CN212963461U - Sensor assembly and valve device - Google Patents

Sensor assembly and valve device Download PDF

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Publication number
CN212963461U
CN212963461U CN202021863643.6U CN202021863643U CN212963461U CN 212963461 U CN212963461 U CN 212963461U CN 202021863643 U CN202021863643 U CN 202021863643U CN 212963461 U CN212963461 U CN 212963461U
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China
Prior art keywords
section
sensing unit
base
sensor assembly
pressure sensing
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CN202021863643.6U
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Chinese (zh)
Inventor
郭雨辰
万霞
饶欢欢
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Hangzhou Sanhua Research Institute Co Ltd
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Hangzhou Sanhua Research Institute Co Ltd
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Priority to CN202021863643.6U priority Critical patent/CN212963461U/en
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Abstract

The sensor assembly comprises a pressure sensing unit, a temperature sensing unit, a base, a circuit board unit and a shell, wherein the pressure sensing unit is electrically connected with the circuit board unit; the conductive part comprises a first part and a second part, the first part is electrically connected with the temperature sensing part and the second part, the second part is electrically connected with the first part and the circuit board unit, at least one part of the second part is fixed in the pressure sensing unit, and at least one part of the first part is fixed in the base. The sensor assembly of the application has good stability.

Description

Sensor assembly and valve device
Technical Field
The application relates to the technical field of detection, in particular to a sensor assembly.
Background
As shown in fig. 19 and 20, in the related art, the sensor assembly 10 includes the variable capacitor 14 and the temperature sensor 28. The variable capacitor 14 has a rigid substrate 14a and a flexible diaphragm 14b, the flexible diaphragm 14b being exposed to the fluid pressure chamber 12k for sensing pressure. The temperature responsive element 28a is mounted on the surface of the flexible diaphragm 14b exposed to the fluid pressure chamber 12K, and an electric signal of the temperature responsive element 28a is transmitted to the circuit chamber 20c through the conductive pins 26d, 26e of the variable capacitor 14 through the leads 28b, 28 c. The leads (28b, 28c) and the conductive pins (26d, 26e) are electrically connected by a conductive epoxy resin. In the related art, the leads (28b, 28c) are liable to shake, which is disadvantageous in terms of stability of the sensor assembly.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a sensor assembly with good stability.
In order to achieve the purpose, the following technical scheme is adopted in the application: a sensor assembly, comprising: the temperature sensing device comprises a pressure sensing unit, a temperature sensing unit, a base, a circuit board unit and a shell; the circuit board unit is positioned on one side of the pressure sensing unit in the thickness direction, the base is at least partially positioned on the other side of the pressure sensing unit in the thickness direction, the pressure sensing unit is electrically connected with the circuit board unit, the shell is provided with an inner cavity, the pressure sensing unit is positioned in the inner cavity of the shell, the base is at least partially positioned in the inner cavity of the shell, and the base and the shell are fixedly arranged; the temperature sensing unit comprises a temperature sensing part and a conductive part, the temperature sensing part and the circuit board unit are located on two opposite sides of the thickness direction of the base, the conductive part is electrically connected with the temperature sensing part and the circuit board unit, the conductive part comprises a first part and a second part, the first part is electrically connected with the temperature sensing part and the second part, the first part is physically connected between the temperature sensing part and the second part, the second part is electrically connected with the first part and the circuit board unit, the second part is physically connected between the first part and the circuit board unit, at least one part of the second part is fixed in the pressure sensing unit, and at least one part of the first part is fixed in the base.
Another object of this application is to provide a valve device, this application adopts following technical scheme: a valve device comprises the sensor assembly, and further comprises a valve body, wherein the sensor assembly is fixedly installed on the valve body, the valve body comprises a first flow passage, the pressure sensing unit is used for detecting the pressure of fluid in the first flow passage, and the temperature sensing unit is used for detecting the temperature of the fluid in the first flow passage.
