CN106946213A - A kind of pressure sensor and preparation method thereof - Google Patents
A kind of pressure sensor and preparation method thereof Download PDFInfo
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- CN106946213A CN106946213A CN201710385541.4A CN201710385541A CN106946213A CN 106946213 A CN106946213 A CN 106946213A CN 201710385541 A CN201710385541 A CN 201710385541A CN 106946213 A CN106946213 A CN 106946213A
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- circuit board
- chip
- mounting groove
- housing
- temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0027—Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a kind of pressure sensor and preparation method thereof, have：Circuit board, circuit board side is provided with the arc-shaped side caved inward, circuit board and is additionally provided with board pads and positioning hole；Chip, it is arranged on the bottom of circuit board；The first mounting groove is provided with housing, housing, the first mounting groove bottom land is provided with the second mounting groove, and chip is arranged in the second mounting groove, and the bottom land of the second mounting groove is provided with passage；Circuit board is arranged in the first mounting groove；The notch of second mounting groove is formed around step；Step periphery is provided with perfusion silica gel in groove, groove, and locating dowel is adapted with the positioning hole on circuit board；Contact pin pad is additionally provided with housing, contact pin pad is bonded line bonding with circuit board by aluminium wire；Gel, fills the first mounting groove, and sensor anti-corrosion is good, long-time stability are good and overload capacity high.
Description
Technical field
The invention belongs to pressure sensor technique field, more particularly to a kind of pressure sensor and preparation method thereof.
Background technology
The manufacture method of existing automobile-used gas pressure sensor, chip package typically binds structure, circuit board using single line
Using wire welding or flexible plate weld between housing, final assembly typically using epoxide-resin glue or silica gel or
The frame mode of sealing ring pressing is completed；
During the present invention is realized, inventor has found that prior art at least has problems with：Cause the close of product
The problem of Feng Xing, overload capacity and long-time stability and corrosion resistance all have larger.
The content of the invention
The technical problems to be solved by the invention are to provide that a kind of corrosion resistance is good, long-time stability are good and overload energy
High pressure sensor of power and preparation method thereof.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is：A kind of pressure sensor, has：
Circuit board, the circuit board side, which is provided with the arc-shaped side caved inward, the circuit board, is additionally provided with circuit board weldering
Disk and positioning hole；
Chip, it is arranged on the bottom of the circuit board, using double gold thread bindings between chip and circuit board；And core is set
Piece rubber cover covers the chip；
The first mounting groove is provided with housing, the housing, the first mounting groove bottom land is provided with the second mounting groove, the core
Piece is arranged in second mounting groove, and the bottom land of second mounting groove is provided with passage；The circuit board is arranged on described
In first mounting groove；The notch of second mounting groove is formed around step, and the step supports the circuit board；The step
Periphery is provided with perfusion silica gel in groove, the groove, and the silica gel height is consistent with shoulder height；
Locating dowel is additionally provided with the housing, the locating dowel is adapted with the positioning hole on circuit board；
Contact pin pad is additionally provided with the housing, the contact pin pad is bonded line bonding with the circuit board by aluminium wire；
Gel, fills first mounting groove, the gel overlay circuit board surface and electronic component.
The second mounting groove bottom land is formed around excessive glue groove.
The circuit board is provided with board pads, and the chip is provided with chip bonding pad；The pad and electricity of the chip
Between the plate pad of road two-wire binding is carried out using 1.0mil gold thread.
The chip periphery is provided with back-up ring, and the back-up ring is fixed on circuit boards；The chip rubber cover is arranged on described
In back-up ring.
The aluminium wire bonding line is arranged on the circuit board upper surface, and the contact pin pad of the board pads and housing is adopted
It is bonded with 10mil aluminum steels two-wire.
A kind of preparation method of above-mentioned pressure sensor, comprises the following steps：
1) chip is bonded on circuit board by bonder, and fixed by hot setting adhesive glue, by full-automatic
Bonding machines will carry out two-wire binding using 1.0mil gold thread between the pad and board pads of chip, binding single line pulling force will
More than 7g is sought, binding terminates to bond back-up ring and fixation, the embedding chip rubber cover in back-up ring in the periphery of chip；
2) silica gel is filled in the groove of housing, and is coated on step, silica gel coating height is consistent with shoulder height,
Ensure the uniformity of silica gel coating；
3) circuit board after encapsulation is loaded in housing according to positioning hole and the matching of housing locating dowel and compressed；
4) product after riveting is placed into high-temperature cabinet and solidified according to wise temperature, according to 60 DEG C of elder generation constant temperature 1 hour, after
130 DEG C of high temperature constant temperature 2 hours solidifies silica gel；
5) the contact pin pad of product circuit plate pad after assembling and housing is welded, using 10mil aluminum steel two-wire keys
Close, the single line pulling force after bonding is not less than 50g；
6) gel embedding is carried out to housing cavity, it is ensured that circuit board surface and electronic component are completely by gel overlay.
