CN211828730U

CN211828730U - Two-sided cavity ceramic package structure that digs based on WB chip

Info

Publication number: CN211828730U
Application number: CN202020913883.6U
Authority: CN
Inventors: 胡孝伟; 代文亮; 伊海伦
Original assignee: Shanghai Sinbo Electronic Technology Co ltd
Current assignee: Shanghai Sinbo Electronic Technology Co ltd
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2020-10-30
Anticipated expiration: 2030-05-27

Abstract

The utility model discloses a two-sided chamber ceramic package structure of digging based on WB chip, including ceramic substrate and WB chip, ceramic substrate both sides face inwards caves in respectively and forms on digging the chamber and dig the chamber down, and on dig the chamber and dig the intracavity down and all laminate and have the WB chip, and the side covers has the upper cover plate on the ceramic substrate, and the ceramic substrate downside covers there is lower apron, and the upper cover plate is through the welded layer fixed connection of felling the ring and ceramic substrate upward side, the welded layer fixed connection of lower apron and ceramic substrate downside. The cavity and the lower cavity are respectively arranged on the two side faces of the ceramic substrate, so that the space of the ceramic substrate is increased, and WB chips are arranged in the cavity and the lower cavity, so that the packaging space of the ceramic substrate is enlarged, the space utilization rate of ceramic packaging is improved, and the overall size of the ceramic packaging is reduced.

Description

Two-sided cavity ceramic package structure that digs based on WB chip

Technical Field

The utility model belongs to the technical field of the ceramic package of chip, be a two-sided chamber ceramic package structure that digs based on WB chip particularly.

Background

With the continuous development of semiconductor technology, more and more chip types are developed to meet different market demands, wherein WB chips are one of the mainstream chips used for packaging at present. However, the existing ceramic packaging structure of the WB chip has a problem that it is difficult to meet the requirement due to a small internal space.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved by the utility model

The utility model aims to solve current WB chip ceramic packaging structure because inner space is little, is difficult to the problem that satisfies the demand.

2. Technical scheme

In order to achieve the above purpose, the utility model provides a technical scheme does:

the utility model discloses a two-sided chamber ceramic package structure of digging based on WB chip, including ceramic substrate and WB chip, ceramic substrate both sides face inwards caves in respectively and forms on digging the chamber and dig the chamber down, on dig the chamber and dig the intracavity down and all laminate and have the WB chip, the ceramic substrate is gone up the side and is stamped the upper cover plate, the ceramic substrate downside covers there is lower apron, the upper cover plate is through the welded layer fixed connection of side on Kovar ring and the ceramic substrate, the welded layer fixed connection of apron and ceramic substrate downside down.

Preferably, the side edge of the upper cover plate is of a step shape.

Preferably, the number of the upper digging cavity is set to be at least one.

Preferably, the area of the upper cover plate is larger than that of the upper digging cavity, and the area of the lower cover plate is smaller than that of the lower digging cavity.

Preferably, the WB chip is connected with a gold wire and connected with a gold finger on the ceramic substrate.

Preferably, the side of the ceramic substrate is uniformly provided with a plurality of pins.

Preferably, the upper cover plate and the ceramic substrate are parallel to each other, and the center of the lower cover plate protrudes outwards relative to the lower digging cavity.

3. Advantageous effects

Adopt the technical scheme provided by the utility model, compare with prior art, have following beneficial effect:

Drawings

Fig. 1 is a schematic structural view of an upper side surface of a ceramic substrate according to the present invention;

FIG. 2 is a schematic view of the lower side of the ceramic substrate according to the present invention;

fig. 3 is a schematic view of the overall structure of the present invention.

The reference numerals in the schematic drawings illustrate:

1. a ceramic substrate; 2. welding the layers; 3. an upper cavity is dug; 4. WB chip; 5. gold thread; 6. a golden finger; 9. a kovar ring; 10. an upper cover plate; 11. a cavity is dug downwards; 12. a lower cover plate; 13. and (7) a pin.

