CN206908857U - A kind of MEMS microphone - Google Patents
A kind of MEMS microphone Download PDFInfo
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- CN206908857U CN206908857U CN201720539551.4U CN201720539551U CN206908857U CN 206908857 U CN206908857 U CN 206908857U CN 201720539551 U CN201720539551 U CN 201720539551U CN 206908857 U CN206908857 U CN 206908857U
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- vibrating diaphragm
- substrate
- mems microphone
- comb
- comb portion
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- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
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- 229920005591 polysilicon Polymers 0.000 description 1
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- 239000002210 silicon-based material Substances 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
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Abstract
The utility model discloses a kind of MEMS microphone, including substrate and vibrating diaphragm, backplane above substrate；It is distributed in the marginal position of the vibrating diaphragm formed with multiple comb portions, the multiple comb portion in the circumferential direction of vibrating diaphragm；Wherein, the position on the vibrating diaphragm between two neighboring comb portion is connected on substrate by insulating barrier；Comb portion on the vibrating diaphragm overlaps with substrate at least in part, with gap and is configured to supply the air flow passage that passes through of stream therebetween.Microphone of the present utility model, there is more preferable impact resistance, but also the invasion of dust can be avoided.
Description
Technical field
Field of acoustics is the utility model is related to, more particularly, to a kind of MEMS microphone.
Background technology
For the application popularization of MEMS sensing components in consumption electronic products, it is current for how accelerating product processes
Spare part supplier's focus of attention, for example, during mobile phone production and assembly caused dust it is broken cut it is directly clear by air gun
Reason, is the minimum scheme of current cost.Therefore the anti-air blowing improvement side of big acoustic pressure or atmospheric pressure must be proposed to MEMS sensor
Case, avoid in assembling process, because air gun cleaning causes microphone that fracture failure occurs.
Current improving countermeasure is that relief hole or pressure-relief valve structure are set on the vibrating diaphragm of MEMS microphone.But pressure release
The structure in hole can reduce the effective area of vibrating diaphragm.Can be limited by size in the pressure-relief valve structure that vibrating diaphragm central region is set,
Its pressure relief capability is limited；But also the vibration characteristics of vibrating diaphragm can be directly affected, especially influence the low frequency characteristic of vibrating diaphragm；Vibrating diaphragm moves
State stability is poor.
Utility model content
A purpose of the present utility model is to provide a kind of new solution of MEMS microphone.
According to first aspect of the present utility model, there is provided a kind of MEMS microphone, including substrate and on substrate
Vibrating diaphragm, the backplane of side；The vibrating diaphragm marginal position formed with multiple comb portions, the multiple comb portion, which is distributed in, to shake
In the circumferential direction of film；Wherein, the position on the vibrating diaphragm between two neighboring comb portion is connected on substrate by insulating barrier；
Comb portion on the vibrating diaphragm overlaps with substrate at least in part, therebetween with gap and be configured to supply stream
The air flow passage passed through.
Alternatively, the vibrating diaphragm includes vibrating diaphragm main body and multiple is distributed in vibrating diaphragm body rim and relative to shaking
The raised connecting portion of film body rim, the comb portion are arranged on the position between two neighboring connecting portion in vibrating diaphragm main body
Put；The connecting portion of the vibrating diaphragm is connected on substrate by insulating barrier.
Alternatively, the vibrating diaphragm main body is integrally formed with connecting portion by MEMS technology.
Alternatively, each comb portion includes at least one discouraged flap formed by etching vibrating diaphragm.
Alternatively, the discouraged flap is rectangular, fan-shaped, oval, trapezoidal or S types.
Alternatively, it is provided with the discouraged flap and sacrifices hole.
Alternatively, the vibrating diaphragm upper comb dent portion to the part between vibrating diaphragm center overlaps with substrate.
Alternatively, the gap between the vibrating diaphragm upper comb dent portion position and substrate is 1-2 μm.
Alternatively, the free end of the comb portion extends to the outer ledge of vibrating diaphragm, and with the outer ledge of the vibrating diaphragm
Flush, or relative to vibrating diaphragm outer ledge in inside contracting state.
Alternatively, the free end of the comb portion relative to vibrating diaphragm outer ledge radially raised position.
Microphone of the present utility model, the air-flow in the external world is connected due to being formd between the comb portion region of vibrating diaphragm and substrate
Circulation passage, the acoustic pressure that vibrating diaphragm is subject to can quickly carry out pressure release by the air flow passage, with rapid balanced microphone
The air pressure of outer chamber.And air flow passage can deform upon according to the compression situation of itself, so as in real time according to by
To overload acoustic pressure adjust the logical size of air flow passage, there is provided pressure release path thereby protects vibrating diaphragm.
The logical regulation and control for also achieving MEMS microphone low frequency performance of air flow passage of the present utility model.Simultaneously because shake
The structure design of film so that the air flow passage can greatly improve the impact resistance of microphone, and can effectively cover powder
Dirt, particulate, dust particle invasion is avoided to produce injury to chip itself.
Inventor of the present utility model has found that in the prior art, the pressure relief capability of relief hole or pressure-relief valve structure has
Limit, and the acoustical behavior of microphone can be influenceed.Therefore, the technical assignment or to be solved that the utility model to be realized
Technical problem be it is that those skilled in the art never expect or it is not expected that, therefore the utility model is a kind of new technology
Scheme.
It is of the present utility model other by referring to the drawings to the detailed description of exemplary embodiment of the present utility model
Feature and its advantage will be made apparent from.
Brief description of the drawings
It is combined in the description and the accompanying drawing of a part for constitution instruction shows embodiment of the present utility model, and
And it is used to explain principle of the present utility model together with its explanation.
Fig. 1 is profile of the utility model microphone from vibrating diaphragm and substrate link position.
Fig. 2 is the structural representation of the utility model vibrating diaphragm.
Fig. 3 is the partial enlarged drawing of comb portion in Fig. 2.
Fig. 4 to Fig. 6 is three kinds of different modes of operation of the utility model microphone.
Fig. 7 is another schematic diagram for implementing structure of the utility model vibrating diaphragm.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：It is unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
The description only actually at least one exemplary embodiment is illustrative to be never used as to this practicality below
New and its application or any restrictions used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
With reference to figure 1, the utility model provides a kind of MEMS microphone, and it includes substrate 1 and above substrate 1
Vibrating diaphragm 2, backplane 5.The central region of substrate 1 is supported on the upper of substrate 1 formed with back of the body chamber, the vibrating diaphragm 2 by the first insulating barrier 3
Side, so as to ensure the insulation between vibrating diaphragm 2 and substrate 1, and the central region of vibrating diaphragm 2 is set to be suspended at the top that substrate 1 carries on the back chamber.The back of the body
Multiple through holes 50 are provided with pole 5, it is supported on the top of vibrating diaphragm 2 by the second insulating barrier 4, and second insulating barrier 4 is not only
The mutually insulated between backplane 5 and vibrating diaphragm 2 can be ensured, can also make that there is certain gap between backplane 5 and vibrating diaphragm 2.The back of the body
Voice signal can be converted to the capacitor arrangement of electric signal by being constituted between pole 5 and vibrating diaphragm 2.
Microphone of the present utility model is manufactured using MEMS technology, and monocrystalline silicon material, vibrating diaphragm 2 and backplane 5 can be selected in substrate 1
Polysilicon material can be used, the first insulating barrier 3, the second insulating barrier 4 can use silica material, this microphone
Structure and its manufacturing process belong to the common knowledge of those skilled in the art, no longer illustrate herein.
With reference to figure 2, Fig. 3, vibrating diaphragm 2 provided by the utility model, in its marginal position formed with multiple comb portions 22, the comb
Teeth portion 22 can be by etching at least one discouraged flap 220 formed in the marginal position of vibrating diaphragm 2.The number of discouraged flap 220
Amount can be one, two, three or more, depending on actual design requirement.The discouraged flap 220 can be with
The air-outlet valve structure well-known to those skilled in the art such as rectangular, fan-shaped, oval, trapezoidal or S types.