6) after step, also carries out following steps：
7) final assembly and aging：After remaining accessory assembling such as product bonnet, sealing ring, whole machine aging, aging are carried out
Kept for 24 hours according in powered -5V, pressurization-full-scale pressure, high temperature -130 DEG C environment；It is quiet under normal temperature condition after aging
Only 24 hours it is to be calibrated；
8) whole machine calibration：Normal temperature calibration, high temperature-calibration temperature are carried out to product using mass calibration tool and software
90~105 DEG C and low temperature--20 DEG C of calibration temperature compensation；
9) storage is examined：Complete the whole machine after calibration and carry out normal temperature, low temperature--40 DEG C, the detection of high temperature -130 DEG C electrical property
With whole machine sealing propertytest, examine and be put in storage after mark without exception.
A technical scheme in above-mentioned technical proposal has the following advantages that or beneficial effect, to MEMS chip and circuit board
Between using 1.0mil double gold threads bind, lifted product anti-fatigue life ability, extension product usage cycles；Using silicon
Structure design and the stage curing and abundant agings of silica gel high/low temperature such as the perfusion of glue groove, circuit board positioning riveting, circuit board arc
Technological design, realizes the final assembly of product, realizes product reduction stress, improves the requirement of overload capacity and sealing；Circuit
Connection is realized using 10mil double aluminum wire bonding techniques, it is to avoid failure welding and tin caused by soldering between plate and housing contact pin
The metallic particles such as slag pollute, and lift product reliability；Gel embedding is carried out in housing cavity, is realized to circuit board and housing contact pin
The protection against oxidation of bonding line and circuit board electronic component, while reducing the influence of mechanical shock, improves product steady for a long time
It is qualitative.
Brief description of the drawings
Fig. 1 is the structural representation of the circuit board of pressure sensor provided in the embodiment of the present invention；
Fig. 2 is the inner-cavity structure schematic diagram of the housing of pressure sensor；
The structural representation of the pressure sensor provided in Fig. 3 embodiment of the present invention；
Fig. 4 is the sectional view of Fig. 3 pressure sensor；
Mark in above-mentioned figure is：100th, chip；101st, chip bonding pad；200th, circuit board；201st, positioning hole；202nd, it is electric
Road plate pad；300th, spun gold binding line；400th, plastics back-up ring；500th, housing；501st, locating dowel；502nd, passage；503rd, step；
504th, groove；505th, contact pin pad；506th, excessive glue groove；600th, aluminium wire bonding line；700th, chip rubber cover；800th, gel.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
Embodiment one
Referring to Fig. 1-3, a kind of pressure sensor has：
Circuit board 202, circuit board side is provided with the arc-shaped side caved inward, circuit board and is additionally provided with board pads 202
With positioning hole 201；
Chip 100, it is arranged on the bottom of circuit board, using double gold thread bindings between chip and circuit board；And core is set
Piece rubber cover 700 covers chip；
The first mounting groove is provided with housing 500, housing 500, the first mounting groove bottom land is provided with the second mounting groove, and chip is installed
In the second mounting groove, the bottom land of the second mounting groove is provided with passage 502；Circuit board is arranged in the first mounting groove；Second peace
The notch of tankage is formed around step 503, the support circuit board of step 503；The periphery of step 503 is provided with groove 504, groove and irrigated
Silica gel, silica gel height is highly consistent with step 503；
Locating dowel 501 is additionally provided with housing 500, locating dowel 501 is adapted with the positioning hole 201 on circuit board；
Contact pin pad 505 is additionally provided with housing 500, contact pin pad 505 is bonded with circuit board by aluminium wire bonding line 600；
Gel 800, fills the first mounting groove, the covering board of gel 800, inner chamber contact pin, aluminium wire.
Second mounting groove bottom land is formed around excessive glue groove 506.
Circuit board is provided with board pads 202, and chip is provided with chip bonding pad 101；Pad and the circuit board weldering of chip
Between disk 202 two-wire binding is carried out using 1.0mil spun gold binding line 300.
Chip periphery is provided with back-up ring 400, and back-up ring 400 is fixed on circuit boards；Chip rubber cover 700 is arranged on back-up ring 400
It is interior.
