CN201876338U - Module packaging structure of pressure sensor - Google Patents
Module packaging structure of pressure sensor Download PDFInfo
- Publication number
- CN201876338U CN201876338U CN2010206225754U CN201020622575U CN201876338U CN 201876338 U CN201876338 U CN 201876338U CN 2010206225754 U CN2010206225754 U CN 2010206225754U CN 201020622575 U CN201020622575 U CN 201020622575U CN 201876338 U CN201876338 U CN 201876338U
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- pressure sensor
- package casing
- pore
- circuit board
- sensor module
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Abstract
The utility model discloses a module packaging structure of a pressure sensor, which comprises a packaging casing, a circuit board mounted in a cavity of the packaging casing and a pressure sensor bare chip, wherein an air hole communicated with the outside is formed at the upper part of the cavity of the packaging casing for inputting the pressure; the pressure sensor bare chip is arranged on the circuit board; the periphery of the pressure sensor bare chip is filled with epoxy; and an external lead is arranged at a bonding pad of the circuit board, penetrates through an external lead hole of the packaging casing and extends out of the packaging casing. By adopting the packaging technology for modularizing the pressure sensor bare chip, the module packaging structure of the pressure sensor is convenient for one module to be replaced when the module is damaged and realizes the module batch process; the mistake in the production process is effectively reduced; and the production efficiency is improved, the defective rate is reduced and the performances of products are improved.
Description
Technical field
The utility model relates to a kind of pressure sensor module encapsulating structure, and particularly a kind of result of use is good, changes pressure sensor module encapsulating structure easily.
Background technology
Pressure transducer is the important component part of pressure unit, generally need be installed on the circuit board and use.The mounting structure of pressure transducer nude film on circuit board mainly contains following mode at present:
First kind, as described in Figure 1, the pressure transducer nude film is fixed on the circuit board, one end of welding gold thread is welded on the pressure transducer nude film, the other end stretches out downward bending and is welded on the circuit board, welding gold thread and sensor are fixed by a glue and are prevented oxidation, and the shortcoming of this syndeton is: easily the welding gold thread is broken during installation, thus the substandard product that occurs.Second kind, as described in Figure 2, for solving the shortcoming of first kind of mounting structure, add constraint circle outside in the outside of pressure transducer nude film, be filled within the constraint circle to drip glue, but its shortcoming is, in case the pressure transducer nude film has been broken, just must and carry out new pressure transducer nude film and load onto, thereby expend too much time and resource the removal of the pressure transducer nude film on the circuit board; And easily circuit board is made a mess of when removing bad pressure transducer nude film and caused production cost to improve.
Summary of the invention
In order to overcome the deficiencies in the prior art, fundamental purpose of the present utility model is to provide that a kind of modularization is handled, pressure sensor module structure easy to use.
The technical scheme that its technical matters that solves the utility model adopts is:
A kind of pressure sensor module encapsulating structure, comprise package casing, be installed in circuit board, pressure transducer nude film in the package casing cavity, the top of package casing inner chamber has the pore that is in communication with the outside with input pressure, the pressure transducer nude film is arranged on the circuit board, be filled with around the pressure transducer nude film and drip glue, the pad place of circuit board is provided with the outer lead hole that external lead wire passes package casing and stretches out package casing.
For convenience pressure transducer is installed, and described package casing is divided into upper shell cover and lower house, and upper shell cover is installed on lower house uncovered;
The pressure sensor module encapsulating structure connects defeated pressure pipe road for convenience, and the pore place of described package casing is extended with the ventilation mouth, and the ventilation mouth is communicated with the package casing cavity;
For the accuracy of the working sensor that keep-ups pressure, by pore one side cushioning fender is installed in the described package casing cavity, have cushion hole on the cushioning fender;
For the accuracy of the working sensor that further keep-ups pressure, stagger between described cushion hole and the pore;
For the pressure that makes input pressure sensor module package structure more stable, described package casing is provided with around the back-up ring of pore and cushion hole by pore and buffering baffle plate one side, and the back-up ring two ends closely are connected the cavity that makes package casing, cushioning fender and back-up ring form a relative sealing with package casing, cushioning fender respectively.
The beneficial effects of the utility model are: owing to adopted the pressure transducer nude film is carried out modular encapsulation technology, change during module damage of convenience, also realized modularization process in batches, reduced the mistake of production run effectively, not only improve efficient, the reduction in the numbers of seconds of producing, and improved the performance of product.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified:
Fig. 1 is the structural representation of first kind of embodiment of product in the past;
Fig. 2 is the structural representation of second kind of embodiment of product in the past;
Fig. 3 is a structural representation of the present utility model;
Fig. 4 is a circuit board vertical view of the present utility model;
Fig. 5 is a upper and lower package casing three-dimensional structure diagram of the present utility model.
Embodiment
With reference to Fig. 3, Fig. 4, Fig. 5, a kind of pressure sensor module encapsulating structure of the present utility model, comprise package casing 1, be installed in the pressure transducer nude film 8 of 1 li of package casing, circuit board 7, wherein the top of package casing 1 inner chamber has pore 12 and is in communication with the outside, the upper surface of circuit board 7 is provided with Pu Tong district 4, pressure transducer nude film 8 is fixed in the Pu Tong district 4 according to the direction that designs, the circuit of circuit board 7 surface with fixing after the upper surface of pressure transducer nude film 8 remain basically stable, the two ends of the welding gold thread 3 between circuit board 7 and the pressure transducer nude film 8 are overlapped on the upper surface line pad place of circuit board 7 and upper surface wiring place of pressure transducer nude film 8 respectively, and are provided with the outer lead hole that external lead wire 6 passes package casing 1 at the pad place of circuit board 7 and stretch out package casing 1.Pore 12 places of package casing 1 are extended with ventilation mouth 13, and ventilation mouth 13 is communicated with to make things convenient for the pressure sensor module encapsulating structure to be connected defeated pressure pipe road with package casing 1 cavity.So promptly constituted the modularization encapsulation technology of pressure transducer nude film.In order further to guarantee the result of use of pressure sensor module encapsulating structure, be filled with around the described pressure transducer nude film 8 and drip glue 2, and this glue 2 covers welding gold thread 3.
With reference to Fig. 3, in order to guarantee the accuracy of pressure transducer work, by pore 12 1 sides cushioning fender 5 is installed in described package casing 1 cavity, 5 have cushion hole 51 on the cushioning fender, the cushion hole 51 of cushioning fender 5 and pore 12 stagger to guarantee buffer action, also can realize the effect of buffering simultaneously, thereby make the pressure of measuring more accurate by open alternate manners such as some apertures at cushioning fender 5.For the pressure that makes input pressure sensor module package structure more stable, described package casing 1 is provided with around the back-up ring 14 of pore 12 and cushion hole 51 by pore 12 and buffering baffle plate 5 one sides, back-up ring 14 two ends closely are connected the cavity that makes package casing 1, cushioning fender 5 and back-up ring 14 form a relative sealing with package casing 1, cushioning fender 5 respectively, and preventing influences measurement effect from the pressure of ventilation mouth 13 inputs from leaking between package casing 1 and the buffering baffle plate 5.
With reference to Fig. 5, for convenience pressure transducer is installed, and described package casing 1 comprises upper shell cover 11 and lower house 15, and upper shell cover 11 is installed on lower house 15 uncovered, open upper shell cover 11 during installation and install, available glue glues the gap of upper shell cover 11 and lower house 15 after the installation.
This pressure sensor module encapsulating structure carries out modular encapsulation technology to the pressure transducer nude film owing to having adopted, change during module damage of convenience, also realized modularization process in batches, reduced the mistake of production run effectively, not only improve efficient, the reduction in the numbers of seconds of producing, and improved the performance of product.
Claims (6)
1. pressure sensor module encapsulating structure, it is characterized in that: comprise package casing (1), be installed in circuit board (7), pressure transducer nude film (8) in package casing (1) cavity, the top of package casing (1) inner chamber has pore (12) and is in communication with the outside, pressure transducer nude film (8) is arranged on the circuit board (7), be filled with around the pressure transducer nude film (8) and drip glue (2), the pad place of circuit board (7) is provided with the outer lead hole that external lead wire (6) passes package casing (1) and stretches out package casing (1).
2. a kind of pressure sensor module encapsulating structure according to claim 1 is characterized in that: described package casing (1) comprises upper shell cover (11) and lower house (15), and upper shell cover (11) is installed on lower house (15) uncovered.
3. a kind of pressure sensor module encapsulating structure according to claim 1 is characterized in that: the pore (12) of described package casing (1) locates to be extended with ventilation mouth (13), and ventilation mouth (13) is communicated with package casing (1) cavity.
4. a kind of pressure sensor module encapsulating structure according to claim 1 is characterized in that: by pore (12) one sides cushioning fender (5) is installed in described package casing (1) cavity, (5) have cushion hole (51) on the cushioning fender.
5. a kind of pressure sensor module encapsulating structure according to claim 4 is characterized in that: between described cushion hole (51) and the pore (12) stagger in the position.
6. according to claim 4 or 5 described a kind of pressure sensor module encapsulating structures, it is characterized in that: described package casing (1) is provided with around the back-up ring (14) of pore (12) and cushion hole (51) by pore (12) and buffering baffle plate (5) one sides, and back-up ring (14) two ends closely are connected with package casing (1), cushioning fender (5) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206225754U CN201876338U (en) | 2010-11-24 | 2010-11-24 | Module packaging structure of pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206225754U CN201876338U (en) | 2010-11-24 | 2010-11-24 | Module packaging structure of pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201876338U true CN201876338U (en) | 2011-06-22 |
Family
ID=44164254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206225754U Expired - Lifetime CN201876338U (en) | 2010-11-24 | 2010-11-24 | Module packaging structure of pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201876338U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103185606A (en) * | 2011-12-30 | 2013-07-03 | 浙江盾安禾田金属有限公司 | Encapsulation structure of sensor core body, core body and sensor |
| CN106793648A (en) * | 2016-11-21 | 2017-05-31 | 畅充科技（北京）有限公司 | USB HUB chip applications are in the method for designing and system of circuit board |
-
2010
- 2010-11-24 CN CN2010206225754U patent/CN201876338U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103185606A (en) * | 2011-12-30 | 2013-07-03 | 浙江盾安禾田金属有限公司 | Encapsulation structure of sensor core body, core body and sensor |
| CN106793648A (en) * | 2016-11-21 | 2017-05-31 | 畅充科技（北京）有限公司 | USB HUB chip applications are in the method for designing and system of circuit board |
| CN106793648B (en) * | 2016-11-21 | 2019-09-06 | 畅充科技（北京）有限公司 | USB HUB chip is applied to the design method and system of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Xinhui Kangyu Control Systems Engineering Inc. Assignor: Li Bingwei Contract record no.: 2011440000785 Denomination of utility model: Module packaging structure of pressure sensor Granted publication date: 20110622 License type: Exclusive License Record date: 20110802 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170914 Address after: Will the West Road hi tech industrial village main workshop 529100 in Guangdong province Jiangmen City Xinhui District Patentee after: Guangdong Yu Yu sensor Co., Ltd. Address before: 529100 Guangdong Province, Jiangmen City Xinhui District Simon Road, hi tech Industrial Village Patentee before: Li Bingwei |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110622 |