CN206819994U - A kind of electronic component - Google Patents
A kind of electronic component Download PDFInfo
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- CN206819994U CN206819994U CN201720504448.6U CN201720504448U CN206819994U CN 206819994 U CN206819994 U CN 206819994U CN 201720504448 U CN201720504448 U CN 201720504448U CN 206819994 U CN206819994 U CN 206819994U
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Abstract
The utility model embodiment discloses a kind of electronic component, and the electronic component includes：Substrate；Oxygen buried layer on substrate；Drift layer on oxygen buried layer, the upper surface of drift layer is formed with window；Positioned at window inwall or window inwall and the doped region of window lower surface；Insulating barrier in window, insulating barrier include at least one first insulating barrier and at least one second insulating barrier；A Metal field plate in insulating barrier, Metal field plate are correspondingly arranged with doped region；Source electrode, gate electrode and drain electrode away from oxygen buried layer side on drift layer or on insulating barrier.Using above-mentioned technical proposal, the interface intersection of the first insulating barrier and the second insulating barrier introduces peak electric field, introduces peak electric field at Metal field plate, can lift the average electric field of drift layer, lifts the breakdown voltage of electronic component.
Description
Technical field
It the utility model is related to technical field of electronic components, more particularly to a kind of electronic component.
Background technology
Power integrated circuit is also referred to as high voltage integrated circuit, is the important branch of modern electronics, can be various power conversions
The new-type circuit of high speed, high integration, low-power consumption and Flouride-resistani acid phesphatase is provided with energy processing unit, is widely used in Electric control system
Many key areas such as current consumption field and national defence, space flight such as system, automotive electronics, display device driving, communication and illumination.
The rapid expansion of its application, higher requirement it is also proposed to the high tension apparatus of its core.For power device,
On the premise of ensure breakdown voltage, it is necessary to which the conducting resistance for reducing device as much as possible improves device performance.But breakdown potential
A kind of approximate quadratic relationship between pressure and conducting resistance be present, formed so-called " silicon limit ".It must be introduced into new material or device
Structure could effectively break through " silicon limit ".In order to further improve device performance, raceway groove-horizontal proliferation metal oxygen is proposed in the industry
Compound semiconductor (Trench-Laterally Diffused Metal Oxide Semiconductor, Trench-LDMOS)
Device architecture, effectively raise semiconductor power device performance.
Traditional silicon on insulated substrate (Silicon On Insulator, SOI) Trench-LDMOS devices are to float
The Trench floor of one layer depth of insertion in the middle part of area is moved, can effectively reduce drift region length, reduces device on-resistance, but device
When part is in OFF state, electric field is largely all gathered in device surface, and internal electric field is smaller, and device easily punctures in advance on surface,
Limit the further raising of breakdown voltage.
Utility model content
In view of this, the utility model embodiment provides a kind of electronic component, is hit with solving electronic component in the prior art
Wear the relatively low technical problem of voltage.
The utility model embodiment provides a kind of electronic component, including：
Substrate；
Oxygen buried layer on the substrate；
The drift layer away from the substrate side on the oxygen buried layer, the upper surface of the drift layer form fenestrate
Mouthful, the drift layer upper surface is surface of the drift layer away from the oxygen buried layer side；
Positioned at the window inwall, or the window inwall and the doped region of the window lower surface；
Insulating barrier in the window, the insulating barrier include at least one first insulating barrier and at least one second
Insulating barrier, first insulating barrier and second insulating barrier arrange in the first direction, the first direction and the drift layer
Upper surface it is parallel；
A Metal field plate in the insulating barrier, the Metal field plate are correspondingly arranged with the doped region；
Away from the oxygen buried layer one on side or the insulating barrier on the drift layer away from the oxygen buried layer
Source electrode, gate electrode and the drain electrode of side.
Optionally, first insulating barrier is SiO2Layer, second insulating barrier is LTCC.
Optionally, the Metal field plate is gate metal field plate or drain metal field plate, the gate metal field plate with
The gate electrode connection, the drain metal field plate are connected with the drain electrode；
When the Metal field plate is gate metal field plate, the doped region is n-type doping area；
When the Metal field plate is drain metal field plate, the doped region is p-type doped region.
