CN206432554U - Ceramic gasket and laser for laser - Google Patents
Ceramic gasket and laser for laser Download PDFInfo
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- CN206432554U CN206432554U CN201621474289.1U CN201621474289U CN206432554U CN 206432554 U CN206432554 U CN 206432554U CN 201621474289 U CN201621474289 U CN 201621474289U CN 206432554 U CN206432554 U CN 206432554U
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Abstract
The utility model discloses a kind of ceramic gasket and laser for laser, wherein the ceramic gasket for laser includes：Ceramic gasket body；Some coats of metal, including the first spaced coat of metal, second coat of metal, the 3rd coat of metal and the 4th coat of metal being laid on ceramic gasket body, longitudinally spaced setting of first and second coat of metal along ceramic gasket body, one end formation first mutually away from second coat of metal of first coat of metal is open, 3rd coat of metal and the 4th coat of metal are separately positioned on the both sides of the first opening, and thin mould resistance is connected between the 3rd coat of metal and the 4th coat of metal；Master chip, is arranged on first coat of metal；MPD, is arranged on second coat of metal.Acted on by the conducting of the coat of metal, effectively shorten the length of plain conductor between chip and pin, reduce the influence of interference and parasitic capacitance inductance between the plain conductor produced under high-frequency signal etc..
Description
Technical field
The utility model is related to field of lasers, more particularly to a kind of ceramic gasket of individual laser package.
Background technology
At present, fiber optic communication has many merits such as message capacity is big, long transmission distance, anti-electromagnetic interference capability are strong because of it
And develop into one of Primary communication mode.Semiconductor laser is the principal light source of fiber optic communication, is the core of fiber optic communication
Heart device.Existing semiconductor laser generally comprises base, pin and is arranged on the ceramic gasket of base top surface, wherein described
Master chip and monitor photo-diode (Monitoring Photodiode are placed with ceramic gasket respectively；MPD), the master
Chip and the MPD are connected to the corresponding pin by plain conductor respectively.But, due to plain conductor have it is larger
Length, can cause the interference between plain conductor under high-frequency signal, while parasitic capacitance inductance can be produced, influence high-frequency signal
Laser propagation effect.In addition, when positive pole and the negative pole of the master chip be arranged at its it is positive when or be separately positioned on its front with
During reverse side, ceramic gasket described in identical cannot be applied to above-mentioned two situations simultaneously, for example, when the semiconductor laser
During for vertical cavity surface emitting laser (Vcsel lasers) within 10G, the positive pole of the master chip is generally in its front, institute
The negative pole of master chip is stated generally in its reverse side, it is described when the semiconductor laser is 14G and the above Vcsel lasers
The positive pole of master chip is with negative pole typically each in its front.
Utility model content
One of the purpose of this utility model is a kind of ceramic gasket for laser of offer, can reduce high-frequency signal
The influence of interference and parasitic capacitance inductance between the plain conductor of lower generation etc. is simultaneously applicable the positive pole of chip and negative pole is arranged at
Front is set up separately in the positive situation with reverse side.
The two of the purpose of this utility model are to provide a kind of laser, can reduce the metal produced under high-frequency signal and lead
The influence of interference and parasitic capacitance inductance between line etc. is simultaneously applicable the positive pole of chip and negative pole is arranged at front or set up separately just
Face and the situation of reverse side.
One of to achieve these goals, the ceramic gasket of the present utility model for laser, the laser includes
Base and some pins located at the base, some pins include laser positive pole pin, laser negative pole pin,
MPD (monitor photo-diode) positive pole pins and MPD negative pole pins, the ceramic gasket for laser include：Ceramic blanket
Piece body, is arranged on the base top surface and between some pins；Some coats of metal, some coats of metal
Including the first spaced coat of metal, second coat of metal, the 3rd metal-plated being laid on the ceramic gasket body
Between layer and the 4th coat of metal, the longitudinal direction of first coat of metal and second coat of metal along the ceramic gasket body
Every setting, one end formation first mutually away from second coat of metal of first coat of metal is open, the 3rd gold medal
Category coating and the 4th coat of metal are separately positioned on the both sides of first opening, the 3rd coat of metal and described the
Thin mould resistance is connected between four coats of metal；Master chip, is arranged on first coat of metal, the positive pole of the master chip
First coat of metal is electrically connected to one of negative pole, and first coat of metal is connected to by plain conductor described to swash
One of light device positive pole pin and the laser negative pole pin, the positive pole of the master chip pass through plain conductor with the another of negative pole
Be connected to the 4th coat of metal, the 3rd coat of metal by plain conductor be connected to the laser positive pole pin with
The laser negative pole pin it is another；MPD, is arranged on second coat of metal, one of positive pole and negative pole of the MPD
One of the MPD positive poles pin and described MPD negative poles pin are accordingly connected to by plain conductor, the positive pole of the MPD is with bearing
The another of pole is electrically connected to second coat of metal, and second coat of metal is connected to the MPD by plain conductor
Positive pole pin is another with the MPD negative poles pin.
