CN115084074A - IC packaging lead frame structure and chip bonding method thereof - Google Patents

IC packaging lead frame structure and chip bonding method thereof Download PDF

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Publication number
CN115084074A
CN115084074A CN202210811799.7A CN202210811799A CN115084074A CN 115084074 A CN115084074 A CN 115084074A CN 202210811799 A CN202210811799 A CN 202210811799A CN 115084074 A CN115084074 A CN 115084074A
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China
Prior art keywords
base island
chip
glue
frame structure
base
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CN202210811799.7A
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Chinese (zh)
Inventor
张进兵
邓旭东
崔卫兵
孙亚丽
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Tianshui Huatian Technology Co Ltd
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Tianshui Huatian Technology Co Ltd
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Priority to CN202210811799.7A priority Critical patent/CN115084074A/en
Publication of CN115084074A publication Critical patent/CN115084074A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

The invention discloses an IC packaging lead frame structure and a chip bonding method thereof, relating to the technical field of semiconductor device packaging. The method is used for solving the problem of delamination of the bottom of the chip and the base island of the existing IC package caused by the fact that a large chip must use a larger base island to be fixed by using a piece of adhesive tape or must use a DAF film to be fixed. The lead frame structure includes: a base island for setting a chip; and the glue overflowing step is arranged at the edge of the base island facing to the direction of arranging the chip and is used for arranging the bonding glue overflowing from the chip and the base island.

Description

IC packaging lead frame structure and chip bonding method thereof
Technical Field
The invention relates to the technical field of semiconductor device packaging, in particular to an IC packaging lead frame structure and a chip bonding method thereof.
Background
In the integrated circuit package product, traditional package product, most lead frame base island designs for single base island bears the structure that single chip or a plurality of base islands bore a plurality of chips, and the lead frame base island that needs to bear when chip size is great also increases along with it, great chip area will appear the cavity when using bonding pad glue or DAF membrane technology bonding pad in great chip area and great base island area this moment, the bubble, the steam parcel can't discharge between chip and frame base island, the heat that the chip produced can further aggravate the cavity when integrated circuit work, the bubble, the expansion of steam and the delaminating of chip bottom and glue film and frame, the popcorn phenomenon appears even when serious, will cause the product to become invalid.
Larger chip area and larger area of the load-bearing base island require more chip-bonding glue (silver paste) to realize firm chip bonding, and the silver paste is used as one of main materials for packaging the integrated circuit, so that the packaging cost is increased. The traditional chip bonding process is to bond a chip on a frame base island with a larger area than the chip by silver paste, so that the chip edge has enough space for glue overflow to the base island edge to prevent the silver paste from overflowing to the back of the frame to cause contamination and reduce the reliability of the product.
In summary, the conventional IC package has a problem of delamination between the bottom of the chip and the base island due to the fact that the large chip must be fixed by using a larger base island or must be fixed by using a DAF film.
Disclosure of Invention
The embodiment of the invention provides an IC packaging lead frame structure and a chip bonding method thereof, which are used for solving the problem of delamination between the bottom of a chip and a base island caused by the fact that a large chip needs to be fixed by using a larger base island or a DAF film in the conventional IC packaging.
The embodiment of the invention provides an IC packaging lead frame structure, which comprises:
a base island for setting a chip;
and the glue overflowing step is arranged at the edge of the base island facing to the direction of arranging the chip and is used for arranging the bonding glue overflowing from the chip and the base island.
Preferably, the glue-pouring device further comprises a frame structure unit and a glue-overflowing groove;
the frame structure unit is used for arranging the base island;
the glue overflow groove is positioned between the base island and the frame structure unit and is used for arranging the adhesive sheet glue overflowing from the position between the chip and the base island.
Preferably, the base islands comprise a first base island and a second base island;
the first base island and the second base island are symmetrically arranged, and the chips are respectively arranged on the first base island and the second base island;
the edge of the first base island facing the direction of the second base island is provided with the glue overflowing step, and the edge of the second base island facing the direction of the first base island is provided with the glue overflowing step.
