CN211879379U - Lead frame structure capable of preventing glue overflow - Google Patents
Lead frame structure capable of preventing glue overflow Download PDFInfo
- Publication number
- CN211879379U CN211879379U CN202020867293.4U CN202020867293U CN211879379U CN 211879379 U CN211879379 U CN 211879379U CN 202020867293 U CN202020867293 U CN 202020867293U CN 211879379 U CN211879379 U CN 211879379U
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- CN
- China
- Prior art keywords
- lead frame
- frame structure
- glue overflow
- groove
- chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a lead frame structure that anti-overflow was glued belongs to system level packaging SiP technical field. The chip packaging structure comprises a lead frame, wherein a plurality of chips are attached to the lead frame, and grooves are formed in the region between the adjacent chips of the lead frame. Through the region between adjacent chips is equipped with the recess, can be so that the chip when filling the binder, unnecessary binder can flow to the recess in, can carry out effectual control to the excessive gluey scope, effectively reduced because the condition of delaminating appears in the encapsulation back product that excessive gluey brought.
Description
Technical Field
The utility model belongs to the technical field of system in package SiP, be a lead frame structure that anti-overflow was glued particularly.
Background
As is well known, most of the semiconductor integrated blocks require lead frames, which are important basic materials in the electronic information industry. However, with the continuous development of the semiconductor industry, the packaging technology is continuously improved, the multi-chip package is widely applied, and the problems of the conventional lead frame package are more and more. Such as insufficient area for placement, difficult control of flash areas, delamination of the packaged product, etc. The invention mainly aims at solving the problem that the glue overflow range is difficult to control when a lead frame is used for multi-chip packaging, and provides a lead frame appearance design which not only can effectively control the glue overflow condition, but also can help layering to a certain extent.
SUMMERY OF THE UTILITY MODEL
1. Technical problem to be solved by the utility model
The utility model aims to solve the problem that the excessive glue range is difficult to control when carrying out multi-chip package of the current lead frame.
2. Technical scheme
In order to achieve the above purpose, the utility model provides a technical scheme does:
the utility model discloses a lead frame structure that anti-overflow was glued, including the lead frame, the lead frame facing is equipped with a plurality of chip, the region of lead frame between adjacent chip is equipped with the recess.
Preferably, the width of the groove is 0.22-0.28 mm, and the depth of the groove is 0.08-0.12 mm.
Preferably, the ratio of the depth of the groove to the thickness of the lead frame is 1: 1.6-1: 2.4.
preferably, the length of the groove is greater than the width of the adjacent chip.
Preferably, the lead frame is provided with a base island and a coating, the coating covers the corresponding routing areas of the base island and the pins, and the groove is formed in the base island.
Preferably, the edge of the lead frame is provided with a pin which is conducted with the chip.
Preferably, a bonding agent is filled between the plurality of chips and the base island, and the bonding agent is silver glue.
3. Advantageous effects
Adopt the technical scheme provided by the utility model, compare with prior art, have following beneficial effect:
the utility model discloses a lead frame structure that anti-overflow was glued, including the lead frame, the lead frame facing is equipped with a plurality of chip, and the region of lead frame between adjacent chip is equipped with the recess. Through the region between adjacent chips is equipped with the recess, can be so that the chip when filling the binder, unnecessary binder can flow to the recess in, can carry out effectual control to the excessive gluey scope, effectively reduced because the condition of delaminating appears in the encapsulation back product that excessive gluey brought.
Drawings
Fig. 1 is a schematic structural view of a lead frame structure for preventing glue overflow according to the present invention;
fig. 2 is a side view of the lead frame structure for preventing glue overflow of the present invention.
The reference numerals in the schematic drawings illustrate:
100. a lead frame; 110. a groove; 120. a base island; 130. a pin; 140. plating; 150. a chip; 160. and (3) a binder.
Detailed Description
In order to facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and are not limited to the embodiments described herein, but which are provided so as to render the disclosure of the invention more thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present; the terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example 1
Referring to fig. 1-2, the lead frame structure for preventing glue overflow of the present embodiment includes a lead frame 100, a plurality of chips 150 are attached to the lead frame 100, and a groove 110 is formed in an area between adjacent chips 150 of the lead frame 100. Through the groove 110 arranged in the region between the adjacent chips 150, when the chip 150 is filled with the bonding agent 160, the excessive bonding agent 160 flows into the groove 110, the glue overflow range can be effectively controlled, and the delamination of the packaged product caused by glue overflow is effectively reduced.
The width of the groove 110 of the embodiment is 0.22-0.28 mm, and the depth of the groove 110 is 0.08-0.12 mm. The ratio of the depth of the groove 110 to the thickness of the lead frame 100 is 1: 1.6-1: 2.4. when the width and length of the groove 110 are too large, the stability of the overall structure of the lead frame 100 may be reduced, and when the width and length of the groove 110 are too small, the adhesive 160 that may be accommodated in the groove 110 may be less, which may make it difficult to effectively control the glue overflow range.
The length of the groove 110 is greater than the width of the adjacent chip 150, so that the glue overflow range can be effectively controlled, and the problem of overlarge glue overflow range caused by the fact that the length of the groove 110 is less than the width of the chip 150 is prevented.
The lead frame 100 of the embodiment is provided with a base island 120 and a plating layer 140, the plating layer 140 covers the base island 120 and the corresponding bonding area of the lead 130, and the groove 110 is disposed on the base island 120. The lead frame 100 has a lead 130 at an edge thereof to be electrically connected to the chip 150. Adhesive 160 is filled between the chips 150 and the base islands 120, and the adhesive 160 is silver paste.
The above-mentioned embodiments only express a certain implementation manner of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention; therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (7)
1. The utility model provides a lead frame structure of anti-overflow is glued, includes lead frame (100), its characterized in that: a plurality of chips (150) are attached to the lead frame (100), and grooves (110) are formed in the regions, between the adjacent chips (150), of the lead frame (100).
2. The lead frame structure of preventing glue overflow of claim 1, characterized in that: the width of the groove (110) is 0.22-0.28 mm, and the depth of the groove (110) is 0.08-0.12 mm.
3. The lead frame structure of preventing glue overflow of claim 1, characterized in that: the ratio of the depth of the groove (110) to the thickness of the lead frame (100) is 1: 1.6-1: 2.4.
4. the lead frame structure of preventing glue overflow of claim 1, characterized in that: the length of the groove (110) is larger than the width of the adjacent chip (150).
5. The lead frame structure of preventing glue overflow of claim 1, characterized in that: the lead frame (100) is provided with a base island (120) and a plating layer (140), the plating layer (140) covers the corresponding routing areas of the base island (120) and the pins (130), and the grooves (110) are formed in the base island (120).
6. The glue overflow prevention lead frame structure according to claim 5, characterized in that: and a pin (130) is arranged at the edge of the lead frame (100) and is communicated with the chip (150).
7. The glue overflow prevention lead frame structure according to claim 5, characterized in that: and an adhesive (160) is filled between the chips (150) and the base islands (120), and the adhesive (160) is silver glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020867293.4U CN211879379U (en) | 2020-05-22 | 2020-05-22 | Lead frame structure capable of preventing glue overflow |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020867293.4U CN211879379U (en) | 2020-05-22 | 2020-05-22 | Lead frame structure capable of preventing glue overflow |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211879379U true CN211879379U (en) | 2020-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020867293.4U Active CN211879379U (en) | 2020-05-22 | 2020-05-22 | Lead frame structure capable of preventing glue overflow |
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| Country | Link |
|---|---|
| CN (1) | CN211879379U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114050149A (en) * | 2022-01-12 | 2022-02-15 | 深圳中科四合科技有限公司 | ESD packaging structure with variable performance parameters and packaging method thereof |
-
2020
- 2020-05-22 CN CN202020867293.4U patent/CN211879379U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114050149A (en) * | 2022-01-12 | 2022-02-15 | 深圳中科四合科技有限公司 | ESD packaging structure with variable performance parameters and packaging method thereof |
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