Comb portion 22 of the present utility model can be arranged on the inside of vibrating diaphragm 2, for example, the discouraged flap 220 is formed
The fringe region of vibrating diaphragm 2, its free end is still in vibrating diaphragm 2.
In the utility model another specific embodiment, the free end of the comb portion 22 extends to vibrating diaphragm 2
Outer ledge, when making, the edge of vibrating diaphragm 2 is run through in the gap of etching, so as to form the discouraged flap 220, and will
The free end of discouraged flap 220 discharges, with reference to figure 2, Fig. 3.The free end of the discouraged flap 220 of the utility model can be with shaking
The outer ledge of film 2 flushes, that is to say, that the radial dimension at the center of vibrating diaphragm 2 to the discouraged free end of flap 220 and the center of vibrating diaphragm 2
Radial dimension to the edge of vibrating diaphragm 2 is consistent.Can also be that the free end of the discouraged flap 220 of the utility model is relative to vibrating diaphragm 2
Outer ledge radially inside contracts state, that is to say, that the radial dimension at the center of vibrating diaphragm 2 to the discouraged free end of flap 220, which is less than, to shake
The radial dimension at the center of film 2 to the edge of vibrating diaphragm 2.
Certainly, for a person skilled in the art, the free end of the comb portion 22 relative to vibrating diaphragm 2 outer side edges
Edge can also radially raised state.That is, the free end of comb portion 22 extends to the outside at the edge of vibrating diaphragm 2, reference
Fig. 7.
Multiple comb portions 22 of the present utility model are distributed in the circumferential direction of vibrating diaphragm 2, so as to realize vibrating diaphragm periphery
The uniformity of pressure release on direction.Such as when vibrating diaphragm 2 is circular, multiple comb portions 22 can be evenly distributed on the circumference of vibrating diaphragm 2
On direction.The quantity of comb portion 22 can according to the actual requirements depending on, such as shown in Figure 2 six can be selected.
MEMS microphone of the present utility model, the position on the vibrating diaphragm 2 between two neighboring comb portion 22 pass through first
Insulating barrier 3 connects on substrate 1, and the comb portion 22 on the vibrating diaphragm 2 overlaps with substrate 1 at least in part.By
Tie point between vibrating diaphragm 2 and substrate 1 between two neighboring comb portion 22, and the region of comb portion 22 and substrate 1 it
Between not the first insulating barrier 3, this allows for having certain gap, the gap quilt between the region of comb portion 22 and substrate 1
It is configured to supply the air flow passage 6 that stream passes through.The size in the gap can be for example 1-2 μm, specifically need according to ASIC
Bias that chip is provided determines.
Fig. 1 is profile of the utility model microphone along vibrating diaphragm 2 and the link position of substrate 1, and Fig. 4 is the utility model wheat
Gram profile of the wind along the position of 2 comb portion of vibrating diaphragm 22.The region of comb portion 22 at the edge of vibrating diaphragm 2 be vacantly in the top of substrate 1, this
The air flow passage 6 for allowing for surrounding can be communicated to the outside of microphone, consequently facilitating pressure release.
For a person skilled in the art, MEMS microphone be by layer by layer deposition, successively etching and follow-up
What corrosion obtained.That is, the lower section of vibrating diaphragm layer is the first insulating barrier of a flood originally.Between comb portion 22 and substrate 1
The first insulating barrier can by lose heart flap 220 between gap be corroded.The utility model is preferably, and is let out described
It is provided with air flap 220 and sacrifices hole 221, with reference to figure 3.The setting in the sacrifice hole 221 is not only advantageous to the fast of the first insulating barrier
Speed corrosion, but also the discouraged pressure relief capability of itself of flap 220 can be improved.
