CN116818156A - MEMS automobile pressure sensor - Google Patents
MEMS automobile pressure sensor Download PDFInfo
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- CN116818156A CN116818156A CN202311099506.8A CN202311099506A CN116818156A CN 116818156 A CN116818156 A CN 116818156A CN 202311099506 A CN202311099506 A CN 202311099506A CN 116818156 A CN116818156 A CN 116818156A
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Abstract
The invention provides an MEMS automobile pressure sensor, which belongs to the technical field of automobile pressure detection and comprises a base, a detection assembly and a connector, wherein the base is provided with a first installation cavity and a second installation cavity which are communicated with each other along a first path, and the second installation cavity is contracted in the first installation cavity on a second path; the detection assembly comprises a PCB, and an induction module and an electronic module which are oppositely arranged at two sides of the PCB, wherein the PCB and the electronic module are both arranged in the first mounting cavity, and the induction module is positioned in the second mounting cavity; the connector is provided with a containing cavity along a second path, one end of the connector is inserted into the first mounting cavity, and the inserted end of the connector is abutted to the PCB. The invention provides a MEMS automobile pressure sensor, which aims to solve the problems that the existing electronic device is in rigid contact with a shell, is extruded by the shell after being stressed or deformed, is easy to generate connection failure or damage and affects detection precision.
Description
Technical Field
The invention belongs to the technical field of automobile pressure detection, and particularly relates to an MEMS automobile pressure sensor.
Background
The automobile sensor is used as an information source of an automobile electronic control system, is a key component of the automobile electronic control system, and is one of core contents of research in the technical field of automobile electronics. The automobile sensor measures and controls various information such as temperature, pressure, position, rotating speed, acceleration, vibration and the like accurately in real time. The key to measuring the level of modern advanced car control systems is the number and level of sensors.
The micro-electro-mechanical system (MEMS) technology developed from the semiconductor integrated circuit technology is mature, and various micro sensors can be manufactured by using the technology, and the micro sensors have small volume and low energy consumption, can realize a plurality of brand new functions, have low cost, are convenient for mass and high-precision production, are easy to form a large-scale and multifunctional array, and are very suitable for being applied to automobiles.
Since MEMS sensors have the irreplaceable advantage, traditional automotive pressure sensors will be gradually replaced by them. The existing pressure sensor is generally provided with a mounting cavity in a shell, an electronic device is arranged in the mounting cavity, and the electronic device is mounted and fixed through rigid contact between the electronic device and the shell. However, since the automobile is often outdoors in the use process, the automobile is seriously affected by environmental climate, for example, the temperature, humidity, air volume change and the like of the external environment can influence the precision of the pressure sensor, and particularly, the automobile is easy to be subjected to external force effects such as collision and the like in the use process, and great test is put forward on the reliability of the pressure sensor. The traditional pressure sensor is installed in such a way that the electronic device is extremely easy to be connected with the shell for failure due to deformation or stress after being subjected to thermal expansion and contraction or external force collision, or is damaged due to extrusion of the shell after deformation or stress due to rigid contact of the electronic device and the shell, so that the detection precision is affected, and the service life is reduced.
Disclosure of Invention
The invention aims to provide an MEMS automobile pressure sensor, which aims to solve the problems that the existing electronic device is in rigid contact with a shell, is extruded by the shell after being stressed or deformed, is easy to generate connection failure or damage and influences detection precision.
In order to achieve the above purpose, the invention adopts the following technical scheme:
there is provided a MEMS automotive pressure sensor comprising:
the base is provided with a first installation cavity and a second installation cavity which are communicated with each other along a first path, the first installation cavity is also communicated with the outside on the first path, the second installation cavity is contracted in the first installation cavity on a second path, so that the first installation cavity and the second installation cavity form a step-shaped cavity together, and the second path is perpendicular to the first path;
the detection assembly comprises a PCB, and an induction module and an electronic module which are oppositely arranged at two sides of the PCB along the first path, wherein the PCB and the electronic module are both arranged in the first mounting cavity, the PCB is contacted with the base on the first path, and the induction module is positioned in the second mounting cavity; and
the connector is provided with a containing cavity along a first path, one end of the connector is inserted into the first mounting cavity, and the inserted end of the connector is abutted to the PCB, so that the containing cavity forms a closed space for containing the electronic module.
In one possible implementation, the MEMS automobile pressure sensor further includes a fastener in interference fit with the second mounting cavity, the fastener contacting the sensing module in the first path for spacing the sensing module in the first path.
In one possible implementation, the fastener is an annular member, the sensing module includes a signal patch panel, a ceramic core, and a MEMS pressure chip connected in sequence along the first path, and the MEMS automotive pressure sensor further includes a buffer disposed in the second mounting cavity, the buffer being a flexible member, wherein:
the signal adapter plate is connected with the electronic module and is inserted into the central hole of the fastener;
the ceramic core body is in contact with the fastening piece and the buffer piece on the first path respectively, and the fastening piece and the buffer piece are matched on the first path to limit the ceramic core body.
In one possible implementation manner, the second mounting cavity is provided with a mounting step, the mounting step is located at one side of the second mounting cavity away from the first mounting cavity, so that a first mounting area and a second mounting area are formed in the second mounting cavity along a first path, the fastener is arranged in the first mounting area and is arranged on the mounting step, the ceramic core, the MEMS pressure chip and the buffer piece are all arranged in the second mounting area, and the side wall of the mounting step is adapted to the ceramic core.
In one possible implementation manner, the base is further provided with a sensing hole along the first path, the sensing hole communicates the second mounting cavity with the outside, and the MEMS pressure chip is disposed corresponding to the sensing hole.
In one possible implementation manner, the base is further provided with a mounting groove, the mounting groove is located in the second mounting area and is communicated with the second mounting area on the first path, and the buffer member is arranged in the mounting groove.
In one possible implementation manner, the outer circumferential surface of the base is provided with an annular connecting groove, and the MEMS automobile pressure sensor further comprises a sealing element arranged in the connecting groove, wherein the sealing element is a flexible member and is used for relieving the pressure between the base and the automobile body.
In one possible implementation manner, the PCB board is provided with a fixing groove, the fixing groove is adapted to the signal adapter board, and an end portion of the signal adapter board is inserted into the fixing groove.
In one possible implementation manner, a third bonding pad is disposed on the PCB board, the third bonding pad is located in the fixing groove, and the signal patch panel is connected to the third bonding pad.
In one possible implementation manner, the PCB board is further provided with an annular grounding piece, the grounding piece and the sensing module are both located on the same side of the PCB board, the sensing module is located in a central hole of the grounding piece, and the grounding piece is in contact with the base.
The MEMS automobile pressure sensor provided by the invention has the beneficial effects that: compared with the prior art, the connector of the MEMS automobile pressure sensor is abutted with the PCB, the connector and the base limit the PCB on the first path respectively, and the inner peripheral surface of the first mounting cavity limits the PCB on the second path, so that the PCB is fixed. Because offer the chamber of holding on the connector, second installation chamber and first installation chamber intercommunication to make the area of the both sides rigid contact of PCB board reduce, avoid receiving environment or external force's influence and take place the extrusion with base or connector, improved the life of PCB board. In addition, the electronic module is located in the first installation cavity, after the connector is inserted into the first installation cavity, the electronic module is located in the accommodating cavity, and the PCB board sealing cover is used for accommodating the opening of the cavity, so that the electronic module is located in the closed space, rigid contact with the connector and the base is avoided, and the influence caused by changes of temperature or humidity and the like of the external environment is reduced. In addition, the induction module is located in the second installation cavity, is fixed through being connected with the PCB, avoids being in rigid contact with the base, reduces the probability of extrusion or collision with the base, and ensures detection accuracy.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural diagram of a MEMS automobile pressure sensor according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a base employed in an embodiment of the present invention;
FIG. 3 is an exploded view of a MEMS automotive pressure sensor provided in an embodiment of the present invention;
FIG. 4 is a partial exploded view of another view of a MEMS automotive pressure sensor according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a MEMS automotive pressure sensor provided by an embodiment of the present invention;
fig. 6 is a partial enlarged view of a portion a in fig. 5.