The application provides a sensor module, the shell is fixed with the base, and at least some of first portion is fixed in the base, and this kind of setting is favorable to keeping the stability of first portion, can reduce the risk that first portion rocked to be favorable to sensor module's stability.
Drawings
FIG. 1 is a perspective schematic view of a sensor assembly of the present application;
FIG. 2 is a schematic bottom view of FIG. 1;
FIG. 3 is an exploded schematic view of a sensor assembly of the present application;
FIG. 4 is an exploded schematic view from another perspective of a sensor assembly of the present application;
FIG. 5 is a cross-sectional view of the sensor assembly of the present application taken along line A-A of FIG. 2;
FIG. 6 is an enlarged schematic view of circle A in FIG. 5;
FIG. 7 is a perspective cross-sectional view of the sensor assembly of the present application taken along line A-A of FIG. 2;
FIG. 8 is a further exploded schematic view of a sensor assembly of the present application;
FIG. 9 is a cross-sectional view of the pressure sensing unit, temperature sensing unit and base assembly of the present application;
FIG. 10 is an enlarged schematic view of circle B of FIG. 9;
FIG. 11 is a schematic perspective view of the temperature sensing unit, pressure sensing unit and circuit board unit of the present application assembled together;
FIG. 12 is a schematic bottom view of FIG. 11;
FIG. 13 is a schematic front view of the temperature sensing unit of the present application assembled with a circuit board unit;
FIG. 14 is a cross-sectional view of the sensor assembly of the present application taken along line B-B of FIG. 2;
FIG. 15 is a schematic perspective view of a valve apparatus of the present application;
FIG. 16 is an exploded schematic view of a valve assembly of the present application;
FIG. 17 is a side schematic view of FIG. 15;
FIG. 18 is a perspective sectional view taken along line C-C of FIG. 17;
FIG. 19 is a perspective view of a sensor assembly of the related art;
fig. 20 is a perspective view of a partial component assembly as shown in fig. 19.
In the drawings:
1. a pressure sensing unit; 11. a first side; 12. a second face; 121. a first region; 122. a second region; 13. a first duct; 14. a conductive post;
2. a temperature sensing unit; 21. a temperature sensing unit; 22. a conductive portion; 23. a first part; 231. a third stage; 232. a second stage; 233. a first stage; 234. a first end portion; 235. a second end portion; 24. a second section; 241. a conductive pin; 242. a first end face; 243. a second end face; 244. a conductive sheet; 245. a third end face; 246. a fourth end face; 25. a pin;
3. a base; 31. a main body portion; 32. a first accommodating chamber; 33. a second through hole; 34. a projection; 36. An annular wall; 37. an annular face; 38 a platform; 39. an annular projection;
4. a circuit board unit; 41. a first substrate; 42. a second substrate;
5. a first housing; 51. a barrel portion; 52. a first extension portion; 53. a second extension portion; 54. a first cavity; 55. a first channel;
6. a second housing; 61. a second cavity; 62. a third extension portion; 65. a conductive terminal;
7. a first sealing element;
8. a second sealing element;
9. a housing;
10. a sensor assembly;
100. a valve device; 101. a valve body portion; 102. a first flow passage.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
It should be understood that the terms "first," "second," and the like, as used in the description and claims of this application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, the terms "front," "back," "left," "right," "up," "down," and the like in this application are used for convenience of description and are not limited to a particular position or spatial orientation. The word "comprise" or "comprises", and the like, is an open-ended expression meaning that an element that precedes "includes" or "comprising" includes "that the element that follows" includes "or" comprises "and its equivalents, that do not preclude the element that precedes" includes "or" comprising "from also including other elements. In this application, the meaning of "a number" if it occurs is two as well as more than two.
Referring to fig. 1 to 16, a sensor assembly 10 provided by the present application includes a pressure sensing unit 1, a temperature sensing unit 2, a base 3, a circuit board unit 4, and a housing 9.
Referring to fig. 1 to 7, the circuit board unit 4 is located on one side of the pressure sensing unit 1 in the thickness direction, a portion of the base 3 is located on the other side of the pressure sensing unit 1 in the thickness direction, that is, the circuit board unit 4 is located above the pressure sensing unit 1, a portion of the base 3 is located below the pressure sensing unit 1, and the pressure sensing unit 1 is electrically connected to the circuit board unit 4. The housing 9 is a hollow shell, and has a cavity surrounded by the shell, and the pressure sensing unit 1 and the base 3 are located in the inner cavity of the housing 9. The temperature sensing unit 2 includes a temperature sensing unit 21 and a conductive portion 22, the temperature sensing unit 21 and the circuit board unit 4 are located on two opposite sides of the thickness direction of the base 3, and the conductive portion 22 electrically connects the temperature sensing unit 21 and the circuit board unit 4.
In some embodiments, the housing 9 includes a first housing 5 and a second housing 6, and a portion of the base 3 is sandwiched between the first housing 5 and the second housing 6 such that the base 3 is fixed with the housing 9.
Referring to fig. 9 and 11, the conductive portion 22 includes a first portion 23 and a second portion 24, the first portion 23 is electrically connected to the temperature sensing portion 21 and the second portion 24, the first portion 23 is physically connected between the temperature sensing portion 21 and the second portion 24, the second portion (24) is electrically connected to the first portion (23) and the circuit board unit (4), and the second portion (24) is physically connected between the first portion (23) and the circuit board unit (4). The first portion 23 is physically connected to the temperature sensing portion 21 and the second portion 24 means that one end of the first portion 23 is in contact with the temperature sensing portion 21 and is fixedly connected to the temperature sensing portion, and the other end of the first portion is in contact with the second portion 24 and is fixedly connected to the temperature sensing portion. The second portion 24 is physically connected between the first portion 23 and the circuit board unit 4, and means opposite ends of the second portion 24, wherein one end is in contact with the first portion 23 and fixed thereto, and the other end is in contact with the circuit board unit and fixed thereto. In some embodiments, a portion of second portion 24 is secured within pressure sensing cell 1 and a portion of first portion 23 is secured within base 3. In other alternative embodiments, second portion 24 is secured entirely within pressure sensing cell 1 and first portion 23 is secured entirely within base 3.
Referring to fig. 9, the first portion 23 includes a first segment 233, a second segment 232, a third segment 233 and a lead 25. The second section 232 is fixed in the base 3, and the first section 233, the third section 231 and the leads 25 are exposed out of the base 3. The second segment 232 is electrically connected to the first segment 233 and the second portion 24, and the second segment 232 is physically connected between the first segment 233 and the second portion 24, the first segment 233 includes a first end 234 and a second end 235, wherein the first end 234 is connected and fixed with the second segment 232, and the second end 235 is abutted to the second portion 24. In some alternative embodiments, the first section 233 is an elastic member, and since one end of the first section 233 is connected and fixed with the second section 232, the first section 233 is a cantilever beam structure, the first section 233 can elastically deform relative to the second section 232, the first section 233 elastically presses against the second portion 24, and the first section 233 is pressed between the second portion 24 and the base 3, so that the connection between the first portion 23 and the second portion 24 is stable. On the other hand, the first portion 23 and the second portion 24 are connected in an abutting manner, so that the operation is convenient, an additional connecting process is not needed, and the connecting process of the sensor assembly is simple. In other alternative embodiments, the second end 235 of the first segment 233 is connected to the second portion 24 by welding; in other alternative embodiments, the second end portion 235 of the first segment 233 is connected to the second portion 24 by a conductive epoxy, and the connection manner of the first segment 233 and the second portion 24 is not limited in this application.
The temperature sensing part 21 is in direct contact with the fluid to sense temperature and convert a temperature signal into an electrical signal, and in some embodiments, the temperature sensing part 21 is a thermistor. However, the type of the temperature sensitive part 21 in the present application is not limited thereto. Referring to fig. 9, the third section 231 is exposed outside the base 3 and physically and electrically connected between the leads 25 and the second section 232, and the leads 25 are physically and electrically connected between the temperature sensing part 21 and the third section 231. The lead 25 transmits the electric signal of the temperature sensing part 21 to the third segment 231. In some embodiments, the temperature sensing part 21 and the leads 25 may be an integral structure, and in particular, the temperature sensing part 21 and the leads 25 may be an integral pin-type NTC. At least a partial region of the third segment 231 is fixed by welding to the lead 25. In alternative embodiments, the leads 25 are located outside the base 3 and directly connected to the second section 232; in alternative embodiments, the leads 25 may be partially fixed in the base 3, and the leads 25 may be directly fixed in the base 3 and connected to the second section 232. In other alternative embodiments, the first portion 23 includes only the second section 232 and the leads 25, the leads 25 are also fixed inside the base 3, the leads 3 and the second section 232 are connected inside the base 3, the pressure sensing unit 1 is attached to the base 3, and the second section 232 is attached to the second portion 23. The structure of the first portion 23 in the present application is not limited thereto.
In some embodiments, the pressure sensing unit 1 includes a first surface 11 and a second surface 12, the first surface 11 and the second surface 12 are located on opposite sides of the pressure sensing unit 1 in the thickness direction, the circuit board unit 4 is located above the first surface 11, and the second surface 12 is located below the first surface 11. The sensor assembly 10 includes a receiving cavity 32, the receiving cavity 32 being located between the second face 12 and the base 3, and the first section 233 being located in the receiving cavity 32. This arrangement facilitates reducing the length of the second section 232 and simplifying the manufacturing process. In other alternative embodiments, the first segment 233 is located between the side of the pressure sensing unit 1 and the base 3, and the position of the first segment 233 is not limited in this application.
In some embodiments, referring to fig. 5, 7 and 9, the base 3 includes a main body 31, the main body 31 is a portion of the base 3 located below the second surface 12, the main body 31 includes a platform 38 and an annular protrusion 39, the annular protrusion 39 protrudes upward from an outer edge portion of the platform 38, and the receiving cavity 32 is located between the annular protrusion 39, the second surface 12 and the platform 38. The annular projection 39 may serve as a lateral locating feature for the seal 8.
In some embodiments, referring to fig. 11, the first section 233, the second section 232, and the third section 231 are the metal sheet 26 of an integral structure. In other alternative embodiments, the second section 232 is fixedly connected to the third section 231, and the second section 232 is fixedly connected to the first section 233, and the structures of the first section 233, the second section 232, and the third section 231 are not limited thereto in this application.
In some embodiments, base 3 is molded using sheet metal 26 as an injection insert by an injection molding encapsulation (insert molding) process to effect a sealed securement of second section 232 within base 3.
In some embodiments, the third segment 231, the first segment 233 and the lead 212 are coated with an anti-corrosion coating, so that the third segment 231, the first segment 233 and the lead 212 exposed outside the base 3 are not easily corroded.
In some embodiments, the pressure sensing unit 1 is a ceramic capacitive sensor. The second surface 12 of the pressure sensing unit 1 is a pressure sensing surface. Referring to fig. 11 and 12, the second surface 12 includes a first area 121 and a second area 122, the first area 121 is a pressure sensing sensitive area, and the second area 122 is surrounded on an outer edge of the first area 121. The first region 121 is exposed to the fluid under test for converting the fluid pressure signal into an electrical signal. Referring to fig. 7 and 8, the pressure sensing unit 1 further includes a conductive pillar 14, the conductive pillar 14 is higher than the first surface 11, and the conductive pillar 14 is electrically connected to the first area 121 and the circuit board unit 4 for transmitting the electrical signal of the first area 121 to the circuit board unit 4. In some embodiments, referring to fig. 12, in the orthographic projection of the second face 12, the second end portion 235 is located on the second region 122, and a portion of the first segment 233 is located in the first region 121, so that the first segment 233 has a suitable length, and when the second end portion 235 is subjected to a certain pressure, the first segment 233 can be compressed between the second face 12 and the main body portion 31. In other alternative embodiments, the second end portion 235 is located on the second region 122 and the first segment 233 is located in the second region 121 in the orthographic projection of the second surface 12, and the location of the first segment 233 is not limited in this application.
