CN206412353U - SMAFL type semiconductor lead frames - Google Patents
SMAFL type semiconductor lead frames Download PDFInfo
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- CN206412353U CN206412353U CN201620991951.4U CN201620991951U CN206412353U CN 206412353 U CN206412353 U CN 206412353U CN 201620991951 U CN201620991951 U CN 201620991951U CN 206412353 U CN206412353 U CN 206412353U
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- frame
- bottom sheet
- upper piece
- lower frame
- upper side
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Abstract
The utility model discloses a kind of SMAFL types semiconductor lead frame, formed by upper piece with the smooth fastening of bottom sheet；It is described upper piece and bottom sheet it is vertical by upper side frame and lower frame and with upper side frame and lower frame and be connected multiple frame units composition；Upper piece the upper side frame and lower frame are all uniformly distributed multiple circular locating openings, multiple oval positioning holes and multiple square holes；The upper side frame and lower frame of the bottom sheet are all uniformly distributed multiple circular locating openings, multiple oval positioning holes and multiple convex thorns；The positioning hole of upper piece the upper side frame and lower frame and oval positioning hole are corresponded with the upper side frame of bottom sheet and the positioning hole of lower frame and oval positioning hole respectively；Each block of band can make upper piece 66 pin to 55 totally 187, the pin of bottom sheet 86 is to 55 totally 187.The multiple rows of design of the utility model, it is high that chip bears density of texture, efficiency high during encapsulation, while upper piece and bottom sheet can do thin patch again.
Description
Technical field
The utility model is related to semiconductor die package field, specifically a kind of SMAFL types semiconductor lead frame.
Background technology
Current SMAFL type semiconductor lead frames are mainly used in hand assembled production, for the ease of hand assembled, product
Encapsulating lead is single design low production efficiency, and chip in lead frame small, the framework utilization rate that bears density of texture
It is low, expend material.Simultaneously upper piece and bottom sheet be difficult to make thin patch.
Utility model content
In view of the above-mentioned problems, main purpose of the present utility model is that providing one kind had both overcome the single design of lead frame,
Chip bears that density of texture is small, and efficiency is low during encapsulation, the problem of lost labor, while overcome piece and bottom sheet can not do thin again
The problem of type paster.
The utility model is to solve above-mentioned technical problem by following technical proposals：
A kind of SMAFL types semiconductor lead frame, by upper piece 66 and bottom sheet 86 it is smooth fastening form；It is described upper piece 66 and under
Piece 86 it is vertical by upper side frame 11 and lower frame 12 and with upper side frame 11 and lower frame 12 and be connected multiple framework lists
Member 58 is constituted；It is described upper piece 66 upper side frame 11 and lower frame 12 to be all uniformly distributed multiple circular locating openings 1, multiple ellipses fixed
Position hole 2 and multiple square holes 9；The upper side frame 11 and lower frame 12 of the bottom sheet 86 be all uniformly distributed multiple circular locating openings 1, multiple
Oval positioning hole 2 and multiple convex thorns 8；It is described upper piece 66 upper side frame 11 and lower frame 12 positioning hole 1 and ellipse position
Hole 2 is corresponded with the upper side frame 11 of bottom sheet 86 and the positioning hole 1 of lower frame 12 and oval positioning hole 2 respectively；It is described upper piece
66 upper side frame 11 and the square hole 9 of lower frame 12 are closely matched somebody with somebody one by one with the convex thorn 8 of the upper side frame 11 of bottom sheet 86 and lower frame 12 respectively
Close；The frame unit 58 includes company's muscle 10 of integrated connection upper side frame 11 and lower frame 12 and evenly distributed up and down and only
The even side of muscle 10 the multipair and even vertical pin of muscle 10 to 55, pin on 55 two pins 5 to all integrally connecting
Jie Yigeji islands 6；The pin of the adjacent frame unit 58 is to the 55 not homonymies for being located at even muscle 10, and the even adjacent framework of muscle 10
Unit 58 is connected with each other and close to its corresponding pin is in same level line respectively to the pin 5 above and below in the of 55
On, even the adjacent frame unit 58 of muscle 10 constitutes compound frame unit 88；It is described upper piece 66 compound frame unit 88 the left side
Base island 6 and the right base island 6 of the compound frame unit 88 of the bottom sheet 86 coordinate, the right side of upper piece the compound frame unit 88
Bian Ji islands 6 and the left side base island 6 of the compound frame unit 88 of the bottom sheet 86 coordinate；It is described upper piece 66 offer 28 framework lists
Member 58；The bottom sheet 86 offers 26 frame units 58；11 pins are equipped with the frame unit 58 to 55；On described
Piece 66 and the upper side frame of bottom sheet 86 11 and lower frame 12 uniformly offer opening 13, and opening 13 has been that punching press prevents the work of stirring
With.