Aluminium wire bonding line 600 is arranged on circuit board upper surface, and board pads 202 and the contact pin pad 505 of housing 500 are adopted
It is bonded with 10mil aluminum steels two-wire.
Embodiment two
The preparation method of sensor, is embodied as follows
1st, the chip package of circuit board
MEMS chip ML808 is bonded on circuit board by bonder, and fixed by hot setting adhesive glue, is passed through
Full-automatic bonding machines will carry out two-wire binding using 1.0mil gold thread between the pad of MEMS chip and board pads 202,
More than single line pulling tension requirements 7g is bound, binding terminates to use manipulator adhered plastics back-up ring 400 and solid in the periphery of MEMS chip
It is fixed, the embedding chip rubber cover 700 in back-up ring 400.
The binding of chip is using 1.0mil double gold threads binding, and gold thread has good electric conductivity and ductility, and double gold
The risk of line binding reduction binding line broken string, improves the anti-fatigue life of product and the service life of product.
2nd, the assembling of circuit board and housing 500
A, fill silica gel in the groove of housing 500, and coated on step 503, silica gel coating height and the height of step 503
It is consistent, it is ensured that the uniformity of silica gel coating；
B, by the circuit board after encapsulation according to positioning hole 201 and the locating dowel 501 of housing 500 match loading the internal pressure of housing 500
Tightly, using the locating dowel 501 of four housings of rivet hot press riveting 500, it is bowl-shape to should be regular back-off after the riveting of locating dowel 501, no drawing
The phenomenons such as silk burr；
C, the product after riveting is placed into high-temperature cabinet solidified according to wise temperature, according to first 60 DEG C of constant temperature 1 hour, after
130 DEG C of high temperature constant temperature 2 hours solidifies silica gel；
The combination sealing mode of silica gel sealing and the riveting of locating dowel 501, silica gel is only sealing filling effect, and sensor is held
Pressure energy power is undertaken by the locating dowel 501 after riveting, improves the overload capacity of product；Locating dowel 501 is the one of the plastics of housing 500
The structural integrity lifting of circuit board and housing 500 after part, riveting, influence of the reduction structural stress to circuit board, so as to carry
Rise the long-time stability of product；Silica gel after the cambered design binding silica gel segmented temperature-curable technique enhancing solidification of circuit board
Compactness, reduces the stress influence to circuit board.In the cold stage of segmented temperature-curable, temperature rises silica gel mobility and increased
By force, discharged after the air expansion in silica gel, the cambered design of circuit board make it that the silica gel in groove is easy to discharge air, simultaneously
Expanded after silica gel solidification, the arc of circuit board is easy to overflow in silica gel unnecessary after expansion, is overflow while being set in the inner chamber of housing 500
Glue groove 506, preventing that silica gel from overflowing causes passage 502 to block, and silica gel reduces the extruding to circuit board after overflowing, and alleviates electricity
The deformation quantity of road plate, the stability of product is improved.
3rd, the connection and protection of circuit board and housing 500
A, the pad of product circuit plate after assembling and the contact pin pad 505 of housing 500 welded, using 10mil crude aluminum
Line two-wire is bonded, and the single line pulling force after bonding is not less than 50g；
B, to the inner chamber of housing 500 carry out the embedding of gel 800, it is ensured that circuit board surface, inner chamber contact pin, crude aluminum line are coagulated completely
Glue 800 is covered, and gel 800 can prevent contact pin, crude aluminum line, circuit board and relative electronic components and air contact, it is to avoid oxidation.
10mil crude aluminum line bonding techniques are used in circuit board and the connection of the contact pin of housing 500, the winding displacement of current main flow is different from
Or flexible plate weld, it is easy to implement automation, reduction welding risk；The embedding gel 800 in the cavity of housing 500, can be to circuit
Plate, metalwork and electronic component and external environment carry out isolating and protecting, while being glued to metallicity impurity that may be present
Knot is fixed, it is to avoid cause short circuit；The perfusion of gel 800 effectively reduces product vibration etc. and component and bonding line is rushed simultaneously
Hit, play good cushioning effect, final gel 800 has preferable radiating effect.
4th, final assembly and aging
After remaining accessory assembling such as product bonnet, sealing ring, whole machine aging is carried out, aging is according to powered (5V), pressurization
Kept for 24 hours in (full-scale pressure), high temperature (130 DEG C) environment；After aging under normal temperature condition static 24 hours it is to be calibrated；
5th, whole machine calibration
(20-28 DEG C) calibration of normal temperature, high temperature (calibration temperature 90- are carried out to product using mass calibration tool and software
105 DEG C) and low temperature (- 20 DEG C of temperature of calibration) compensation；
6th, storage is examined
Complete the whole machine after calibration and carry out normal temperature, low temperature (- 40 DEG C), the detection of high temperature (130 DEG C) electrical property and whole secret envelope
Property detection, examine and be put in storage after mark without exception.