Referring to fig. 8, 9 and 10, the pressure sensing unit 1 has a first hole 13 extending along a thickness direction of the pressure sensing unit 1, and the second portion 24 includes a conductive pin 241, wherein the conductive pin 241 is made of a metal conductive material. The pore passage comprises a pore and a pore wall around the pore. The conductive pin 241 is at least partially received in the first hole 13, the conductive pin 241 includes a first end surface 242 and a second end surface 243, and the first end surface 242 and the second end surface 243 are respectively located at different sides of the conductive pin 241 in the length direction. The first end face 242 is located on an upper side of the first face 11. In some embodiments, a jelly is filled between the peripheral wall of the conductive pin 241 and the wall of the hole of the first hole 13 to seal the conductive pin 241 and the wall of the hole of the first hole 13.
Referring to fig. 9, 10 and 13, in some embodiments, the second end face 243 of the conductive pin 241 is flush with the second face 12, the second portion 24 includes a conductive sheet 244, and the conductive sheet 244 is located between the conductive pin 241 and the first segment 233. The conductive sheet 244 includes a third end surface 245 located above and a fourth end surface 246 located below, and the third end surface 245 and the fourth end surface 246 are located at opposite ends in the thickness direction of the conductive sheet 244. The third end surface 245 is attached to the second end surface 243. The first section 233, the second section 232, and the third section 231 are integrally formed metal sheets, the first section 233 is in a cantilever structure, the first section 233 is elastically deformable relative to the second section 232, and the second end 235 of the first section 233 elastically presses against the fourth end surface 246 of the conductive sheet 244, so as to electrically connect the first section 233 and the conductive pin 241. In other alternative embodiments, the second end face 243 of the conductive pin 243 is located above the second face 12, and the second end face 243 is directly contacted with the second end portion 235, so that the third segment 233 is partially located in the accommodating cavity 32 and partially located in the first duct 13. In other alternative embodiments, the second end face 243 of the conductive pin 243 is located below the second face 12, and the second end 235 directly abuts the second end face 243.
Referring to fig. 5 and 6, in some embodiments, the base 3 includes an annular wall 36, the annular wall 36 extends upward from the outer edge of the main body 31, the extending direction of the annular wall 36 is along the thickness direction of the main body 31, and the annular wall 36 is disposed on the periphery of the pressure sensing unit 1.
Referring to fig. 5 and 6, the first housing 5 has a first cavity 54 and a first channel 55, and the pressure sensing unit 1 and a portion of the base 3 are located in the first cavity 54. The first housing 5 includes a barrel 51, a first extension 52 and a second extension 53, the first extension 52 and the second extension 53 are located on opposite sides of the barrel 51 in the length direction, the first extension 52 extends from the barrel 51 toward the center of the barrel 51, the second extension 53 extends from the barrel 51 toward the center of the barrel 51, and the first cavity 54 is located between the first extension 52 and the second extension 53. Referring to fig. 14, the base has a second through hole 33, and the second through hole 33 connects the first channel 55 and the accommodating cavity 32, so that the fluid can reach the accommodating cavity 32 through the first channel 55, and the second surface 12 can be exposed to the fluid to sense the fluid pressure.
As shown in fig. 14, in some embodiments, the body portion 31 includes a projection 34 that projects downwardly from the platform 38. The projections 34 increase the strength of the base 3 on the one hand; on the other hand, the outer peripheral wall of the projection 34 is fitted to the inner peripheral wall of the second extension 53, and the lateral positioning of the base 3 is achieved. Referring to fig. 14, the pressure sensing unit 1, the annular wall 36, the annular protrusion 39 and the platform 38 are located in the first cavity 54, and the protrusion 34 is located in the first channel 55. In other alternative embodiments, the projection 34 extends downwardly from the platform 38 along the length of the first channel 55 and has a portion that is outside of the first channel 55. The structure of the base 3 in the present application is not limited thereto.
Referring to fig. 5 and 6, the sensor assembly 10 includes a second housing 6, the second housing 6 having a second cavity 61, the second cavity 61 of the second housing 6 communicating with the first cavity 54 of the first housing 5, the second housing 6 including a third extension 62 located in the first cavity 54 of the first housing 5. The third extension 62 is located at the outer edge portion of the second housing 6, and the third extension 62, the annular wall 36, the annular projection 39 and the platform 38 are clamped together between the first extension 52 and the second extension 53. The annular wall 36 comprises a first surface 37, said first surface 37 being located at the upper end of the extension of said annular wall 36. In some embodiments, referring to fig. 6, the first surface 37 is flush with the first surface 11, and the third extending portion 62 is in contact with both the first surface 37 and the first surface 11, so that the base 3 can share the pressure applied to the pressure sensing unit 1, which is beneficial to reducing the risk of damage to the pressure sensing unit 1. The assembly process between the first and second housings 5 and 6 is: the first extension 52 is kept in the same vertical state as the barrel 51, then the third extension 62 of the second housing 6 is extended into the accommodating space formed by the barrel 51, and the third extension 62 is attached to the first surface 37 and the first surface 11, at this time, the vertical first extension 62 is pressed inwards to the first extension 52 extending from the barrel 51 to the center of the barrel 51 by the tool, so that the third extension 62, the annular wall 36, the annular protrusion 39 and the platform 38 are pressed between the second extension 53 of the first extension 52. In other alternative embodiments, the first surface 37 is located below the first surface 11, and the first extending portion 62 contacts the first surface 11, and the locations of the first surface 37 and the first surface 11 are not limited thereto.
Referring to fig. 5 and 6, the sensor assembly 10 includes a first sealing element 7 and a second sealing element 8. In some embodiments, the first sealing element 7 is located between the main body portion 31 and the second extension portion 53, and the second sealing element 8 is located between the pressure sensing unit 1 and the main body portion 31. The pressure sensing unit 1 and the base 3 are pressed by the third extending part 62 in the longitudinal direction and transmit the pressure to the first sealing element 7 and the second sealing element 8, so that the pressure sensing unit 1 and the base 3 are sealed, and the base 3 and the first shell 5 are sealed, so that the circuit board unit 4 can not contact the measured fluid.
Referring to fig. 3 and 4, the circuit board unit 4 includes a first substrate 41, a second substrate 42 and a flexible connecting board/flexible circuit board 43, the first substrate 41 and the second substrate 42 are connected by the flexible connecting board/circuit board 43, and both the first substrate 41 and the second substrate 42 are flexible connecting boards/circuit boards. Referring to fig. 14, the first substrate 41 is attached to the first surface 11, the pressure sensing unit 1 includes a conductive pillar 14 protruding from the first surface 11, a corresponding hole is formed in the first substrate 41, the conductive pillar 14 penetrates out of the hole, and the connection between the conductive pin and the first substrate 41 is fixed by soldering through a spot welding process, so as to electrically connect the conductive pillar 14 and the circuit board unit 4. In some optional embodiments, referring to fig. 6, the first end surface 242 of the conductive pin 241 is located above the first surface 11, so that a part of the conductive pin 241 protrudes out of the first surface 11, the first substrate 41 is provided with a corresponding hole, the conductive pin 241 penetrates out of the hole, and the connection between the conductive pin 241 and the first substrate 41 is fixed by soldering through a spot welding process, which is stable and can realize stable electrical connection between the conductive pin 241 and the circuit board unit 4. In other alternative embodiments, the first end surface 242 of the conductive pin 241 is flush with the first surface 11, and the first end surface 242 is attached to the first substrate 4. Referring to fig. 4, the second substrate 42 is mounted in the second cavity 61 of the second housing 6, and the sensor assembly further includes a conductive terminal 65 embedded in the top of the second housing 6, wherein the conductive terminal 65 is electrically connected to the second substrate 42 and an external device.
