CN206814841U - The graphite carrying plate structure of above and below board-like PECVD plated film equipment integratings - Google Patents

The graphite carrying plate structure of above and below board-like PECVD plated film equipment integratings Download PDF

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Publication number
CN206814841U
CN206814841U CN201720514909.8U CN201720514909U CN206814841U CN 206814841 U CN206814841 U CN 206814841U CN 201720514909 U CN201720514909 U CN 201720514909U CN 206814841 U CN206814841 U CN 206814841U
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China
Prior art keywords
graphite
rectangular pyramids
truncated rectangular
carrying plate
positive truncated
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CN201720514909.8U
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Inventor
李慧
陈克
徐建
樊华
彭彪
俞超
徐长坡
徐强
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Huansheng Photovoltaic Jiangsu Co Ltd
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Eastern Link Photovoltaic (jiangsu) Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical Vapour Deposition (AREA)

Abstract

The utility model discloses a kind of graphite carrying plate structure of board-like above and below PECVD plated films equipment integrating, the graphite carrying plate has multiple graphite frame units, it is characterized in that each graphite frame unit is in inverted positive truncated rectangular pyramids structure, the upper bottom edge of positive truncated rectangular pyramids is graphite frame, four sides of positive truncated rectangular pyramids are graphite cake, the upper bottom of positive truncated rectangular pyramids to hollow formation cavity of going to the bottom;Between upper bottom edge and the length of side of bottom, silicon chip is placed on the side of positive truncated rectangular pyramids the length of side of silicon chip.During producing solar panel, by cell piece after containing the upper and lower plated film equipment integratings of PECVD of the present utility model, cell piece front prints without white edge, without fulcrum, and the back side is without around plating, the positive back side color uniformity of cell piece.

Description

The graphite carrying plate structure of above and below board-like PECVD plated film equipment integratings
Technical field
The utility model belongs to the technical field of solar panel production equipment, specifically a kind of board-like above and below PECVD The graphite carrying plate structure of plated film equipment integrating.
Background technology
In order to reduce light energy of the solar cell surface because of reflection loss, using vacuum vapor deposition method, vapor growth method or Other chemical methodes, single or multiple lift passivating film is plated in battery front side, plays a part of surface passivation and antireflective, to carry The photoelectric current and photoelectric transformation efficiency of high battery.
In solar cell fabrication process, plasma reinforced chemical vapour deposition (PECVD) is a kind of generally to be used For preparing a kind of method of battery surface antireflective coating.PECVD is to make the gas electricity containing film composed atom by microwave From being partially formed plasma, because plasma chemical activity is strong, is easily reacting, go out frozen composition in deposition on substrate Film.
In order to improve the transformation efficiency of cell piece, increase back of the body passivation technology at the conventional batteries back side, be more ripe at present Technology.PERC cell backsides typically overleaf grow AlOx/SiNx stack membranes using board-like PECVD device, and the back side is completed After passivating film, enter next process and carry out positive SiNx depositions.Because positive back side film is completed on different devices respectively, On the one hand automation and artificial input are added, causes battery manufacture cost increase;On the other hand, in silicon slice transmission course, Pollution and the probability increase of processing procedure exception are introduced, causes yield to decline.At present, existing device manufactory produces positive back side coating film All-in-one, equipment body structure are divided into three chambers, and wherein PM1 and PM2 use upper plated film mode, deposited respectively in silicon chip back side AlOx/SiNx stack membranes;PM3 uses lower plated film mode, grows layer of sin x films in front side of silicon wafer.Silicon chip is in coating process In, due to being placed on graphite carrying plate, there is the contact of certain area with support plate, cause the positive back side of silicon chip fulcrum print, edge occur Around plating, cell piece outward appearance and conversion efficiency are had a strong impact on.
Utility model content
The utility model provides plated film equipment integrating above and below a kind of board-like PECVD for problem present in background technology Graphite carrying plate structure, the graphite carrying plate have multiple graphite frame units, and each graphite frame unit is in inverted positive truncated rectangular pyramids knot Structure, the upper bottom edge of positive truncated rectangular pyramids is graphite frame, and four sides of positive truncated rectangular pyramids are graphite cake, and the upper bottom of positive truncated rectangular pyramids is under The hollow formation cavity in bottom;For the length of side of silicon chip between upper bottom edge and the length of side of bottom, silicon chip is placed in the side of positive truncated rectangular pyramids On face.
Preferably, the upper bottom edge length of side is 159m;The bottom length of side is 156mm.
Preferably, the chamfering of the upper bottom edge is Φ 214.5mm, and the chamfering of the bottom is Φ 208.5mm.
Preferably, the quantity of the graphite frame unit is 24, arranges and arranges in four rows six.
The beneficial effects of the utility model
During producing solar panel, silicon chip is integrally set by the upper and lower plated film containing PECVD of the present utility model After standby, due to silicon chip be brought into close contact with graphite side it is seamless, therefore obtained cell piece front without white edge, without fulcrum print, the back side Without around plating, the positive back side color uniformity of cell piece.
Brief description of the drawings
Fig. 1 is installation whole structure figure of the present utility model.
Fig. 2 is graphite frame cellular construction figure of the present utility model.
Fig. 3 is that silicon chip of the present utility model places schematic diagram.
Embodiment
With reference to embodiment, the utility model is described in further detail, but the scope of protection of the utility model is not limited to This:
With reference to Fig. 1 and Fig. 2, embodiment 1:A kind of graphite carrying plate structure of above and below board-like PECVD plated film equipment integratings, it is described Graphite carrying plate has multiple graphite frame units, and each graphite frame unit is in inverted positive truncated rectangular pyramids structure, the upper bottom of positive truncated rectangular pyramids Side 1 is graphite frame, and four sides 2 of positive truncated rectangular pyramids are graphite cake, the upper bottom of positive truncated rectangular pyramids to hollow formation cavity of going to the bottom 4;The length of side of silicon chip 5 is between the length of side of upper bottom edge 1 and bottom 3.With reference to Fig. 3, silicon chip 5 is placed in the side of positive truncated rectangular pyramids On 2.Side 2 in embodiment can be formed by polishing or cutting graphite cake.
Embodiment 2:The graphite carrying plate structure of above and below board-like PECVD plated film equipment integratings as described in Example 1, for outer The silicon chip 5 that shape is 156.75x156.75mm, chamfering is Φ 210mm.The length of side of upper bottom edge 1 of the graphite frame unit is 159m;Institute It is 156mm to state the length of side of bottom 3.
Embodiment 3:The graphite carrying plate structure of board-like PECVD as described in Example 2 plated film equipment integratings up and down, it is described on The chamfering on base 1 is Φ 214.5mm, and the chamfering of the bottom 3 is Φ 208.5mm.
Preferably, the quantity of the graphite frame unit is 24, arranges and arranges in four rows six.
The graphite carrying plate of the utility model design makes silicon chip 5 realize the linear contact lay with positive truncated rectangular pyramids side 2 by its edge It is fixed, gapless between silicon chip 5 and graphite cake, it on the one hand can avoid producing around plating phenomenon, on the other hand, the design is without hook branch Support, obtained cell piece front is avoided to produce fulcrum print, the positive back side color uniformity of cell piece;Meanwhile using the design stone Black support plate, compatible various sizes of silicon chip 5 (quantity that silicon chip 5 can be carried inside graphite carrying plate shown in Fig. 1 is 4x6 totally 24, Support plate internal structure slide glass number can also be made an amendment, such as make 6x6 or 5x7 ... into according to the size of equipment cavity);And should Design plated film and lower filming equipment on compatible board-like PECVD, while be applied to all upper and lower plated film PECVD all-in-ones simultaneously.
Specific embodiment described herein is only the utility model spirit to be done for example, the chi of slide glass unit Very little, shape can be designed according to the die size and chamfer shape of use.The utility model those of skill in the art Member can be made various modifications or supplement to described specific embodiment or be substituted using similar mode, but can't Deviate spirit of the present utility model or surmount scope defined in appended claims.

Claims (4)

1. the graphite carrying plate structure of plated film equipment integrating, the graphite carrying plate have multiple graphite frames above and below a kind of board-like PECVD Unit, it is characterised in that for each graphite frame unit in inverted positive truncated rectangular pyramids structure, the upper bottom edge (1) of positive truncated rectangular pyramids is graphite side Frame, four sides (2) of positive truncated rectangular pyramids are graphite cake, the upper bottom of positive truncated rectangular pyramids to hollow formation cavity (4) of going to the bottom;Silicon chip (5) between the length of side of upper bottom edge (1) and bottom (3), silicon chip (5) is placed on the side (2) of positive truncated rectangular pyramids the length of side.
2. the graphite carrying plate structure of plated film equipment integrating above and below board-like PECVD according to claim 1, it is characterised in that institute It is 159m to state upper bottom edge (1) length of side;Bottom (3) length of side is 156mm.
3. the graphite carrying plate structure of plated film equipment integrating above and below board-like PECVD according to claim 2, it is characterised in that institute The chamfering for stating upper bottom edge (1) is Φ 214.5mm, and the chamfering of the bottom (3) is Φ 208.5mm.
4. the graphite carrying plate structure of plated film equipment integrating above and below board-like PECVD according to claim 1, it is characterised in that institute The quantity for stating graphite frame unit is 24, arranges and arranges in four rows six.
CN201720514909.8U 2017-05-10 2017-05-10 The graphite carrying plate structure of above and below board-like PECVD plated film equipment integratings Active CN206814841U (en)

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CN201720514909.8U CN206814841U (en) 2017-05-10 2017-05-10 The graphite carrying plate structure of above and below board-like PECVD plated film equipment integratings

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109020627A (en) * 2018-08-06 2018-12-18 珠海汉瓷精密科技有限公司 A kind of tool fixture suitable for the two-sided continuous metallised of potsherd
CN111690911A (en) * 2020-06-30 2020-09-22 成都晔凡科技有限公司 Bearing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109020627A (en) * 2018-08-06 2018-12-18 珠海汉瓷精密科技有限公司 A kind of tool fixture suitable for the two-sided continuous metallised of potsherd
CN111690911A (en) * 2020-06-30 2020-09-22 成都晔凡科技有限公司 Bearing device
CN111690911B (en) * 2020-06-30 2023-07-25 通威太阳能(金堂)有限公司 Bearing device

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Address after: 214203 No. 20 Wen Zhuang Road, Yixing Economic Development Zone, Jiangsu, Wuxi

Patentee after: Huansheng photovoltaic (Jiangsu) Co., Ltd

Address before: 214203 No. 20 Wen Zhuang Road, Yixing Economic Development Zone, Jiangsu, Wuxi

Patentee before: Eastern link photovoltaic (Jiangsu) Co., Ltd.