Optionally, the Metal field plate is located in first insulating barrier；Or
The Metal field plate is located in second insulating barrier；Or
The Metal field plate is located at the interface intersection of first insulating barrier and second insulating barrier.
Optionally, the insulating barrier includes two the first insulating barriers and at least two second insulating barriers, along the first party
To at least two second insulating barriers are between two first insulating barriers, and at least two second insulating barriers
Dielectric constant it is different.
Optionally, the insulating barrier includes at least two first insulating barriers and at least two second insulating barriers, and described first
Insulating barrier and second insulating barrier arrange along the first direction space crossings, and Jie of at least two second insulating barriers
Electric constant is identical or different.
Optionally, the electronic component also includes：
Polysilicon layer, it is correspondingly arranged with the gate electrode；
Source body, it is correspondingly arranged with the source electrode.
Optionally, the substrate is P type substrate, and the drift layer is N-type drift layer, and the oxygen buried layer is SiO2Layer.
The electronic component that the utility model embodiment provides, including substrate, oxygen buried layer and the drift layer on oxygen buried layer,
The upper surface of drift layer is formed with window, window inwall or the lower surface of window inwall and window formed with doped region, window
Intraoral formed with insulating barrier, insulating barrier includes at least one first insulating barrier and at least one second insulating barrier, shape in insulating barrier
Cheng Youyi Metal field plate, when element is in reversely pressure-resistant, Metal field plate can introduce new peak electric field in drift layer, and
And new peak electric field can be also produced in the interface intersection of the first insulating barrier and the second insulating barrier, so as to improve drift layer
Average electric field, improve electronic component breakdown voltage；When electronic component turns on, the assisted depletion effect of insulating barrier can be effective
The doped region in window is exhausted, reduces electronic component conducting resistance.
Brief description of the drawings
In order to clearly illustrate the technical scheme of the utility model exemplary embodiment, below in description embodiment
The required accompanying drawing used does a simple introduction.Obviously, the accompanying drawing introduced is the utility model part to be described
The accompanying drawing of embodiment, rather than whole accompanying drawings, for those of ordinary skill in the art, are not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation for electronic component that the utility model embodiment provides；
Fig. 2 is the structural representation for another electronic component that the utility model embodiment provides；
Fig. 3 is the structural representation for another electronic component that the utility model embodiment provides；
Fig. 4 is a kind of schematic flow sheet of the preparation method for electronic component that the utility model embodiment provides；
Fig. 5 is the structural representation that oxygen buried layer is prepared on substrate that the utility model embodiment provides；
Fig. 6 is the structural representation that drift layer is prepared on oxygen buried layer that the utility model embodiment provides；
Fig. 7 be the utility model embodiment provide prepare the structural representation of window in the upper surface of drift layer；
Fig. 8 is the structural representation that doped region is prepared in window that the utility model embodiment provides；
Fig. 9 a are the structural representation that the first insulating barrier of formation is prepared in window that the utility model embodiment provides；
Fig. 9 b are being performed etching to the first insulating barrier for the utility model embodiment offer, form the second insulating barrier and prepare
The structural representation in region；
Fig. 9 c prepare to form the second insulating barrier for what the utility model embodiment provided in the second insulating barrier preparation region
Structural representation；
Figure 10 is that prepare polysilicon layer, source body, source doping region and the drain electrode that the utility model embodiment provides are mixed
The structural representation in miscellaneous area；
Figure 11 is the structural representation that a Metal field plate is prepared in insulating barrier that the utility model embodiment provides；
Figure 12 is that the structure for preparing source electrode, gate electrode and drain electrode that the utility model embodiment provides is shown
It is intended to.
Embodiment
To make the purpose of this utility model, technical scheme and advantage clearer, implement below with reference to the utility model
Accompanying drawing in example, by embodiment, is fully described by the technical solution of the utility model.Obviously, described implementation
Example is part of the embodiment of the present utility model, rather than whole embodiments, based on embodiment of the present utility model, this area
The every other embodiment that those of ordinary skill obtains on the premise of creative work is not made, each falls within the utility model
Protection domain within.
Fig. 1 is a kind of structural representation for electronic component that the utility model embodiment provides, as shown in figure 1, this practicality
The electronic component that new embodiment provides can include：
Substrate 10；
Oxygen buried layer 20 on substrate 10；
The drift layer 30 away from the side of substrate 10 on oxygen buried layer 20, the upper surface of drift layer 30 formed with window 40,
The upper surface of drift layer 30 is surface of the drift layer 30 away from the side of oxygen buried layer 20；
Positioned at the inwall of window 40, or the inwall of window 40 and the doped region 50 of the lower surface of window 40；
Insulating barrier 60 in window 40, insulating barrier 60 include at least one first insulating barrier 601 and at least one the
Two insulating barriers 602, the first insulating barrier 601 and the second insulating barrier 602 arrange in the first direction, the first direction and drift layer 30
Upper surface it is parallel；
A Metal field plate 70 in insulating barrier 60, Metal field plate 70 are correspondingly arranged with doped region 50；
Away from the source electrode electricity away from the side of oxygen buried layer 20 on the side of oxygen buried layer 20 or insulating barrier 60 on drift layer 30
Pole 801, gate electrode 802 and drain electrode 803.
Exemplary, substrate 10 can be P type substrate, can be by passing through in monocrystalline substrate or single-crystal germanium substrate
Incorporation p type impurity obtains the P type substrate, and the p type impurity can be one or several kinds of in boron, indium, gallium and aluminium
Combination.
Oxygen buried layer 20 is located on substrate 10, and oxygen buried layer 20 can be SiO2Layer.
It can be N-type drift layer that drift layer 30, which is located at the side away from substrate 10, drift layer 30 on oxygen buried layer 20, Ke Yitong
Cross and obtain the N-type substrate by mixing N-type impurity in monocrystalline substrate or single-crystal germanium substrate, the N-type impurity can be with
For phosphorus or other pentad materials.
Optionally, substrate 10, oxygen buried layer 20 and drift layer 30 can be collectively as the silicon-on-insulators of the electronic component
Structure (Silicon On Insulator, SOI) is sunk to the bottom.
Exemplary, the upper surface of drift layer 30 is formed with window 40, and optionally, the upper surface of drift layer 30 is drift layer
30 surfaces away from the side of oxygen buried layer 20.Optionally, in the first direction, the development length of window 40 can be less than drift layer 30
The development length of upper surface, in a second direction, the depth of window 40 can be less than the height of drift layer 30.Optionally, described
One direction can be horizontal direction, and the second direction can be vertical direction.
Doped region 50 is located at the inwall of window 40, or the lower surface of the inwall of window 40 and window 40, specifically, can be
Doped region 50 is located on the side inwall of window 40 or doped region 50 is located on the both sides inwall of window 40, can be with
It is that doped region 50 is located at the inwall of window 40 or the lower surface of window 40.Fig. 1 is only located at the side of window 40 with doped region 50
Illustrated exemplified by inwall, the utility model embodiment is not defined to the position of doped region 50.Optionally, doped region 50
It can be one kind in n-type doping area or p-type doped region.
Insulating barrier 60 is located in window 40, and insulating barrier 60 can include at least one first insulating barrier 601 and at least one
Second insulating barrier 602, the first insulating barrier 601 and the second insulating barrier 602 arrange in the first direction, wherein, first direction and drift
The upper surface of layer 30 is parallel, and optionally, the first direction can be horizontal direction, and Fig. 1 only includes one the with insulating barrier 60
Illustrated exemplified by one insulating barrier 601 and second insulating barrier 602.Optionally, the first insulating barrier 601 can be SiO2Layer,
Second insulating barrier 602 can be LTCC (Low Temperature Co-Fired Ceramic, LTCC) material,
LTCC materials are compared to traditional material, and sintering temperature is low, with SiO2Layer process temperature close.Optionally, the upper table of insulating barrier 60
Face and the upper surface flush of drift layer 30.
Metal field plate 70 is located in insulating barrier 60, specifically, Metal field plate 70 can be located in the first insulating barrier 601, or
Person's Metal field plate 70 can be located in the second insulating barrier 602, or Metal field plate 70 can be located at the first insulating barrier 601 and second
The interface intersection of insulating barrier 602, the utility model embodiment are not defined to the position of Metal field plate 70, and Fig. 1 is only with gold
Category field plate 70 illustrates exemplified by being located in the first insulating barrier 601.
Optionally, Metal field plate 70 can be gate metal field plate or drain metal field plate, when Metal field plate 70 is grid
During the Metal field plate of pole, the gate electrode 801 of Metal field plate more than 70 connects；When Metal field plate 70 is drain metal field plate, metal field
Plate 70 is connected with drain electrode 803, and Fig. 1 illustrates so that Metal field plate 70 is gate metal field plate as an example.
Optionally, Metal field plate 70 can be correspondingly arranged with doped region 50, specifically, when Metal field plate 70 is gate metal
During field plate, doped region 50 can be n-type doping area；When Metal field plate 70 is drain metal field plate, doped region 50 can be p-type
Doped region.
Source metal 801, gate metal 802 and drain metal 803 are disposed offset from the side away from oxygen buried layer 20 on layer 30
Or the side away from oxygen buried layer 20 on insulating barrier 60, source metal 801, gate metal 802 and drain metal 803 are located at respectively
Default source area, gate regions and drain region.Optionally, the gate metal field plate is connected with gate electrode 802, the drain electrode
Metal field plate is connected with drain electrode 803.
Optionally, the electronic component that the utility model embodiment provides can also include polysilicon layer 90, as shown in figure 1,
Polysilicon layer 90 is correspondingly arranged with gate electrode 802, and polysilicon layer 90 can be located in insulating barrier 60, such as the first insulating barrier
601 or second in insulating barrier 602.
Optionally, the electronic component that the utility model embodiment provides can also include source body 100, source body
100 are correspondingly arranged with source electrode 801, as shown in Figure 1.
Optionally, 801 corresponding region of source metal is provided with source doping region 110, source doping region 110 can wrap
Include p-type doped region and n-type doping area；The region being correspondingly arranged with drain metal 802 is provided with drain doping region 120, and drain electrode is mixed
Miscellaneous area 120 can include n-type doping area, as shown in Figure 1.
To sum up, the electronic component that the utility model embodiment provides, including substrate, oxygen buried layer and the drift on oxygen buried layer
Layer is moved, the upper surface of drift layer is formed with window, and window inwall or the lower surface of window inwall and window are formed with doping
Area, window is interior to include at least one first insulating barrier and at least one second insulating barrier, insulating barrier formed with insulating barrier, insulating barrier
It is interior formed with there is a Metal field plate, when element is in reversely pressure-resistant, Metal field plate can introduce new electric field in drift layer
Peak value, and new peak electric field can be also produced in the interface intersection of the first insulating barrier and the second insulating barrier, so as to improve
The average electric field of drift layer, improve electronic component breakdown voltage；When electronic component turns on, the assisted depletion effect of insulating barrier can
Effectively to exhaust the doped region in window, electronic component conducting resistance is reduced.
Optionally, Fig. 2 is the structural representation for another electronic component that the utility model embodiment provides, shown in Fig. 2
Electronic component based on the electronic component described in above-described embodiment, be improved on the basis of above-described embodiment, such as Fig. 2
Shown, the electronic component that the utility model embodiment provides can include：
Substrate 10；
Oxygen buried layer 20 on substrate 10；
The drift layer 30 away from the side of substrate 10 on oxygen buried layer 20, the upper surface of drift layer 30 formed with window 40,
The upper surface of drift layer 30 is surface of the drift layer 30 away from the side of oxygen buried layer 20；
Positioned at the inwall of window 40, or the inwall of window 40 and the doped region 50 of the lower surface of window 40；
Insulating barrier 60 in window 40, it is exhausted that insulating barrier 60 includes two the first insulating barriers 601 and at least two second
Edge layer 602, along the first direction, at least two second insulating barriers 602 are located between two the first insulating barriers 601, and at least
The dielectric constant of two the second insulating barriers 602 is different.
A Metal field plate 70 in insulating barrier 60, Metal field plate 70 are correspondingly arranged with doped region 50；
Away from the source electrode electricity away from the side of oxygen buried layer 20 on the side of oxygen buried layer 20 or insulating barrier 60 on drift layer 30
Pole 801, gate electrode 802 and drain electrode 803.
