JP2001015668A5 - - Google Patents
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- Publication number
- JP2001015668A5 JP2001015668A5 JP1999188914A JP18891499A JP2001015668A5 JP 2001015668 A5 JP2001015668 A5 JP 2001015668A5 JP 1999188914 A JP1999188914 A JP 1999188914A JP 18891499 A JP18891499 A JP 18891499A JP 2001015668 A5 JP2001015668 A5 JP 2001015668A5
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- mounting surface
- semiconductor package
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 description 11
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 238000007789 sealing Methods 0.000 description 8
Description
【特許請求の範囲】
【請求項１】 封止樹脂とリード部とを備えるとともに、前記リード部の４面にて前記封止樹脂と接着し、かつ実装面が露出した樹脂封止型半導体パッケージにおいて、
前記リード部の実装面の隅部に隣接する部分のリードの側面には、前記実装面から離れるに従って、リードの幅が広がる形状のテーパが設けられており、前記リード部の実装面と反対の上面の隅部に隣接する部分のリード側面には、前記実装面から離れるに従って、リードの幅が広がる形状のテーパが設けられていないことを特徴とする樹脂封止型半導体パッケージ。
【請求項２】 前記リード部の前記封止樹脂と接着する部分にくぼみを設けたことを特徴とする、請求項１記載の樹脂封止型半導体パッケージ。
【請求項３】 前記リード部の実装面の隅部に段差を設けたことを特徴とする、請求項１記載の樹脂封止型半導体パッケージ。
【請求項４】 前記リード部の前記封止樹脂と接着する部分をくさび型にしたことを特徴とする、請求項１記載の樹脂封止型半導体パッケージ。
【請求項５】 前記リード部が、スタンピングで加工されたフレームから成ることを特徴とする、請求項１ないし請求項４のいずれかに記載の樹脂封止型半導体パッケージ。
[Claims]
1. In a resin-sealed semiconductor package that includes a sealing resin and a lead portion, adheres to the sealing resin on four surfaces of the lead portion, and has an exposed mounting surface.
Of the lead partThe side surface of the lead of the portion adjacent to the corner portion of the mounting surface is provided with a taper having a shape in which the width of the lead increases as the distance from the mounting surface increases, and the corner portion of the upper surface opposite to the mounting surface of the lead portion. The lead side surface of the portion adjacent to the lead is not provided with a taper having a shape in which the width of the lead increases as the distance from the mounting surface increases.A resin-sealed semiconductor package characterized by this.
2. The first aspect of the present invention, wherein a recess is provided in a portion of the lead portion that adheres to the sealing resin.Resin-sealed semiconductor package.
3. SaidIt is characterized by providing a step at the corner of the mounting surface of the lead portion.1.Resin-sealed semiconductor package.
4. BeforeA wedge-shaped portion of the lead portion to be adhered to the sealing resin is used.1.Resin-sealed semiconductor package.
5. SaidThe resin-sealed semiconductor package according to any one of claims 1 to 4, wherein the lead portion comprises a frame processed by stamping.
【０００７】
【課題を解決するための手段】
第１の発明にかかる樹脂封止型半導体パッケージは、封止樹脂とリード部とを備えるとともに、前記リード部の４面にて前記封止樹脂と接着し、かつ実装面が露出した樹脂封止型半導体パッケージにおいて、前記リード部の実装面の隅部に隣接する部分のリードの側面には、前記実装面から離れるに従って、リードの幅が広がる形状のテーパが設けられており、前記リード部の実装面と反対の上面の隅部に隣接する部分のリード側面には、前記実装面から離れるに従って、リードの幅が広がる形状のテーパが設けられていないことを特徴とするものである。
0007
[Means for solving problems]
The resin-sealed semiconductor package according to the first invention includes a sealing resin and a lead portion, and is resin-sealed by adhering to the sealing resin on four surfaces of the lead portion and exposing the mounting surface. In the type semiconductor package, the side surface of the lead of the portion adjacent to the corner of the mounting surface of the lead portion is provided with a taper having a shape in which the width of the lead increases as the distance from the mounting surface increases. The lead side surface of the portion adjacent to the corner of the upper surface opposite to the mounting surface is not provided with a taper having a shape in which the width of the lead increases as the distance from the mounting surface increases .
また、第２の発明にかかる樹脂封止型半導体パッケージは、前記リード部の前記封止樹脂と接着する部分にくぼみを設けたことを特徴とするものである。 Further, the resin-sealed semiconductor package according to the second invention is characterized in that a recess is provided in a portion of the lead portion that adheres to the sealing resin.