In the figure:
1. a connector; 101. a limiting block; 102. a receiving chamber; 103. a second bonding pad;
2. a base; 201. a first mounting cavity; 202. a second mounting cavity; 2021. a first mounting region; 2022. a second mounting region; 203. an induction hole; 204. mounting steps; 205. a clamping strip; 206. a connecting groove; 207. a mounting groove;
3. a seal;
4. a detection assembly; 401. a PCB board; 4011. a limit groove; 4012. a first bonding pad; 4013. a grounding plate; 402. an electronic module; 403. an induction module; 4031. a signal patch panel; 4032. a ceramic core; 4033. a MEMS pressure chip;
5. a fastener;
6. and a buffer member.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the claims, specification and drawings hereof, unless explicitly defined otherwise, the terms "first," "second," or "third," etc. are used for distinguishing between different objects and not for describing a particular sequential order. Unless otherwise indicated, the terms of orientation or position such as "vertical," "clockwise," "counterclockwise," and the like refer to an orientation or positional relationship based on the orientation and positional relationship shown in the drawings and are merely for convenience of description and to simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, nor should it be construed as limiting the specific scope of protection of the present invention. In the claims, specification and drawings of the present invention, unless explicitly defined otherwise, the term "fixedly connected" or "fixedly connected" should be construed broadly, i.e. any connection between them without a displacement relationship or a relative rotation relationship, that is to say includes non-detachably fixedly connected, integrally connected and fixedly connected by other means or elements. In the claims, specification and drawings of the present invention, the terms "comprising," having, "and variations thereof as used herein, are intended to be" including but not limited to.
Note that the arrow direction in fig. 3 indicates the first path.
Referring to fig. 1 to 6, the MEMS automobile pressure sensor provided by the present invention will now be described. The MEMS automobile pressure sensor comprises a base 2, a detection component 4 and a connector 1, wherein a first installation cavity 201 and a second installation cavity 202 which are communicated are formed in the base 2 along a first path, the first installation cavity 201 is also communicated with the outside on the first path, the second installation cavity 202 is contracted in the first installation cavity 201 on a second path, so that the first installation cavity 201 and the second installation cavity 202 form a step-shaped cavity together, and the second path is perpendicular to the first path; the detection assembly 4 comprises a PCB 401, and an induction module 403 and an electronic module 402 which are oppositely arranged at two sides of the PCB 401 along a first path, wherein the PCB 401 and the electronic module 402 are both arranged in the first installation cavity 201, the PCB 401 is contacted with the base 2 on the first path, and the induction module 403 is arranged in the second installation cavity 202; the connector 1 is provided with a containing cavity 102 along the second path, one end of the connector 1 is inserted into the first mounting cavity 201, and the inserted end of the connector 1 is abutted against the PCB 401, so that the containing cavity 102 forms a closed space for containing the electronic module 402.
Compared with the prior art, the MEMS automobile pressure sensor provided by the invention has the advantages that the connector 1 of the MEMS automobile pressure sensor is abutted against the PCB 401, the connector 1 and the base 2 limit the PCB 401 on a first path respectively, and the inner periphery of the first mounting cavity 201 limits the PCB 401 on a second path, so that the PCB 401 is fixed. Since the accommodating cavity 102 is formed in the connector 1, the second mounting cavity 202 is communicated with the first mounting cavity 201, so that the rigid contact area of two sides of the PCB 401 is reduced, the situation that the PCB is extruded with the base 2 or the connector 1 due to the influence of environment or external force is avoided, and the service life of the PCB 401 is prolonged. In addition, the electronic module 402 is located in the first mounting cavity 201, after the connector 1 is inserted into the first mounting cavity 201, the electronic module 402 is located in the accommodating cavity 102, and the PCB 401 seals the opening of the accommodating cavity 102, so that the electronic module 402 is located in a closed space, which not only avoids rigid contact with the connector 1 and the base 2, but also reduces the influence of changes such as temperature or humidity due to external environment. In addition, the sensing module 403 is located in the second mounting cavity 202, and is fixed by being connected with the PCB 401, so as to avoid rigid contact with the base 2, reduce the probability of extrusion or collision with the base 2, and ensure the detection accuracy.
It should be noted that, the electronic module 402 includes a plurality of electronic components integrated on the PCB 401, and cooperates with the sensing module 403 to detect pressure and output a detection signal.
In some embodiments, referring to fig. 3 to 6, the mems automobile pressure sensor further includes a fastener 5 in interference fit with the base 2, the fastener 5 being disposed in the second mounting cavity 202, the fastener 5 contacting the sensing module 403 in a first path for limiting the sensing module 403 in the first path.
The induction module 403 and the electronic module 402 in the existing pressure sensor are connected with the housing in a welding manner, and the induction module 403 and the electronic module 402 are in rigid contact with the housing in such a manner, so that the pressure sensor is easy to damage after the stress change is induced in work. The fastener 5 in this embodiment is disposed in the second mounting cavity 202 and is in interference fit with the second mounting cavity 202, thereby achieving the fixation of the fastener 5 in the second mounting cavity 202. The induction module 403 is connected with the PCB 401, and because the PCB 401 is fixed on the first path under the action of the base 2 and the connector 1, the induction module 403 connected with the PCB 401 is also fixed on the first path, and the induction module 403 is also contacted with the fastener 5, and the fixed fastener 5 further fixes the induction module 403. The scheme in this embodiment need not to adopt welded mode fixed response module 403, has avoided the rigid contact of response module 403 and base 2 or other parts, reduces the probability that response module 403 and base 2 extrusion take place to damage after expend with heat and contract with cold or atress, has improved the life of response module 403, has ensured the detection precision.
It should be noted that, the sensing module 403 and the electronic module 402 are electrically connected to the PCB 401 respectively, so as to realize signal transmission.
In some embodiments, referring to fig. 3 to 6, the fastener 5 is a ring-shaped member, the sensing module 403 includes a signal adapter plate 4031, a ceramic core 4032 and a MEMS pressure chip 4033 sequentially connected along a first path, the MEMS automobile pressure sensor further includes a buffer 6 disposed in the second mounting cavity 202, and the buffer 6 is a flexible member, wherein: the signal adapter plate 4031 is connected to the electronic module 402 and is inserted into the central hole of the fastener 5; the ceramic core 4032 is in contact with the fastener 5 and the bumper 6, respectively, on a first path, the fastener 5 and the bumper 6 cooperating on the first path to limit the ceramic core 4032.
The signal adapter plate 4031 passes through the fastener 5 and then is electrically connected with the PCB 401, one side of the ceramic core 4032 is contacted with the fastening plate, the other side is contacted with the buffer piece 6, the fastening plate and the buffer piece 6 limit the ceramic core 4032 in a first path respectively, so that the ceramic core 4032 is in rigid contact in sequence, the other side is in flexible contact, the mounting stress of the ceramic core 4032 is reduced to the greatest extent, the ceramic core 4032 is prevented from being damaged after being stressed or deformed due to the rigid contact of the two sides, and the reliability of the ceramic core 4032 is improved. In addition, because the fastener 5 is an annular member, the contact area with the ceramic core 4032 is reduced, and the probability of damage caused by deformation or extrusion with the fastener 5 after stress of the ceramic core 4032 is further reduced.
Alternatively, the fastener 5 and the base 2 are members of the same material, preferably a metallic material, such as an aluminum alloy material. The same material has the same material characteristics and temperature characteristics, and no internal stress is generated.
Optionally, both the fastener 5 and the base 2 have chamfer designs, so that the fastener 5 can be preassembled in place, and only even and complete stress is ensured during installation, so that the reliability of the fastener 5 is ensured.
Optionally, the cushion 6 is one of a rubber member, a sponge member, or an EVA member.
In some embodiments, referring to fig. 2 to 6, the second mounting cavity 202 has a mounting step 204 therein, the mounting step 204 is located at a side of the second mounting cavity 202 away from the first mounting cavity 201, such that a first mounting region 2021 and a second mounting region 2022 are formed along a first path in the second mounting cavity 202, the fastener 5 is disposed in the first mounting region 2021 and is disposed on the mounting step 204, the ceramic core 4032, the MEMS pressure chip 4033 and the buffer 6 are all disposed in the second mounting region 2022, and a sidewall of the mounting step 204 is adapted to the ceramic core 4032.
The fastener 5 is erected on the mounting step 204, and the mounting step 204 provides supporting force for the fastener 5, so that the fastener 5 is connected with the base 2 by means of interference fit, the fastener 5 is restrained on a first path, and the connection stability of the fastener 5, the base 2 and the mounting step 204 is improved. The side walls of the mounting step 204 are adapted to the ceramic core 4032 to provide restraint to the ceramic core 4032, and the fastener 5 contacts the ceramic core 4032 to restrain the ceramic core 4032 in a first path to secure the ceramic core 4032.
Alternatively, the mounting step 204 is an integral component with the base 2.
In some embodiments, referring to fig. 5, the base 2 is further provided with a sensing hole 203 along the first path, the sensing hole 203 communicates the second mounting cavity 202 with the outside, and the MEMS pressure chip 4033 is disposed corresponding to the sensing hole 203.
