CN204558456U - The exposed lead frame of integrated circuit radiator - Google Patents
The exposed lead frame of integrated circuit radiator Download PDFInfo
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- CN204558456U CN204558456U CN201520167624.2U CN201520167624U CN204558456U CN 204558456 U CN204558456 U CN 204558456U CN 201520167624 U CN201520167624 U CN 201520167624U CN 204558456 U CN204558456 U CN 204558456U
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- pin
- frame
- dao
- lead frame
- muscle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model provides the exposed lead frame of a kind of integrated circuit radiator, comprises multiple wall scroll framework, and each wall scroll framework is provided with side by side six encapsulation units, encapsulation unit comprises frame carrier, and the position of frame carrier is lower than the position of its perimeter frame.The lead frame of the large heat radiation type of the alternative riveted type of this lead frame, the design of riveted radiation sheet is replaced by framework Zhong Ji island, the object of eZIP25L and eZIP27L common mode design is reached by the reasonable arrangement of interior pin, save frame mold design, cost of manufacture and lead frame Development of Framework and utilize cost, and frame material consumption can be reduced, reduce framework difficulty of processing and improve plastic packaging material utilance, utilize frame material greatly, improve production efficiency and product quality, reduces error rate and security risk.Contribute to the rate of finished products, quality, the reliability that improve product.Be one reduce costs, the effective way of energy-saving and emission-reduction.
Description
Technical field
The utility model belongs to packaging part technical field, relates to a kind of carrier for integrated antenna package, particularly the exposed lead frame of a kind of integrated circuit radiator.
Background technology
For a long time, due to the reason of product structure, traditional HZIP25L encapsulation technology framework adopts fin and framework riveted structure, the encapsulation of HZIP25L product manufactures and is limited by early development lead frame pattern out always, framework processing technology is complicated, and frame mass ensures difficulty, and Product processing difficulty is large, production capacity delivery efficiency is low, and finished product rate is low.Further, due to the problem of project organization, stock utilization is low, causes cost very high, takies a large amount of human resources simultaneously.Usually, lead frame is provided by framework supplier, but along with the requirement of technological progress, existing increasing packaging and testing manufacturer independent development or require that lead frame professional production producer produces lead frame by the design of encapsulation enterprise self-determining.Therefore many lead frames having unique texture and autonomous innovation have also been there is.And efficiently solve above some, improve product market competition ability.
Summary of the invention
The purpose of this utility model is to provide the exposed lead frame of a kind of integrated circuit radiator, and processing technology is simple, and difficulty of processing is little, can ensure the quality of products, and reduces frame material consumption.
For achieving the above object, the technical scheme that the utility model adopts is: the exposed lead frame of a kind of integrated circuit radiator, comprise multiple wall scroll framework, each wall scroll framework is provided with side by side six encapsulation units, encapsulation unit comprises frame carrier, and the position of frame carrier is lower than the position of its perimeter frame.
Difference in height between frame carrier and its perimeter frame is 1.95mm.
The lead frame of the large heat radiation type of the alternative riveted type of the utility model radiating fin exposed outside formula framework, the design of riveted radiation sheet is replaced by framework Zhong Ji island, the object of eZIP25L and eZIP27L common mode design is reached by the reasonable arrangement of interior pin, save frame mold design, cost of manufacture and lead frame Development of Framework and utilize cost, and frame material consumption can be reduced, reduce framework difficulty of processing and improve plastic packaging material utilance, utilize frame material greatly, improve production efficiency and product quality, reduces error rate and security risk.Contribute to the rate of finished products, quality, the reliability that improve product.Be one reduce costs, the effective way of energy-saving and emission-reduction.
Accompanying drawing explanation
Fig. 1 is the general structure schematic diagram of existing four row lead frames.
Fig. 2 is the fin riveted structure schematic diagram of existing four row lead frames.
Fig. 3 is the general structure schematic diagram of the utility model radiating fin exposed outside formula framework;
Fig. 4 is the structural representation of encapsulation unit in the utility model radiating fin exposed outside formula framework.
Fig. 5 is the end view of encapsulation unit shown in Fig. 4.
Fig. 6 is that the utility model framework Ji Dao exposes mode and forms the structural representation exposing fin.
Fig. 7 is the utility model eZIP27L the 1st pin ground connection schematic diagram.
Fig. 8 is the utility model eZIP27L the 27th pin ground connection schematic diagram.
