CN207028385U - Single, double surface non-gel flexible copper-clad plate - Google Patents
Single, double surface non-gel flexible copper-clad plate Download PDFInfo
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- CN207028385U CN207028385U CN201720253201.1U CN201720253201U CN207028385U CN 207028385 U CN207028385 U CN 207028385U CN 201720253201 U CN201720253201 U CN 201720253201U CN 207028385 U CN207028385 U CN 207028385U
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Abstract
A kind of production technology used time is short, bond strength is high between copper foil and soft board and is advantageous to improve the single, double surface non-gel flexible copper-clad plate that bubbling, flexible plate copper foil dislocation waste product are reduced when mounting component during yield, yield and use afterwards in process of production.It by the two individual layer non-gel flexible copper-clad plates made in 300 DEG C 400 DEG C and pressure is 60 120 tons/cm that two-sided non-gel flexible copper-clad plate, which is,2Under conditions of through hot pressing form five layers of insulated substrate.It can greatly shorten pressing-in temp when warm and pressing before pressing in the hot pressing stage, improve production efficiency, reduce energy expenditure.Production efficiency can improve 5-10 times.Moreover, product smooth performance is good, bubbling is bad to be greatly reduced.
Description
Technical field
A kind of single, double surface non-gel flexible copper-clad plate (abbreviation FCCL) and manufacture method are the utility model is related to, more particularly to
A kind of two-sided non-gel flexible copper-clad plate that at least three layers thermoplastic polyimide layer is stacked between two-sided copper foil and manufacturer
Method.
Background technology
The development trend of global electronic industry is to compact, high-fire resistance, multifunctionality, densification, Gao Ke at present
Develop by the direction of property and low cost, therefore the selection of substrate just turns into critically important influence factor.And good substrate is necessary
Possess high thermal conductivity, high dimensional stability, the high material for hiding color effect, high-cooling property, high-fire resistance and low thermal coefficient of expansion
Characteristic.Polyimide resin heat endurance is high and has excellent thermal diffusivity, mechanical strength and adherence, often applies to a variety of
Electronic material, such as it is used for flexible printed wiring board (Flexible Printed Circuit).
And by polyimides (including multi-layer thermoplastic polyimides, abbreviation TPI, and Multi-layer thermal solidity polyimides, referred to as
PI) the two-sided non-gel flexible copper-clad plate formed as the dielectric film (soft board 2) between double copper foil layers 1 put goods on the market to
The present, about 10 years, substantially divide following two generations product：
1st, for first generation production life cycle in 5-7, it is by copper foil layer 1, the and of soft board 2 made in advance by TPI+PI+TPI
Another copper foil layer 1 is sent into pressing machine simultaneously, and two-sided non-gel flexible copper-clad plate is formed after hot pressing (refering to shown in Fig. 1).
Advantage：Realize without the two-sided copper coin of glue.
Shortcoming：
1) technique controlling difficulty is big in production process, due to three plates (two copper coins and a soft board 2) being sent into simultaneously
Pressing machine hot pressing, therefore, the tension force difficulty of equipment tensioning apparatus (wrap-up of i.e. three plates) are big, longer pressing
During copper-clad plate, wrinkle are also easy to produce.
2) when pressing, rolling speed is unsuitable too fast, is otherwise easily caused finished product out-of-flatness, therefore, control speed 1-3 rice/
Minute, cause production efficiency low.
2nd, second generation product is used till today, such as Chinese utility model patent (Patent No.：CN200720138928, title
For《Without binding agent double-side copper foil base board》) a kind of two-sided non-gel flexible copper-clad plate for disclosing (refering to shown in Fig. 2,3).
It is to apply one layer of PI layer (thermosetting polyamides Asia on a surface of copper foil layer 1 using shower nozzle with mechanically spraying means
Amine layer), the PI layers are solidified using air-dried means, and then TPI layers are formed using above-mentioned coating and air-dried means on PI layers
(i.e. thermoplastic polyimide layer), form individual layer non-gel flexible copper-clad plate.
By above-mentioned two individual layers non-gel flexible copper-clad plate, connected with the TPI layers in first with the TPI layers in second patch
The mode of conjunction, preheated using continuous high temperature and formed in a nitrogen environment after high-temperature laminating without binding agent double-side copper foil base board
(i.e. second generation product, it is in fact the five-layer structure being stacked by Cu+PI+TPI+TPI+PI+Cu, two layers in-between of TPI is through hot pressing
One layer is formed afterwards).
Advantage：Because the difference of thermal expansion coefficient between PI and copper foil layer is smaller, therefore, first generation product point is which solved
The defects of layer plate bursting.Further, since be sent into pressing machine is two individual layer non-gel flexible copper-clad plates, during pressing, to winding device
The adjustment of tension force with respect to (having lacked a soft board 2) is adjusted well for generation product, and therefore, rolling speed is quicker compared with generation product,
Thus, relative to improve production efficiency, generally, its rolling speed is at 3-5 ms/min.
Shortcoming：
1) because PI glass transition temperature (abbreviation Tg temperature) is too high, so its peeling force between layers of copper is relatively low
(peeling force is also known as peel strength, and it refers to the material being pasted together, required when carrying out unit width stripping from contact surface
Maximum, force, the adhesion strength between its reaction material).
In this way, the peeling force between PI and copper foil layer 1 is relatively low, easily cause circuit to come off, be particularly in conducting wire
During fine rule road.
2) high-temperature laminating speed causes low production efficiency slowly.
Because the glass transition temperature of PI layers is very high, generally at more than 380 degree Celsius, by two individual layer non-gel flexibles
When copper-clad plate is pressed into no binding agent double-side copper foil base board, if temperature during pressing is relatively low, the PI layers below Tg temperature
The intimate rigid sticking structure (PI layers now are glassy state) between copper foil layer 1, in high pressure roll-in, easily produce therebetween wrong
Position is peeled off, therefore, in order to avoid occurring peeling off waste product, it is necessary to carry out by low temperature extremely the copper-clad plate of individual layer non-gel flexible before pressing
The warm (temperature during pressing generally need to be at more than 400 degree Celsius) of high temperature, will so cause energy consumption to increase.
Because warm is completed in the case of individual layer non-gel flexible copper-clad plate forward (FWD) is slow, therefore, lead
Cause its production efficiency is not high (if forward (FWD) excessive velocities, to be pressed by force in the case where PI layers degree of rigidity is relatively strong, institute's structure can be caused
Into without binding agent double-side copper foil base board poor flatness and adhesion it is low).
3) during user uses above-mentioned no binding agent double-side copper foil base board, in attachment component high temperature piece or cross back
During fluid welding, bubbling is easily produced.
Its reason is：Temperature when high temperature piece or excessively Reflow Soldering is at 280 degree Celsius or so, and the Tg temperature of PI layers is being taken the photograph
More than 380 degree of family name, now, relatively (now PI layers are glassy state to the degree of rigidity of PI layers, compared to its height more than Tg temperature by force
Play state for, degree of rigidity is stronger), because the peeling force between PI layers and layers of copper is relatively low, therefore, certain pressure effect and
Under high temperature thermal shocking, rigid PI layers are also easy to produce with copper foil layer 1 to be separated, i.e. described bubbling.
Utility model content
The technical problems to be solved in the utility model, which is to provide between a kind of short production technology used time, copper foil and soft board, to be combined
Intensity is high and is advantageous to improve in process of production and reduces drum when mounting component during yield, yield and use afterwards
Bubble, the single, double surface non-gel flexible copper-clad plate of flexible plate copper foil dislocation waste product and its manufacture method.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is：
Individual layer non-gel flexible copper-clad plate of the present utility model, including copper foil layer and be fixed in it is exhausted on the surface of copper foil layer one
Edge basic unit, it is characterised in that：The insulated substrate is followed successively by the composite bed of the first thermoplastic layer, thermoset layer and the second thermoplastic layer, its
In, thermoset layer is the permeable formation mutually to blend with the abutted surface of the first thermoplastic layer, the second thermoplastic layer respectively；First thermoplastic layer
It is thermoplastic polyimide layer with the second thermoplastic layer, thermoset layer is thermoset polyimide layer.
First thermoplastic layer thickness is 1 μm to 5 μm, and the thickness of the second thermoplastic layer is 1 μm to 5 μm；The thickness of thermoset layer is 3 μm
To 20 μm.
Peel strength between first thermoplastic layer and the copper foil layer is not less than 1.0kgf/cm.
The Tg temperature of first thermoplastic layer and the second thermoplastic layer is less than 330 DEG C, and the Tg temperature of thermoset layer is higher than 380 DEG C.
The copper foil layer is one kind in rolled copper foil, electrolytic copper foil and high extension copper foil, and the thickness of the copper foil is 7.5
μm-35μm。
Two-sided non-gel flexible copper-clad plate of the present utility model, it is by the individual layer non-gel flexible copper-clad plate of the present utility model
In 300 DEG C -400 DEG C and pressure it is 60-120 tons/cm in a manner of the second thermoplastic layer therein connects2Under conditions of through hot pressing
The double face copper of the five layers of insulated substrate formed, it is followed successively by top layer copper foil, thermoplastic upper strata, thermosetting upper strata, thermoplastic respectively
Layer, thermosetting lower floor, thermoplastic lower floor and bottom copper foil, wherein, thermoplastic middle level is melted as the second thermoplastic layer described in two layers through hot pressing
It is integrated composition；Thermosetting upper strata is the permeable formation mutually to blend with the abutted surface in thermoplastic upper strata, thermoplastic middle level respectively, thermosetting lower floor
It is the permeable formation mutually to blend with the abutted surface of thermoplastic middle level, thermoplastic lower floor respectively.
The preparation method of two-sided non-gel flexible copper-clad plate of the present utility model, there is following steps：
1) individual layer non-gel flexible copper-clad plate is made：
Using comprising unreeling, being coated with, dry and winding function is in the coating machine of one, by TPI and thermosetting
The liquid dispersion of property polyimides uses one or many coating methods, and the first thermoplastic is formed on a surface of copper foil layer
Layer, thermoset layer and the second thermoplastic layer；
2) two-sided non-gel flexible copper-clad plate is made：
The individual layer non-gel flexible copper-clad plate that two are made, in a manner of the second thermoplastic layer therein connects
300 DEG C -400 DEG C and pressure are 60-120 tons/cm2Under conditions of, five layers of insulated substrate are formed with 1-30m/min speed pressing
Double face copper, it is followed successively by under top layer copper foil, thermoplastic upper strata, thermosetting upper strata, thermoplastic middle level, thermosetting lower floor, thermoplastic respectively
Layer and bottom copper foil, wherein, thermoplastic middle level is combined together through hot pressing by the second thermoplastic layer described in two layers and formed；Thermosetting upper strata
Be the permeable formation mutually to blend with the abutted surface in thermoplastic upper strata, thermoplastic middle level respectively, thermosetting lower floor respectively with thermoplastic middle level, thermoplastic
The abutted surface of lower floor is the permeable formation mutually to blend.
In method of the present utility model, the length range of the individual layer non-gel flexible copper-clad plate is in 100m-5000m.
In method of the present utility model, used in the liquid dispersion of coating thermoplastic polyimides and Thermocurable polyimide
Nozzle the liquid dispersion is disposably sprayed into copper foil layer surface using three-in-one coating nozzles, the nozzle includes shell
Body, the liqiud outlet head and feed flow interface for being located at housing front and rear respectively, the liqiud outlet head are shaped as flat cone body, gone out
The front end of liquid head is from top to bottom sequentially provided with separate Shang Zui, Zhong Zui and lower mouth, and three also are provided with the feed flow interface
Individual liquid-inlet corresponding with described Shang Zui, Zhong Zui and lower mouth；Liqiud outlet head to the housing cavity between feed flow interface is three phases
The liquor charging passage mutually isolated, described Shang Zui, Zhong Zui and lower mouth correspond to a liquor charging passage respectively.
Compared with prior art, two-sided non-gel flexible copper-clad plate of the present utility model is to use three-in-one coating nozzles once
TPI materials, PI materials and TPI materials are coated on individual layer copper foil by property successively first forms individual layer non-gel flexible copper-clad plate, then,
Two individual layer non-gel flexible copper-clad plates are pressed together again and form product of the present utility model.It is new from structure, this practicality
Type is made up of for six layers Cu+TPI+PI+TPI+TPI+PI+TPI+Cu, in fact, after pressing, two layers middle of TPI melts as one
Layer, and because all PI and TPI are disposably sprayed in flow regime, so being had between adjacent TPI layers and PI layers
Trace level interpenetrates, and thus, the characteristics such as its thermal coefficient of expansion, glass transition temperature is occurred gradually in this infiltration area
Become, and adhesion therebetween is got a promotion.Further, since TPI layers connect with copper foil layer, and TPI Tg temperature is at 280 degree
In left and right, either the high temperature piece in hot pressing process or the use afterwards of production phase or mistake reflow process,
Because of Wen Du≤Tg temperature of TPI layers, it is in elastomeric state, therefore, its abutted surface between copper foil in the case of compression not
Rigid hierarchical or inconsistent phenomenon occurs, can still keep very high cohesive force therebetween.Equally, between TPI layers and PI layers
Abutted surface is also at elastic abutment state, is also not in rigid hierarchical or inconsistent phenomenon in the case of compression similarly.The structure
The adhesion between soft board and copper foil can be made to improve 60%.
