CN206931595U

CN206931595U - semiconductor packaging frame

Info

Publication number: CN206931595U
Application number: CN201720468351.4U
Authority: CN
Inventors: 许海渐
Original assignee: Nantong Excellent Semiconductor Co Ltd
Current assignee: Nantong Excellent Semiconductor Co Ltd
Priority date: 2017-04-30
Filing date: 2017-04-30
Publication date: 2018-01-26
Anticipated expiration: 2027-04-30

Abstract

The utility model discloses a kind of semiconductor packaging frame, it includes semiconductor packaging frame body, each encapsulation unit includes six pin configurations for being located at the Ji Dao in plastic packaging region and being connected with Ji Dao in semiconductor packaging frame body, at least one pin of encapsulation unit is half-breadth pin, the width of the interior pin of half-breadth pin is less than the width of outer pin, and outer pin is consistent with the width of interior pin adjacent part.Pin locations constriction, it is easy to the later stage to cut off the pin.

Description

Semiconductor packaging frame

Technical field

Technical field of semiconductors is the utility model is related to, more particularly, to a kind of semiconductor packaging frame.

Background technology

It is well known that semiconductor packaging frame needs targetedly to carry out structure to set according to different pin configurations Meter, for example, semiconductor packaging frame needs to carry out individually designed, same semiconductor package according to 5 pin configurations, 6 pin configurations The frame that frames up can not share, virtually the cost and expense of two kinds of semiconductor packaging frames of increased design.

Utility model content

The purpose of this utility model is to provide a kind of semiconductor packaging frame, and it can allow draws with five pin configurations, six The semiconductor packaging frame of leg structure is general.

In order to solve the above technical problems, embodiment of the present utility model provides a kind of semiconductor packaging frame, it is wrapped Include semiconductor packaging frame body, in semiconductor packaging frame body each encapsulation unit include Ji Dao positioned at plastic packaging region with Six connected pin configurations of Ji Yuji islands, at least one pin of encapsulation unit are half-breadth pin, the interior pin of half-breadth pin Width be less than the width of outer pin, and outer pin is consistent with the width of interior pin adjacent part.

Further, the width of interior pin is the 1/2 of outer pin width.

Further, half-breadth pin is provided with the cut-out structure for being easy to cut off pin.

Further, it is to be arranged at the triangular groove of pin to cut off structure.

Further, the angle of the two side of triangular groove is 60 °.

The utility model has the advantages that：Pin locations constriction, it is easy to the later stage to cut off the pin, due to 6 being drawn A pin in leg structure is designed as half-breadth pin, and later stage cut-out half-breadth pin can realizes 5 pin configurations, so as to allow partly Conductor packaging frame is realized general between five pin configurations and six pin configurations.

Brief description of the drawings

Fig. 1 is semiconductor packaging frame schematic diagram, and the figure is semiconductor packaging frame single package cell schematics；

Fig. 2 is semiconductor packaging frame local structural graph；

Fig. 3 is B-B sectional views in Fig. 1.

Embodiment

In order that technological means, creation characteristic, reached purpose and effect that the utility model is realized are easy to understand, under In conjunction with specific embodiments, the utility model is expanded on further in face.

Embodiment of the present utility model provides a kind of semiconductor packaging frame, and referring to Fig. 1, it includes semiconductor packages Frame body, each encapsulation unit E is included positioned at the base island 1 in plastic packaging region 2 and and Ji Dao in semiconductor packaging frame body Six connected pin configurations, a pin of encapsulation unit is half-breadth pin T, and the width of the interior pin of half-breadth pin is less than outer The width of pin, and outer pin is consistent with the width of interior pin adjacent part, referring to Fig. 2, Pin1-Pin5 pin are normal pins knot Structure, and the pin between Pin4 pin and Pin5 pin is then half-breadth pin, such as the width of interior pin is outer pin width 1/2.Fig. 1 shows interior pin 3, astute and able area 4.

It is noted that referring to Fig. 3, half-breadth pin is provided with the cut-out structure for being easy to cut off pin, for example, cut-out knot Structure is the triangular groove 5 for being arranged at pin, and the angle of the two side of triangular groove is 60 °.Triangular groove is set Pin surface is roughened structure.

In case of need, the triangular groove, can be easily due to being arranged along lock leg structure width The pin that fractures, so as to complete the conversion of six pin configurations and five pin configurations.And the bottom of triangular groove may be used also To set rectangular recess, the convenience of operation of breakage is further improved.

It will be understood by those skilled in the art that the respective embodiments described above are to realize specific implementation of the present utility model Example, and in actual applications, can to it, various changes can be made in the form and details, without departing from spirit of the present utility model And scope.

Claims

1. a kind of semiconductor packaging frame, it includes semiconductor packaging frame body, each sealed in semiconductor packaging frame body Dress unit includes six pin configurations for being located at the Ji Dao in plastic packaging region and being connected with Ji Dao, it is characterised in that the encapsulation At least one pin of unit is half-breadth pin, and the width of the interior pin of the half-breadth pin is less than the width of outer pin, and outside Pin is consistent with the width of interior pin adjacent part.

2. semiconductor packaging frame according to claim 1, it is characterised in that the width of the interior pin is that outer pin is wide The 1/2 of degree.

3. semiconductor packaging frame according to claim 1, it is characterised in that the half-breadth pin, which is provided with, to be easy to cut off The cut-out structure of pin.

4. semiconductor packaging frame according to claim 3, it is characterised in that the cut-out structure is to be arranged at pin Triangular groove.

5. semiconductor packaging frame according to claim 4, it is characterised in that the folder of the two side of the triangular groove Angle is 60 °.