The refrigerating pipe of the automobile air conditioner needs to monitor the pressure in real time, so that the overvoltage of the refrigerating pipeline of the air conditioner is prevented, and the stable and safe operation of an automobile air conditioning system is ensured. The sensing hole 203 can enable external air flow to enter the second mounting cavity 202, so that the MEMS pressure chip 4033 can sense external pressure change sharply, the pressure change of the refrigeration pipeline can be monitored accurately, and the accuracy of the detection result of the MEMS pressure chip 4033 can be improved.
In some embodiments, referring to fig. 2 and 5, the base 2 further includes a mounting groove 207, the mounting groove 207 is located in the second mounting area 2022 and is in communication with the second mounting area 2022 on the first path, and the buffer member 6 is disposed in the mounting groove 207.
The buffer member 6 is disposed in the mounting groove 207, so that the buffer member 6 is prevented from moving in the second mounting cavity 202, and the stability of the buffer member 6 is ensured. In addition, during installation, the installation piece is not required to be positioned, and the installation efficiency is improved.
In some embodiments, referring to fig. 2, an annular connecting groove 206 is formed on the outer peripheral surface of the base 2, and the mems automobile pressure sensor further includes a sealing member 3 disposed in the connecting groove 206, where the sealing member 3 is a flexible member for relieving the pressure between the base 2 and the automobile body.
The base 2 needs to be connected with the car body, the sealing element 3 is installed in the connecting groove 206, after the base 2 is connected with the car body, the sealing element 3 seals the connecting position of the base 2 and the car body, the stability of connection is improved, and the influence of car body shaking on a detection result is reduced.
Optionally, the seal 3 is a rubber ring.
In some embodiments, referring to fig. 2, a fixing groove is formed on the pcb 401, and the fixing groove is adapted to the signal patch panel 4031, and an end portion of the signal patch panel 4031 is inserted into the fixing groove.
During installation, the signal adapter plate 4031 is directly installed in the fixing groove without repositioning, so that the installation efficiency is improved.
In some embodiments, referring to fig. 1, a third pad is disposed on the pcb 401, and the third pad is located in the fixing slot, and the signal patch panel 4031 is connected to the third pad.
The signal transfer plate 4031 is electrically connected with the PCB 401 through the third bonding pad, and compared with the prior art that the metal spring plates are respectively arranged on the PCB 401 and the signal transfer plate 4031 to realize the electrical connection, the area occupied by the PCB 401 is reduced, the utilization rate of the PCB 401 is improved, the miniaturization of the MEME automobile pressure sensor is facilitated, and the size is reduced by 20%.
In some embodiments, referring to fig. 1, an annular grounding piece 4013 is further disposed on the PCB 401, the grounding piece 4013 and the sensing module 403 are both located on the same side of the PCB 401, and the sensing module 403 is located in a central hole of the grounding piece 4013, and the grounding piece 4013 is in contact with the base 2.
Compared with the traditional connection mode adopting the grounding pin, the scheme in the embodiment greatly reduces the production cost, reduces the assembly process difficulty and improves the connection reliability. Through setting up annular grounding piece 4013, construct annular shielding net, realization electromagnetic protection that can be better has improved holistic EMC performance.
In some embodiments, referring to fig. 1, the pcb 401 is further provided with a first pad 4012, and the connector 1 is provided with a second pad 103 corresponding to the first pad 4012, and the first pad 4012 is in contact with the second pad 103.
In this embodiment, the contact between the first pad 4012 and the second pad 103 realizes the conductive connection between the PCB 401 and the connector 1, which has simple and stable process, avoids the problem that the welding slag easily occurs in the conventional via hole welding, which easily causes poor contact between the spring piece, and improves the overall assembly efficiency and yield.
Optionally, a plurality of first pads 4012 are provided, and the plurality of first pads 4012 are distributed on the same circumferential surface with the axis of the PCB 401 as a center. The connector 1 is provided with a plurality of second bonding pads 103, and the second bonding pads 103 are arranged in one-to-one correspondence with the first bonding pads 4012, so that the reliability and stability of conductive connection are improved.
Optionally, a limiting groove 4011 is formed in the PCB 401, a limiting block 101 corresponding to the limiting groove 4011 is arranged on the connector 1, and the limiting block 101 is inserted into the limiting groove 4011, so that positioning of the PCB 401 is achieved, and the first bonding pad 4012 is correspondingly contacted with the second bonding pad 103.
As a specific embodiment of the base 2, the base 2 is further provided with a clamping strip 205, where the clamping strip 205 is located at a free end of the first mounting cavity 201 and is used for being clamped with the connector 1.
According to the scheme in the embodiment, holes are not required to be drilled in the base 2 and the connector 1, the base 2 and the connector 1 are fixed in a clamping mode, intermediate connecting parts are avoided, and the installation efficiency is improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
- Mems automobile pressure sensor, characterized in that it comprises:the base is provided with a first installation cavity and a second installation cavity which are communicated with each other along a first path, the first installation cavity is also communicated with the outside on the first path, the second installation cavity is contracted in the first installation cavity on a second path, so that the first installation cavity and the second installation cavity form a step-shaped cavity together, and the second path is perpendicular to the first path;the detection assembly comprises a PCB, and an induction module and an electronic module which are oppositely arranged at two sides of the PCB along the first path, wherein the PCB and the electronic module are both arranged in the first mounting cavity, the PCB is contacted with the base on the first path, and the induction module is positioned in the second mounting cavity; andthe connector is provided with a containing cavity along a first path, one end of the connector is inserted into the first mounting cavity, and the inserted end of the connector is abutted to the PCB, so that the containing cavity forms a closed space for containing the electronic module.
- 2. The MEMS automobile pressure sensor of claim 1, further comprising a fastener in interference fit with the second mounting cavity, the fastener contacting the sensing die set in the first path for limiting the sensing die set in the first path.
- 3. The MEMS automobile pressure sensor of claim 2, wherein the fastener is a ring-shaped member, the sensing module comprises a signal-transfer plate, a ceramic core, and a MEMS pressure chip connected in sequence along the first path, the MEMS automobile pressure sensor further comprising a buffer disposed within the second mounting cavity, the buffer being a flexible member, wherein:the signal adapter plate is connected with the electronic module and is inserted into the central hole of the fastener;the ceramic core body is in contact with the fastening piece and the buffer piece on the first path respectively, and the fastening piece and the buffer piece are matched on the first path to limit the ceramic core body.
- 4. The MEMS automobile pressure sensor of claim 3 wherein the second mounting cavity has a mounting step therein, the mounting step being located on a side of the second mounting cavity facing away from the first mounting cavity such that a first mounting region and a second mounting region are formed in the second mounting cavity along a first path, the fastener being located in the first mounting region and riding on the mounting step, the ceramic core, the MEMS pressure chip and the buffer being located in the second mounting region, a sidewall of the mounting step being adapted to the ceramic core.
- 5. The MEMS automobile pressure sensor of claim 3 wherein the base is further provided with a sensing hole along the first path, the sensing hole communicates the second mounting cavity with the outside, and the MEMS pressure chip is disposed in correspondence with the sensing hole.
- 6. The MEMS automobile pressure sensor according to claim 4, wherein the base is further configured with a mounting slot, wherein the mounting slot is positioned in the second mounting region and communicates with the second mounting region along the first path, and wherein the buffer is positioned within the mounting slot.
- 7. The MEMS automobile pressure sensor of claim 1, wherein the outer peripheral surface of the base is provided with an annular connecting groove, and the MEMS automobile pressure sensor further comprises a sealing element arranged in the connecting groove, wherein the sealing element is a flexible member for relieving pressure between the base and the automobile body.
- 8. The MEMS automobile pressure sensor of claim 3 wherein the PCB is provided with a fixing groove, the fixing groove is adapted to the signal adapter plate, and an end of the signal adapter plate is inserted into the fixing groove.
- 9. The MEMS automobile pressure sensor of claim 8, wherein a third bonding pad is disposed on the PCB board, the third bonding pad is disposed in the fixing groove, and the signal patch panel is connected to the third bonding pad.
- 10. The MEMS automobile pressure sensor of claim 3 wherein the PCB is further provided with an annular grounding plate, the grounding plate and the sensing module are both located on the same side of the PCB, the sensing module is located in a central hole of the grounding plate, and the grounding plate is in contact with the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311099506.8A CN116818156A (en) | 2023-08-30 | 2023-08-30 | MEMS automobile pressure sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311099506.8A CN116818156A (en) | 2023-08-30 | 2023-08-30 | MEMS automobile pressure sensor |
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| CN116818156A true CN116818156A (en) | 2023-09-29 |
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| CN202311099506.8A Pending CN116818156A (en) | 2023-08-30 | 2023-08-30 | MEMS automobile pressure sensor |
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