph 40, second segment 41 is located at the position of fixed part 5, and the free end of maintaining part 3 is located at sensing
The position of sensitive portion 2 of diaphragm.
With reference to Fig. 4, when sensing diaphragm by top-down big acoustic pressure, because the free end of maintaining part 3 is extended only to
The marginal position in sensitive portion 2, the compression face in sensitive portion 2 is far longer than maintaining part 3, and sensitive portion 2 is due to by larger impact meeting
It is subjected to displacement downwards, and maintaining part 3 is then remained stationary as, this allows for mutually staggering between sensitive portion 2 and maintaining part 3, from
And the air flow passage between maintaining part 3 and sensitivity portion 2 is opened, so as to rapidly pressure release.
The sensing diaphragm of the present invention, different from traditional pressure-relief valve structure, the air flow passage of pressure release passes through sensitive portion
Itself compressive deformation amount and produce, and the chi that air flow passage is led to can be adjusted according to the external and internal pressure difference in sensitivity portion in real time
Very little (deformation quantity being pressurized by itself adjusts pressure release opening speed in real time) thereby protects sensing diaphragm there is provided pressure release path.This
The sensing diaphragm of invention, because air flow passage is located at the marginal position in sensitivity portion, and passes through the displacement of itself of sensitive portion
Formed, this is allowed for, and vibration characteristics influence of the air flow passage on sensitive portion is very small, and the dynamic stability in sensitive portion is more preferable.
The present invention maintaining part 3 can be provided with one, two, three or more.It is currently preferred to be to maintain
Portion 3 is at least provided with three, and three maintaining parts 3 are evenly distributed in the circumference at the sensitive edge of portion 2.For example when sensitive portion 2 is
During circular configuration, three maintaining parts 3 are evenly distributed on the circumferencial direction at the sensitive edge of portion 2, with ensure the uniformity of pressure release with
And the stability that sensitivity portion 2 is subjected to displacement.
In the preferred embodiment of the present invention, the first paragraph 40, second segment 41 are symmetrical along its center axis so that shape
Into maintaining part 3 be a centrosymmetric structure.Certainly, for a person skilled in the art, the maintaining part 3 can also be
One unsymmetric structure, when being subjected to displacement in sensitive portion 2, can equally form the air flow passage of pressure release.
The gap portion integrally can in regularly or irregularly U-shaped, square, semicircle, half elliptic, with reference to Fig. 5,
Or other shapes well-known to those skilled in the art etc..
Preferably, it is provided with the free termination of the first paragraph 40, second segment 41 and deviates prolonging for itself bearing of trend
Extending portion 42.With reference to Fig. 3, described two extensions 42 can be extended towards the center position in gap portion 4, can also be towards opposite
Opposite extension.The setting of extension 42 can discharge stress when gap portion 4 is formed in film layer well, to ensure to sense film
The flatness and stability of piece.
Development length of the gap portion 4 of the present invention in sensitive portion 2 characterizes development length of the maintaining part 3 in sensitive portion 2,
Which dictates that sensitivity portion 2 is subjected to displacement the size of rear air flow passage.That is, extension of the gap portion 4 in sensitive portion 2
Length is bigger, then the pressure relief capability of the air flow passage between sensitivity portion 2 and maintaining part 3 is bigger.
In addition, if the area that maintaining part 3 takes sensitive portion 2 is excessive, it can cause in big acoustic pressure, maintaining part 3 can also be sent out
Raw relative displacement, the technical scheme of this and the application is disagreed.Accordingly, it would be desirable to design maintaining part 3 and sensitivity portion 2 it
Between dimension scale relation, this proportionate relationship those skilled in the art can by effectively time experiment obtain.In the present invention one
In individual specific embodiment, the proportionate relationship of the area that the gap portion 4 extends in sensitive portion 2 and the area of sensitivity portion 2 is excellent
Choosing is arranged on 5%-50%.
Although some specific embodiments of the present invention are described in detail by example, the skill of this area
Art personnel are it should be understood that example above is merely to illustrate, the scope being not intended to be limiting of the invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (10)
1. one kind sensing diaphragm, it is characterised in that：Including positioned at the sensitive portion (2) of central region, and positioned at sensitive portion (2) outside
Lateral edges and with the integrally formed fixed part of the sensitive portion (2) (5)；Also include extending to sensitive portion (2) side from fixed part (5)
Edge position and the gap portion (4) of non-close, the gap portion (4) defined on sensing diaphragm root on the fixed part (5),
Free end extends to the maintaining part (3) of sensitive portion (2) upper marginal position；The sensitive portion (2) is configured as when being impacted
It is subjected to displacement relative to maintaining part (3), to form air flow passage between maintaining part (3) and sensitivity portion (2).
