CN205681691U - A kind of transmission-line compensation structure based on defect ground - Google Patents
A kind of transmission-line compensation structure based on defect ground Download PDFInfo
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- CN205681691U CN205681691U CN201620610765.1U CN201620610765U CN205681691U CN 205681691 U CN205681691 U CN 205681691U CN 201620610765 U CN201620610765 U CN 201620610765U CN 205681691 U CN205681691 U CN 205681691U
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Abstract
The utility model discloses a kind of transmission-line compensation structure based on defect ground, including pad body, transmission line, impedance-compensated structure, described transmission line connects described pad body, is transmitted by described pad body, has first medium layer under described transmission line, described impedance-compensated structure includes the second dielectric layer of the predetermined thickness increasing in described first medium layer bottom, for the thickness by increasing second dielectric layer to increase the impedance of described transmission-line compensation structure.The utility model uses defect ground mode to carry out impedance-compensated, second dielectric layer is increased predetermined thickness, improve the impedance causing owing to suddenling change to reduce, add effective reference thickness, the effective dielectric constant of transmission line in this way, thus reduce insertion loss, improve noise dither, increase bandwidth, reduce noise.
Description
Technical field
The utility model relates to circuited transmission field, particularly to a kind of transmission-line compensation structure based on defect ground.
Background technology
For obtaining the balance of best power transmission and minimal losses in height of eye speed interconnection circuit, typically can be by the spy of transmission line
Levy impedance setting to a fixing value, such as 50 Ω, this makes the transmission line in system must keep fixing linear dimension of walking, but
Pad such as BGA ball-pads in each integrated component package in system, upper connection in series-parallel coupling in QFN rectangular pads, transmission
Element；And various interconnection element: socket, SMA adapter, row array, via, golden finger etc. so that transmission line is difficult to and these
Device electric size is mated, even if can mate in size, in welding process, soldering layer is also inevitable to the thickness increase of conductor thickness
Cause impedance discontinuity, produce change in the instantaneous impedance, and then affect the signal quality in system.
Fig. 1 is a kind of transmission line scheme of prior art, owing to transmission line upward wiring is through various pads, causes in system
The lateral dimension of device bonding pad, via or interconnection devices increases；Fig. 2 is the another kind of transmission line scheme of prior art, due to right
Interconnection devices carries out welding, encapsulates, assembling etc., causes the conductor thickness of system to increase；To sum up, currently existing scheme all can have as
Lower defect: insertion loss increases, shake deteriorates, bandwidth reduces, system noise increases.
Utility model content
The utility model is to overcome the above-mentioned deficiency of prior art, provides one can reduce insertion loss, improve and make an uproar
Sound shake, the transmission-line compensation structure based on defect ground increasing bandwidth, reduction noise.
In order to realize above-mentioned utility model purpose, the technical solution adopted in the utility model is:
A kind of transmission-line compensation structure based on defect ground, including pad body, transmission line, impedance-compensated structure, described
Transmission line connects described pad body, is transmitted by described pad body, has first medium layer, institute under described transmission line
State impedance-compensated structure and include the second dielectric layer of the predetermined thickness increasing in described first medium layer bottom, for by increasing
The thickness of second dielectric layer is to increase the impedance of described transmission-line compensation structure.
In one specific embodiment mode of the utility model, the dielectric constant of described first medium layer is more than described second
The dielectric constant of dielectric layer.
In one specific embodiment mode of the utility model, described transmission line is microstrip line, plane coupled microstrip line, band
One in shape line, coupling strip line.
In one specific embodiment mode of the utility model, also including the via that refluxes, described backflow via is arranged at institute
State the front end of impedance-compensated structure or/and rear end, be used for reducing the parasitic capacitance effect that described second dielectric layer causes.
Compared with prior art, the beneficial effects of the utility model
The utility model uses defect ground mode to carry out impedance-compensated, second dielectric layer is increased predetermined thickness, changes
The kind impedance causing owing to suddenling change reduces, and adds effective reference thickness, the effective dielectric constant of transmission line in this way,
Thus reduce insertion loss, improve noise dither, increase bandwidth, reduce noise.
Brief description
It is the transmission line mutation defect schematic diagram in one scheme of prior art shown in Fig. 1.
It is the transmission line mutation defect schematic diagram in another scheme of prior art shown in Fig. 2.
It is the transmission-line compensation structural representation based on defect ground of the present utility model shown in Fig. 3.
It is impedance-compensated structure principle chart of the present utility model shown in Fig. 4.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the utility model is described in further detail.But this should be interpreted as this
The scope of the above-mentioned theme of utility model is only limitted to below example, and all technology being realized based on the utility model content all belong to
In scope of the present utility model.
Embodiment 1:
Fig. 3, Fig. 4 show the transmission-line compensation structural representation based on defect ground of the present utility model, including pad is originally
Body 1, transmission line 2, impedance-compensated structure 3, described transmission line 2 connects described pad body 1, is carried out by described pad body 1
Transmission, has first medium layer 4 under described transmission line 2, described impedance-compensated structure 3 includes in described first medium layer 4 bottom
The second dielectric layer 31 of the predetermined thickness increasing, for being mended to increase described transmission line by increasing the thickness of second dielectric layer 31
The impedance of compensation structure.
By the analysis to prior art, transmission line sudden change is usually the sudden change on width or the sudden change on thickness,
When sudden change occurs, electric current per unit length reduces, and magnetic energy reduces and causes energy of position to increase, and this makes the parasitic capacitance on transmission line
Increasing in capacitive, from the definition of characteristic impedance, said mutation will result in the reduction of characteristic impedance, therefore, the utility model
Increase effective reference thickness of transmission line, the medium filling effective dielectric constant by way of defect ground.
Concrete, in one embodiment, the dielectric constant of the transmission line model before compensation is Er1, and reference thickness is h1,
Using scheme of the present utility model, increasing dielectric constant below original dielectric layer is Er2, and reference thickness is the second medium of h2
Layer, therefore, the effective dielectric constant after compensation becomes Ere=(Er1*Er2) ^1/2, effective reference thickness becomes he=h1+h2.
The design of concrete thickness design and dielectric layer determines according to transmission line model, or also can be by full three-dimensional
Electromagnetic-field simulation instrument is modeled analyzing and scanning acquisition optimal modification size, and this belongs to prior art, no longer superfluous at this
State.
The utility model uses defect ground mode to carry out impedance-compensated, second dielectric layer is increased predetermined thickness, changes
The kind impedance causing owing to suddenling change reduces, and adds effective reference thickness, the effective dielectric constant of transmission line in this way,
Thus reduce insertion loss, improve noise dither, increase bandwidth, reduce noise.
In one specific embodiment mode of the utility model, the dielectric constant of described first medium layer is more than described second
The dielectric constant of dielectric layer.
In one specific embodiment mode of the utility model, described transmission line is microstrip line, plane coupled microstrip line, band
One in shape line, coupling strip line.
Due to the difference of transmission line, its model is also just different, needs according to concrete transmission line pin in being applied to
Dielectric constant, thickness to second dielectric layer in the design compensation of property.
In one specific embodiment mode of the utility model, also including the via that refluxes, described backflow via is arranged at institute
State the front end of impedance-compensated structure or/and rear end, be used for reducing the parasitic capacitance effect that described second dielectric layer causes.
Above in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described in detail, but the utility model is not
It is limited to above-mentioned embodiment, in the case of the spirit and scope without departing from claims hereof, those skilled in the art
Member may be made that various modification or remodeling.
Claims (4)
1. the transmission-line compensation structure based on defect ground, it is characterised in that include pad body, transmission line, impedance-compensated
Structure, described transmission line is connected described pad body, is transmitted by described pad body, has first under described transmission line
Dielectric layer, described impedance-compensated structure includes the second dielectric layer of the predetermined thickness increasing in described first medium layer bottom, uses
In the thickness by increasing second dielectric layer to increase the impedance of described transmission-line compensation structure.
2. the transmission-line compensation structure based on defect ground according to claim 1, it is characterised in that described first medium layer
Dielectric constant more than the dielectric constant of described second dielectric layer.
3. the transmission-line compensation structure based on defect ground according to claim 1, it is characterised in that described transmission line is micro-
With the one in line, plane coupled microstrip line, strip line, coupling strip line.
4. the transmission-line compensation structure based on defect ground according to any one of claim 1-3, it is characterised in that also include
Backflow via, described backflow via is arranged at the front end of described impedance-compensated structure or/and rear end, is used for reducing by described second Jie
The parasitic capacitance effect that matter layer causes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620610765.1U CN205681691U (en) | 2016-06-21 | 2016-06-21 | A kind of transmission-line compensation structure based on defect ground |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620610765.1U CN205681691U (en) | 2016-06-21 | 2016-06-21 | A kind of transmission-line compensation structure based on defect ground |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205681691U true CN205681691U (en) | 2016-11-09 |
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| CN201620610765.1U Active CN205681691U (en) | 2016-06-21 | 2016-06-21 | A kind of transmission-line compensation structure based on defect ground |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108259084A (en) * | 2017-12-26 | 2018-07-06 | 武汉电信器件有限公司 | A kind of assessment harden structure of high-speed light receiver test and its test system |
| CN110856350A (en) * | 2019-11-08 | 2020-02-28 | 广东浪潮大数据研究有限公司 | Compensation method and system for board card edge routing return path and board card |
-
2016
- 2016-06-21 CN CN201620610765.1U patent/CN205681691U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108259084A (en) * | 2017-12-26 | 2018-07-06 | 武汉电信器件有限公司 | A kind of assessment harden structure of high-speed light receiver test and its test system |
| CN108259084B (en) * | 2017-12-26 | 2020-06-30 | 武汉电信器件有限公司 | Evaluation board structure for high-speed optical receiver test and test system thereof |
| CN110856350A (en) * | 2019-11-08 | 2020-02-28 | 广东浪潮大数据研究有限公司 | Compensation method and system for board card edge routing return path and board card |
| CN110856350B (en) * | 2019-11-08 | 2021-03-12 | 广东浪潮大数据研究有限公司 | Compensation method and system for board card edge routing return path and board card |
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| GR01 | Patent grant |