Preferably, the base islands include a first base island, a second base island, a third base island and a fourth base island;
the first base island, the second base island, the third base island and the fourth base island are diagonally arranged on the frame structure unit, and the chips are respectively arranged on the first base island, the second base island, the third base island and the fourth base island;
the edge of the first base island, the edge of the second base island, the edge of the third base island and the edge of the fourth base island facing to the direction of the chip are respectively provided with the glue overflowing steps;
the glue overflow groove is arranged between the first base island and the frame structure unit; the glue overflow groove is arranged between the second base island and the frame structure unit; the glue overflow groove is arranged between the third base island and the frame structure unit; and the glue overflow groove is arranged between the fourth base island and the frame structure unit.
Preferably, the base island is a hollow base island;
the hollowed-out base island is composed of a frame, a hollowed-out area and four base island connecting ribs, the four base island connecting ribs are arranged diagonally and are respectively connected with the frame, and the hollowed-out area is triangular and is positioned between the base island connecting ribs and the frame;
glue overflow steps are arranged at the edge of the inner side of the frame, and glue overflow steps are arranged at the edges of the two sides of the base island connecting rib;
the glue overflow groove is arranged between the outer side of the frame and the frame structure unit.
Preferably, the glue overflow groove comprises a U-shaped groove or a V-shaped groove.
Preferably, the glue overflowing step is formed by pressing a stamping die; or by chemical etching;
the height of the glue overflowing step is equal to half of the thickness of the frame;
the length of the glue overflowing step is greater than the edge length of the chip;
the width of the glue overflowing step is determined according to the diffusivity of the adhesive sheet glue.
The embodiment of the invention provides a sheet sticking method, which comprises the following steps:
arranging a piece sticking glue on a base island, wherein the base island is as described in the embodiment;
and arranging a chip on the base island by a chip bonding machine, and enabling the chip bonding glue arranged between the base island and the chip to flow to the glue overflowing step from the position between the base island and the chip under the action of the chip bonding machine.
Preferably, the step of flowing the die bonding adhesive disposed between the base island and the chip from between the base island and the chip to the flash step further comprises:
under the action of the die bonder, the die bonder adhesive arranged between the base island and the chip flows to an adhesive overflow groove from the position between the base island and the chip, and the adhesive overflow groove is positioned between the base island and the frame structure unit.
Preferably, a piece-sticking glue is arranged on the base island through a glue dispensing process; or
Arranging a piece-sticking adhesive on the base island by an adhesive spraying process
The embodiment of the invention provides an IC packaging lead frame structure and a chip bonding method thereof, wherein the lead frame structure comprises: a base island for setting a chip; and the glue overflowing step is arranged at the edge of the base island facing to the direction of arranging the chip and is used for arranging the bonding glue overflowing from the chip and the base island. It is through setting up the excessive gluey step at the base island edge, and it has increased the space at base island edge for the adhesive sheet that overflows from between base island and the chip glues and flows to the excessive gluey step, thereby can avoid the adhesive sheet to cause the viscidity to base island edge and base island back, influence the problem of the reliability of product (integrated circuit device) even. The lead frame structure for the IC package can solve the problems of product quality reduction and reliability reduction of the existing IC package caused by the fact that the bonding glue easily overflows from the edges of the chip and the base island and flows to the edges of the base island and even the back of the base island.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of a lead frame structure of a first IC package according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the lead frame structure of FIG. 1 after mounting a chip thereon according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of the structure of FIG. 2 according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a lead frame structure of an IC package with V-shaped grooves according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a lead frame structure of an IC package with a U-shaped slot according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of the leadframe structure of FIG. 5 after die attachment according to an embodiment of the invention;
FIG. 7 is a schematic diagram of a third IC package lead frame structure according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of the leadframe structure of FIG. 7 after die attachment according to an embodiment of the invention;
wherein, the number of the base islands is 110-first base island, 120-second base island, 130-glue overflow step, 140-chip, 150-glue overflow groove, 160-adhesive sheet glue, 170-third base island, 180-fourth base island, 190-frame, 200-hollow area, 210-base island connecting rib.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic diagram of a lead frame structure of a first IC package according to an embodiment of the present invention; FIG. 2 is a schematic diagram of the lead frame structure of FIG. 1 after mounting a chip thereon according to an embodiment of the present invention; FIG. 3 is a schematic cross-sectional view of the structure of FIG. 2 according to an embodiment of the present invention; FIG. 4 is a schematic diagram of a lead frame structure of an IC package with V-shaped grooves according to an embodiment of the present invention; FIG. 5 is a schematic diagram of a lead frame structure of an IC package with a U-shaped slot according to an embodiment of the present invention; FIG. 6 is a schematic diagram of the leadframe structure of FIG. 5 after die attachment according to an embodiment of the invention; FIG. 7 is a schematic diagram of a third IC package lead frame structure according to an embodiment of the present invention; FIG. 8 is a schematic diagram of the leadframe structure of FIG. 7 after die attachment according to an embodiment of the invention; the following describes in detail the lead frame structure of the IC package according to the embodiment of the present invention with reference to fig. 1 to 7 as an example.