Fig. 9 is the utility model eZIP25L the 1st pin ground connection schematic diagram.
Figure 10 is the utility model eZIP25L the 25th pin ground connection schematic diagram
In figure: 1. wall scroll framework, 2. encapsulation unit, 3. framework border, 4. pin A and pin B dowel, 5. pin A and frame dowel, 6. pin A and TIE BAR connects muscle, and 7. the first Ji Dao connects muscle, 8. glue overflow prevention grooves, 9. the second Ji Dao connects muscle, and 10. Ji Dao connects muscle nibs, and 11. pin C and TIE BAR connect muscle, 12. pin C and frame connect muscle, 13. pin C and pin D connect muscle, 14. frame carriers, 15. lock glue steps, 16. pin C, 17. pin D, 18. the 3rd Ji Dao connect muscle, 19. pin B, 20. pin A, 21. fin.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Existing HZIP25L packaging frame adopts fin and framework riveted structure, as depicted in figs. 1 and 2, comprise multiple wall scroll framework 1, each wall scroll framework is provided with multiple encapsulation unit 2 side by side, encapsulation unit 2 is not directly connected with framework border 3, and fin and the wall scroll framework 1 of encapsulation unit 2 are riveted.The encapsulation of HZIP25L product manufactures and is limited by early development lead frame pattern out always, and framework processing technology complicated processing difficulty is large, and frame mass is difficult to ensure, production capacity delivery efficiency is low, and finished product rate is low.Meanwhile, due to the problem of project organization, stock utilization is low, causes cost very high, and takies a large amount of human resources.In order to overcome problems of the prior art, the utility model provides the exposed lead frame of a kind of general structure integrated circuit radiator as shown in Figure 3, its maximum overall dimension is 193.8mm × 34.5mm, comprise multiple wall scroll framework 1, each wall scroll framework 1 is provided with side by side six encapsulation units 2, the encapsulation unit 2 on wall scroll framework 1 forms 1 row 6.
The utility model radiating fin exposed outside formula lead frame adopts the compatible size design with existing HZIP25L framework, the versatility of production equipment etc. can be reached, make the equipment of existing production HZIP25L product and mould be applicable to the production of the utility model radiating fin exposed outside formula lead frame completely, not need or a small amount of investment goods and mould just can realize the production of new product.The basic structure of encapsulation unit 2 in the utility model radiating fin exposed outside formula lead frame, as shown in Figure 4, comprise frame carrier 14, the position of frame carrier 14 is lower than the position of its perimeter frame, difference in height between frame carrier 14 and its perimeter frame is 1.95mm, to ensure that the back side of frame carrier is concordant with colloid bottom surface, Formation cross-section as shown in Figure 5 arc, a sidewall of frame carrier 14 connects muscle 18 by the 3rd Ji Dao and is connected with a pin, on frame carrier 14, with be provided with the 3rd Ji Dao and connect and the relative sidewall of muscle 18 sidewall is provided with side by side the first Ji Dao and connects muscle 7 and the second Ji Dao connects muscle 9, one end that first Ji Dao connects muscle 7 is connected with frame carrier 14 respectively with one end that the second Ji Dao connects muscle 9, the other end that first Ji Dao connects muscle 7 is connected with framework border respectively with the other end that the second Ji Dao connects muscle 9, first Ji Dao connects muscle 7 and the second Ji Dao and connects muscle 9 and be symmetrical in the 3rd Ji Dao and connect muscle 18 and arrange, first Ji Dao connects the junction of muscle 7 and framework border and the second Ji Dao and connects muscle 9 and be equipped with leg-of-mutton Ji Dao with the junction of framework border and connect muscle nibs 10, the front of frame carrier 14 is provided with the glue overflow prevention grooves 8 of annular, and the longitudinal section of glue overflow prevention grooves 8 is " V " shape, and the back side of frame carrier 14 is provided with lock glue step 15.
Pin A 20 is connected with framework border with frame dowel 5 by pin A, pin A 20 is connected with pin B dowel 4 by pin A with pin B 19, first Ji Dao connects muscle 7 and connects muscle by pin A with TIE BAR(Ji Dao) connect muscle 6 be connected with pin A 20, pin C 16 connects muscle 13 with pin D 17 by pin C and pin D and is connected, pin C 16 connects muscle 11 by pin C and TIE BAR and connects muscle 9 with the second Ji Dao and be connected, and pin C 16 connects muscle 12 by pin C with frame and is connected with framework border;
The utility model radiating fin exposed outside formula lead frame adopts deeply to beat and is recessed into type (see figure 5), make the position of position lower than its perimeter frame of frame carrier 14, substitute the Welding Structure of existing lead frame, Shi Ji island is exposed simultaneously, formation exposes heat radiating fin structure, as Fig. 6, fin 21 i.e. the outer back side being exposed at the frame carrier 14 outside colloid.Frame carrier 14 connects muscle by three foundation islands and is connected with pin with framework border respectively, to increase the stationarity of Ji Dao.The muscle nibs 10 that connects Ji Dao plays locking and stable effect.Pin C 16 connects muscle 11 by pin C and TIE BAR and connects muscle 9 with the second Ji Dao and be connected, and reaches ground connection object.Pin C 16 connects muscle 12 by pin C with frame and is connected with framework border, reaches stable object.
In the utility model radiating fin exposed outside formula lead frame manufacture process, some pin in selective removal framework basic structure (see figure 4), just can produce the lead frame of different model, specific as follows:
Excision pin A and pin B dowel 4, pin A and frame dowel 5, pin C and TIE BAR connect muscle 11 and pin C and pin D and connect muscle 13, as shown in Figure 7, realize pin A 20 ground connection, now, this lead frame is the eZIP27L lead frame of the 1st pin (pin A 20 is the 1st pin) ground connection.
Excision pin A and pin B dowel 4, pin A and TIE BAR connect muscle 6, pin C and frame and connect muscle 12 and pin C and pin D and connect muscle 13, as shown in Figure 8, realize pin C 16 ground connection, now, this lead frame is the eZIP27L lead frame of the 27th pin (pin C 16 is the 27th pin) ground connection.
Excision pin A and frame dowel 5, pin C and TIE BAR connect muscle 11, pin C 16 and pin A 20, as shown in Figure 9, realize pin B 19 ground connection, now, this lead frame is the eZIP25L lead frame of the 1st pin ground connection (pin B 19 is the 1st pin) ground connection.
Excision pin A and TIE BAR connects muscle 6, pin C and frame and connects muscle 12, pin C 16 and pin A 20, as shown in Figure 10, realize pin D 17 ground connection, now, this lead frame is the eZIP25L lead frame of the 25th pin ground connection (pin D 17 is the 25th pin) ground connection.
Like this, a sub-frame realizes the design of four products, be farthest suitable for the compatibility of various product function.The utility model lead frame can reduce manufacture difficulty and the technical process difficulty of framework greatly, improves the utilance of frame material.
In above-mentioned four kinds of lead frames, when manufacture be eZIP25L lead frame time, the first Ji Dao connect muscle 18 connect be the 13rd pin, pin B 19 is the 1st pin, and pin D 17 is the 25th pin.When manufacture be eZIP27L lead frame time, the 3rd Ji Dao connect muscle 18 connect be the 14th pin, pin A 20 is the 1st pin, and pin B 19 is the 2nd pin, and pin C 16 is the 27th pin, and pin D 17 is the 26th pin.
Claims (7)
1. the exposed lead frame of integrated circuit radiator, it is characterized in that, comprise multiple wall scroll framework (1), each wall scroll framework (1) is provided with side by side six encapsulation units (2), encapsulation unit (2) comprises frame carrier (14), and the position of frame carrier (14) is lower than the position of its perimeter frame.
2. the exposed lead frame of integrated circuit radiator according to claim 1, is characterized in that, the difference in height between frame carrier (14) and its perimeter frame is 1.95mm.
3. the exposed lead frame of integrated circuit radiator according to claim 1 and 2, it is characterized in that, a sidewall of described frame carrier (14) connects muscle (18) by the 3rd Ji Dao and is connected with a pin, on frame carrier (14), with be provided with the 3rd Ji Dao and connect and the relative sidewall of muscle (18) sidewall is provided with side by side the first Ji Dao and connects muscle (7) and the second Ji Dao connects muscle (9), one end that first Ji Dao connects muscle (7) is connected with frame carrier (14) respectively with one end that the second Ji Dao connects muscle (9), the other end that first Ji Dao connects muscle (7) is connected with framework border respectively with the other end that the second Ji Dao connects muscle (9), first Ji Dao connects muscle (7) and the second Ji Dao and connects muscle (9) and be symmetrical in the 3rd Ji Dao and connect muscle (18) and arrange, first Ji Dao connects the junction of muscle (7) and framework border and the second Ji Dao and connects muscle (9) and be equipped with leg-of-mutton Ji Dao with the junction of framework border and connect muscle nibs (10), the front of frame carrier (14) is provided with the glue overflow prevention grooves (8) of annular, and the longitudinal section of glue overflow prevention grooves (8) is " V " shape, and the back side of frame carrier (14) is provided with lock glue step (15).
