CN212695175U

CN212695175U - Structure for improving air tightness of LED packaging product

Info

Publication number: CN212695175U
Application number: CN202021304635.8U
Authority: CN
Inventors: 龚文; 黄见
Original assignee: Suzhou Kinglight Optoelectronics Co ltd
Current assignee: Suzhou Kinglight Optoelectronics Co ltd
Priority date: 2020-07-06
Filing date: 2020-07-06
Publication date: 2021-03-12
Anticipated expiration: 2030-07-06

Abstract

The utility model relates to a LED device encapsulates the field, especially relates to a promote structure of LED encapsulation product gas tightness, contain the base plate main part that a plurality of chips are constituteed, the front of chip is equipped with the functional area, the back is equipped with a plurality of pin pads, the edge of two adjacent chips is connected with the sieve mesh jointly, the pin pad is connected with the sieve mesh, be connected with between two adjacent chips and electroplate the wire, it is used for linking the cladding material of functional area and pin pad to electroplate the wire on being located the pin pad connecting wire of the different sieve meshes of two adjacent chips. The utility model discloses a to the position design of electroplating the wire, can satisfy the positive and negative electroplating requirement, avoid steam to send out light zone from positive access channel direct contact chip to realize promoting the gas tightness of encapsulation product.

Description

Structure for improving air tightness of LED packaging product

Technical Field

The utility model relates to a LED device encapsulation field especially relates to a promote structure of LED encapsulation product gas tightness.

Background

In recent years, the CHIP LED failure caused by the entry of water vapor accounts for a high proportion, and meanwhile, the problem exists in the whole LED packaging industry, the plating lead in the current packaging product exists at the edge of the front functional area of the substrate, and in order to improve the air tightness, the plating lead needs to be polished and removed, so that the operation is complex, and the efficiency is low. For example, in the LED substrate, the LED chip, the manufacturing method thereof, the LED lamp source and the display device disclosed in patent CN109755372A, the plating lead is polished and removed by setting the precut region on the substrate, which is relatively complicated in operation and low in efficiency. There is a need for a method for solving the problem of air tightness of LED package products with simple and efficient operation.

SUMMERY OF THE UTILITY MODEL

The utility model provides a promote structure of LED encapsulation product gas tightness, the utility model discloses a to the position design of electroplating the wire, can satisfy the positive and negative electroplating requirement, avoid steam to send out light zone from positive access channel direct contact chip to realize promoting the gas tightness of encapsulation product.

The technical scheme of the utility model is that:

the utility model provides a promote structure of LED encapsulation product gas tightness, contains the base plate main part that a plurality of chips are constituteed, and the front of chip is equipped with the functional area, and the back is equipped with a plurality of pin pads, and the edge of two adjacent chips is connected with the sieve mesh jointly, and the pin pad is connected with the sieve mesh, is connected with between two adjacent chips and electroplates the wire, electroplates the cladding material that the wire is used for linking functional area and pin pad on being located the pin pad connecting wire of the different sieve meshes of two adjacent chips.

Further, the base material of the substrate body is BT resin.

Further, covering copper foils on the front side and the back side of the BT resin, drilling holes on the surfaces of the BT resin, conducting the front side and the back side through an electroplating copper mode, and then etching the copper foils to form a functional area, a pin bonding pad and an electroplating lead.

Further, the plating lead is convex.

Further, the width of the plated wire was 0.06 mm.

Furthermore, the functional area is provided with a die bonding pad.

Further, three die bond pads are provided.

Furthermore, the three die bond pads are arranged in a straight line.

Furthermore, the three die bond pads are communicated with each other into a whole.

Furthermore, the three die bond pads are respectively used for fixing the red light chip, the green light chip and the blue light chip.

The utility model has the advantages that:

the utility model discloses the design position of electroplating the wire is located the pin pad connecting wire of the different sieve meshes of two adjacent chips, can electroplate completely like this and accomplish positive functional area and do not walk the line, increases colloid and BT resin bonding force, avoids steam to send out the light zone from positive access channel direct contact chip to need not to polish to electroplating the wire and get rid of, thereby reach structural design reasonable, novel, the preparation is efficient, has promoted the competitiveness of product.

Drawings

FIG. 1 is a schematic front design view of a substrate body;

FIG. 2 is a schematic view of a backside design of a substrate body;

in the figure: 1. a substrate main body; 2. a functional region; 3. screening holes; 4. a pin pad; 5. and electroplating the lead.

Detailed Description

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.

Example 1:

as shown in figure 1 and figure 2, a structure for improving the air tightness of an LED packaging product comprises a substrate main body consisting of a plurality of chips, wherein the front surface of each chip is provided with a functional area, the back surface of each chip is provided with a plurality of pin bonding pads, the corners of two adjacent chips are jointly connected with sieve pores, the pin bonding pads are connected with the sieve pores, an electroplating wire is connected between the two adjacent chips, and the electroplating wire is positioned on a pin bonding pad connecting line of the two adjacent chips with different sieve pores and is used for connecting the functional area with a plating layer of the pin bonding pad.

In this embodiment, the substrate of the substrate body is BT resin, copper foils are coated on the front and back surfaces of the BT resin, holes are drilled on the surface of the BT resin, the front and back surfaces are conducted through an electroplating copper method, and then the functional region, the pin pad and the electroplating lead are formed on the copper foils through etching.

In this embodiment, the plating line is convex, and the width of the plating line is 0.06 mm.

In this embodiment, the functional region is provided with three die bond pads, the three die bond pads are linearly arranged and are mutually communicated into a whole, and the three die bond pads are respectively used for fixing the red light chip, the green light chip and the blue light chip.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A structure for improving the air tightness of an LED packaging product is characterized by comprising a substrate main body consisting of a plurality of chips, wherein the front surfaces of the chips are provided with a functional area, the back surfaces of the chips are provided with a plurality of pin bonding pads, the corners of two adjacent chips are commonly connected with sieve pores, the pin bonding pads are connected with the sieve pores, an electroplating lead is connected between the two adjacent chips and is positioned on a pin bonding pad connecting line of different sieve pores of the two adjacent chips and used for connecting the functional area with a plating layer of the pin bonding pad;

the functional area is provided with three die bond pads, the three die bond pads are linearly arranged and are communicated with each other to form a whole, and the three die bond pads are respectively used for fixing a red light chip, a green light chip and a blue light chip.

2. The structure of claim 1, wherein the base material of the substrate body is BT resin.

3. The structure of claim 2, wherein copper foils are coated on the front and back sides of the BT resin, holes are drilled on the surface of the BT resin, the front and back sides are connected by means of electro-coppering, and then the functional regions, the pin pads and the electro-plated wires are formed on the copper foils by etching.

4. The structure of claim 1, wherein the plated conductive wires are raised.

5. The structure for improving the air tightness of the LED packaging product as claimed in claim 1, wherein the width of the plated wire is 0.06 mm.