Referring to fig. 15-18, the sensor assembly 10 may be mounted on a component having the first flow passage 102, which may be an electronic expansion valve, for controlling the flow of refrigerant in an air conditioning system of a vehicle to throttle the refrigerant. The sensor assembly 10, as a temperature and pressure integrated sensor, may be used to detect the pressure and temperature of the refrigerant passing through the first flow passage 102. Of course, the component may also be a four-way valve, a heat exchanger, a fluid pipeline thermal management system component, etc., and the pressure and temperature of the refrigerant in the thermal management system component may be measured.
Referring to fig. 15 to 18, a valve device 100 is shown in an embodiment, which includes a valve body 101, a sensor assembly 10 and a fixing member 103. The sensor assembly 10 is fixedly mounted on the valve body 101, the valve body 101 includes a first flow passage 102, the first passage 55 of the sensor assembly 10 is communicated with the first flow passage 102, the pressure sensing unit 1 is used for sensing the pressure of the fluid in the first flow passage 102, and the temperature sensing unit 2 is used for sensing the temperature of the fluid in the first flow passage 102. The fixing member 103 is installed between the sensor assembly 10 and the valve body 101, and fixes the sensor assembly 10. In some embodiments, the fixing member 103 may be a circular ring member with external threads (not shown in the drawings), the contacting wall of the valve body 101 and the fixing member 103 has internal threads, the valve body 101 is fixed to the fixing member 103 by screwing, and the fixing member 103 is pressed against the housing 5 to fix the base 3. The valve assembly 100 also includes a third seal 104 positioned between the valve body 101 and the sensor assembly 10 to effect a seal between the valve body 101 and the sensor assembly 10.
Although the present application has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the application, and all changes, substitutions and alterations that fall within the spirit and scope of the application are to be understood as being covered by the following claims.

Claims (10)

1. A sensor assembly (10), comprising: the temperature sensing device comprises a pressure sensing unit (1), a temperature sensing unit (2), a base (3), a circuit board unit (4) and a shell (9);
the circuit board unit (4) is located on one side of the pressure sensing unit (1) in the thickness direction, the base (3) is located on the other side of the pressure sensing unit (1) in the thickness direction at least in part, the pressure sensing unit (1) is electrically connected with the circuit board unit (4), the shell (9) is provided with an inner cavity, the pressure sensing unit (1) is located in the inner cavity of the shell (9), the base (3) is located in the inner cavity of the shell (9) at least in part, and the base (3) and the shell (9) are fixedly arranged;
the temperature sensing unit (2) comprises a temperature sensing part (21) and a conductive part (22), the temperature sensing part (21) and the circuit board unit (4) are positioned on two opposite sides of the thickness direction of the base (3), the conductive part (22) is electrically connected with the temperature sensing part (21) and the circuit board unit (4), the conductive part (22) comprises a first part (23) and a second part (24), the first part (23) is electrically connected with the temperature sensing part (21) and the second part (24), the first part (23) is physically connected between the temperature sensing part (21) and the second part (24), the second part (24) is electrically connected with the first part (23) and the circuit board unit (4), the second part (24) is physically connected between the first part (23) and the circuit board unit (4), at least one part of the second part (24) is fixed in the pressure sensing unit (1), at least a part of the first portion (23) is fixed in the base (3).
2. The sensor assembly according to claim 1, wherein the first portion (23) comprises a first section (233) and a second section (232), the second section (232) is fixed in the base (3), the first section (233) is exposed out of the base (3), the first section (233) is electrically connected to the second section (232) and the second portion (24), the first section (233) is physically connected between the second section (232) and the second portion (24), and the first section (233) abuts against the second portion (24).
3. The sensor assembly according to claim 2, characterized in that the pressure sensing unit (1) comprises a first face (11) and a second face (12), the first face (11) and the second face (12) being located on opposite sides of the pressure sensing unit (1) in the thickness direction, the circuit board unit (4) and the second face (12) being located on opposite sides of the first face, the sensor assembly (10) comprising a receiving cavity (32), the receiving cavity (32) being located between the second face (12) and the base (3), the first section (233) being located at least partially in the receiving cavity (32).