4. the exposed lead frame of integrated circuit radiator according to claim 3, it is characterized in that, when this lead frame is a kind of eZIP27L lead frame: the first Ji Dao connects muscle (7) and connects muscle (6) and pin A(20 by pin A and TIE BAR) be connected, framework border connects muscle (12) and pin C(16 by pin C with frame) be connected, 3rd Ji Dao connects muscle (18) and connects the 14th pin, pin A(20) be the 1st pin, pin C(16) be the 27th pin.
5. the exposed lead frame of integrated circuit radiator according to claim 3, it is characterized in that, when this lead frame is another kind of eZIP27L lead frame: framework border is by pin A and frame dowel (5) and pin A(20) be connected, second Ji Dao connects muscle (9) and connects muscle (11) and pin C(16 by pin C and TIE BAR) be connected, 3rd Ji Dao connects muscle (18) and connects the 14th pin, pin A(20) be the 1st pin, pin C(16) be the 27th pin.
6. the exposed lead frame of integrated circuit radiator according to claim 3, it is characterized in that, when this lead frame is a kind of eZIP25L lead frame: the first Ji Dao connects muscle (7) and connects muscle (6) and pin A and pin B dowel (4) and pin B(19 by pin A and TIE BAR successively) be connected, framework border connects muscle (12) by pin C with frame successively and pin C connects muscle (13) and pin D(17 with pin D) be connected; 3rd Ji Dao connects muscle (18) and connects the 13rd pin, pin B(19) be the 1st pin, pin D (17) is the 25th pin.
7. the exposed lead frame of integrated circuit radiator according to claim 3, it is characterized in that, when this lead frame is another kind of eZIP25L lead frame: framework border is successively by pin A and frame dowel (5) and pin A and pin B dowel (4) and pin B(19) be connected, second Ji Dao connects muscle (9) and connects muscle (11) by pin C and TIE BAR successively and pin C connects muscle (13) and pin D(17 with pin D) be connected, 3rd Ji Dao connects muscle (18) and connects the 13rd pin, pin B(19) be the 1st pin, pin D (17) is the 25th pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520167624.2U CN204558456U (en) | 2015-03-24 | 2015-03-24 | The exposed lead frame of integrated circuit radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520167624.2U CN204558456U (en) | 2015-03-24 | 2015-03-24 | The exposed lead frame of integrated circuit radiator |
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| CN204558456U true CN204558456U (en) | 2015-08-12 |
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| CN201520167624.2U Active CN204558456U (en) | 2015-03-24 | 2015-03-24 | The exposed lead frame of integrated circuit radiator |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107481990A (en) * | 2017-09-26 | 2017-12-15 | 深圳赛意法微电子有限公司 | Lead frame, semiconductor devices and its packaging technology |
| CN108269778A (en) * | 2018-01-09 | 2018-07-10 | 深圳电通纬创微电子股份有限公司 | A kind of biradical island SOP chip-packaging structures |
| CN110137342A (en) * | 2019-05-07 | 2019-08-16 | 合肥久昌半导体有限公司 | A kind of high-power hall device lead frame, encapsulating structure and its packaging technology |
-
2015
- 2015-03-24 CN CN201520167624.2U patent/CN204558456U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107481990A (en) * | 2017-09-26 | 2017-12-15 | 深圳赛意法微电子有限公司 | Lead frame, semiconductor devices and its packaging technology |
| CN108269778A (en) * | 2018-01-09 | 2018-07-10 | 深圳电通纬创微电子股份有限公司 | A kind of biradical island SOP chip-packaging structures |
| CN110137342A (en) * | 2019-05-07 | 2019-08-16 | 合肥久昌半导体有限公司 | A kind of high-power hall device lead frame, encapsulating structure and its packaging technology |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |