CN206945202U - A kind of pressure sensor - Google Patents
A kind of pressure sensor Download PDFInfo
- Publication number
- CN206945202U CN206945202U CN201720601119.3U CN201720601119U CN206945202U CN 206945202 U CN206945202 U CN 206945202U CN 201720601119 U CN201720601119 U CN 201720601119U CN 206945202 U CN206945202 U CN 206945202U
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- CN
- China
- Prior art keywords
- circuit board
- mounting groove
- chip
- housing
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of pressure sensor, have：Circuit board, circuit board side are provided with the arc-shaped side to cave inward, board pads and positioning hole are additionally provided with circuit board；Chip, it is arranged on the bottom of circuit board；Housing, housing is interior to be provided with the first mounting groove, and the first mounting groove bottom land is provided with the second mounting groove, and chip is arranged in the second mounting groove, and the bottom land of the second mounting groove is provided with passage；Circuit board is arranged in the first mounting groove；The notch of second mounting groove is surrounded by step；Step periphery is provided with groove, irrigates silica gel in groove, locating dowel is adapted with the positioning hole on circuit board；Contact pin pad is additionally provided with housing, contact pin pad is bonded line bonding with circuit board by aluminium wire；Gel, the first mounting groove is filled, sensor anti-corrosion is good, long-time stability are good and overload capacity is high.
Description
Technical field
The utility model belongs to pressure sensor technique field, more particularly to a kind of pressure sensor.
Background technology
The manufacture method of existing automobile-used gas pressure sensor, chip package is typically using single line binding structure, circuit board
Use wire welding or flexible plate weld between housing, final assembly typically using epoxide-resin glue either silica gel or
The frame mode of sealing ring pressing is completed；
During the utility model is realized, utility model people has found that prior art at least has problems with：Cause
The problem of larger all be present in sealing, overload capacity and the long-time stability and corrosion resistance of product.
Utility model content
Technical problem to be solved in the utility model is to provide that a kind of corrosion resistance is good, long-time stability are good and mistake
The high pressure sensor of loading capability.
In order to solve the above-mentioned technical problem, technical scheme is used by the utility model：A kind of pressure sensor, tool
Have：
Circuit board, the circuit board side are provided with the arc-shaped side to cave inward, and circuit board weldering is additionally provided with the circuit board
Disk and positioning hole；
Chip, it is arranged on the bottom of the circuit board, is bound between chip and circuit board using double gold threads；And core is set
Piece rubber cover covers the chip；
Housing, the housing is interior to be provided with the first mounting groove, and the first mounting groove bottom land is provided with the second mounting groove, the core
Piece is arranged in second mounting groove, and the bottom land of second mounting groove is provided with passage；The circuit board is arranged on described
In first mounting groove；The notch of second mounting groove is surrounded by step, and the step supports the circuit board；The step
Periphery is provided with groove, and silica gel is irrigated in the groove, and the silica gel height is consistent with shoulder height；
Locating dowel is additionally provided with the housing, the locating dowel is adapted with the positioning hole on circuit board；
Contact pin pad is additionally provided with the housing, the contact pin pad is bonded line bonding with the circuit board by aluminium wire；
Gel, fill first mounting groove, the gel overlay circuit board surface and electronic component.
The second mounting groove bottom land is surrounded by excessive glue groove.
The circuit board is provided with board pads, and the chip is provided with chip bonding pad；The pad and electricity of the chip
Between the plate pad of road two-wire binding is carried out using 1.0mil gold thread.
The chip periphery is provided with back-up ring, and the back-up ring is fixed on circuit boards；The chip rubber cover is arranged on described
In back-up ring.
The aluminium wire bonding line is arranged on the circuit board upper surface, and the contact pin pad of the board pads and housing is adopted
It is bonded with 10mil aluminum steels two-wire.
A technical scheme in above-mentioned technical proposal has the following advantages that or beneficial effect, to MEMS chip and circuit board
Between using 1.0mil the binding of double gold threads, lift the anti-fatigue life ability of product, extend the service life of product；Using silicon
Structure design and the stage curing and abundant agings of silica gel high/low temperature such as the perfusion of glue groove, circuit board positioning riveting, circuit board arc
Technological design, the final assembly of product is realized, realize that product reduces stress, improves the requirement of overload capacity and sealing；Circuit
Between plate and housing contact pin connection, failure welding and tin caused by avoiding soldering are realized using 10mil double aluminum wire bonding techniques
The metallic particles such as slag pollute, and lift product reliability；Gel embedding is carried out in housing cavity, is realized to circuit board and housing contact pin
The protection against oxidation of bonding line and circuit board electronic component, while the influence of mechanical shock is reduced, it is steady for a long time to improve product
It is qualitative.
Brief description of the drawings
Fig. 1 is the structural representation of the circuit board of the pressure sensor provided in the utility model embodiment；
Fig. 2 is the inner-cavity structure schematic diagram of the housing of pressure sensor；
The structural representation of the pressure sensor provided in Fig. 3 the utility model embodiments；
Fig. 4 is the sectional view of Fig. 3 pressure sensor；
Mark in above-mentioned figure is：100th, chip；101st, chip bonding pad；200th, circuit board；201st, positioning hole；202nd, it is electric
Road plate pad；300th, spun gold binding line；400th, plastics back-up ring；500th, housing；501st, locating dowel；502nd, passage；503rd, step；
504th, groove；505th, contact pin pad；506th, excessive glue groove；600th, aluminium wire bonding line；700th, chip rubber cover；800th, gel.
Embodiment
It is new to this practicality below in conjunction with accompanying drawing to make the purpose of this utility model, technical scheme and advantage clearer
Type embodiment is described in further detail.
Embodiment one
Referring to Fig. 1-3, a kind of pressure sensor, have：
Circuit board 202, circuit board side are provided with the arc-shaped side to cave inward, board pads 202 are additionally provided with circuit board
With positioning hole 201；
Chip 100, it is arranged on the bottom of circuit board, is bound between chip and circuit board using double gold threads；And core is set
Piece rubber cover 700 covers chip；
Housing 500, housing 500 is interior to be provided with the first mounting groove, and the first mounting groove bottom land is provided with the second mounting groove, chip installation
In the second mounting groove, the bottom land of the second mounting groove is provided with passage 502；Circuit board is arranged in the first mounting groove；Second peace
The notch of tankage is surrounded by step 503, and step 503 supports circuit board；The periphery of step 503 is provided with groove 504, is irrigated in groove
Silica gel, silica gel height are highly consistent with step 503；
Locating dowel 501 is additionally provided with housing 500, locating dowel 501 is adapted with the positioning hole 201 on circuit board；
Contact pin pad 505 is additionally provided with housing 500, contact pin pad 505 is bonded with circuit board by aluminium wire bonding line 600；
Gel 800, fill the first mounting groove, the covering board of gel 800, inner chamber contact pin, aluminium wire.
Second mounting groove bottom land is surrounded by excessive glue groove 506.
Circuit board is provided with board pads 202, and chip is provided with chip bonding pad 101；Pad and the circuit board weldering of chip
Between disk 202 two-wire binding is carried out using 1.0mil spun gold binding line 300.
Chip periphery is provided with back-up ring 400, and back-up ring 400 is fixed on circuit boards；Chip rubber cover 700 is arranged on back-up ring 400
It is interior.
Aluminium wire bonding line 600 is arranged on circuit board upper surface, and board pads 202 and the contact pin pad 505 of housing 500 are adopted
It is bonded with 10mil aluminum steels two-wire.
Embodiment two
The preparation method of sensor, specific implementation are as follows
1st, the chip package of circuit board
MEMS chip ML808 is bonded on circuit board by bonder, and fixed by hot setting adhesive glue, is passed through
Full-automatic bonding machines will carry out two-wire binding using 1.0mil gold thread between the pad of MEMS chip and board pads 202,
Bind more than single line pulling tension requirements 7g, binding terminates to use manipulator adhered plastics back-up ring 400 and solid in the periphery of MEMS chip
It is fixed, the embedding chip rubber cover 700 in back-up ring 400.
The binding of chip is using 1.0mil double gold threads binding, and gold thread has good electric conductivity and ductility, and double gold
Line binding reduces the risk of binding line broken string, improves the anti-fatigue life of product and the service life of product.
2nd, the assembling of circuit board and housing 500
A, silica gel is filled in the groove of housing 500, and is coated on step 503, silica gel coating height and the height of step 503
It is consistent, it is ensured that the uniformity of silica gel coating；
B, the circuit board after encapsulation is matched according to positioning hole 201 and the locating dowel 501 of housing 500 and loads the internal pressure of housing 500
Tightly, using the locating dowel 501 of four housings of rivet hot press riveting 500, it is bowl-shape to should be regular back-off after the riveting of locating dowel 501, no drawing
Phenomena such as silk burr；
C, the product after riveting is placed into high-temperature cabinet and solidified according to wise temperature, according to first 60 DEG C of constant temperature 1 hour, after
130 DEG C of high temperature constant temperature 2 hours solidifies silica gel；
The combination sealing mode of silica gel sealing and the riveting of locating dowel 501, silica gel are only to seal filling effect, and sensor is held
Pressure energy power is undertaken by the locating dowel 501 after riveting, improves the overload capacity of product；Locating dowel 501 is the one of the plastics of housing 500
Part, the structural integrity of circuit board and housing 500 is lifted after riveting, influence of the structural stress to circuit board is reduced, so as to carry
Rise the long-time stability of product；Silica gel after the cambered design binding silica gel segmented temperature-curable technique enhancing solidification of circuit board
Compactness, reduce the stress influence to circuit board.In the cold stage of segmented temperature-curable, temperature rises silica gel mobility and increased
By force, discharged after the air expansion in silica gel, the cambered design of circuit board causes the silica gel in groove to be easy to discharge air, simultaneously
Expanded after silica gel solidification, the arc of circuit board is easy to overflow in silica gel unnecessary after expansion, while sets and overflow in the inner chamber of housing 500
Glue groove 506, prevent silica gel overflows from causing passage 502 to block, silica gel reduces the extruding to circuit board after overflowing, alleviate electricity
The deformation quantity of road plate, the stability of product improve.
3rd, the connection and protection of circuit board and housing 500
A, the pad of product circuit plate after assembling and the contact pin pad 505 of housing 500 are welded, using 10mil crude aluminum
Line two-wire is bonded, and the single line pulling force after bonding is not less than 50g；
B, the embedding of gel 800 is carried out to the inner chamber of housing 500, it is ensured that circuit board surface, inner chamber contact pin, crude aluminum line are coagulated completely
Glue 800 covers, and gel 800 can prevent contact pin, crude aluminum line, circuit board and relative electronic components and air contact, avoid aoxidizing.
Connected in circuit board with the contact pin of housing 500 and use 10mil crude aluminum line bonding techniques, be different from the winding displacement of current main flow
Or flexible plate weld, automation is easy to implement, reduces welding risk；The embedding gel 800 in the cavity of housing 500, can be to circuit
Plate, metalwork and electronic component and external environment carry out isolating and protecting, while metallicity impurity that may be present is glued
Knot is fixed, and avoids result in short circuit；The perfusion of gel 800 effectively reduces product vibration etc. and component and bonding line is rushed simultaneously
Hit, play good cushioning effect, final gel 800 has preferable radiating effect.
4th, final assembly and aging
After remaining accessory assembling such as product bonnet, sealing ring, complete machine aging is carried out, aging is according to powered (5V), pressurization
Kept for 24 hours in (full-scale pressure), high temperature (130 DEG C) environment；After aging under normal temperature condition static 24 hours it is to be calibrated；
5th, complete machine is calibrated
(20-28 DEG C) calibration of normal temperature, high temperature (calibration temperature 90- are carried out to product using mass calibration tool and software
105 DEG C) and low temperature (- 20 DEG C of temperature of calibration) compensation；
6th, storage is examined
Complete the complete machine after calibration and carry out normal temperature, low temperature (- 40 DEG C), the detection of high temperature (130 DEG C) electrical property and complete machine sealing
Property detection, be put in storage after examining mark without exception.