After above-mentioned scheme, double gold threads between MEMS chip and circuit board using 1.0mil are bound, lifting production
The anti-fatigue life ability of product, extends the usage cycles of product；Using the perfusion of silica gel groove, circuit board positioning riveting, circuit board
The structure designs such as arc and the stage curing and abundant aging technique design of silica gel high/low temperature, realize the final assembly of product, realize
Product reduction stress, the requirement for improving overload capacity and sealing；Using the double of 10mil between circuit board and the contact pin of housing 500
Aluminum wire bonding technique realizes connection, it is to avoid the metallic particles such as failure welding and scruff pollutes caused by soldering, and lifting product is reliable
Property；The embedding of gel 800 is carried out in the inner chamber of housing 500, is realized to circuit board and the contact pin bonding line of housing 500 and circuit board electronic
The protection against oxidation of component, while reducing the influence of mechanical shock, improves product long-time stability.
The present invention is exemplarily described above in conjunction with accompanying drawing, it is clear that the present invention is implemented not by aforesaid way
Limitation, as long as the improvement for the various unsubstantialities that method of the present invention design and technical scheme are carried out is employed, or without changing
Enter and the design of the present invention and technical scheme are directly applied into other occasions, within protection scope of the present invention.
Claims (7)
1. a kind of pressure sensor, it is characterised in that have：
Circuit board, the circuit board side be provided with the arc-shaped side that caves inward, the circuit board be additionally provided with board pads and
Positioning hole；
Chip, it is arranged on the bottom of the circuit board, using double gold thread bindings between chip and circuit board；And set chip to cover
Lid glue covers the chip；
The first mounting groove is provided with housing, the housing, the first mounting groove bottom land is provided with the second mounting groove, the chip peace
In second mounting groove, the bottom land of second mounting groove is provided with passage；The circuit board is arranged on described first
In mounting groove；The notch of second mounting groove is formed around step, and the step supports the circuit board；The step periphery
Provided with groove, perfusion silica gel in the groove, the silica gel height is consistent with shoulder height；
Locating dowel is additionally provided with the housing, the locating dowel is adapted with the positioning hole on circuit board；
Contact pin pad is additionally provided with the housing, the contact pin pad is bonded line bonding with the circuit board by aluminium wire；
Gel, fills first mounting groove, the gel overlay circuit board surface and electronic component.
2. pressure sensor as claimed in claim 1, it is characterised in that the second mounting groove bottom land is formed around excessive glue ditch
Groove.
3. pressure sensor as claimed in claim 2, it is characterised in that the circuit board is provided with board pads, described
Chip is provided with chip bonding pad；Two-wire is carried out between the pad and board pads of the chip using 1.0mil gold thread to tie up
It is fixed.
4. pressure sensor as claimed in claim 3, it is characterised in that the chip periphery is provided with back-up ring, the back-up ring is consolidated
Determine on circuit boards；The chip rubber cover is arranged in the back-up ring.
5. pressure sensor as claimed in claim 4, it is characterised in that the aluminium wire bonding line is arranged on the circuit board
Surface, the board pads are bonded with the contact pin pad of housing using 10mil aluminum steel two-wires.
6. the preparation method of a kind of pressure sensor as described in claim 1-5 is any, it is characterised in that including following step
Suddenly：
1) chip is bonded on circuit board by bonder, and fixed by hot setting adhesive glue, pass through full-automatic bonding
Machine will carry out two-wire binding, binding single line pulling tension requirements 7g using 1.0mil gold thread between the pad and board pads of chip
More than, binding terminates to bond back-up ring and fixation, the embedding chip rubber cover in back-up ring in the periphery of chip；
2) silica gel is filled in the groove of housing, and is coated on step, silica gel coating height is consistent with shoulder height, it is ensured that
The uniformity of silica gel coating；
3) circuit board after encapsulation is loaded in housing according to positioning hole and the matching of housing locating dowel and compressed；
4) product after riveting is placed into high-temperature cabinet and solidified according to wise temperature, according to 60 DEG C of elder generation constant temperature 1 hour, rear high temperature
130 DEG C of constant temperature, 2 hours solidification silica gel；
5) the contact pin pad of product circuit plate pad after assembling and housing is welded, be bonded using 10mil aluminum steels two-wire, key
Single line pulling force after conjunction is not less than 50g；
6) gel embedding is carried out to housing cavity, it is ensured that circuit board surface and electronic component are completely by gel overlay.