The difference of the electronic component shown in electronic component and Fig. 1 shown in Fig. 2 is that insulating barrier 60 includes two the
One insulating barrier 601 and at least two second insulating barriers 602, as shown in Fig. 2 in the first direction, two the second insulating barriers 602 are located at
Between first insulating barrier 601, Fig. 2 only illustrates by taking two the second insulating barriers 602 as an example.Optionally, the first insulating barrier 601 can
Think SiO2Layer, the second insulating barrier 602 can be LTCC materials, and the dielectric constant of two the second insulating barriers 602 is different, example
Such as, the dielectric constant of two insulating barriers 602 can be respectively 3.4 and 2.9, it is necessary to explanation, in the utility model embodiment
Dielectric constant refer to relative dielectric constant.LTCC materials are compared to traditional material, and sintering temperature is low, with SiO2Layer process temperature
Spend close, therefore, set electronic component to include two the first insulating barriers 601 and at least two second insulating barriers 602, at least two
Second insulating barrier 602 is between two the first insulating barriers 601, and the dielectric constant of at least two second insulating barriers 602 is different,
In the first insulating barrier 601 and the interface intersection of the second insulating barrier 602, and two neighboring second insulation that dielectric constant is different
The interface intersection of layer 602 produces new peak electric field, so as to improve the average electric field of drift layer, improves electronic component breakdown
Voltage；When electronic component turns on, the assisted depletion effect of insulating barrier can effectively exhaust the doped region in window, reduce electricity
Subcomponent conducting resistance.
Optionally, Fig. 3 is the structural representation for another electronic component that the utility model embodiment provides, shown in Fig. 3
Electronic component based on the electronic component described in above-described embodiment, be improved on the basis of above-described embodiment, such as Fig. 3
Shown, the electronic component that the utility model embodiment provides can include：
Substrate 10；
Oxygen buried layer 20 on substrate 10；
The drift layer 30 away from the side of substrate 10 on oxygen buried layer 20, the upper surface of drift layer 30 formed with window 40,
The upper surface of drift layer 30 is surface of the drift layer 30 away from the side of oxygen buried layer 20；
Positioned at the inwall of window 40, or the inwall of window 40 and the doped region 50 of the lower surface of window 40；
Insulating barrier 60 in window 40, insulating barrier 60 include at least two first insulating barriers 601 and at least two the
Space crossings arrange in the first direction for two insulating barriers 602, the first insulating barrier 601 and the second insulating barrier 602, and at least two second
The dielectric constant of insulating barrier 602 is identical or different；
A Metal field plate 70 in insulating barrier 60, Metal field plate 70 are correspondingly arranged with doped region 50；
Away from the source electrode electricity away from the side of oxygen buried layer 20 on the side of oxygen buried layer 20 or insulating barrier 60 on drift layer 30
Pole 801, gate electrode 802 and drain electrode 803.
The difference of the electronic component shown in electronic component and Fig. 1 shown in Fig. 3 is that insulating barrier 60 includes at least two
The individual insulating barrier 602 of first insulating barrier 601 and at least two second, as shown in figure 3, the first insulating barrier 601 and the second insulating barrier 602
Space crossings arrange in the first direction, and Fig. 3 is only with two the first insulating barriers 601 and two space crossings of the second insulating barrier 602 rows
Example is classified as to illustrate.Optionally, the first insulating barrier 601 can be SiO2Layer, the second insulating barrier 602 can be LTCC materials,
And the dielectric constant of two the second insulating barriers 602 is identical or different.For LTCC materials compared to traditional material, sintering temperature is low,
With SiO2Layer process temperature close, therefore, electronic component is set to include at least two first insulating barriers 601 and the second insulating barrier
602 space crossings are arranged, and new peak electric field can be produced in the interface intersection of the first insulating barrier 601 and the second insulating barrier 602,
So as to improve the average electric field of drift layer, electronic component breakdown voltage is improved；When electronic component turns on, the auxiliary of insulating barrier
Depletion action can effectively exhaust the doped region in window, reduce electronic component conducting resistance.