The IC packaging lead frame structure provided by the embodiment of the invention comprises a base island and an overflow glue step. Specifically, the base island is used for arranging the chip, and the glue overflowing step is arranged on the base island. In practical application, set up the chip on the base island, need use the bonding die glue to bond fixedly between base island and the chip, in order to avoid the bonding die glue to overflow from between base island and the chip and flow to the back of base island edge and base island, preferentially, overflow and glue the step setting and set up the edge of chip direction at the base island orientation, through the aforesaid setting, can increase the space at base island edge, make the bonding die who comes from the overflow between base island and the chip flow to overflowing and glue the step on, thereby can avoid the bonding die glue to cause the viscidity to base island edge and base island back, influence the problem of lead frame reliability even.
In the embodiment of the invention, the base islands are used for arranging the chips, the number of the base islands can be determined according to the size of the chips and the actual application scene, and meanwhile, the positions of the glue overflow steps arranged on the base islands can also be determined according to the specific combination mode of the chips and the base islands.
Illustratively, as shown in fig. 1, 2 and 3, this embodiment provides a first IC package lead frame structure including a first base island 110, a second base island 120, an overfill step 130 and a chip 140. The first base island 110 and the second base island 120 are disposed opposite to each other, and the two opposite edges of the first base island 110 and the second base island 120 are respectively provided with an overflow step 130. Since the first base island 110 and the second base island 120 are used to dispose one chip 140 at the same time, the first base island 110 is disposed toward the chip 140, that is, toward the second base island 120, and accordingly, the second base island 120 is disposed toward the chip 140, that is, toward the first base island 110. That is, the first base island 110 is provided with the flash step 130 toward the second base island 120, and the second base island 120 is also provided with the flash step 130 toward the first base island 110.
It should be noted that, as shown in fig. 1, the specific shapes of the first base island 110 and the second base island 120 may not be the same, the glue overflow step 130 disposed on the first base island 110 is only located on the edge of one side of the first base island 110, and the glue overflow step 130 disposed on the second base island 120 is located on the edge of three sides of the second base island 120. In the embodiment of the present invention, the specific position of the glue overflow step 130 on the base island is not limited.
In practical applications, the IC package lead frame includes a plurality of frame structure units, and therefore, the first IC package lead frame structure may be referred to as a first frame structure unit. When a plurality of frame structure units are arranged in rows, they may constitute a single-row frame; when a plurality of frame structure units are arranged in rows and columns, they may constitute a multi-row matrix type lead frame.
As shown in fig. 2 and 3, after the chip 140 is disposed on the first base island 110 and the second base island 120, the adhesive sheet 160 disposed between the chip 140 and the first base island 110 or the second base island 120 may flow out from four sides of the chip 140 contacting with the first base island 110 or the second base island 120, and a part of the adhesive sheet 160 flows on the upper surface of the base island, and another part flows on the overflow step 130.
It should be noted that, in practical applications, the length of the glue overflowing step is greater than the width of the chip disposed on the base island.
The IC packaging lead frame structure provided by the embodiment adopts the two base islands to arrange the chip, namely most area of the bottom of the chip is not contacted with the base islands, so that a bonding pad glue layer arranged between the chip and the base islands is reduced, and the production cost is reduced; moreover, a large chip is arranged by adopting a small base island, and most of the area of the bottom of the chip is free from a frame metal entity; the problem that when a chip with a large area is arranged on a base island with a large area, cavities and bubbles caused by sticking of a piece adhesive or bubbles and water vapor wrapped between the chip and the base island cannot be discharged due to a DAF film is solved; further, the problem of delamination between the bottom of the chip and the base island is avoided, so that the product quality and reliability are improved.
The lead frame structure for IC package provided by the embodiment of the invention can also comprise a frame structure unit and an adhesive overflow groove. Specifically, the frame structure unit is used for setting a base island; the glue overflowing groove is positioned between the base island and the frame structure unit, in other words, the glue overflowing groove is positioned in the peripheral direction of the base island towards the chip and is close to the edge of the base island, and the glue overflowing groove is also used for arranging the adhesive sheet glue at the overflow position between the chip and the base island as well as the glue overflowing step.
Illustratively, as shown in fig. 4, 5 and 6, this embodiment provides a second IC package lead frame structure, mainly comprising a first base island 110, a second base island 120, a third base island 170, a fourth base island 180, an overflow step 130, an overflow trough 150 and a chip 140. The first base island 110, the second base island 120, the third base island 170 and the fourth base island 180 are diagonally arranged, and the first base island 110, the second base island 120, the third base island 170 and the fourth base island 180 are all arranged on the frame structure unit.
Because the first base island 110, the second base island 120, the third base island 170 and the fourth base island 180 are used for disposing one chip 140 at the same time, the first base island 110 sets the glue overflowing steps 130 towards the two edges of the chip 140, that is, towards the diagonal direction, the second base island 120 sets the glue overflowing steps 130 towards the two edges of the chip 140, that is, towards the diagonal direction, the third base island 170 sets the glue overflowing steps 130 towards the two edges of the chip 140, that is, towards the diagonal direction, and the fourth base island 180 sets the glue overflowing steps 130 towards the two edges of the chip 140.
Further, glue overflow grooves 150 are arranged in the direction in which the first base island 110 is far away from the center of the chip 140, that is, at two near edges between the first base island 110 and the frame structure unit; glue overflow grooves 150 are arranged in the direction of the second base island 120 away from the center of the chip 140, namely at two adjacent edges between the second base island 120 and the frame structure unit; the glue overflow grooves 150 are arranged in the direction of the third base island 170 far away from the center of the chip 140, namely, at two near edges between the third base island 170 and the frame structure unit; the glue overflow groove 150 is disposed in a direction in which the fourth base island 180 is far from the center of the chip 140, that is, at two near edges between the fourth base island 180 and the frame structure unit.
It should be noted that, in practical applications, the glue overflow groove may include a U-shaped groove or a V-shaped groove, which is different from the preparation method. For example, the glue overflow groove 150 shown in fig. 4 is a V-shaped groove, and the glue overflow groove 150 shown in fig. 5 is a U-shaped groove.
In the embodiment of the present invention, the specific type of the glue overflow groove disposed between the base island and the frame structure unit is not limited.
The IC packaging lead frame structure provided by the embodiment adopts the plurality of small base islands to arrange a single large chip, so that most area of the bottom of the large chip is not provided with the bonding glue, and the production cost can be reduced; moreover, a large chip is arranged by adopting the small base island, and most of the area of the bottom of the chip is free from a frame metal entity; the problem that when a chip with a large area is arranged on a base island with a large area, cavities and bubbles caused by sticking glue or bubbles and water vapor wrapped between the chip and the base island are not discharged because of a DAF film is solved; further, the problem of delamination between the bottom of the chip and the base island is avoided, so that the product quality and reliability are improved.
In the lead frame structure for IC package provided by the embodiment of the invention, the base island can also be a hollow base island, and the hollow base island is composed of a frame, a hollow area and four base island connecting ribs. Illustratively, this embodiment provides a third IC package leadframe structure, as shown in fig. 7 and 8. The four base island connecting ribs 210 are arranged diagonally, that is, one end of each base island connecting rib 210 is connected with the frame 190, and the other end of each base island connecting rib 210 is connected with the other ends of the other three base island connecting ribs 210 at the central positions of the hollow base islands; the hollowed-out base island comprises four hollowed-out areas 200, the four hollowed-out areas 200 are consistent in shape and are triangular, and the four hollowed-out areas 200 are located between the base island connecting ribs 210 and the frame 190.
In practical application, the hollow base island is used for arranging the chip 140, that is, the frame 190 and the base island connecting rib 210 are respectively contacted with the chip 140, so that the edge of the inner side of the frame 190 is provided with the glue overflow step 130, and the edges of the two sides of the base island connecting rib 210 are also provided with the glue overflow step 130. Because the hollow base island is arranged on the frame structure unit, the outer side of the frame 190 near the edge is provided with the glue overflow groove 150.
According to the IC packaging lead frame structure provided by the embodiment, the single large chip is arranged by adopting the single large base island hollow structure, and the adhesive sheet glue is not arranged on most area of the bottom of the large chip, so that the production cost can be reduced; moreover, the hollow base island is adopted to arrange the chip, and most area of the bottom of the chip is free of a frame metal entity; the problem that when a chip with a large area is arranged on a base island with a large area, cavities and bubbles caused by sticking of a piece adhesive or bubbles and water vapor wrapped between the chip and the base island cannot be discharged due to a DAF film is solved; further, the problem of delamination between the bottom of the chip and the base island is avoided, so that the product quality and reliability are improved.
In the embodiment of the invention, the glue overflowing step is formed by pressing a stamping die; or by chemical etching; in order to set the maximum range of the overflowing adhesive sheet glue and effectively fill the plastic powder particles into the overflowing adhesive step after the adhesive sheet glue and the chip are set during the integrated circuit packaging, preferably, the height of the overflowing adhesive step is equal to half of the thickness of the frame; the length of the glue overflowing step is greater than the edge length of the set chip; the width of the glue overflowing step is determined according to the diffusion degree of the adhesive sheet glue.
The embodiment of the invention also provides a chip bonding method based on the IC packaging lead frame structure, which specifically comprises the following steps:
step 101, arranging a piece of adhesive on a base island, wherein the shape and the structure of the base island can be determined according to the base island included in the lead frame structure of the IC package provided by the embodiment;
and 102, arranging a chip on the base island by a bonding machine, and enabling bonding glue arranged between the base island and the chip to flow to a glue overflowing step from the position between the base island and the chip under the action of the bonding machine.
In the above embodiment, three kinds of frame structures are included in total, and the base island corresponding to each kind of frame structure has a different structural form, and based on this, when the die bonding method is described, the above three kinds of frame structures are described, respectively.
A first frame structure, as shown in fig. 1, 2 and 3:
in step 101, when the base island includes a first base island and a second base island, a multi-row matrix frame is formed by a plurality of frame structure units, and firstly, a tape-bonding adhesive is respectively disposed on the first base island and the second base island on the plurality of frame structure units through a tape-bonding process of a tape-bonding machine.
It should be noted that the painting process of the die bonder can be a dispensing process or a glue spraying process.
In step 102, a multi-row matrix frame which is composed of a plurality of frame structure units and provided with bonding glue is conveyed to a bonding position in a track of a bonding machine, two ends of a plurality of chips are respectively bonded on a first base island and a second base island of the plurality of frame structure units, the bonding glue at the edge opposite positions of the first base island and the second base island is extruded from the edge surface of the base island, which is contacted with the chips, under the action of the bonding force of the bonding machine, overflows to the side surface of a glue overflowing step, which is close to the surface of the inner base island, and overflows to the step surface of the glue overflowing step.
It should be noted that, in the embodiment of the present invention, the width of the glue overflow step is set according to the diffusion performance of the die attach adhesive, the height of the glue overflow step is equal to half of the thickness of the frame, and the length of the glue overflow step is greater than the edge length of the set chip. Based on the arrangement, the adhesive sheet glue overflowing from the surface of the base island along the height direction and the width direction of the glue overflowing step can not overflow the width surface of the glue overflowing step and overflow to the back surface.
Further, after the arrangement of the bonding sheet adhesive and the chips is completed, the frame is automatically conveyed to the lead transfer box from the bonding sheet machine, and then taken down from the machine table to be taken into the oven for bonding sheet adhesive solidification, so that the chips are fixed on the multi-row matrix type frame.
A second frame structure, as shown in fig. 4, 5 and 6:
in step 101, when the base island includes a first base island, a second base island, a third base island and a fourth base island, a multi-row matrix frame is formed by a plurality of frame structure units, and first, the first base island, the second base island, the third base island and the fourth base island are respectively provided with a bonding tape by a tape-drawing process of a tape-bonding machine.
It should be noted that the painting process of the die bonder can be a dispensing process or a glue spraying process.
In step 102, a multi-row matrix frame which is composed of a plurality of frame structure units and provided with bonding glue is conveyed to a bonding position in a track of a bonding machine, four corners of a plurality of chips are respectively bonded on a first base island, a second base island, a third base island and a fourth base island on the plurality of frame structure units, the bonding glue on the inner side edges of the relative angle positions of the four base islands is extruded from the surfaces of the inner side edges of the relative angle positions of the base islands under the action of the bonding force of the bonding machine, overflows to the side surface of a glue overflow step close to the surface of the base island and simultaneously overflows to the step surface of the glue overflow step; the four base islands are respectively extruded from the outer edges, close to the peripheral direction of the chip, of the four base islands under the action of the bonding force of the die bonder, the flow direction of the bonding glue is arranged in glue overflowing grooves, close to the edges, of the base islands, and the bonding glue is prevented from overflowing to the outer edges of the base islands.
It should be noted that, in the embodiment of the present invention, the width of the glue overflow step is set according to the diffusion performance of the die attach adhesive, the height of the glue overflow step is equal to half of the thickness of the frame, and the length of the glue overflow step is greater than the edge length of the set chip. Based on the arrangement, the adhesive sheet glue overflowing from the surface of the base island along the height direction and the width direction of the glue overflowing step can not overflow the width surface of the glue overflowing step and overflow to the back surface.
Furthermore, after the arrangement of the bonding sheet adhesive and the chips is completed, the frame is automatically conveyed to the lead wire transfer box from the bonding sheet machine, and then taken off from the machine table to be taken into an oven for curing the bonding sheet adhesive, so that the chips are fixed on the multi-row matrix type frame.
A third frame structure, as shown in fig. 7 and 8:
in step 101, when the base island is a hollow base island, the hollow base island is composed of a frame, a hollow area and four base island connecting ribs. On the multirow matrix frame that a plurality of frame structure unit is constituteed, through the program control that the sticking machine set up, adopt and spout gluey technology and draw glue respectively on the base island center of a plurality of frame structure unit and even muscle, draw "x" type, adopt in addition to spout gluey technology and draw glue respectively on the base island of fretwork base island on the entity all around, the required sticking piece glue shape is made in two kinds of combinations.
In step 102, the multi-row matrix frame which is composed of a plurality of frame structure units and sprayed with glue and drawn with glue is conveyed to a gluing position in a track of a gluing machine, a plurality of chips are glued on hollow-out base islands of the plurality of frame structure units, the gluing glue on the inner side edge of a frame and the two side edges of a base island connecting rib is extruded from the surfaces of the inner side edge of the frame and the two side edges of the base island connecting rib under the action of the gluing machine gluing force, overflows to the side surface of a glue overflowing step close to the surface of the base island, and overflows to the step surface of the glue overflowing step. The adhesive sheet glue extruded from the outer edge surface of the frame flows into the overflow glue groove of the frame towards the edge of the chip in the peripheral direction, so that the adhesive sheet glue is prevented from overflowing to the outer edge of the hollow base island.
Further, after the arrangement of the bonding sheet adhesive and the chips is completed, the frame is automatically conveyed to the lead transfer box from the bonding sheet machine, and then taken down from the machine table to be taken into the oven for bonding sheet adhesive solidification, so that the chips are fixed on the multi-row matrix type frame.
In summary, embodiments of the present invention provide an IC package lead frame structure and a die bonding method thereof, in which a space at an edge of a base island is increased by an overflow step arranged at the edge of the base island, so that an overflow adhesive from between the base island and a chip flows onto the overflow step, thereby avoiding a problem that the die bonding adhesive causes contamination to the edge of the base island and a back surface of the base island, and even affects reliability of a product. Furthermore, an adhesive overflow groove is arranged at the edge of the base island, which is close to the peripheral direction of the chip, so that the adhesive is prevented from overflowing to the edge of the base island; furthermore, the chip can be arranged by two base islands, the chips are arranged by a plurality of base islands, and the chips are arranged by hollowing out the base islands, namely most area of the bottom of the chip is not contacted with the base islands, so that a bonding pad glue layer arranged between the chip and the base islands is reduced, and the production cost is reduced; moreover, the hollow base island is adopted to arrange the chip, and most area of the bottom of the chip is free of a frame metal entity; the problem that when a chip with a large area is arranged on a base island with a large area, cavities and bubbles caused by sticking of a piece adhesive or bubbles and water vapor wrapped between the chip and the base island cannot be discharged due to a DAF film is solved; further, the problem of delamination between the bottom of the chip and the base island is avoided, so that the product quality and reliability are improved. The lead frame structure for the IC package can solve the problems of product quality reduction and reliability reduction of the existing IC package caused by the fact that the adhesive easily overflows from the edges of the chip and the base island and the adhesive overflows to the edges of the base island and even the back of the base island.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. An IC package lead frame structure, comprising:
a base island for setting a chip;
and the glue overflowing step is arranged at the edge of the base island facing to the direction of arranging the chip and is used for arranging the bonding glue overflowing from the chip and the base island.
2. The IC package lead frame structure of claim 1, further comprising a frame structure unit and an overflow trough;
the frame structure unit is used for arranging the base island;
the glue overflow groove is positioned between the base island and the frame structure unit and is used for arranging the adhesive sheet glue overflowing from the position between the chip and the base island.
3. The IC package lead frame structure of claim 1, wherein the base island includes a first base island and a second base island;
the first base island and the second base island are symmetrically arranged, and the chips are respectively arranged on the first base island and the second base island;
the edge of the first base island facing the direction of the second base island is provided with the glue overflowing step, and the edge of the second base island facing the direction of the first base island is provided with the glue overflowing step.
4. The IC package lead frame structure of claim 2, wherein the base islands comprise a first base island, a second base island, a third base island, and a fourth base island;
the first base island, the second base island, the third base island and the fourth base island are diagonally arranged on the frame structure unit, and the chips are respectively arranged on the first base island, the second base island, the third base island and the fourth base island;
the edge of the first base island, the edge of the second base island, the edge of the third base island and the edge of the fourth base island facing to the direction of the chip are respectively provided with the glue overflowing steps;
the glue overflow groove is arranged between the first base island and the frame structure unit; the glue overflow groove is arranged between the second base island and the frame structure unit; the glue overflow groove is arranged between the third base island and the frame structure unit; and the glue overflow groove is arranged between the fourth base island and the frame structure unit.
5. The IC package lead frame structure of claim 2, wherein the base island is a hollowed-out base island;
the hollowed-out base island is composed of a frame, a hollowed-out area and four base island connecting ribs, the four base island connecting ribs are arranged diagonally and are respectively connected with the frame, and the hollowed-out area is triangular and is positioned between the base island connecting ribs and the frame;
glue overflow steps are arranged at the edge of the inner side of the frame, and glue overflow steps are arranged at the edges of the two sides of the base island connecting rib;
the glue overflow groove is arranged between the outer side of the frame and the frame structure unit.
6. The IC package lead frame structure of claim 4 or 5, wherein the glue overflow groove comprises a U-shaped groove or a V-shaped groove.
7. The lead frame structure of IC package according to any one of claims 1-5, wherein the flash step is formed by pressing with a stamping die; or by chemical etching;
the height of the glue overflowing step is equal to half of the thickness of the frame;
the length of the glue overflowing step is greater than the edge length of the chip;
the width of the glue overflowing step is determined according to the diffusivity of the adhesive sheet glue.
8. A method of die bonding, comprising:
providing a piece-sticking adhesive on a base island, wherein the base island is as claimed in any one of claims 1 to 5;
and arranging a chip on the base island by a chip bonding machine, and enabling the chip bonding glue arranged between the base island and the chip to flow to the glue overflowing step from the position between the base island and the chip under the action of the chip bonding machine.
9. The die bonding method according to claim 8, wherein the step of causing die bonding paste disposed between the base island and the die to flow from between the base island and the die to the flash step further comprises:
under the action of the die bonder, the die bonder adhesive arranged between the base island and the chip flows to an adhesive overflow groove from the position between the base island and the chip, and the adhesive overflow groove is positioned between the base island and the frame structure unit.
10. The die bonding method according to claim 8 or 9, wherein a die bonding adhesive is provided on the base island by a dispensing process; or
And arranging a piece sticking glue on the base island by a glue spraying process.
CN202210811799.7A 2022-07-11 2022-07-11 IC packaging lead frame structure and chip bonding method thereof Pending CN115084074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210811799.7A CN115084074A (en) 2022-07-11 2022-07-11 IC packaging lead frame structure and chip bonding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210811799.7A CN115084074A (en) 2022-07-11 2022-07-11 IC packaging lead frame structure and chip bonding method thereof

Publications (1)

Publication Number Publication Date
CN115084074A true CN115084074A (en) 2022-09-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210811799.7A Pending CN115084074A (en) 2022-07-11 2022-07-11 IC packaging lead frame structure and chip bonding method thereof

Country Status (1)

Country Link
CN (1) CN115084074A (en)

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