7. the preparation method of pressure sensor as claimed in claim 6, it is characterised in that 6) after step, is also walked as follows
Suddenly：
7) final assembly and aging：After the assembling of remaining accessory such as product bonnet, sealing ring, carry out whole machine aging, aging according to
Kept for 24 hours in powered -5V, pressurization-full-scale pressure, high temperature -130 DEG C environment；After aging static 24 under normal temperature condition
Hour is to be calibrated；
8) whole machine calibration：Using mass calibration tool and software product is carried out normal temperature calibration, high temperature-calibration temperature 90~
105 DEG C and low temperature--20 DEG C of calibration temperature compensation；
9) storage is examined：The whole machine progress normal temperature after calibration, low temperature--40 DEG C, high temperature -130 DEG C electrical property is completed to detect and whole
Machine sealing propertytest, examines and be put in storage after mark without exception.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710385541.4A CN106946213B (en) | 2017-05-26 | 2017-05-26 | A kind of pressure sensor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710385541.4A CN106946213B (en) | 2017-05-26 | 2017-05-26 | A kind of pressure sensor and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106946213A true CN106946213A (en) | 2017-07-14 |
| CN106946213B CN106946213B (en) | 2019-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710385541.4A Expired - Fee Related CN106946213B (en) | 2017-05-26 | 2017-05-26 | A kind of pressure sensor and preparation method thereof |
Country Status (1)
| Country | Link |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108303560A (en) * | 2018-04-18 | 2018-07-20 | 北京方等传感器研究所有限公司 | Anti-channeling structure and sensor |
| CN108871483A (en) * | 2018-07-13 | 2018-11-23 | 深圳电通纬创微电子股份有限公司 | A kind of corrosion-resistant fuel gas table temperature and pressure compensation integrated transducer and its manufacturing method |
| CN108940729A (en) * | 2018-05-08 | 2018-12-07 | 南昌工控电装有限公司 | The anti-corrosion bonding method of dispensing needle tubing, point glue equipment and pressure sensor chip |
| CN109629174A (en) * | 2019-01-01 | 2019-04-16 | 佛山市顺德区硕美工业设计有限公司 | The interior without phosphorus decomposition washing machine of life |
| CN111487006A (en) * | 2020-04-16 | 2020-08-04 | 南京高华科技股份有限公司 | Micro differential pressure sensor based on stress isolation structure |
| CN111883434A (en) * | 2020-08-07 | 2020-11-03 | 安徽华东光电技术研究所有限公司 | Flow standard device module manufacturing process |
| CN111965388A (en) * | 2020-08-21 | 2020-11-20 | 西安交通大学 | Low-temperature-drift relative-plane surface-mounted differential integrated resonant accelerometer |
| CN116818156A (en) * | 2023-08-30 | 2023-09-29 | 河北美泰电子科技有限公司 | MEMS automobile pressure sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108303560A (en) * | 2018-04-18 | 2018-07-20 | 北京方等传感器研究所有限公司 | Anti-channeling structure and sensor |
| CN108940729A (en) * | 2018-05-08 | 2018-12-07 | 南昌工控电装有限公司 | The anti-corrosion bonding method of dispensing needle tubing, point glue equipment and pressure sensor chip |
| CN108871483A (en) * | 2018-07-13 | 2018-11-23 | 深圳电通纬创微电子股份有限公司 | A kind of corrosion-resistant fuel gas table temperature and pressure compensation integrated transducer and its manufacturing method |
| CN109629174A (en) * | 2019-01-01 | 2019-04-16 | 佛山市顺德区硕美工业设计有限公司 | The interior without phosphorus decomposition washing machine of life |
| CN111487006A (en) * | 2020-04-16 | 2020-08-04 | 南京高华科技股份有限公司 | Micro differential pressure sensor based on stress isolation structure |
| CN111883434A (en) * | 2020-08-07 | 2020-11-03 | 安徽华东光电技术研究所有限公司 | Flow standard device module manufacturing process |
| CN111965388A (en) * | 2020-08-21 | 2020-11-20 | 西安交通大学 | Low-temperature-drift relative-plane surface-mounted differential integrated resonant accelerometer |
| CN116818156A (en) * | 2023-08-30 | 2023-09-29 | 河北美泰电子科技有限公司 | MEMS automobile pressure sensor |
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