CN113939104A - Processing method for surface treatment of circuit board and circuit board - Google Patents
Processing method for surface treatment of circuit board and circuit board Download PDFInfo
- Publication number
- CN113939104A CN113939104A CN202111047760.4A CN202111047760A CN113939104A CN 113939104 A CN113939104 A CN 113939104A CN 202111047760 A CN202111047760 A CN 202111047760A CN 113939104 A CN113939104 A CN 113939104A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- surface treatment
- solder resist
- window
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004381 surface treatment Methods 0.000 title claims abstract description 58
- 238000003672 processing method Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 108
- 229910000679 solder Inorganic materials 0.000 claims abstract description 64
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 230000000873 masking effect Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 8
- 239000003814 drug Substances 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 13
- 229910052737 gold Inorganic materials 0.000 description 13
- 239000010931 gold Substances 0.000 description 13
- 238000009713 electroplating Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a processing method for surface treatment of a circuit board and the circuit board, comprising the steps of applying a connecting material on a first surface of the circuit board and surrounding a solder resisting windowing window, wherein a first surface treatment material is applied in the solder resisting windowing window on the first surface of the circuit board; laminating a shielding material on the first surface of the circuit board; cutting the shielding material to obtain a shielding layer which covers the solder mask window and is connected with the connecting material; performing second surface treatment on the second surface of the circuit board; and removing the connecting material and the shielding layer. By arranging the connecting material and the shielding layer on the first surface of the circuit board, the first surface treatment material on the first surface of the circuit board can be protected, and organic pollution of liquid medicine in the second surface treatment process is reduced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a processing method for surface treatment of a circuit board and the circuit board.
Background
Currently, in the application of memory chip circuit boards, different surface treatments are used to meet the requirements of different functions. The two surfaces of the storage chip circuit board respectively adopt different surface treatment modes, such as hard gold electroplating and soft gold electroplating. However, in the case of the electroplated soft gold, since the chip packaging area is large, the design of the electroplated lead is complicated, and the electroplated lead needs to be removed by etching after the electroplating is completed, so that the requirements of miniaturization and high density of the circuit board cannot be met. The prior art gradually adopts chemical nickel palladium gold (ENEPIG) to replace electroplated soft gold. However, in the production process, the dry film or the anti-electroplating ink for protecting the surface of the electroplated hard gold cannot meet the requirement of the chemical nickel palladium gold liquid medicine on organic matter pollution, so the existing method cannot meet the technical requirement of processing the circuit board of the memory chip.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a processing method for surface treatment of a circuit board and the circuit board, which can protect different surface treatment parts of the circuit board in the surface treatment process.
In a first aspect, a processing method for surface treatment of a circuit board according to an embodiment of the present invention is applied to a circuit board, wherein solder resists are disposed on two opposite surfaces of the circuit board, and each solder resist is provided with a solder resist window, and the processing method includes:
applying a connecting material on the first surface of the circuit board and around the solder resist window, wherein a first surface treatment material is applied in the solder resist window on the first surface of the circuit board;
pressing a shielding material on the first surface of the circuit board;
cutting the shielding material to obtain a shielding layer which covers the solder mask window and is connected with the connecting material;
carrying out second surface treatment on the second surface of the circuit board;
and removing the connecting material and the shielding layer.
The processing method for processing the surface of the circuit board provided by the embodiment of the invention at least has the following beneficial effects:
by arranging the connecting material and the shielding layer on the first surface of the circuit board, the first surface treatment material on the first surface of the circuit board can be protected, and organic pollution of liquid medicine in the second surface treatment process is reduced.
According to some embodiments of the invention, the connecting material is solder resist ink.
According to some embodiments of the invention, the solder resist ink is a photosensitive solder resist ink.
According to some embodiments of the invention, the connecting material is processed by coating and exposure development, or the connecting material is processed by jet printing.
According to some embodiments of the invention, the masking material is polyimide.
In a second aspect, a circuit board according to an embodiment of the present invention is prepared by the processing method of the surface treatment of the circuit board of the first aspect.
In a third aspect, a wiring board according to an embodiment of the present invention includes: the plate comprises a plate body and a base, wherein the plate body is provided with a first surface and a second surface which are opposite to each other, the first surface and the second surface of the plate body are both provided with solder mask layers, and the solder mask layers are provided with solder mask windows; a first surface treatment material disposed within the solder resist opening window of the first face of the board body; the connecting material is arranged on the first surface of the plate main body and surrounds the solder resisting window; and the shielding layer covers the solder mask window on the first surface of the plate main body and is connected with the connecting material.
