CN107624002A - The FPC and its pad pasting preparation technology of a kind of circuit flush type - Google Patents
The FPC and its pad pasting preparation technology of a kind of circuit flush type Download PDFInfo
- Publication number
- CN107624002A CN107624002A CN201710947771.5A CN201710947771A CN107624002A CN 107624002 A CN107624002 A CN 107624002A CN 201710947771 A CN201710947771 A CN 201710947771A CN 107624002 A CN107624002 A CN 107624002A
- Authority
- CN
- China
- Prior art keywords
- circuit
- fpc
- copper
- layer
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of FPC of circuit flush type; including circuit, the solder mask positioned at the gluing layer side and the sealer positioned at the gluing layer opposite side in gluing layer, the embedment gluing layer; there are some pad areas on the solder mask; the pad area is connected insertion with the circuit, and the circuit upper surface in the pad area has surface-treated layer.Circuit in a kind of FPC of the present invention is embedded in gluing layer, and the width and line-spacing of circuit are further reduced on the premise of high reliability is kept, and product size is also ultra-thin, and bending property is good, and assembling is good, can reduce client encapsulation short-circuit risks；A kind of pad pasting preparation technology cost of FPC of the present invention is low, and reliability is high, and this method is easily achieved, and can be mass.
Description
Technical field
The invention belongs to printed circuit technique field, and in particular to a kind of FPC and its pad pasting preparation technology.
Background technology
With the continuous progress of science and technology, the consumer electronics industry such as product such as mobile phone, Pad develops rapidly, to display screen
Miniaturization and high-resolution demand are more and more urgent, so as to improve the requirement to the fine and closely woven property of soft board encapsulating carrier plate circuit.It is existing
There is the pitch produced in traditional subtractive process technique in technology（The distance between adjacent two circuit central points）Minimum 60
μm, but the more based on 70 μm of volume production can be realized；40 μm of the semi-additive process limit, it can realize that the more of volume production are with 50 μm
It is main, but still can not meet the needs of in the market is to low line-spacing wiring board.
The content of the invention
In view of this, in order to overcome prior art the defects of, it is an object of the invention to provide a kind of FPC, is protecting
The width and line-spacing of circuit are further reduced on the premise of holding high reliability, and bending property is good, assembling is good.
In order to achieve the above object, the present invention uses following technical scheme：
A kind of FPC, including gluing layer, the circuit in the embedment gluing layer, the welding resistance positioned at the gluing layer side
Layer and the sealer positioned at the gluing layer opposite side, there is some pad areas, the pad area on the solder mask
Be connected insertion with the circuit, and the circuit upper surface in the pad area has surface-treated layer.
Preferably, the material of the solder mask is ink.
Preferably, the material of the sealer is polyimides.
Preferably, the surface-treated layer is the coat of metal, is from top to bottom followed successively by layer gold, palladium layers and nickel dam.
Present invention also offers a kind of preparation technology of FPC, comprise the following steps：Figure is carried out after preparing base material
Shape obtains circuit, afterwards presses to gluing layer and sealer on the base material with circuit, and the base material is carried out
FeCl3Selective etch and microetch are carried out after etching, solder mask is then prepared and reserves pad area, finally in the pad
Circuit upper surface in area prepares surface-treated layer.
Specifically, comprise the following steps：
1）Prepare base material：Prepare copper-clad plate；
2）Circuit makes：The circuit of design is electroplated out using graphic making technique to the surface of the copper-clad plate；
3）Paste epiphragma：Cover layer is pressed in the copper-clad plate with circuit；
4）FeCl3Etching：FeCl is carried out to copper-clad plate3Etching；
5）Selective etch：Iron exposed on wiring board is removed, retains the circuit of plating formation and on the circuit
Bottom copper；
6）Microetch：Bottom copper exposed on wiring board is removed, retains the circuit that plating is formed；
7）Prepare solder mask：The upper surface of assist side prepares the solder mask, and reserves the pad area；
8）Prepare surface-treated layer：Circuit upper surface in the pad area prepares surface-treated layer, obtains FPC.
Preferably, step 1）In the copper-clad plate be copper-clad iron, including iron plate and the cladding iron positioned at centre
The copper foil of piece.
Preferably, step 3）In the cover layer there is gluing layer and sealer.
It is further preferred that step 3）It is described paste epiphragma behaviour be taken as press equipment the cover layer is pressed to it is described
In copper-clad plate so that the gluing layer is mutually chimeric with the circuit, and the pressing condition is 180-220 DEG C, 10-15kgf/
cm2Pressure precompressed 250-350s.
Preferably, step 7）It is described prepare solder mask operation be specially：Described in being removed in the upper surface of the wiring board
The position printing solder mask of pad area, forms ink solder mask.
Compared with prior art, the beneficial effects of the invention are as follows：Circuit embedment in a kind of FPC of the present invention
In gluing layer, the width and line-spacing of circuit are further reduced on the premise of high reliability is kept, product size is also ultra-thin, curved
Folding endurance is good, and assembling is good, can reduce client encapsulation short-circuit risks；A kind of preparation technology cost of FPC of the present invention
Low, reliability is high, and the process is easily achieved, and can be mass.
Brief description of the drawings
Fig. 1 is the sectional view of the FPC of the present invention；
Fig. 2 is the Making programme figure of FPC in embodiment one；
Fig. 3 is the sectional view of copper-clad iron in embodiment one；
Fig. 4 is the sectional view that step S2 circuits make after terminating in embodiment one；
Fig. 5 is that step S3 pastes the sectional view after epiphragma terminates in embodiment one；
Fig. 6 is the FeCl of step S4 in embodiment one3Etch the sectional view after terminating；
Fig. 7 be embodiment one in step S5 selective etch terminate after sectional view；
Fig. 8 be embodiment one in step S6 microetch terminate after sectional view；
Fig. 9 is that step S7 prepares the sectional view after solder mask terminates in embodiment one；
In accompanying drawing：FPC -1, gluing layer -11, circuit -12, solder mask -13, pad area -14, surface-treated layer -15,
Sealer -16, copper-clad iron -2, iron plate -21, copper foil -22.
Embodiment
The preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.
Embodiment one
Fig. 1 to Fig. 9 is referred to, in a kind of single-sided flexible circuit board 1 of the present embodiment, including gluing layer 11, embedment gluing layer 11
Circuit 12, the solder mask 13 positioned at the side of gluing layer 11 and the sealer 16 positioned at the opposite side of gluing layer 11, welding resistance
Some pad areas 14 are offered on layer, and pad area 14 is connected insertion with circuit 12, the upper table mask of circuit 12 in pad area 14
There is surface-treated layer 15.The material of sealer 16 is polyimides in the present embodiment（PI）, thermoplastic poly specifically can be selected
Acid imide（TPI）, the material of solder mask 13 is solder mask, and surface-treated layer is the coat of metal, be from top to bottom followed successively by layer gold,
Palladium layers and nickel dam, thickness are followed successively by 0.05-0.15 μm, 0.05-0.15 μm, 3-8 μm.
The present embodiment additionally provides a kind of preparation technology of FPC, as shown in Fig. 2 specifically including following steps：
Step S1：Prepare material
Prepare copper-clad plate.Copper-clad plate in the present embodiment is copper-clad iron 2, as shown in figure 3, including positioned at centre iron plate 21 and
The copper foil 22 of iron plate 21 is coated, manufacture craft is the copper of 3 μm of the plating on pure iron piece.
Step S2：Circuit makes
The circuit of design is electroplated out using graphic making technique to the surface of copper-clad iron 2, as shown in Figure 4.Specifically include to flow down
Journey：Photosensitive film is sticked after the photic pre-treatment of surface progress to copper-clad iron 2, the line map of design is exposed using exposure sources
Shape, development treatment is carried out, unexposed part is removed to the line that design totally, is electroplated out on the copper-clad iron 2 after development treatment
Road 12, carry out taking off film process afterwards.
Step S3：Paste epiphragma
Cover layer with gluing layer 11 and sealer 16 is pressed to by separating with circuit 12 using press equipment
On copper foil 2 so that gluing layer 11 is mutually chimeric with circuit 12, as shown in Figure 5.
Pressing condition is 180-220 DEG C, 10-15kgf/cm2Pressure precompressed 250-350s, the present embodiment preferably presses bar
Part is 200 DEG C, 13kgf/cm2Pressure precompressed 300s.
Step S4：FeCl3Etching
Copper-clad iron 2 with gluing layer 11 is subjected to FeCl3Etching, by controlling etch-rate to control etch quantity, removal does not connect
The copper foil 22 and part iron plate 21 of circuit 12 are connected to, as shown in Figure 6.
Step S5：Selective etch
In FeCl3Continue selective etch after etching, selective etch liquid medicine is CuCl2, remaining iron plate 21 is etched
Completely, circuit 12 and the bottom copper on circuit 12 that plating is formed are retained, as shown in Figure 7.
Step S6：Microetch
Bottom copper exposed on wiring board is removed, retains the circuit 12 that plating is formed, as shown in Figure 8.
Step S7：Prepare solder mask
The upper surface of assist side prepares solder mask 13, and reserves pad area 14, as shown in Figure 9.Specific behaviour in this implementation
Solder mask is printed in the position that upper surface as assist side removes pad area 14, forms ink solder mask 13.
Step S8：Prepare surface-treated layer
The upper surface of circuit 12 in pad area 14 prepares surface-treated layer 15, obtains FPC 1, as shown in Figure 1.
Circuit in a kind of FPC of the present invention is embedded in gluing layer, is entered on the premise of high reliability is kept
One step reduces the width and line-spacing of circuit, and line-spacing is minimum to can reach 20 μm, and product size is also ultra-thin, and bending property is good, and assembling is good,
Client encapsulation short-circuit risks can be reduced；A kind of preparation technology cost of FPC of the present invention is low, and reliability is high, and should
Method is easily achieved, and can be mass.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention, all according to the present invention
The equivalent change or modification that Spirit Essence is made, it should all be included within the scope of the present invention.
Claims (10)
1. a kind of FPC of circuit flush type, it is characterised in that including the line in gluing layer, the embedment gluing layer
Road, the solder mask positioned at the gluing layer side and the sealer positioned at the gluing layer opposite side, the solder mask
Upper have some pad areas, and the pad area is connected insertion with the circuit, and the circuit upper surface in the pad area has
Surface-treated layer.
A kind of 2. FPC of circuit flush type according to claim 1, it is characterised in that the material of the solder mask
Matter is ink.
A kind of 3. FPC of circuit flush type according to claim 1, it is characterised in that the sealer
Material be polyimides.
A kind of 4. FPC of circuit flush type according to claim 1, it is characterised in that the surface-treated layer
For the coat of metal, layer gold, palladium layers and nickel dam are from top to bottom followed successively by.
5. a kind of pad pasting preparation technology of the FPC of circuit flush type, it is characterised in that comprise the following steps：Prepare base
Graphic making is carried out after material and obtains circuit, is afterwards pressed to gluing layer and sealer on the base material with circuit, by institute
State base material and carry out FeCl3Selective etch and microetch are carried out after etching, solder mask is then prepared and reserves pad area, finally
Circuit upper surface in the pad area prepares surface-treated layer.
A kind of 6. pad pasting preparation technology of the FPC of circuit flush type according to claim 5, it is characterised in that
Comprise the following steps：
1）Prepare base material：Prepare copper-clad plate；
2）Circuit makes：The circuit of design is electroplated out using graphic making technique to the surface of the copper-clad plate；
3）Paste epiphragma：Cover layer is pressed in the copper-clad plate with circuit；
4）FeCl3Etching：FeCl is carried out to copper-clad plate3Etching；
5）Selective etch：Iron exposed on wiring board is removed, retains the circuit of plating formation and on the circuit
Bottom copper；
6）Microetch：Bottom copper exposed on wiring board is removed, retains the circuit that plating is formed；
7）Prepare solder mask：The upper surface of assist side prepares the solder mask, and reserves the pad area；
8）Prepare surface-treated layer：Circuit upper surface in the pad area prepares surface-treated layer, obtains FPC.
A kind of 7. pad pasting preparation technology of the FPC of circuit flush type according to claim 6, it is characterised in that
Step 1）In the copper-clad plate be copper-clad iron, including iron plate and the copper foil of the cladding iron plate positioned at centre.
A kind of 8. pad pasting preparation technology of the FPC of circuit flush type according to claim 6, it is characterised in that
Step 3）In the cover layer there is gluing layer and sealer.
A kind of 9. pad pasting preparation technology of the FPC of circuit flush type according to claim 8, it is characterised in that
Step 3）It is described to paste epiphragma behaviour and be taken as press equipment and press to the cover layer in the copper-clad plate so that described glutinous
Knot layer is mutually chimeric with the circuit, and the pressing condition is 180-220 DEG C, 10-15kgf/cm2Pressure precompressed 250-
350s。
10. a kind of pad pasting preparation technology of the FPC of circuit flush type according to claim 6, its feature exist
In step 7）It is described prepare solder mask operation be specially：The position of the pad area is removed in the upper surface of the wiring board
Solder mask is printed, forms ink solder mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947771.5A CN107624002B (en) | 2017-10-12 | 2017-10-12 | Circuit embedded flexible circuit board and film pasting preparation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947771.5A CN107624002B (en) | 2017-10-12 | 2017-10-12 | Circuit embedded flexible circuit board and film pasting preparation process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107624002A true CN107624002A (en) | 2018-01-23 |
| CN107624002B CN107624002B (en) | 2019-12-27 |
Family
ID=61091765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710947771.5A Active CN107624002B (en) | 2017-10-12 | 2017-10-12 | Circuit embedded flexible circuit board and film pasting preparation process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107624002B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939104A (en) * | 2021-09-08 | 2022-01-14 | 东山精密新加坡有限公司 | Processing method for surface treatment of circuit board and circuit board |
| CN114340184A (en) * | 2021-02-25 | 2022-04-12 | 武汉铱科赛科技有限公司 | Manufacturing method of flexible circuit board and processing method of flexible material |
| CN114885514A (en) * | 2021-02-05 | 2022-08-09 | 深南电路股份有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| US11997799B2 (en) | 2021-02-05 | 2024-05-28 | Shennan Circuits Co., Ltd. | Method for manufacturing printed circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100314755A1 (en) * | 2009-06-12 | 2010-12-16 | Myung Sam Kang | Printed circuit board, semiconductor device comprising the same, and method of manufacturing the same |
| CN104093272A (en) * | 2014-07-25 | 2014-10-08 | 华进半导体封装先导技术研发中心有限公司 | Improved semiconductor packaging substrate structure and manufacturing method thereof |
| CN104244616A (en) * | 2014-08-27 | 2014-12-24 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method for thin coreless substrate |
| CN105338740A (en) * | 2014-08-04 | 2016-02-17 | 三星电机株式会社 | Printed circuit board and method of manufacturing the same |
| CN105792548A (en) * | 2016-05-23 | 2016-07-20 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with stepped slot structure through electroplating and etching method |
| CN106409688A (en) * | 2016-07-22 | 2017-02-15 | 深南电路股份有限公司 | Processing method of ultrathin coreless package substrate and structure |
-
2017
- 2017-10-12 CN CN201710947771.5A patent/CN107624002B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100314755A1 (en) * | 2009-06-12 | 2010-12-16 | Myung Sam Kang | Printed circuit board, semiconductor device comprising the same, and method of manufacturing the same |
| CN104093272A (en) * | 2014-07-25 | 2014-10-08 | 华进半导体封装先导技术研发中心有限公司 | Improved semiconductor packaging substrate structure and manufacturing method thereof |
| CN105338740A (en) * | 2014-08-04 | 2016-02-17 | 三星电机株式会社 | Printed circuit board and method of manufacturing the same |
| CN104244616A (en) * | 2014-08-27 | 2014-12-24 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method for thin coreless substrate |
| CN105792548A (en) * | 2016-05-23 | 2016-07-20 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with stepped slot structure through electroplating and etching method |
| CN106409688A (en) * | 2016-07-22 | 2017-02-15 | 深南电路股份有限公司 | Processing method of ultrathin coreless package substrate and structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114885514A (en) * | 2021-02-05 | 2022-08-09 | 深南电路股份有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| WO2022166215A1 (en) * | 2021-02-05 | 2022-08-11 | 深南电路股份有限公司 | Method for manufacturing printed circuit board, and printed circuit board |
| US11997799B2 (en) | 2021-02-05 | 2024-05-28 | Shennan Circuits Co., Ltd. | Method for manufacturing printed circuit board |
| CN114340184A (en) * | 2021-02-25 | 2022-04-12 | 武汉铱科赛科技有限公司 | Manufacturing method of flexible circuit board and processing method of flexible material |
| CN113939104A (en) * | 2021-09-08 | 2022-01-14 | 东山精密新加坡有限公司 | Processing method for surface treatment of circuit board and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107624002B (en) | 2019-12-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107624002A (en) | The FPC and its pad pasting preparation technology of a kind of circuit flush type | |
| CN104244616B (en) | A kind of preparation method of centreless thin base sheet | |
| WO1982002138A1 (en) | Multilayer wiring substrate | |
| CN106376184A (en) | Manufacturing method of embedded line and packaging substrate | |
| CN107041077A (en) | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity | |
| CN102821553A (en) | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) | |
| CN103681384A (en) | Chip sealing base plate as well as structure and manufacturing method thereof | |
| CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
| CN102209438B (en) | High-density flexible circuit board and manufacturing method thereof | |
| CN107734877B (en) | Flexible circuit board and laser preparation process thereof | |
| CN107770953B (en) | A kind of single-sided flexible circuit board and its pad pasting preparation method based on separable copper foil | |
| CN102223752A (en) | Multi-layer flexible circuit board and manufacturing method thereof | |
| CN107645855A (en) | Non-conductor electroplating circuit board and preparation method thereof | |
| CN107734845A (en) | A kind of FPC and preparation method thereof | |
| CN107734846A (en) | A kind of double-faced flexible wiring board based on separable copper foil and preparation method thereof | |
| CN216291577U (en) | Multilayer circuit board | |
| CN107645842A (en) | A kind of single-sided flexible circuit board of circuit flush type and preparation method thereof | |
| CN102523694A (en) | Method for avoiding substrate exposure during pattern transfer of step circuit boards | |
| TW201216801A (en) | Manufacturing method of circuit board | |
| CN114007346A (en) | Multilayer circuit board manufacturing method and multilayer circuit board | |
| CN107666776A (en) | A kind of double-faced flexible wiring board and preparation method thereof | |
| CN104284530B (en) | The method that no core plate technique makes printed circuit board | |
| JP5439165B2 (en) | Multilayer wiring board and manufacturing method thereof | |
| CN103384443B (en) | The conduction through hole structure of circuit board | |
| CN102256453B (en) | Multilayer circuit board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |