CN206505913U - SMC type semiconductor lead frames - Google Patents
SMC type semiconductor lead frames Download PDFInfo
- Publication number
- CN206505913U CN206505913U CN201620999903.XU CN201620999903U CN206505913U CN 206505913 U CN206505913 U CN 206505913U CN 201620999903 U CN201620999903 U CN 201620999903U CN 206505913 U CN206505913 U CN 206505913U
- Authority
- CN
- China
- Prior art keywords
- frame
- bottom sheet
- upper piece
- lower frame
- upper side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a kind of SMC types semiconductor lead frame, formed by upper piece with the smooth fastening of bottom sheet；It is described upper piece and bottom sheet it is vertical by upper side frame and lower frame and with upper side frame and lower frame and be connected multiple frame units composition；Upper piece the upper side frame and lower frame are all uniformly distributed multiple circular locating openings, multiple oval positioning holes and multiple square holes；The upper side frame and lower frame of the bottom sheet are all uniformly distributed multiple circular locating openings, multiple oval positioning holes and multiple convex thorns；The positioning hole of upper piece the upper side frame and lower frame and oval positioning hole are corresponded with the upper side frame of bottom sheet and the positioning hole of lower frame and oval positioning hole respectively；Upper piece the pin 5 that each block of band can make totally 200, the pin 5 of bottom sheet totally 200.The multiple rows of design of the utility model, it is high that chip bears density of texture, efficiency high during encapsulation, while upper piece and bottom sheet can do thin patch again.
Description
Technical field
The utility model is related to semiconductor die package field, specifically a kind of SMC types semiconductor lead frame.
Background technology
Current SMC type semiconductor lead frames are mainly used in hand assembled production, for the ease of hand assembled, product envelope
Dress lead frame is single design, and it is small that the chip in low production efficiency, and lead frame bears density of texture, framework utilization rate
It is low, expend material.Simultaneously upper piece and bottom sheet be difficult to make thin patch.
Utility model content
In view of the above-mentioned problems, main purpose of the present utility model is that providing one kind had both overcome the single design of lead frame,
Chip bears that density of texture is small, and efficiency is low during encapsulation, the problem of lost labor, while overcome piece and bottom sheet can not do thin again
The problem of type paster.
The utility model is to solve above-mentioned technical problem by following technical proposals：
A kind of SMC types semiconductor lead frame, by upper piece 66 and bottom sheet 86 it is smooth fastening form；It is described upper piece 66 and bottom sheet
86 by upper side frame 11 and lower frame 12 and it is vertical with upper side frame 11 and lower frame 12 and be connected multiple frame units
58 compositions；It is described upper piece 66 upper side frame 11 and lower frame 12 be all uniformly distributed multiple circular locating openings 1, it is multiple ellipse positioning
Hole 2 and multiple square holes 9；The upper side frame 11 and lower frame 12 of the bottom sheet 86 be all uniformly distributed multiple circular locating openings 1, multiple ellipse
Circular locating openings 2 and multiple convex thorns 8；Upper piece 66 upper side frame 11 and the positioning hole 1 of lower frame 12 and oval positioning hole 2
Corresponded respectively with the upper side frame 11 of bottom sheet 86 and the positioning hole 1 of lower frame 12 and oval positioning hole 2；It is described upper piece 66
Convex thorn 8 of the square hole 9 of upper side frame 11 and lower frame 12 respectively with the upper side frame 11 of bottom sheet 86 and lower frame 12 is fitted close one by one；Institute
State frame unit 58 include integrated connection upper side frame 11 and lower frame 12 company's muscle 10 and it is evenly distributed up and down and only even
A Ge Ji islands 7 are connected on multiple pins 5 vertical with the even muscle 10 of the side of muscle 10, pin 5；The adjacent frame
The pin 5 of unit 58 is located at the not homonymy of even muscle 10, and even the adjacent frame unit 58 of muscle 10 is connected with each other and close to even muscle 10
The adjacent composition compound frame of frame unit 58 unit 88；It is described upper piece 66 compound frame unit 88 left side base island 7 and institute
The right base island 7 for stating the compound frame unit 88 of bottom sheet 86 coordinates, the right base island 7 of upper piece the compound frame unit 88 with
The left side base island 7 of the compound frame unit 88 of the bottom sheet 86 coordinates；Upper piece 66 adjacent vertical center lines of compound frame unit 58
The distance between be 23.6 ± 0.025mm, the distance between the adjacent vertical center line of compound frame unit 58 of bottom sheet 86 is also
23.6±0.025mm；Pin 5 of the compound frame unit 88 in same level has one on the extension line in opposite direction
Hole 6 is disconnected, company's muscle 10 with corresponding pin 5 and thereon is integrally attached to, the shape for disconnecting hole 6 is rectangle；It is described upper piece
66 offer 20 frame units 58；The bottom sheet 86 offers 20 frame units 58；It is equipped with the frame unit 58
10 pins 5.
Each block of band can make upper piece 66 pin 5 totally 200, the pin 5 of bottom sheet 86 totally 200, upper piece 66 Hes
Bottom sheet 86 can encapsulate 200 chips, so save waste of material.
The disconnection hole 6 directly just can break, also save material when shearing pin 5.Optimum density is reached.
Hem 3 is provided between the pin 5 and base island 7, described tears edge open provided with two anti-layering holes 4.
The both sides in described two anti-layering holes 4 are respectively provided with a bound edge thorn 14.
It is described upper piece 66 and the length and width of bottom sheet 86 be respectively 236 ± 0.1mm, 78 ± 0.05mm.
It is described upper piece 66 and bottom sheet 86 multiple oval positioning holes 2 length be 2.36 ± 0.025mm.
Distance between two adjacent centers of base island 7 of the frame unit 58 in same level is 11.8 ± 0.1mm.
The diameter in described two anti-layering holes 4 is 0.6 ± 0.025mm.
The length on the base island 7 and wide subregion are：3±0.025mm.
The center on the upper Pian66Ji islands 7 is provided with boss 13.
The base island 7 of the bottom sheet 86 is provided with 16 small lattice.
Positive effect of the present utility model is：Multiple rows of design, chip bears density of texture height, efficiency during encapsulation
Height, at the same upper piece and bottom sheet can do thin patch again.
Brief description of the drawings
Fig. 1 is the structure chart of bottom sheet 86 of the present utility model.
Fig. 2 is the partial enlarged drawing at A in Fig. 1.
Fig. 3 is one of structure chart of bur 8 of bottom sheet 86 of the present utility model.
Fig. 4 is the two of the structure chart of the bur 8 of bottom sheet 86 of the present utility model.
Fig. 5 be it is of the present utility model upper piece 66 structure chart.
Fig. 6 is the partial enlarged drawing at C in Fig. 5.
Fig. 7 is Fig. 6 side view.
Embodiment
The utility model preferred embodiment is provided below in conjunction with the accompanying drawings, to describe the technical solution of the utility model in detail.
As shown in figs. 1-7, a kind of SMC types semiconductor lead frame, by upper piece 66 and bottom sheet 86 it is smooth fastening form；It is described
Upper piece 66 and bottom sheet 86 it is vertical by upper side frame 11 and lower frame 12 and with upper side frame 11 and lower frame 12 and be connected
Multiple frame units 58 are constituted；It is described upper piece 66 upper side frame 11 and lower frame 12 be all uniformly distributed multiple circular locating openings 1, it is many
Individual oval positioning hole 2 and multiple square holes 9；The upper side frame 11 and lower frame 12 of the bottom sheet 86 are all uniformly distributed multiple circular fixed
Position hole 1, multiple oval positioning holes 2 and multiple convex thorns 8；It is described upper piece 66 upper side frame 11 and the He of positioning hole 1 of lower frame 12
Oval positioning hole 2 respectively with the upper side frame 11 of bottom sheet 86 and the positioning hole 1 of lower frame 12 and a pair of oval positioning hole 2 one
Should；It is described upper piece 66 upper side frame 11 and lower frame 12 square hole 9 respectively with the upper side frame 11 of bottom sheet 86 and the convex thorn 8 of lower frame 12
It is fitted close one by one；The frame unit 58 includes integrated connection upper side frame 11 and company's muscle 10 of lower frame 12 and uniform up and down
Arrangement and be only connected a Ge Ji islands on the multiple and vertical pins 5 of company's muscle 10 of the even side of muscle 10, pin 5
7；The pin 5 of the adjacent frame unit 58 is located at the not homonymy of even muscle 10, and even the adjacent frame unit 58 of muscle 10 is mutually interconnected
Connect and close to even the adjacent frame unit 58 of muscle 10 constitutes compound frame unit 88；It is described upper piece 66 compound frame unit 88
Left side base island 7 and the right base island 7 of the compound frame unit 88 of the bottom sheet 86 coordinate, upper piece the compound frame unit
88 the right base island 7 coordinates with the left side base island 7 of the compound frame unit 88 of the bottom sheet 86；Upper piece 66 adjacent compound frame lists
The distance between first 58 vertical center lines are 23.6 ± 0.025mm, the adjacent vertical center line of compound frame unit 58 of bottom sheet 86 it
Between distance be also 23.6 ± 0.025mm；Extension line of pin 5 of the compound frame unit 88 in same level in opposite direction
On, there is a disconnection hole 6, company's muscle 10 with corresponding pin 5 and thereon is integrally attached to, and the shape for disconnecting hole 6 is rectangular
Shape；The width for disconnecting hole 6 is 0.5 ± 0.025mm；It is described upper piece 66 offer 20 frame units 58；The bottom sheet 86 is opened up
There are 20 frame units 58；10 pins 5 are equipped with the frame unit 58.Each block of band can make upper piece 66 draw
Totally 200, pin 5, the pin 5 of bottom sheet 86 totally 200, upper piece 66 and bottom sheet 86 can encapsulate 200 chips, so save material
Waste.The disconnection hole 6 directly just can break, also save material when shearing pin 5.Optimum density is reached.It is described to draw
Hem 3 is provided between pin 5 and base island 7, described tears edge open provided with two anti-layering holes 4.Described two anti-layering holes 4
Both sides are respectively provided with a bound edge thorn 14.It is described upper piece 66 and bottom sheet 86 length and width be respectively 236 ± 0.1mm, 78 ±
0.05mm.It is described upper piece 66 and bottom sheet 86 multiple oval positioning holes 2 length be 2.36 ± 0.025mm.The framework list
Distance between first 58 two adjacent centers of base island 7 in same level is 11.8 ± 0.1mm.Described two anti-layering holes 4
Diameter be 0.6 ± 0.025mm.The length on the base island 7 and wide subregion are：3±0.025mm.The base island 7 of the bottom sheet 86 is set
There are 16 small lattice.The center on the upper Pian66Ji islands 7 is provided with boss 13.The length and width of the boss 13 are 1.45mm*
1.45mm。
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the utility model spirit and scope are not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within the range of claimed the utility model, the utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (9)
1. a kind of SMC types semiconductor lead frame, is formed by upper piece with the smooth fastening of bottom sheet；It is described upper piece and bottom sheet by top
Frame and lower frame and multiple frame units composition that is vertical with upper side frame and lower frame and being connected；Upper piece the top
Frame and lower frame are all uniformly distributed multiple circular locating openings, multiple oval positioning holes and multiple square holes；The top of the bottom sheet
Frame and lower frame are all uniformly distributed multiple circular locating openings, multiple oval positioning holes and multiple convex thorns；Upper piece the top
The positioning hole and oval positioning hole of frame and lower frame are fixed with the upper side frame of bottom sheet and the positioning hole of lower frame and ellipse respectively
Position hole is corresponded；The square hole of upper piece the upper side frame and lower frame respectively with the convex thorn of bottom sheet upper side frame and lower frame one by one
It is fitted close；The frame unit includes company's muscle of integrated connection upper side frame and lower frame and evenly distributed up and down and only exist
Connect and be connected a Ge Ji islands on multiple pins vertical with the even muscle of the side of muscle, pin；The adjacent frame unit
Pin be located at the not homonymy of even muscle, and even the adjacent frame unit of muscle is connected with each other and close to the even adjacent frame unit of muscle
Constitute compound frame unit；The left side Ji Dao of upper piece the compound frame unit and the compound frame unit of the bottom sheet right side
Bian Ji islands coordinate, the right Ji Dao of upper piece the compound frame unit and the compound frame unit of the bottom sheet left side Ji Dao
Coordinate；It is characterized in that：
The distance between upper piece adjacent compound frame unit vertical center line is 23.6 ± 0.025mm, the adjacent compound frame of bottom sheet
The distance between unit vertical center line is also 23.6 ± 0.025mm；Pin of the compound frame unit in same level is in phase
To on the extension line in direction, there is a disconnection hole, company's muscle with corresponding pin and thereon is integrally attached to, and disconnects the shape in hole
It is rectangle；It is described upper piece offer 20 frame units；The bottom sheet offers 20 frame units；The frame unit
On be equipped with 10 pins；The center on the Shang Pianji islands is provided with boss.
2. a kind of SMC types semiconductor lead frame as claimed in claim 1, it is characterised in that：Between pin and the base island
Provided with hem, described hem is provided with two anti-layering holes.
3. a kind of SMC types semiconductor lead frame as claimed in claim 2, it is characterised in that：Described two anti-layering holes
Diameter is 0.6 ± 0.025mm.
4. a kind of SMC types semiconductor lead frame as claimed in claim 3, it is characterised in that：Described two anti-layering holes
Both sides are respectively provided with a bound edge thorn.
5. a kind of SMC types semiconductor lead frame as claimed in claim 1, it is characterised in that：It is described upper piece and bottom sheet length
Degree and width are respectively 236 ± 0.1mm, 78 ± 0.05mm.
6. a kind of SMC types semiconductor lead frame as claimed in claim 1, it is characterised in that：It is described upper piece and bottom sheet it is many
The length of individual oval positioning hole is 2.36 ± 0.025mm.
7. a kind of SMC types semiconductor lead frame as claimed in claim 1, it is characterised in that：The frame unit is same
The distance between two adjacent Ji Dao centers in level are 11.8 ± 0.1mm.
8. a kind of SMC types semiconductor lead frame as claimed in claim 1, it is characterised in that：The length and width point of the Ji Dao
Qu Wei：3±0.025mm.
9. a kind of SMC types semiconductor lead frame as claimed in claim 1, it is characterised in that：The Ji Dao of the bottom sheet is provided with
16 small lattice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620999903.XU CN206505913U (en) | 2016-08-31 | 2016-08-31 | SMC type semiconductor lead frames |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620999903.XU CN206505913U (en) | 2016-08-31 | 2016-08-31 | SMC type semiconductor lead frames |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206505913U true CN206505913U (en) | 2017-09-19 |
Family
ID=59843893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620999903.XU Active CN206505913U (en) | 2016-08-31 | 2016-08-31 | SMC type semiconductor lead frames |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206505913U (en) |
-
2016
- 2016-08-31 CN CN201620999903.XU patent/CN206505913U/en active Active
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| GR01 | Patent grant |