Detailed Description

In order to facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and are not limited to the embodiments described herein, but which are provided so as to render the disclosure of the invention more thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present; the terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example 1

Referring to fig. 1-3, the two-sided chamber ceramic package structure of digging based on WB chip of this embodiment, including ceramic substrate 1 and WB

chip

4, 1 both sides face of ceramic substrate is inwards sunken to form respectively and is dug chamber 3 and dig chamber 11 down, on dig chamber 3 and dig down and all laminate WB chip 4 in the chamber 11, ceramic substrate 1 goes up the side cover and has

upper cover plate

10, 1 downside of ceramic substrate covers and has lower apron 12, upper cover plate 10 is through the welded layer 2 fixed connection of kovar ring 9 and ceramic substrate 1 upper side, apron 12 is 2 fixed connection with the welded layer of 1 downside of ceramic substrate down. This embodiment is through digging chamber 3 and digging chamber 11 down on 1 both sides face of ceramic substrate sets up respectively for ceramic substrate 1's space obtains the increase, and on dig chamber 3 and dig all be equipped with WB chip 4 in the chamber 11 down, make ceramic substrate 1's encapsulation space grow, improved ceramic package's space utilization and reduced ceramic package's overall dimension.

The upper cover plate 10 side of this embodiment is the notch cuttype, and the upper cover plate 10 at notch cuttype edge cooperatees with kovar ring 9, and the upper cover plate 10 of not only being convenient for and kovar ring 9's installation can also promote stability and fastness between upper cover plate 10 and the kovar ring 9.

The number of the upper cavities 3 of the present embodiment is set to at least one. The area of the upper cover plate 10 is larger than that of the upper digging cavity 3, and the area of the lower cover plate 12 is smaller than that of the lower digging cavity 11. The WB chip 4 is connected with gold wires 5 and gold fingers 6 on the ceramic substrate 1. A plurality of pins 13 are uniformly arranged on the side of the ceramic substrate 1. The upper cover plate 10 and the ceramic substrate 1 are parallel to each other, and the center of the lower cover plate 12 is convex outwards relative to the lower digging cavity 11

The above-mentioned embodiments only express a certain implementation manner of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention; therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a two-sided chamber ceramic package structure of digging based on WB chip which characterized in that: including ceramic substrate (1) and WB chip (4), ceramic substrate (1) both sides face inwards caves in respectively and forms and dig chamber (3) and dig chamber (11) down, on dig chamber (3) and dig chamber (11) down in all laminate WB chip (4), ceramic substrate (1) side cover has upper cover plate (10), ceramic substrate (1) downside covers and has lower apron (12), upper cover plate (10) are through can fell welding layer (2) fixed connection of side on ring (9) and ceramic substrate (1), apron (12) and welding layer (2) fixed connection of ceramic substrate (1) downside down.

2. The WB chip-based double-sided cavity-digging ceramic package structure of claim 1, wherein: the side edge of the upper cover plate (10) is of a step type.

3. The WB chip-based double-sided cavity-digging ceramic package structure of claim 1, wherein: the number of the upper digging cavities (3) is set to be at least one.

4. The WB chip-based double-sided cavity-digging ceramic package structure of claim 1, wherein: the area of the upper cover plate (10) is larger than that of the upper digging cavity (3), and the area of the lower cover plate (12) is smaller than that of the lower digging cavity (11).

5. The WB chip-based double-sided cavity-digging ceramic package structure of claim 1, wherein: the WB chip (4) is connected with a gold thread (5) and connected with a gold finger (6) on the ceramic substrate (1).

6. The WB chip-based double-sided cavity-digging ceramic package structure of claim 1, wherein: the side of the ceramic substrate (1) is uniformly provided with a plurality of pins (13).

7. The WB chip-based double-sided cavity-digging ceramic package structure of claim 1, wherein: the upper cover plate (10) is parallel to the ceramic substrate (1), and the center of the lower cover plate (12) protrudes outwards relative to the lower digging cavity (11).