Two-sided non-gel flexible copper-clad plate of the present utility model can greatly shorten preheated before pressing in the hot pressing stage
Pressing-in temp when journey and pressing, thus, can both improve production efficiency, can reduce energy expenditure again.By two individual layers without
When glue flexibility coat copper plate presses, temperature need to only control the Tg temperature in TPI on the upper side, and speed of production (i.e. without glue scratch by individual layer
Tape speed is entered in property copper-clad plate) it can improve to 10-15 ms/min, compared with prior art, production efficiency can improve 5-10 times.
Temperature during due to pressing is not high, accordingly, produces asking for bubbling when also solving high temperature between soft board and copper foil
Topic.Improve the smooth performance of product.Simultaneously as preheating and bonding processes temperature be not high, the rigidity of copper foil is stronger, before pressing,
The tension force of winding device is easily adjusted in place and copper foil shrinkage effect is small after pressing, thus can reduce two-sided non-gel flexible after pressing
The problem of plate face out-of-flatness of copper-clad plate.
Brief description of the drawings
Fig. 1 is manufacture and the structural representation of the two-sided non-gel flexible copper-clad plate of the first generation.
Fig. 2 is the manufacture of individual layer copper-clad plate and structural representation in the two-sided non-gel flexible copper-clad plate of the second generation.
Fig. 3 is the two-sided non-gel flexible copper-clad plate manufacture of the second generation and structural representation.
Fig. 4 is the manufacture of individual layer copper-clad plate and structural representation in two-sided non-gel flexible copper-clad plate of the present utility model.
Fig. 5 is two-sided non-gel flexible copper-clad plate manufacture of the present utility model and structural representation.
Reference is as follows：
Copper foil layer 1, soft board 2, coating nozzles 3, drying plant 4, press 5, TPI layer TPI, PI layers PI.
Embodiment
As shown in Figure 4,5, two-sided non-gel flexible copper-clad plate of the present utility model is that the individual layer that will be made in advance is scratched without glue
Property copper-clad plate is superimposed together, then is made through hot pressing, and its manufacturing process is as follows：
First, individual layer non-gel flexible copper-clad plate is made
Using comprising unreeling, being coated with, dry and winding function is in the coating machine of one, by TPI (English
Abbreviation TPI) and the liquid dispersion of Thermocurable polyimide (English abbreviation PI) use one or many coating methods, in copper foil
The insulated substrate for being secured to connection is formed on one surface of layer 1, the insulated substrate is to be sequentially stacked the first thermoplastic together
Layer, thermoset layer and the second thermoplastic layer.Wherein, first thermoplastic layer and the second thermoplastic layer are thermoplastic polyimide layer (abbreviation
TPI layers, similarly hereinafter), thermoset layer is thermoset polyimide layer (abbreviation PI layers, similarly hereinafter).
The insulated substrate can use three-in-one coating nozzles 3 disposably by above-mentioned triple coatings in the table of copper foil layer 1
On face；First two layers in above-mentioned three layers can also be coated on the surface of copper foil layer 1 using two-in-one coating nozzles 3, then
Another layer therein is coated on two layers of outer surface of composition；Can also the routinely coating of coating method again and again, i.e.,
The first thermoplastic layer, thermoset layer and the second thermoplastic layer are sequentially coated with successively.
First thermoplastic layer thickness is 1 μm to 5 μm, and the thickness of the second thermoplastic layer is 1 μm to 5 μm；The thickness of thermoset layer is 3 μm
To 20 μm.
Peel strength between first thermoplastic layer and the copper foil layer 1 is not less than 1.0kgf/cm.
The Tg temperature of first thermoplastic layer and the second thermoplastic layer is less than 330 DEG C, and the Tg temperature of thermoset layer is higher than 380 DEG C.
The copper foil layer 1 is one kind in rolled copper foil, electrolytic copper foil and high extension copper foil, and the thickness of the copper foil layer 1
For 7.5 μm -35 μm.
The length range of the individual layer non-gel flexible copper-clad plate is in 100-1000m.
The utility model preferentially uses three-in-one coating nozzles 3, and the three-in-one coating nozzles 3 include housing, are located at respectively
The liqiud outlet head and feed flow interface of housing front and rear, the liqiud outlet head is shaped as flat cone body, in the front end of liqiud outlet head
From top to bottom be sequentially provided with separate Shang Zui, Zhong Zui and lower mouth, the feed flow interface also be provided with three with it is described on
Mouth, Zhong Zui and liquid-inlet corresponding to lower mouth；Liqiud outlet head is three to the housing cavity between feed flow interface and mutually isolated sent
Liquid passage, described Shang Zui, Zhong Zui and lower mouth correspond to a liquor charging passage, a kind of each described liquid of liquor charging passage conveying respectively
State dispersion.