After above-mentioned scheme, double gold threads that 1.0mil is used between MEMS chip and circuit board are bound, lifting production
The anti-fatigue life ability of product, extend the service life of product；Using the perfusion of silica gel groove, circuit board positioning riveting, circuit board
The structure designs such as arc and the stage curing and abundant aging technique design of silica gel high/low temperature, realize the final assembly of product, realize
Product reduces stress, improves the requirement of overload capacity and sealing；Using the double of 10mil between circuit board and the contact pin of housing 500
Aluminum wire bonding technique realizes connection, and the metallic particles such as failure welding and scruff caused by avoiding soldering pollutes, and lifting product is reliable
Property；The embedding of gel 800 is carried out in the inner chamber of housing 500, is realized to circuit board and the contact pin bonding line of housing 500 and circuit board electronic
The protection against oxidation of component, while the influence of mechanical shock is reduced, improve product long-time stability.
The utility model is exemplarily described above in conjunction with accompanying drawing, it is clear that the utility model specific implementation not by
The limitation of aforesaid way, as long as employing changing for the various unsubstantialities that methodology and technical scheme of the present utility model are carried out
Enter, or it is not improved by it is of the present utility model design and technical scheme directly apply to other occasions, in the utility model
Protection domain within.
Claims (5)
1. a kind of pressure sensor, it is characterised in that have：
Circuit board, the circuit board side are provided with the arc-shaped side that caves inward, be additionally provided with the circuit board board pads and
Positioning hole；
Chip, it is arranged on the bottom of the circuit board, is bound between chip and circuit board using double gold threads；And chip is set to cover
Lid glue covers the chip；
Housing, the housing is interior to be provided with the first mounting groove, and the first mounting groove bottom land is provided with the second mounting groove, the chip peace
In second mounting groove, the bottom land of second mounting groove is provided with passage；The circuit board is arranged on described first
In mounting groove；The notch of second mounting groove is surrounded by step, and the step supports the circuit board；The step periphery
Provided with groove, silica gel is irrigated in the groove, the silica gel height is consistent with shoulder height；
Locating dowel is additionally provided with the housing, the locating dowel is adapted with the positioning hole on circuit board；
Contact pin pad is additionally provided with the housing, the contact pin pad is bonded line bonding with the circuit board by aluminium wire；
Gel, fill first mounting groove, the gel overlay circuit board surface and electronic component.
2. pressure sensor as claimed in claim 1, it is characterised in that the second mounting groove bottom land is surrounded by excessive glue ditch
Groove.
3. pressure sensor as claimed in claim 2, it is characterised in that the circuit board is provided with board pads, described
Chip is provided with chip bonding pad；Two-wire is carried out between the pad and board pads of the chip using 1.0mil gold thread to tie up
It is fixed.
4. pressure sensor as claimed in claim 3, it is characterised in that the chip periphery is provided with back-up ring, and the back-up ring is consolidated
Determine on circuit boards；The chip rubber cover is arranged in the back-up ring.
5. pressure sensor as claimed in claim 4, it is characterised in that the aluminium wire bonding line is arranged on the circuit board
Surface, the board pads are bonded with the contact pin pad of housing using 10mil aluminum steel two-wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720601119.3U CN206945202U (en) | 2017-05-26 | 2017-05-26 | A kind of pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720601119.3U CN206945202U (en) | 2017-05-26 | 2017-05-26 | A kind of pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206945202U true CN206945202U (en) | 2018-01-30 |
Family
ID=61363353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720601119.3U Expired - Fee Related CN206945202U (en) | 2017-05-26 | 2017-05-26 | A kind of pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206945202U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106946213A (en) * | 2017-05-26 | 2017-07-14 | 芜湖恒铭电子科技有限公司 | A kind of pressure sensor and preparation method thereof |
-
2017
- 2017-05-26 CN CN201720601119.3U patent/CN206945202U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106946213A (en) * | 2017-05-26 | 2017-07-14 | 芜湖恒铭电子科技有限公司 | A kind of pressure sensor and preparation method thereof |
| CN106946213B (en) * | 2017-05-26 | 2019-04-23 | 芜湖恒铭电子科技有限公司 | A kind of pressure sensor and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180130 Termination date: 20180526 |