4. The sensor assembly according to claim 3, wherein the pressure sensing unit (1) has a first hole (13) extending in a thickness direction of the pressure sensing unit (1), the second portion (24) comprises a conductive pin (241), the conductive pin (241) is at least partially received in the first hole (13), the conductive pin (241) comprises a first end surface (242) and a second end surface (243), the first end surface (242) and the second end surface (243) are respectively located at different sides of the conductive pin (241) in a length direction, and the first end surface (242) and the second surface (12) are respectively located at two opposite sides of the first surface (11).
5. The sensor assembly (10) of claim 4, wherein the second end face (243) is flush with the second face (12), the second portion (24) includes a conductive tab (244), the conductive tab (244) electrically connecting the conductive pin (241) with the first segment (233), the conductive tab (244) physically connecting between the conductive pin (241) and the first segment (233).
6. The sensor assembly (10) of claim 2, wherein the first portion (23) includes a third segment (231), the third segment (231) being exposed from the base (3), the second segment (232) electrically connecting the third segment (231) to the first segment (233), the second segment (232) being physically connected between the third segment (231) and the first segment (233).
7. The sensor assembly (10) of claim 6, wherein the first section (233), the second section (232) and the third section (231) are a metal sheet (26) of an integral structure, the first section (233) is of a cantilever beam structure, the first section (233) can be elastically deformed relative to the second section (232), the first section (233) and the conductive sheet (244) are elastically pressed against each other, and the base (3) is formed by injection molding and insert molding of the metal sheet (26).
8. The sensor assembly (10) of claim 3, wherein the second face (12) includes a first region (121) and a second region (122), the first region (121) being a pressure sensitive region, the second region (122) being disposed around an outer edge of the first region (121), the first segment (233) being partially within the first region (121) in an orthographic projection of the second face (12).
9. The sensor assembly (10) according to claim 3, wherein the base (3) comprises a main body portion (31) and an annular wall (36), the annular wall (36) extends from the outer edge of the main body portion (31), the annular wall (36) extends along the thickness direction of the main body portion (31), the annular wall (36) is located at the periphery of the pressure sensing unit (1), the base (3) is provided with a second through hole (33), and the second through hole (33) is communicated with the accommodating cavity (32) so as to enable the second face (12) of the pressure sensing unit (1) to contact the fluid to be measured;
the shell (9) comprises a first shell (5) and a second shell (6), the first shell (5) comprises a barrel part (51), a first extending part (52) and a second extending part (53), the first extending part (52) and the second extending part (53) are positioned on two opposite sides of the length direction of the barrel part (51), the first extending part (52) extends from the barrel part (51) to the center direction of the barrel part (51), and the second extending part (53) extends from the barrel part (51) to the center direction of the barrel part (51); the second housing (6) comprises a third extension (62), the third extension (62) is located at the outer peripheral part of the second housing (6), and the third extension (62), the annular wall (36) and the part main body part (31) are clamped together between the first extension (52) and the second extension (53);
the annular wall (36) comprises a first surface (37), the first surface (37) is located at one end of the annular wall (36) in the extending direction, the first surface (37) is flush with the first surface (11), and the pressure sensing unit (1) is clamped between the third extending portion (62) and the base (3).
10. A valve device (100), characterized by: comprising a sensor assembly (10) according to any of the claims 1 to 9, the valve device (100) further comprising a valve body (101), the sensor assembly (10) being fixedly mounted to the valve body (101), the valve body (101) comprising a first flow channel (102), the pressure sensing unit (1) being adapted to sense a pressure of a fluid in the first flow channel (102), the temperature sensing unit (2) being adapted to sense a temperature of the fluid in the first flow channel (102).
CN202021863643.6U 2020-08-31 2020-08-31 Sensor assembly and valve device Active CN212963461U (en)

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CN212963461U true CN212963461U (en) 2021-04-13

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