Optionally, Fig. 4 is a kind of schematic flow sheet of the preparation method for electronic component that the utility model embodiment provides,
As shown in figure 4, the preparation method for the electronic component that the utility model embodiment provides can include：
S110, a substrate is provided and prepares oxygen buried layer over the substrate.
Exemplary, Fig. 5 is the structural representation that oxygen buried layer is prepared on substrate that the utility model embodiment provides, such as
Shown in Fig. 5, oxygen buried layer 20 is prepared over the substrate 10, and substrate 10 can be P type substrate, and oxygen buried layer 20 can be SiO2Layer.It is optional
, oxygen buried layer 20 can be prepared by way of depositing oxygen buried layer material over the substrate 10 by preparing oxygen buried layer 20 over the substrate 10,
The utility model embodiment is to the preparation method of oxygen buried layer 20 without limiting.
S120, the side away from the substrate prepares drift layer, the upper surface shape of the drift layer on the oxygen buried layer
Into there is window, the upper surface of the drift layer is surface of the drift layer away from the oxygen buried layer side.
Exemplary, Fig. 6 is the structural representation that drift layer is prepared on oxygen buried layer that the utility model embodiment provides,
As shown in fig. 6, the side away from substrate 10 prepares drift layer 30 on oxygen buried layer 20, drift layer 30 can be N-type drift layer.Can
Choosing, can be that deflection layer 30 is prepared by way of depositing offset layer material on oxygen buried layer 20.
Optionally, Fig. 7 be the utility model embodiment provide prepare the structural representation of window in the upper surface of drift layer
Figure, as shown in fig. 7, formed with window 40 on the upper surface of deflection layer 30, the upper surface of deflection layer 30 can be deflection layer 30
A side surface away from oxygen buried layer 20.Optionally, window 40 is prepared in the upper surface of drift layer 30, etch bias layer can be passed through
Window 40 is prepared in the mode of 30 upper surface, can be specifically to drift by way of dry etching or wet etching
The upper surface of layer 30 performs etching, and the utility model embodiment is to lithographic method without limiting.
S130, in the window inwall, or the window inwall and the window lower surface prepare doped region.
Exemplary, Fig. 8 is the structural representation that doped region is prepared in window that the utility model embodiment provides, such as
Shown in Fig. 8, doped region 50 is prepared in the inwall of window 40, or the inwall of window 40 and lower surface.Optionally, doped region can
50 can be one kind in n-type doping area or p-type doped region.Optionally, in the inwall of window 40 or the inwall of window 40 and
Window lower surface prepares doped region 50 can be by injecting N-type in the inwall or the inwall of window 40 of window 40 and lower surface
The mode of ion either p-type ion obtains n-type doping area or p-type doped region.Fig. 8 is only with the shape on the both sides inwall of window 40
Illustrated exemplified by into doped region 50.
S140, insulating barrier is prepared in the window, the insulating barrier includes at least one first insulating barrier and at least one
Individual second insulating barrier, first insulating barrier and second insulating barrier arrange in the first direction, the first direction with it is described
The upper surface of drift layer is parallel.
Exemplary, prepared in window 40 and form insulating barrier 60, the upper surface of insulating barrier 60 and the upper table of drift layer 30
Face flushes, and insulating barrier 60 can include at least one first insulating barrier 601 and at least one second insulating barrier 602.Optionally,
One insulating barrier 601 can be SiO2Layer, the second insulating barrier 602 can be LTCC materials.
Optionally, the first insulating barrier 601 and the second insulating barrier 602 being prepared in window 40 can specifically include：
The depositing first insulator layer material in window 40, prepare and form the first insulating barrier 601；
The first insulating barrier 601 is performed etching with 602 corresponding opening position of the second insulating barrier, spills the following table of window 40
Face, obtain the preparation region of the second insulating barrier 602；
The insulating layer material of area deposition second is prepared in the second insulating barrier 602, prepares and forms the second insulating barrier 602.
Exemplary, Fig. 9 a are the structure that the first insulating barrier of formation is prepared in window that the utility model embodiment provides
Schematic diagram；Fig. 9 b are being performed etching to the first insulating barrier for the utility model embodiment offer, form the second insulating barrier and prepare
The structural representation in region；Fig. 9 c prepare to form second for what the utility model embodiment provided in the second insulating barrier preparation region
The structural representation of insulating barrier, as shown in Fig. 9 a, 9b and 9c, the depositing first insulator layer material in window 40, such as SiO2, system
It is standby to form the first insulating barrier 601, then the first insulating barrier 601 is performed etching, such as dry etching or wet etching, obtain
The preparation region of second insulating barrier 602, the preparation region of the second insulating barrier 602 can be cleaned, avoided second exhausted afterwards
There are other impurities in the preparation region of edge layer 602, then preparing area deposition or smear second exhausted in the second insulating barrier 602
Edge layer material, prepare and form the second insulating barrier 602.
It should be noted that Fig. 9 a, 9b and 9c only include first insulating barrier 601 to insulating barrier 60 and one second exhausted
The preparation process of edge layer 602 is illustrated, when insulating barrier 60 includes at least two first insulating barriers 601 and at least two second
During insulating barrier 602, such as when insulating barrier 60 includes two the first insulating barriers 601 and at least two second insulating barriers 602, and along institute
First direction is stated, when at least two second insulating barriers 602 are between two the first insulating barriers 601, shown in Fig. 9 a, 9b and 9c
Preparation method is equally applicable, repeats no more here.
Optionally, prepare and formed after insulating barrier 60, can also be included：
Polysilicon layer 90 is prepared in insulating barrier 60；
On deflection layer 30 source body 100 is formed with 801 corresponding region of source metal；
On source body 100 source doping region 110 is formed with 801 corresponding region of source metal；
Drain doping region 120 is formed with 803 corresponding region of drain metal on deflection layer 30, as shown in Figure 10.
S150, a Metal field plate is prepared in the insulating barrier, the Metal field plate is correspondingly arranged with the doped region.
Exemplary, Figure 11 is the structure that a Metal field plate is prepared in insulating barrier that the utility model embodiment provides
Schematic diagram, as shown in figure 11, Metal field plate 70 is prepared in insulating barrier 60, metal field can be prepared in the first insulating barrier 601
Plate 70, Metal field plate 70 can also be prepared in the second insulating barrier 602, can also be in the first insulating barrier 601 and the second insulating barrier
602 interface intersection prepares Metal field plate 70, and Figure 11 is only carried out exemplified by preparing Metal field plate 70 in the first insulating barrier 601
Explanation.Optionally, Metal field plate 70 can be gate metal field plate or drain metal field plate, when Metal field plate 70 is grid gold
When belonging to field plate, the gate electrode 801 of Metal field plate more than 70 connects；When Metal field plate 70 is drain metal field plate, Metal field plate 70
It is connected with drain electrode 803, Fig. 1 illustrates so that Metal field plate 70 is gate metal field plate as an example.Optionally, Metal field plate 70
It is correspondingly arranged with doped region 50, when Metal field plate 70 is gate metal field plate, doped region 50 can be n-type doping area；Work as gold
When category field plate 70 is drain metal field plate, doped region 50 can be p-type doped region.
Optionally, Metal field plate 70 is prepared in insulating barrier 60, can be by performing etching to form metal to insulating barrier 60
Field plate window, metal formation Metal field plate 70 is deposited in Metal field plate window.
Away from the oxygen buried layer on S160, the side on the drift layer away from the oxygen buried layer or the insulating barrier
Side prepare source electrode, gate electrode and drain electrode.
Exemplary, Figure 12 prepares source electrode, gate electrode and drain electrode electricity for what the utility model embodiment provided
The structural representation of pole, as shown in figure 12, on deflection layer 30 or on insulating barrier 60 with source electrode 801, gate electrode 802
With drain electrode 803 corresponding to position prepare source electrode 801, gate electrode 802 and drain electrode 803.
Optionally, can be first when preparing Metal field plate 70, source electrode 801, gate electrode 802 and drain electrode 803
First insulating barrier 60 is performed etching, obtains Metal field plate window, then on deflection layer 30 or on insulating barrier 60 and metal
In field plate window simultaneously deposited metal material, Metal field plate 70 is obtained in Metal field plate window, on deflection layer 30 and absolutely
The metal electrode of flood is obtained in edge layer 60, the metal electrode of flood is performed etching afterwards, respectively band source electrode 801,
Gate electrode 802 and drain electrode 803, i.e. gate metal field plate are prepared simultaneously with gate electrode 802, drain metal field plate and leakage
Pole electrode 803 is prepared simultaneously.
To sum up, the preparation method for the electronic component that the utility model embodiment provides, by forming doped region in window,
At least one first insulating barrier and at least one second insulating barrier are prepared in insulating barrier, a metal field is prepared in insulating barrier
Plate, when element is in reversely pressure-resistant, Metal field plate can introduce new peak electric field in drift layer, and in the first insulating barrier
New peak electric field can be also produced with the interface intersection of the second insulating barrier, so as to improve the average electric field of drift layer, is improved
Electronic component breakdown voltage；When electronic component turns on, the assisted depletion effect of insulating barrier effectively can be exhausted in window
Doped region, reduce electronic component conducting resistance.
Pay attention to, above are only preferred embodiment of the present utility model and institute's application technology principle.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, can carried out for a person skilled in the art various bright
Aobvious change, readjust, be combined with each other and substitute without departing from the scope of protection of the utility model.Therefore, although passing through
Above example is described in further detail to the utility model, but the utility model is not limited only to above implementation
Example, in the case where not departing from the utility model design, other more equivalent embodiments can also be included, and it is of the present utility model
Scope is determined by scope of the appended claims.
Claims (8)
- A kind of 1. electronic component, it is characterised in that including：Substrate；Oxygen buried layer on the substrate；The drift layer away from the substrate side on the oxygen buried layer, the upper surface of the drift layer is formed with window, institute It is surface of the drift layer away from the oxygen buried layer side to state drift layer upper surface；Positioned at the window inwall, or the window inwall and the doped region of the window lower surface；Insulating barrier in the window, the insulating barrier include at least one first insulating barrier and at least one second insulation Layer, first insulating barrier and second insulating barrier arrange in the first direction, and the first direction is upper with the drift layer Surface is parallel；A Metal field plate in the insulating barrier, the Metal field plate are correspondingly arranged with the doped region；Away from the source away from the oxygen buried layer side on the oxygen buried layer side or the insulating barrier on the drift layer Pole electrode, gate electrode and drain electrode.
- 2. electronic component according to claim 1, it is characterised in that first insulating barrier is SiO2Layer, described second is exhausted Edge layer is LTCC.
- 3. electronic component according to claim 1, it is characterised in that the Metal field plate is gate metal field plate or leakage Pole Metal field plate, the gate metal field plate are connected with the gate electrode, the drain metal field plate and the drain electrode Connection；When the Metal field plate is gate metal field plate, the doped region is n-type doping area；When the Metal field plate is drain metal field plate, the doped region is p-type doped region.
- 4. electronic component according to claim 3, it is characterised in that the Metal field plate is located at first insulating barrier It is interior；OrThe Metal field plate is located in second insulating barrier；OrThe Metal field plate is located at the interface intersection of first insulating barrier and second insulating barrier.
- 5. electronic component according to claim 1, it is characterised in that the insulating barrier is including two the first insulating barriers and extremely Few two the second insulating barriers, along the first direction, at least two second insulating barriers are located at two first insulating barriers Between, and the dielectric constant of at least two second insulating barriers is different.
- 6. electronic component according to claim 1, it is characterised in that the insulating barrier includes at least two first insulating barriers With at least two second insulating barriers, first insulating barrier and second insulating barrier are arranged along the first direction space crossings Row, and the dielectric constant of at least two second insulating barriers is identical or different.
- 7. electronic component according to claim 1, it is characterised in that the electronic component also includes：Polysilicon layer, it is correspondingly arranged with the gate electrode；Source body, it is correspondingly arranged with the source electrode.
- 8. electronic component according to claim 1, it is characterised in that the substrate is P type substrate, and the drift layer is N Type drift layer, the oxygen buried layer are SiO2Layer.
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| CN107134481A (en) * | 2017-05-08 | 2017-09-05 | 工业和信息化部电子第五研究所华东分所 | A kind of electronic component and preparation method thereof |
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