Above-mentioned coating method is whether coated with using once coating or using gradation, in the insulated substrate between each layer
The permeable formation mutually to blend is formed in microscopic dimensions, thus, Formation and characteristics (such as hot expansion system, glass between the layers
Change transition temperature) transitional region (i.e. thermoset layer and the abutted surface of the first thermoplastic layer, thermoset layer and the abutted surface of the second thermoplastic layer).
2nd, two-sided non-gel flexible copper-clad plate (as shown in Figure 5) is made
1st, two individual layer non-gel flexible copper-clad plates made are taken, in a manner of the second thermoplastic layer therein connects,
Gap of its end through two pressure rollers of press 5 is clamped on winder.
2nd, 300 DEG C -400 DEG C are heated to individual layer non-gel flexible copper-clad plate to be laminated.
3rd, the pressure between two pressure rollers is adjusted to 60-120 tons/cm2。
4th, wound using 1-30m/min speed.
5th, the double face copper of five layers of insulated substrate is formed, it is followed successively by top layer copper foil, thermoplastic upper strata, in thermosetting respectively
Layer, thermoplastic middle level, thermosetting lower floor, thermoplastic lower floor and bottom copper foil, wherein, thermoplastic middle level is by two individual layer non-gel flexible copper-clad plates
In two layers of second thermoplastic layers combined together composition through hot pressing.
Claims (6)
1. a kind of individual layer non-gel flexible copper-clad plate, including copper foil layer (1) and the insulation base that is fixed on the surface of copper foil layer (1) one
Layer, it is characterised in that：The insulated substrate is followed successively by the composite bed of the first thermoplastic layer, thermoset layer and the second thermoplastic layer, wherein, heat
Gu layer is the permeable formation mutually to blend with the abutted surface of the first thermoplastic layer, the second thermoplastic layer respectively；First thermoplastic layer and
Two thermoplastic layers are thermoplastic polyimide layer, and thermoset layer is thermoset polyimide layer.
2. individual layer non-gel flexible copper-clad plate according to claim 1, it is characterised in that：First thermoplastic layer thickness is 1 μm to 5
μm, the thickness of the second thermoplastic layer is 1 μm to 5 μm；The thickness of thermoset layer is 3 μm to 20 μm.
3. individual layer non-gel flexible copper-clad plate according to claim 2, it is characterised in that：First thermoplastic layer and the copper foil layer
(1) peel strength between is not less than 1.0kgf/cm.
4. individual layer non-gel flexible copper-clad plate according to claim 2, it is characterised in that：First thermoplastic layer and the second thermoplastic layer
Tg temperature be less than 330 DEG C, the Tg temperature of thermoset layer is higher than 380 DEG C.
5. individual layer non-gel flexible copper-clad plate according to claim 1, it is characterised in that：The copper foil layer (1) is calendering copper
One kind in paper tinsel, electrolytic copper foil and high extension copper foil, and the thickness of the copper foil layer (1) is 7.5 μm -35 μm.
A kind of 6. two-sided non-gel flexible copper-clad plate, it is characterised in that：It is as two as any one of claim 1-5
The copper-clad plate of individual layer non-gel flexible is formed with five layers of insulated substrate in a manner of the second thermoplastic layer therein connects through hot pressing
Double face copper, it is followed successively by top layer copper foil, thermoplastic upper strata, thermosetting upper strata, thermoplastic middle level, thermosetting lower floor, thermoplastic lower floor respectively
With bottom copper foil, wherein, thermoplastic middle level is combined together through hot pressing by the second thermoplastic layer described in two layers and formed；Thermosetting upper strata point
Be the permeable formation mutually to blend with the abutted surface in thermoplastic upper strata, thermoplastic middle level, thermosetting lower floor respectively with thermoplastic middle level, thermoplastic
The abutted surface of layer is the permeable formation mutually to blend.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720253201.1U CN207028385U (en) | 2017-03-15 | 2017-03-15 | Single, double surface non-gel flexible copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720253201.1U CN207028385U (en) | 2017-03-15 | 2017-03-15 | Single, double surface non-gel flexible copper-clad plate |
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| Publication Number | Publication Date |
|---|---|
| CN207028385U true CN207028385U (en) | 2018-02-23 |
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ID=61471669
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| CN201720253201.1U Active CN207028385U (en) | 2017-03-15 | 2017-03-15 | Single, double surface non-gel flexible copper-clad plate |
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| Country | Link |
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2017
- 2017-03-15 CN CN201720253201.1U patent/CN207028385U/en active Active
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