2. sensing diaphragm according to claim 1, it is characterised in that：The maintaining part (3) is at least provided with one.
3. sensing diaphragm according to claim 2, it is characterised in that：The maintaining part (3) is at least provided with three, uniformly
In the circumference for being distributed in sensitive portion (2) edge.
4. sensing diaphragm according to claim 1, it is characterised in that：The gap portion (4) is included from fixed part (5) extension
To the first paragraph (40) in sensitivity portion (2), and from the roundabout second segment for extending to fixed part (5) in first paragraph (40) termination
(41)。
5. sensing diaphragm according to claim 4, it is characterised in that：The first paragraph (40), second segment (41) are along wherein
Heart axisymmetrical.
6. sensing diaphragm according to claim 5, it is characterised in that：Gap portion (4) overall U-shaped, square, semicircle
Shape or half elliptic.
7. sensing diaphragm according to claim 4, it is characterised in that：The first paragraph (40), second segment (41) from
The extension (42) for deviateing itself bearing of trend is provided with by termination.
8. sensing diaphragm according to claim 1, it is characterised in that：What the gap portion (4) extended on sensitive portion (2)
The ratio of area and sensitivity portion (2) area is 5%-50%.
9. sensing diaphragm according to claim 1, it is characterised in that：The gap portion (4) by corrode or etch
Mode is formed.
10. a kind of MEMS microphone, including backplane and the sensing diaphragm according to claim any one of 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710297168.7A CN106996827B (en) | 2017-04-28 | 2017-04-28 | Sensing diaphragm and MEMS microphone |
| PCT/CN2017/083569 WO2018196036A1 (en) | 2017-04-28 | 2017-05-09 | Sensing diaphragm and mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710297168.7A CN106996827B (en) | 2017-04-28 | 2017-04-28 | Sensing diaphragm and MEMS microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106996827A true CN106996827A (en) | 2017-08-01 |
| CN106996827B CN106996827B (en) | 2020-11-20 |
Family
ID=59434531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710297168.7A Active CN106996827B (en) | 2017-04-28 | 2017-04-28 | Sensing diaphragm and MEMS microphone |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106996827B (en) |
| WO (1) | WO2018196036A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022519A (en) * | 2018-01-08 | 2019-07-16 | 美商富迪科技股份有限公司 | MEMS condenser microphone |
| CN110636417A (en) * | 2018-06-25 | 2019-12-31 | 台湾积体电路制造股份有限公司 | Microphone and method of manufacturing microphone |
| CN111137842A (en) * | 2019-12-31 | 2020-05-12 | 共达电声股份有限公司 | MEMS diaphragm and MEMS sensor chip |
| CN112087698A (en) * | 2020-10-15 | 2020-12-15 | 潍坊歌尔微电子有限公司 | MEMS microphone |
| CN110636417B (en) * | 2018-06-25 | 2024-06-07 | 台湾积体电路制造股份有限公司 | Microphone and method for manufacturing microphone |
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| CN103338427A (en) * | 2013-07-18 | 2013-10-02 | 山东共达电声股份有限公司 | MEMS (micro-electromechanical systems) chip and MEMS microphone |
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| CN106375912A (en) * | 2016-08-31 | 2017-02-01 | 歌尔股份有限公司 | Vibration diaphragm in MEMS microphone, and MEMS microphone |
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| CN103338427A (en) * | 2013-07-18 | 2013-10-02 | 山东共达电声股份有限公司 | MEMS (micro-electromechanical systems) chip and MEMS microphone |
| CN204316746U (en) * | 2014-11-28 | 2015-05-06 | 歌尔声学股份有限公司 | A kind of MEMS sensor and MEMS microphone |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022519A (en) * | 2018-01-08 | 2019-07-16 | 美商富迪科技股份有限公司 | MEMS condenser microphone |
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| CN110636417A (en) * | 2018-06-25 | 2019-12-31 | 台湾积体电路制造股份有限公司 | Microphone and method of manufacturing microphone |
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| CN111137842A (en) * | 2019-12-31 | 2020-05-12 | 共达电声股份有限公司 | MEMS diaphragm and MEMS sensor chip |
| CN111137842B (en) * | 2019-12-31 | 2023-06-23 | 共达电声股份有限公司 | MEMS membrane and MEMS sensor chip |
| CN112087698A (en) * | 2020-10-15 | 2020-12-15 | 潍坊歌尔微电子有限公司 | MEMS microphone |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106996827B (en) | 2020-11-20 |
| WO2018196036A1 (en) | 2018-11-01 |
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