また、第３の発明にかかる樹脂封止型半導体パッケージは、前記リード部の実装面の隅部に段差を設けたことを特徴とするものである。 The resin sealed semiconductor package according to a third invention is characterized in that a step in the corner portion of the mounting surface of the front Symbol lead portion.
また、第４の発明にかかる樹脂封止型半導体パッケージは、前記リード部の前記封止樹脂と接着する部分をくさび型にしたことを特徴とするものである。
The resin sealed semiconductor package according to a fourth invention is characterized in that the said portion of bonding the sealing resin before Symbol leads to wedge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18891499A JP4390317B2 (en) | 1999-07-02 | 1999-07-02 | Resin-sealed semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18891499A JP4390317B2 (en) | 1999-07-02 | 1999-07-02 | Resin-sealed semiconductor package |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007128525A Division JP4489791B2 (en) | 2007-05-14 | 2007-05-14 | QFN package |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001015668A JP2001015668A (en) | 2001-01-19 |
| JP2001015668A5 true JP2001015668A5 (en) | 2006-07-27 |
| JP4390317B2 JP4390317B2 (en) | 2009-12-24 |
Family
ID=16232103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18891499A Expired - Fee Related JP4390317B2 (en) | 1999-07-02 | 1999-07-02 | Resin-sealed semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4390317B2 (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4520056B2 (en) * | 2001-02-07 | 2010-08-04 | ローム株式会社 | Semiconductor device |
| JP3714408B2 (en) * | 2001-07-16 | 2005-11-09 | セイコーエプソン株式会社 | Piezoelectric vibrator |
| JP2003174136A (en) * | 2001-12-07 | 2003-06-20 | Aoi Electronics Co Ltd | Resin mold semiconductor device |
| JP2003234425A (en) * | 2002-02-07 | 2003-08-22 | Mitsui Chemicals Inc | Hollow package for loading semiconductor element |
| JP2003258183A (en) * | 2002-03-04 | 2003-09-12 | Shinko Electric Ind Co Ltd | Method of manufacturing lead frame |
| JP4372508B2 (en) * | 2003-10-06 | 2009-11-25 | ローム株式会社 | Lead frame manufacturing method, semiconductor device manufacturing method using the same, semiconductor device, and portable device and electronic device including the same |
| JP4305310B2 (en) * | 2004-07-15 | 2009-07-29 | 株式会社デンソー | Semiconductor device |
| JP5262374B2 (en) * | 2004-11-30 | 2013-08-14 | 日亜化学工業株式会社 | RESIN MOLDED BODY, SURFACE MOUNTED LIGHT EMITTING DEVICE AND METHOD FOR PRODUCING THEM |
| US9502624B2 (en) | 2006-05-18 | 2016-11-22 | Nichia Corporation | Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same |
| JP2010021259A (en) * | 2008-07-09 | 2010-01-28 | Toshiba Corp | Optical semiconductor device |
| JP5217800B2 (en) | 2008-09-03 | 2013-06-19 | 日亜化学工業株式会社 | Light emitting device, resin package, resin molded body, and manufacturing method thereof |
| JP2010129591A (en) * | 2008-11-25 | 2010-06-10 | Mitsui High Tec Inc | Lead frame, semiconductor device using the lead frame and intermediate product thereof, and method for manufacturing same |
| JP5649277B2 (en) | 2008-12-22 | 2015-01-07 | ローム株式会社 | Semiconductor device |
| CN102428558B (en) | 2009-05-15 | 2014-06-25 | 罗姆股份有限公司 | Semiconductor device |
| JP5346865B2 (en) * | 2010-04-05 | 2013-11-20 | 新電元工業株式会社 | Method for manufacturing magnetic substrate |
| JP2015070161A (en) * | 2013-09-30 | 2015-04-13 | ローム株式会社 | Lead frame, semiconductor device, and method of manufacturing semiconductor device |
| US10062493B2 (en) | 2013-11-26 | 2018-08-28 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and circuit board having the same mounted thereon |
| JP2018074067A (en) * | 2016-11-01 | 2018-05-10 | 旭化成エレクトロニクス株式会社 | Semiconductor device |
| JP7338204B2 (en) | 2019-04-01 | 2023-09-05 | 富士電機株式会社 | semiconductor equipment |
-
1999
- 1999-07-02 JP JP18891499A patent/JP4390317B2/en not_active Expired - Fee Related
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