Compared with prior art, the ceramic gasket of the present utility model for laser, passes through leading for the coat of metal
Logical effect, effectively shortens between chip and pin the length of plain conductor and the layout of plain conductor is more rationalized, subtract
Lack the influence of interference and parasitic capacitance inductance between the plain conductor produced under high-frequency signal etc., and then meet high-frequency signal
Transmission requirement.In addition, passing through the setting of the coat of metal so that the positive pole and negative pole that the ceramic gasket can be applicable chip are equal
It is arranged on front or sets up separately in the positive situation with reverse side.
It is preferred that second coat of metal is formed with the second opening close to one end of first coat of metal, it is described
First coat of metal is formed with convex portion accordingly, and the convex portion is located at the second opening of second coat of metal, thereby reached
Into the effect of compact conformation.
It is preferred that first coat of metal, second coat of metal, the 3rd coat of metal and the 4th gold medal
It is in integrally lateral symmetry structure to belong to coating, is easy to the attachment of different structure chip.
Specifically, first coat of metal connects the negative pole of the laser negative pole pin and the master chip, described
3rd coat of metal is connected to the laser positive pole pin, and the 4th coat of metal is connected to the positive pole of the master chip.
Specifically, the positive pole of the master chip is respectively positioned on the front of the master chip, the positive pole of the master chip with negative pole
It is connected with one of negative pole with first coat of metal by plain conductor.
Specifically, the positive pole of the master chip is located at front and the reverse side of the master chip, the main core with negative pole respectively
One of positive pole and negative pole of piece are located at the master chip reverse side and pass through conductive gemel connection with first coat of metal.
Specifically, one of the positive pole of the MPD and negative pole are located at the front of the MPD, the positive pole and negative pole of the MPD it
It is another to be located at the MPD reverse side and be connected by conducting resinl with second coat of metal.
To achieve these goals two, laser of the present utility model, including：Base；Some pins, are arranged on described
Base, some pins include laser positive pole pin, laser negative pole pin, MPD positive poles pin and MPD negative pole pins；
Ceramic gasket body, is arranged on the base top surface and between some pins；Some coats of metal, some gold
Category coating includes the first spaced coat of metal being laid on the ceramic gasket body, second coat of metal, the 3rd
The coat of metal and the 4th coat of metal, first coat of metal and second coat of metal are along the ceramic gasket body
Longitudinally spaced to set, first coat of metal is located between the laser positive pole pin and the laser negative pole pin,
Second coat of metal is located between the MPD positive poles pin and the MPD negative poles pin, the phase of first coat of metal
First is formed away from one end of second coat of metal to be open, the 3rd coat of metal and the 4th coat of metal difference
The both sides of first opening are arranged on, Bao Mo electricity is connected between the 3rd coat of metal and the 4th coat of metal
Resistance；Master chip, is arranged on first coat of metal, and one of positive pole of the master chip and negative pole are electrically connected to described the
One coat of metal, first coat of metal is connected to the laser positive pole pin by plain conductor and born with the laser
One of pole pipe pin, the positive pole of the master chip is connected to the 4th coat of metal, institute with the another of negative pole by plain conductor
State the 3rd coat of metal and the another of the laser positive pole pin and the laser negative pole pin is connected to by plain conductor；
MPD, is arranged on second coat of metal, and one of the positive pole of the MPD and negative pole are connected to institute by the way that plain conductor is corresponding
State one of MPD positive poles pin and described MPD negative poles pin, the positive pole of the MPD and the another of negative pole are electrically connected to described the
Two coats of metal, second coat of metal is connected to the MPD positive poles pin and the MPD negative poles pin by plain conductor
It is another.
Compared with prior art, laser of the present utility model, is acted on by the conducting of the coat of metal, effectively shortened
The length of plain conductor and the layout of plain conductor is more rationalized between chip and pin, reduce and produced under high-frequency signal
The influence of interference and parasitic capacitance inductance between raw plain conductor etc., and then meet the transmission requirement of high-frequency signal.In addition, logical
Cross the setting of the coat of metal so that the laser can be applicable the positive pole of chip and negative pole is arranged at front or set up separately
Front and the situation of reverse side.
Brief description of the drawings
Fig. 1 is the schematic diagram of an embodiment of the utility model ceramic gasket.
Fig. 2 is the schematic diagram of an embodiment of the utility model laser.
Fig. 3 is the schematic diagram of another embodiment of the utility model laser.
Embodiment
To describe technology contents of the present utility model, construction feature, the effect realized in detail, below in conjunction with embodiment
And coordinate accompanying drawing to be explained in detail.
Fig. 1 to Fig. 3 discloses a kind of ceramic gasket 10 and the laser 100/100 ' with the ceramic gasket 10.It is described
Laser 100/100 ' includes base 20, some pins and is arranged on the top surface of base 20 and is located between some pins
The ceramic gasket 10.Some pins include laser positive pole pin 31, laser negative pole pin 32, the positive pole pipes of MPD
Pin 33 and MPD negative poles pin 34.
The ceramic gasket 10 includes ceramic gasket body 11, is laid with the ceramic gasket body 11 spaced
First coat of metal 12, second coat of metal 13, the 3rd coat of metal 14 and the 4th coat of metal 15.Wherein, first gold medal
Belong to the longitudinally spaced setting of coating 12 and second coat of metal 13 along the ceramic gasket body 11, first metal-plated
Layer 12 is provided with master chip 17, and second coat of metal 13 is provided with MPD 18, and first coat of metal 12 mutually deviates from
One end of second coat of metal 13 forms the first opening 120, the 3rd coat of metal 14 and the 4th coat of metal
15 are separately positioned on the both sides of first opening 120, between the 3rd coat of metal 14 and the 4th coat of metal 15
Thin mould resistance 16 is connected with, corresponding impedance matching can be achieved by the setting of the thin mould resistance 16, in addition, according to actual need
The thin mould resistance 16 of different resistance values can be set.Specifically, second coat of metal 13 is close to first metal
One end of coating 12 is formed with the second opening 130, and first coat of metal 12 is formed with convex portion 121, the convex portion accordingly
121 are located at the second opening 130 of second coat of metal 13, thereby reach the effect of compact conformation.Specifically, described
One coat of metal 12, second coat of metal 13, the 3rd coat of metal 14 and the entirety of the 4th coat of metal 15 are in
Lateral symmetry structure, and then facilitate the chip attachment and routing of different structure.
After the ceramic gasket 10 is installed in base 20, first coat of metal 12 is being located at the laser just
Between pole pipe pin 31 and the laser negative pole pin 32, second coat of metal 13 be located at the MPD positive poles pin 33 with
Between the MPD negative poles pin 34.One of positive pole and negative pole of wherein described master chip 17 are electrically connected to first metal
Coating 12, first coat of metal 12 is connected to the laser positive pole pin 31 and the laser by plain conductor 40
One of negative pole pin 32, the positive pole of the master chip 17 is connected to the 4th metal with the another of negative pole by plain conductor 40
Coating 15, the 3rd coat of metal 14 is connected to the laser positive pole pin 31 and the laser by plain conductor 40
Negative pole pin 32 it is another, one of the positive pole of the MPD 18 and negative pole are being connected to the MPD just by the way that plain conductor 40 is corresponding
One of pole pipe pin 33 and described MPD negative poles pin 34, the positive pole of the MPD 18 and the another of negative pole are electrically connected to described the
Two coats of metal 13, second coat of metal 13 is connected to the MPD positive poles pin 33 and the MPD by plain conductor 40
Negative pole pin 34 it is another；Preferentially, first coat of metal 12 connects the laser negative pole pin 32 and the main core
The negative pole of piece 17, the 3rd coat of metal 14 is connected to the laser positive pole pin 31, and the 4th coat of metal 15 connects
It is connected to the positive pole of the master chip 17；Specifically, when the positive pole and negative pole of the master chip 17 are respectively positioned on the master chip 17
(Fig. 2 is referred to when positive), and one of the positive pole of the master chip 17 and negative pole are led with first coat of metal 12 by metal
Line 40 is connected, and (is referred to when the positive pole of the master chip 17 is located at the front of the master chip 17 with reverse side respectively with negative pole
Fig. 3), the positive pole of the master chip 17 and one of negative pole are positioned at the reverse side of master chip 17 and logical with first coat of metal 12
Conducting resinl (being preferably elargol) connection is crossed, for example, when the laser 100 is the Vcsel laser (vertical cavity surfaces within 10G
Emitting laser) when, the positive pole of the master chip 17 is located at its front, and the negative pole of the master chip 17 is located at its reverse side, works as institute
When stating the Vcesl lasers that laser 100 is 14G or more, positive pole and the negative pole of the master chip 17 are respectively positioned on its front；Tool
Body, positive pole and the negative pole of the MPD 18 are separately positioned on its front and reverse side, and the positive pole and negative pole of the MPD 18 is another
One is located at the reverse side of MPD 18 and is connected by conducting resinl (being preferably elargol) with second coat of metal 13.
Compared with prior art, the ceramic gasket 10 and the laser 100/100 ' of the present utility model pass through described
The conducting effect of the coat of metal 12,13,14,15, effectively shortens between chip and pin the length of plain conductor and makes metal
The layout of wire is more rationalized, and reduces interference and parasitic capacitance inductance between the plain conductor produced under high-frequency signal etc.
Influence, and then meet the transmission requirement of high-frequency signal.In addition, passing through the setting of the coat of metal 12,13,14,15 so that institute
State that ceramic gasket 10 can be applicable the positive pole of chip and negative pole is arranged at front or sets up situation in front and reverse side separately.
Above disclosed is only preferred embodiments of the present utility model, can not limit the utility model with this certainly
Interest field, therefore equivalent variations made according to present utility model application the scope of the claims still fall within the utility model and are covered
Scope.
Claims (8)
1. a kind of ceramic gasket for laser, the laser includes base and some pins located at the base,
Some pins include laser positive pole pin, laser negative pole pin, MPD positive poles pin and MPD negative pole pins, its feature
It is, the ceramic gasket for laser includes：
Ceramic gasket body, is arranged on the base top surface and between some pins；
Some coats of metal, some coats of metal include spaced first being laid on the ceramic gasket body
The coat of metal, second coat of metal, the 3rd coat of metal and the 4th coat of metal, first coat of metal and second gold medal
Belong to longitudinally spaced setting of the coating along the ceramic gasket body, first coat of metal mutually deviates from second metal-plated
One end of layer forms first and is open, and the 3rd coat of metal and the 4th coat of metal are separately positioned on first opening
Both sides, be connected with thin mould resistance between the 3rd coat of metal and the 4th coat of metal；
Master chip, is arranged on first coat of metal, and one of positive pole and negative pole of the master chip are electrically connected to described
First coat of metal, first coat of metal is connected to the laser positive pole pin and the laser by plain conductor
One of negative pole pin, the positive pole of the master chip is connected to the 4th coat of metal with the another of negative pole by plain conductor,
It is another with the laser negative pole pin that 3rd coat of metal is connected to the laser positive pole pin by plain conductor
One；
MPD, is arranged on second coat of metal, and one of the positive pole of the MPD and negative pole are connected by the way that plain conductor is corresponding
To one of the MPD positive poles pin and the MPD negative poles pin, the positive pole of the MPD is electrically connected to institute with the another of negative pole
Second coat of metal is stated, second coat of metal is connected to the MPD positive poles pin and the MPD negative poles by plain conductor
Pin it is another.
2. it is used for the ceramic gasket of laser as claimed in claim 1, it is characterised in that second coat of metal is close to institute
The one end for stating first coat of metal is formed with the second opening, and first coat of metal is formed with convex portion, the convex portion accordingly
At the second opening of second coat of metal.
3. it is used for the ceramic gasket of laser as claimed in claim 1, it is characterised in that first coat of metal, described
Second coat of metal, the 3rd coat of metal and the 4th coat of metal are in integrally lateral symmetry structure.
4. it is used for the ceramic gasket of laser as claimed in claim 1, it is characterised in that first coat of metal connects institute
The negative pole of laser negative pole pin and the master chip is stated, the 3rd coat of metal is connected to the laser positive pole pin,
4th coat of metal is connected to the positive pole of the master chip.
5. it is used for the ceramic gasket of laser as claimed in claim 1, it is characterised in that the positive pole and negative pole of the master chip
It is respectively positioned on the front of the master chip, one of the positive pole of the master chip and negative pole are led with first coat of metal by metal
Line is connected.
6. it is used for the ceramic gasket of laser as claimed in claim 1, it is characterised in that the positive pole and negative pole of the master chip
Respectively positioned at the front of the master chip and reverse side, one of positive pole and negative pole of the master chip are located at the master chip reverse side simultaneously
Pass through conductive gemel connection with first coat of metal.
7. be used for the ceramic gasket of laser as claimed in claim 1, it is characterised in that the positive pole of the MPD and negative pole it
One is located at the front of the MPD, and the positive pole of the MPD is located at the MPD reverse side with the another of negative pole and passes through conducting resinl and institute
State the connection of second coat of metal.
8. a kind of laser, it is characterised in that including：
Base；
Some pins, are arranged on the base, and some pins include laser positive pole pin, laser negative pole pin, MPD
Positive pole pin and MPD negative pole pins；
Ceramic gasket body, is arranged on the base top surface and between some pins；
Some coats of metal, some coats of metal include spaced first being laid on the ceramic gasket body
The coat of metal, second coat of metal, the 3rd coat of metal and the 4th coat of metal, first coat of metal and second gold medal
Belong to longitudinally spaced setting of the coating along the ceramic gasket body, first coat of metal is located at the laser positive pole pin
Between the laser negative pole pin, second coat of metal is located at the MPD positive poles pin and the MPD negative poles pin
Between, one end formation first mutually away from second coat of metal of first coat of metal is open, the 3rd metal
Coating and the 4th coat of metal are separately positioned on the both sides of first opening, the 3rd coat of metal and the described 4th
Thin mould resistance is connected between the coat of metal；
Master chip, is arranged on first coat of metal, and one of positive pole and negative pole of the master chip are electrically connected to described
First coat of metal, first coat of metal is connected to the laser positive pole pin and the laser by plain conductor
One of negative pole pin, the positive pole of the master chip is connected to the 4th coat of metal with the another of negative pole by plain conductor,
It is another with the laser negative pole pin that 3rd coat of metal is connected to the laser positive pole pin by plain conductor
One；
MPD, is arranged on second coat of metal, and one of the positive pole of the MPD and negative pole are connected by the way that plain conductor is corresponding
To one of the MPD positive poles pin and the MPD negative poles pin, the positive pole of the MPD is electrically connected to institute with the another of negative pole
Second coat of metal is stated, second coat of metal is connected to the MPD positive poles pin and the MPD negative poles by plain conductor
Pin it is another.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621474289.1U CN206432554U (en) | 2016-12-29 | 2016-12-29 | Ceramic gasket and laser for laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621474289.1U CN206432554U (en) | 2016-12-29 | 2016-12-29 | Ceramic gasket and laser for laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206432554U true CN206432554U (en) | 2017-08-22 |
Family
ID=59584959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621474289.1U Active CN206432554U (en) | 2016-12-29 | 2016-12-29 | Ceramic gasket and laser for laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206432554U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022156489A1 (en) * | 2021-01-25 | 2022-07-28 | 华为技术有限公司 | Laser carrier and manufacturing method therefor |
-
2016
- 2016-12-29 CN CN201621474289.1U patent/CN206432554U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022156489A1 (en) * | 2021-01-25 | 2022-07-28 | 华为技术有限公司 | Laser carrier and manufacturing method therefor |
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Address after: 523000, Guangdong province Dongguan Songshan Lake hi tech Industrial Development Zone 12 industrial East Road, Kwong Yun Tatsu plant two, 5 floor Patentee after: Guangdong Guangzhi Communication Technology Co., Ltd Address before: 523000, Guangdong province Dongguan Songshan Lake hi tech Industrial Development Zone 12 industrial East Road, Kwong Yun Tatsu plant 2, 5 floor Patentee before: Dongguan Guang Zhi communication Science and Technology Ltd. |