Each block of band can make upper piece 66 pin to 55 totally 187, the pin of bottom sheet 86 to 55 totally 187, on
Piece 66 and bottom sheet 86 can encapsulate 374 chips, so save waste of material.
The width and height of the opening 13 are 1mm, 0.4mm respectively.
Hem 3 is provided between the pin 5 and base island 6, described tears edge open provided with anti-layering hole 4.
It is described upper piece 66 and the length and width of bottom sheet 86 be respectively 244.8 ± 0.1mm, 78.2 ± 0.05mm.
It is described upper piece 66 and bottom sheet 86 multiple circular locating openings 1 a diameter of 1.5 ± 0.025mm
The length and width on the base island 6 are 1.2mm.
Wide 1.4 ± 0.03mm of the pin 5.
The lower section on the base island 6 of the bottom sheet 86 is provided with boss 14.Position and use when boss 14 is for welding chip.
Positive effect of the present utility model is：Multiple rows of design, chip bears density of texture height, efficiency during encapsulation
Height, at the same upper piece and bottom sheet can do thin patch again.
Brief description of the drawings
Fig. 1 is the structure chart of bottom sheet 86 of the present utility model.
Fig. 2 is the structure chart of opening 13 of the present utility model.
Fig. 3 be it is of the present utility model upper piece 66 structure chart.
Fig. 4 is the structure chart of compound frame unit 88 of the present utility model.
Fig. 5 is office's enlarged drawing at C in Fig. 4.
Fig. 6 is Fig. 5 side view.
Reference：1 is circular locating openings, and 2 be oval positioning hole, 3 hems, 4 anti-layering holes, and 5 be pin,
8 be convex thorn, and 9 be square hole, and 10 be even muscle, and 11 be upper side frame, and 12 be lower frame, and 13 are open, 14 boss, and 55 be pin
Right, 58 be frame unit, and 88 be compound frame unit, 66 be upper piece, 86 be bottom sheet.
Embodiment
The utility model preferred embodiment is provided below in conjunction with the accompanying drawings, to describe the technical solution of the utility model in detail.
As shown in figures 1 to 6, a kind of SMAFL types semiconductor lead frame, by upper piece 66 and bottom sheet 86 it is smooth fastening form；Institute
State pieces 66 and bottom sheet 86 it is vertical by upper side frame 11 and lower frame 12 and with upper side frame 11 and lower frame 12 and be connected
Multiple frame units 58 constitute；It is described upper piece 66 upper side frame 11 and lower frame 12 be all uniformly distributed multiple circular locating openings 1,
Multiple oval positioning holes 2 and multiple square holes 9；The upper side frame 11 and lower frame 12 of the bottom sheet 86 are all uniformly distributed multiple circles
Positioning hole 1, multiple oval positioning holes 2 and multiple convex thorns 8；It is described upper piece 66 upper side frame 11 and the positioning hole 1 of lower frame 12
With oval positioning hole 2 respectively with the upper side frame 11 of bottom sheet 86 and the positioning hole 1 of lower frame 12 and a pair of oval positioning hole 2 one
Should；It is described upper piece 66 upper side frame 11 and lower frame 12 square hole 9 respectively with the upper side frame 11 of bottom sheet 86 and the convex thorn 8 of lower frame 12
It is fitted close one by one；The frame unit 58 includes integrated connection upper side frame 11 and company's muscle 10 of lower frame 12 and uniform up and down
Arrangement and only the even side of muscle 10 the multipair and vertical pin of company's muscle 10 to 55, pin to 55 two pins 5
On be all connected a Ge Ji islands 6；The pin of the adjacent frame unit 58 is to the 55 not homonymies for being located at even muscle 10, and even muscle 10
Adjacent frame unit 58 is connected with each other and close to its corresponding pin is in together respectively to the pin 5 above and below in the of 55
On one horizontal line, even the adjacent frame unit 58 of muscle 10 constitutes compound frame unit 88；It is described upper piece 66 compound frame list
First 88 left side base island 6 coordinates with the right base island 6 of the compound frame unit 88 of the bottom sheet 86, upper piece the compound frame
The right base island 6 of unit 88 coordinates with the left side base island 6 of the compound frame unit 88 of the bottom sheet 86；It is described upper piece 66 offer
28 frame units 58；The bottom sheet 86 offers 26 frame units 58；11 pins are equipped with the frame unit 58
To 55.Each block of band can make upper piece 66 pin to 55 totally 187, the pin of bottom sheet 86 to 55 totally 187, upper piece 66
374 chips can be encapsulated with bottom sheet 86, waste of material is so saved.