The circuit board provided by the embodiment of the invention at least has the following beneficial effects:
by arranging the connecting material and the shielding layer on the first surface of the circuit board, the first surface treatment material on the first surface of the circuit board can be protected, and organic pollution of liquid medicine in the second surface treatment process is reduced.
According to some embodiments of the invention, a second surface treatment material is disposed within the solder resist window of the second side of the board body.
According to some embodiments of the invention, the connecting material is solder resist ink.
According to some embodiments of the invention, the masking layer is made of a polyimide material.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a flowchart illustrating steps of a method for processing a surface of a circuit board according to an embodiment of the present invention;
fig. 2 to 6 are schematic diagrams of intermediate structures of a processing method for surface treatment of a circuit board according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, "a plurality" means one or more, "a plurality" means two or more, and greater than, less than, more than, etc. are understood as excluding the present number, and "greater than", "lower than", "inner", etc. are understood as including the present number. If the description of "first", "second", etc. is used for the purpose of distinguishing technical features, it is not intended to indicate or imply relative importance or to implicitly indicate the number of indicated technical features or to implicitly indicate the precedence of the indicated technical features.
In the description of the present invention, unless otherwise explicitly limited, the terms "disposed," "connected," and the like are to be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the above-mentioned terms in the present invention by combining the detailed contents of the technical solutions.
Example 1
Referring to fig. 1 and fig. 2, the present embodiment discloses a processing method for processing a surface of a circuit board, which is applied to a circuit board, wherein two opposite surfaces of the circuit board are both provided with solder masks 110, the solder masks 110 are provided with solder mask windows 111, and the solder mask windows 111 are used for exposing pads on the surface of the circuit board, and the processing method includes steps S100 to S500, which are described in detail below:
s100, referring to fig. 2, a connection material 200 is applied on the first surface of the circuit board and around the solder resist window 111, wherein the first surface treatment material 120 is applied in the solder resist window 111 of the first surface of the circuit board.
Specifically, before the joining material 200 is applied, the following steps are further included:
s101, applying a protective material (not shown), such as a dry film, to the second surface of the circuit board so as to protect the second surface of the circuit board;
s102, performing first surface treatment on the first surface of the circuit board to form a first surface material in the solder resist window 111 of the first surface of the circuit board, wherein the first surface treatment is electroplating hard gold. In the electroplating process, the dry film can not cause organic pollution to the liquid medicine for electroplating hard gold, so that the dry film can be used for protecting the second surface of the circuit board.
And S103, after the first surface treatment is finished, removing the protective material so as to carry out second surface treatment on the second surface of the circuit board.
The first surface treatment material 120 on the first side of the circuit board needs to be protected before the second surface treatment, so that the second surface treatment material 130 is prevented from covering the first surface treatment material 120, and materials are wasted. In this embodiment, the connection material 200 is processed on the first surface of the circuit board, so that the subsequent shielding layer 300 can be connected. In this embodiment, the connection material 200 is solder resist ink, which is a commonly used circuit board processing material, and the processing technology is mature, thereby facilitating reduction of processing difficulty and production cost. Further, the solder resist ink is photosensitive ink, and is processed by coating, exposing and developing, so that the solder resist ink surrounds the solder resist window 111 to form a dam. Of course, the connection material 200 may also be processed by inkjet printing, which has high processing precision and simple operation, and is beneficial to applying the connection material 200 on a high-density circuit board.
S200, referring to fig. 2 and fig. 3, a shielding material 301 is pressed on the first side of the circuit board.
In this embodiment, the shielding material 301 is made of polyimide (PI, polyimide), which is a common material for manufacturing FPC boards, and has a small thickness, a soft texture, and a strong bonding force with solder resist ink, so as to be beneficial to improving the connection strength between the shielding material 301 and the connection material 200, and it should be noted that, after the connection material 200 is applied to the first surface of the circuit board, post-curing is not required, and the shielding material 301 and the connection material 200 are pressed together by a high-temperature quick-pressing device, so as to achieve connection between the shielding material 301 and the connection material 200. In addition, the polyimide does not contain a reinforcing material, so that the cutting processing is easy, and the cutting in the subsequent steps is convenient.
S300, referring to fig. 3 and fig. 4, the shielding material 301 is cut to obtain the shielding layer 300 covering the solder mask window 111 and connected to the connection material 200.
In practice, the circuit board has a plurality of solder mask windows 111, and for ease of processing, the masking material 301 covers the entire first side of the circuit board, which is then passed through the CO2The masking material 301 is cut and peeled off by laser, thereby obtaining the masking layer 300.
S400, referring to fig. 4 and 5, a second surface treatment is performed on the second side of the circuit board to apply the second surface material 130 in the solder mask window of the second side of the circuit board.
In this embodiment, the shielding layer 300 and the connecting material 200 cooperate to cover the solder resist opening 111 on the first side of the circuit board in the closed area, so as to protect the first surface treatment material 120 in the closed area. The second surface treatment of the present embodiment is chemical nickel palladium gold, wherein, compared with the existing protective material, such as a dry film or an anti-plating ink, the connection material 200 and the shielding material 301 of the present embodiment can avoid organic pollution to the chemical liquid during the chemical nickel palladium gold processing process, and can meet the technical requirements of the second surface treatment.
S500, please refer to fig. 5 and 6, the connection material 200 and the shielding layer 300 are removed.
Specifically, the connecting material 200 and the shielding layer 300 are formed by a routing knife to remove the connecting material 200 and the shielding layer 300, so as to expose the first surface treatment material 120 on the first surface of the circuit board.
In this embodiment, the first surface of the circuit board is provided with the connecting material 200 and the shielding layer 300, so that the first surface treatment material 120 of the first surface of the circuit board can be protected, and organic pollution of the liquid medicine in the second surface treatment process can be reduced. It is understood that the machining method of the present embodiment can be applied to two different surface treatment methods.
The embodiment also discloses a circuit board, which is prepared by the processing method for the surface treatment of the circuit board of the first aspect.
Example 2
Referring to fig. 4, the present embodiment discloses a circuit board, which includes a board main body 100, a first surface treatment material 120, a connection material 200 and a shielding layer 300, wherein the board main body 100 has a first surface and a second surface opposite to each other, the first surface and the second surface of the board main body 100 are both provided with a solder resist layer 110, the solder resist layer 110 is provided with a solder resist window 111, the solder resist window 111 is used for exposing a pad on the surface of the board main body 100, the first surface treatment material 120 is disposed in the solder resist window 111 on the first surface of the board main body 100, the connection material 200 is disposed on the first surface of the board main body 100 and surrounds the solder resist window 111, and the shielding layer 300 covers the solder resist window 111 on the first surface of the board main body 100 and is connected to the connection material 200.
In this embodiment, the first surface of the circuit board is provided with the connecting material 200 and the shielding layer 300, so that the first surface treatment material 120 of the first surface of the circuit board can be protected, and organic pollution of the liquid medicine in the subsequent second surface treatment process can be reduced.
Referring to fig. 5, in the present embodiment, a second surface treatment material 130 is disposed in the solder resist window 111 on the second surface of the board body 100. The first surface treatment material 120 is electroplated hard gold, and the second surface treatment material 130 is electroless nickel palladium gold.
In this embodiment, the connection material 200 is solder resist ink, which is a commonly used circuit board processing material, and the processing technology is mature, thereby facilitating reduction of processing difficulty and production cost. Further, the solder resist ink is photosensitive ink, and is processed by coating, exposing and developing, so that the solder resist ink surrounds the solder resist window 111 to form a dam. Of course, the connection material 200 may also be processed by inkjet printing, which has high processing precision and simple operation, and is beneficial to applying the connection material 200 on a high-density circuit board.
In this embodiment, the shielding material 301 is made of polyimide (PI, polyimide), which is a common material made of a Flexible Printed Circuit (FPC) board, and has a small thickness, a soft texture, and a strong bonding force with solder resist ink, so as to be beneficial to improving the connection strength between the shielding material 301 and the connecting material 200, and it should be noted that after the connecting material 200 is applied to the first surface of the Circuit board, post-curing is not required, and the shielding material 301 and the connecting material 200 are pressed together by a high-temperature quick-pressing device, so as to achieve connection between the shielding material 301 and the connecting material 200. In addition, the polyimide does not contain a reinforcing material, is easy to cut and process and is convenient to cut in the production process.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. The utility model provides a processing method of circuit board surface treatment, is applied to the circuit board, the relative two sides of circuit board all are provided with solder mask (110), solder mask (110) are provided with and hinder and open window (111), its characterized in that includes:
applying a connecting material (200) on the first side of the circuit board and around the solder resist window (111), wherein a first surface treatment material (120) is applied inside the solder resist window (111) of the first side of the circuit board;
pressing a shielding material (301) on the first surface of the circuit board;
cutting the shielding material (301) to obtain a shielding layer (300) which covers the solder-resisting windowing window (111) and is connected with the connecting material (200);
carrying out second surface treatment on the second surface of the circuit board;
removing the connecting material (200) and the masking layer (300).
2. The processing method for surface treatment of circuit board according to claim 1, characterized in that the connecting material (200) is solder resist ink.
3. The processing method for surface treatment of a wiring board according to claim 2, wherein the solder resist ink is a photosensitive solder resist ink.
4. The processing method for processing the surface of the circuit board according to the claim 1, 2 or 3, characterized in that the connecting material (200) is processed by coating and exposure development, or the connecting material (200) is processed by spray printing.
5. A method of processing circuit board surface treatment according to claim 1, 2 or 3, characterized in that the masking material (301) is polyimide.
6. A wiring board produced by the processing method for surface treatment of a wiring board according to any one of claims 1 to 5.
7. A circuit board, comprising:
the circuit board comprises a board main body (100) and a circuit board, wherein the board main body is provided with a first surface and a second surface which are opposite to each other, the first surface and the second surface of the board main body (100) are both provided with a solder mask layer (110), and the solder mask layer (110) is provided with a solder mask opening window (111);
a first surface treatment material (120) provided in the solder resist opening window (111) of the first face of the board main body (100);
a connecting material (200) provided on a first surface of the board main body (100) and surrounding the solder resist window (111);
and the shielding layer (300) covers the solder resisting window (111) on the first surface of the board main body (100) and is connected with the connecting material (200).
8. The wiring board of claim 7, wherein a second surface treatment material (130) is provided within the solder resist window (111) of the second side of the board body (100).
9. Wiring board according to claim 7, characterized in that the connection material (200) is a solder resist ink.
10. The wiring board according to claim 7 or 9, wherein the shielding layer (300) is made of a polyimide material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111047760.4A CN113939104A (en) | 2021-09-08 | 2021-09-08 | Processing method for surface treatment of circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111047760.4A CN113939104A (en) | 2021-09-08 | 2021-09-08 | Processing method for surface treatment of circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113939104A true CN113939104A (en) | 2022-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111047760.4A Pending CN113939104A (en) | 2021-09-08 | 2021-09-08 | Processing method for surface treatment of circuit board and circuit board |
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| Country | Link |
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| CN (1) | CN113939104A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116546736A (en) * | 2023-06-20 | 2023-08-04 | 清远市富盈电子有限公司 | PCB (printed circuit board) manufacturing method containing two surface treatments and PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335600A (en) * | 1995-06-05 | 1996-12-17 | Hitachi Cable Ltd | Single-layer wiring tcp tape without adhesive |
| KR20140032244A (en) * | 2012-09-06 | 2014-03-14 | 삼성전기주식회사 | Manufacturing method of pcb |
| CN107624002A (en) * | 2017-10-12 | 2018-01-23 | 安捷利（番禺）电子实业有限公司 | The FPC and its pad pasting preparation technology of a kind of circuit flush type |
-
2021
- 2021-09-08 CN CN202111047760.4A patent/CN113939104A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335600A (en) * | 1995-06-05 | 1996-12-17 | Hitachi Cable Ltd | Single-layer wiring tcp tape without adhesive |
| KR20140032244A (en) * | 2012-09-06 | 2014-03-14 | 삼성전기주식회사 | Manufacturing method of pcb |
| CN107624002A (en) * | 2017-10-12 | 2018-01-23 | 安捷利（番禺）电子实业有限公司 | The FPC and its pad pasting preparation technology of a kind of circuit flush type |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116546736A (en) * | 2023-06-20 | 2023-08-04 | 清远市富盈电子有限公司 | PCB (printed circuit board) manufacturing method containing two surface treatments and PCB |
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