Vibrating diaphragm 2 of the present utility model can be a circular membrane, in one preferred embodiment of the utility model, ginseng
Fig. 2 is examined, the vibrating diaphragm 2 includes vibrating diaphragm main body 20 and multiple connecting portions 21 for being distributed in the edge of vibrating diaphragm main body 20, the company
Socket part 21 is relative to the edge of vibrating diaphragm main body 20 radially raised state so that whole vibrating diaphragm 2 is in gear-like.The vibrating diaphragm 2
Connecting portion 21 is connected on substrate 1 by the first insulating barrier 3, so as to realize overall support, the connection on substrate 1 of vibrating diaphragm 2.
The comb portion 22 forms the position between two neighboring connecting portion 21 in vibrating diaphragm main body 20.This practicality is new
The vibrating diaphragm main body 20 of type, connecting portion 21, comb portion 22 can be formed by way of etching in same vibrating diaphragm layer, this
MEMS technology belongs to the common knowledge of those skilled in the art, no longer illustrates herein.
The structure design of the utility model air flow passage 6 makes it have three kinds of modes of operation, with reference to figure 4 to Fig. 6.
Fig. 4 shows the first mode of operation of the utility model air flow passage 6, when vibrating diaphragm 2 is normally working
During state, air-flow can be flowed out by air flow passage 6, so as to meet the needs of regulation and control microphone low frequency performance.
Fig. 5 shows second of mode of operation of the utility model air flow passage 6, when vibrating diaphragm 2 is by micro mistake
Carry acoustic pressure, for example, by 0.2-0.4MPa overload acoustic pressure when, the comb portion 22 on vibrating diaphragm 2 can be heaved, so that air-flow
Circulation passage 6 forms the structure of an enlarging, in order to quick pressure releasing, ensures that vibrating diaphragm 2 is not damaged by overload acoustic pressure.
Fig. 6 shows the third mode of operation of the utility model air flow passage 6, when vibrating diaphragm 2 is by larger mistake
Carry acoustic pressure, for example, by 0.4-0.8MPa overload acoustic pressure when, because the edge of vibrating diaphragm 2 only part links together with substrate 1, this
Allowing for larger overload acoustic pressure can make vibrating diaphragm 2 be pressurized and be subjected to displacement, so as to provide the pressure release path of maximum；Vibrating diaphragm 2 simultaneously
On comb portion 22 can be heaved so that air flow passage 6 forms the structure of an enlarging, in order to quick pressure releasing,
Ensure that vibrating diaphragm 2 is not damaged by overload acoustic pressure.
Microphone of the present utility model, the external world is connected due to being formd between the region of comb portion 22 of vibrating diaphragm 2 and substrate 1
Air flow passage 6, the acoustic pressure that vibrating diaphragm 2 is subject to can quickly carry out pressure release by the air flow passage 6, with rapid balanced wheat
The air pressure of outer chamber in gram wind.And air flow passage 6 can deform upon according to the compression situation of itself, so as to real-time
The logical size of air flow passage is adjusted according to the overload acoustic pressure being subject to, there is provided pressure release path thereby protects vibrating diaphragm 2.
The logical regulation and control for also achieving MEMS microphone low frequency performance of air flow passage of the present utility model.Simultaneously because shake
The structure design of film 2 so that the air flow passage 6 can greatly improve the impact resistance of microphone, and can effectively cover
Dust, particulate, dust particle invasion is avoided to produce injury to chip itself.
Microphone of the present utility model, the upper comb dent portion 22 of vibrating diaphragm 2 and the overlapping dimension of substrate 1 determine air flow passage
6 lateral length.The comb portion 22 partly can overlap with substrate 1.Preferably, the comb portion 22 is whole
Overlaped with substrate 1.
It is further preferred that the upper comb dent portion 22 of vibrating diaphragm 2 to the part between the center of vibrating diaphragm 2 overlaps with substrate 1.
That is, not only comb portion 22 all overlaps with substrate 1, the upper comb dent portion 22 of vibrating diaphragm 2 to the area between the center of vibrating diaphragm 2
Domain is also partly extended to the top of substrate 1, and participates in the formation of air flow passage 6.This substantially prolongs airflow to lead to
The lateral dimension in road 6, when by larger overload acoustic pressure, be advantageous to drive vibrating diaphragm 2 is overall to be subjected to displacement, to provide maximum
Pressure release path.And longer air flow passage 6, dust particle can be effectively prevented from and invaded to the inside of chip.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that example above merely to illustrate, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case of, to above example
Modify.The scope of the utility model is defined by the following claims.
Claims (10)
- A kind of 1. MEMS microphone, it is characterised in that：Vibrating diaphragm (2), backplane including substrate (1) and above substrate (1) (5)；It is distributed in the marginal position of the vibrating diaphragm (2) formed with multiple comb portions (22), the multiple comb portion (22) In the circumferential direction of vibrating diaphragm (2)；Wherein, the position on the vibrating diaphragm (2) between two neighboring comb portion (22) passes through insulating barrier It is connected on substrate (1)；Comb portion (22) on the vibrating diaphragm (2) overlaps with substrate (1) at least in part, the two it Between there is gap and be configured to supply the air flow passage (6) that passes through of stream.
- 2. MEMS microphone according to claim 1, it is characterised in that：The vibrating diaphragm (2) include vibrating diaphragm main body (20) with And multiple it is distributed in vibrating diaphragm main body (20) edge and relative to the connecting portion (21) of vibrating diaphragm main body (20) edge protuberance, institute State comb portion (22) and be arranged on position in vibrating diaphragm main body (20) between two neighboring connecting portion (21)；The vibrating diaphragm (2) Connecting portion (21) be connected to by insulating barrier on substrate (1).
- 3. MEMS microphone according to claim 2, it is characterised in that：The vibrating diaphragm main body (20) is logical with connecting portion (21) MEMS technology is crossed to be integrally formed.
- 4. MEMS microphone according to claim 1, it is characterised in that：Each comb portion (22) includes at least one The discouraged flap (220) formed by etching vibrating diaphragm (2).
- 5. MEMS microphone according to claim 4, it is characterised in that：The discouraged flap (220) is rectangular, it is fan-shaped, Oval, trapezoidal or S types.
- 6. MEMS microphone according to claim 4, it is characterised in that：It is provided with the discouraged flap (220) sacrificial Domestic animal hole (221).
- 7. MEMS microphone according to claim 1, it is characterised in that：Vibrating diaphragm (2) the upper comb dent portion (22) is to vibrating diaphragm (2) part between center overlaps with substrate (1).
- 8. MEMS microphone according to claim 1, it is characterised in that：Vibrating diaphragm (2) upper comb dent portion (22) position with Gap between substrate (1) is 1-2 μm.
- 9. according to the MEMS microphone described in any one of claim 1 to 8, it is characterised in that：The freedom of the comb portion (22) End extends to the outer ledge of vibrating diaphragm (2), and is flushed with the outer ledge of the vibrating diaphragm (2), or relative to the outer of vibrating diaphragm (2) Lateral edges are in inside contract state.
- 10. according to the MEMS microphone described in any one of claim 1 to 8, it is characterised in that：The freedom of the comb portion (22) End relative to vibrating diaphragm (2) outer ledge radially raised position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720539551.4U CN206908857U (en) | 2017-05-15 | 2017-05-15 | A kind of MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720539551.4U CN206908857U (en) | 2017-05-15 | 2017-05-15 | A kind of MEMS microphone |
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| Publication Number | Publication Date |
|---|---|
| CN206908857U true CN206908857U (en) | 2018-01-19 |
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ID=61288951
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|---|---|---|---|
| CN201720539551.4U Active CN206908857U (en) | 2017-05-15 | 2017-05-15 | A kind of MEMS microphone |
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| Country | Link |
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| CN (1) | CN206908857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107105377A (en) * | 2017-05-15 | 2017-08-29 | 歌尔股份有限公司 | A kind of MEMS microphone |
-
2017
- 2017-05-15 CN CN201720539551.4U patent/CN206908857U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107105377A (en) * | 2017-05-15 | 2017-08-29 | 歌尔股份有限公司 | A kind of MEMS microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191118 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co., Ltd Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Gore Co., Ltd. |
|
| TR01 | Transfer of patent right |