It is described upper piece 66 and the upper side frame 11 and lower frame 12 of bottom sheet 86 uniformly offer opening 13.The width of the opening 13
It is 1mm, 0.4mm respectively with height.Hem 3 is provided between the pin 5 and base island 6, described tears edge open provided with anti-layering
Hole 4.It is described upper piece 66 and the length and width of bottom sheet 86 be respectively 244.8 ± 0.1mm, 78.2 ± 0.05mm.It is described upper piece 66
Length and width with base island 6 described in a diameter of 1.5 ± 0.025mm of multiple circular locating openings 1 of bottom sheet 86 are 1.2mm.It is described
Wide 1.4 ± 0.03mm of pin 5.The lower section on the base island 6 of the bottom sheet 86 is provided with boss 14.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the utility model spirit and scope are not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within the range of claimed the utility model, the utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (3)
1. a kind of SMAFL types semiconductor lead frame, is formed by upper piece with the smooth fastening of bottom sheet；It is described upper piece and bottom sheet by upper
Frame and lower frame and multiple frame units composition that is vertical with upper side frame and lower frame and being connected；It is described upper piece it is upper
Frame and lower frame are all uniformly distributed multiple circular locating openings, multiple oval positioning holes and multiple square holes；The bottom sheet it is upper
Frame and lower frame are all uniformly distributed multiple circular locating openings, multiple oval positioning holes and multiple convex thorns；It is described upper piece it is upper
The positioning hole of frame and lower frame and oval positioning hole respectively with the upper side frame of bottom sheet and the positioning hole of lower frame and ellipse
Positioning hole is corresponded；The square hole of upper piece the upper side frame and lower frame respectively with bottom sheet upper side frame and the convex thorn one of lower frame
One is fitted close；The frame unit includes company's muscle of integrated connection upper side frame and lower frame and evenly distributed up and down and only
A base is all connected on the multipair pin pair vertical with the even muscle in the even side of muscle, two pins of pin pair
Island；The pin of the adjacent frame unit is pointed to the not homonymy of even muscle, and even the adjacent frame unit of muscle is connected with each other and tight
Pin above and below neighbour, its corresponding pin pair is on same level line respectively, even the adjacent frame unit of muscle
Constitute compound frame unit；The left side Ji Dao of upper piece the compound frame unit and the compound frame unit of the bottom sheet right side
Bian Ji islands coordinate, the right Ji Dao of upper piece the compound frame unit and the compound frame unit of the bottom sheet left side Ji Dao
Coordinate；It is characterized in that：
It is described upper piece offer 28 frame units；The bottom sheet offers 26 frame units；The frame unit
On be equipped with 11 pins pair, it is described upper piece and the upper side frame and lower frame of bottom sheet uniformly offer opening；The opening
Width and height be 1mm, 0.4mm respectively；Hem is provided between pin and the base island, described hem is provided with anti-layering
Hole；Wide 1.4 ± 0.03mm of the pin；
The length and width of the Ji Dao is 1.2mm；
The Ji Dao of bottom sheet lower section is provided with boss.
2. a kind of SMAFL types semiconductor lead frame as claimed in claim 1, it is characterised in that：It is described upper piece and bottom sheet
Length and width is respectively 244.8 ± 0.1mm, 78.2 ± 0.05mm.
3. a kind of SMAFL types semiconductor lead frame as claimed in claim 1, it is characterised in that：It is described upper piece and bottom sheet
A diameter of 1.5 ± 0.025mm of multiple circular locating openings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620991951.4U CN206412353U (en) | 2016-08-31 | 2016-08-31 | SMAFL type semiconductor lead frames |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620991951.4U CN206412353U (en) | 2016-08-31 | 2016-08-31 | SMAFL type semiconductor lead frames |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206412353U true CN206412353U (en) | 2017-08-15 |
Family
ID=59547994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620991951.4U Active CN206412353U (en) | 2016-08-31 | 2016-08-31 | SMAFL type semiconductor lead frames |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206412353U (en) |
-
2016
- 2016-08-31 CN CN201620991951.4U patent/CN206412353U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190524 Address after: 276100 High-tech Electronic Industry Park Area A, Tancheng County, Linyi City, Shandong Province Patentee after: Shandong Junyu Electronic Technology Co., Ltd. Address before: Room 499, No. 456 Liangxin Road, Laogang Town, Pudong New District, Shanghai, 200120 Patentee before: Shanghai Jun Yu Electronic Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |