CN201956543U - Device capable of realizing intercommunication of connector with PCB (printed circuit board) ground shielding system - Google Patents
Device capable of realizing intercommunication of connector with PCB (printed circuit board) ground shielding system Download PDFInfo
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- CN201956543U CN201956543U CN2010206582501U CN201020658250U CN201956543U CN 201956543 U CN201956543 U CN 201956543U CN 2010206582501 U CN2010206582501 U CN 2010206582501U CN 201020658250 U CN201020658250 U CN 201020658250U CN 201956543 U CN201956543 U CN 201956543U
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Abstract
The utility model provides a device capable of realizing intercommunication of a connector with a PCB (printed circuit board) ground shielding system, which aims to overcome shortcomings of an existing connector. The device is capable of effectively reducing the problem of larger crosstalk between adjacent signals inside the same sheet and reducing requirement on processing precision of the sheet of the connector. The device is characterized in that a grounding pin is arranged among signal pins on one side of a printed circuit board of a bent female connector and is used for being conducted with a ground layer of the PCB, two ground holes are arranged among signal pins in a PCB package, one ground hole is capable of receiving and conducting the grounding pin of the bent female connector so that the bent female connector realizes conduction of a ground shielding sheet and a ground wire with the ground layer of the PCB, ground wires are additionally arranged among signal wires inside the sheet on the basis of the complete ground shielding sheet, and accordingly the device effectively reduces influence of signal crosstalk and is favorable for high-speed transmission.
Description
Technical field
The utility model relates to a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground, belongs to the network communications technology apparatus field.
Background technology
In communication system, connector is realized being connected of backboard and each professional daughter board, and along with the user bandwidth demand constantly increases, signal rate has reached 6Gbps between backboard and the daughter board, or even 10Gbps.This high speed, highly dense connection requirement have proposed very high request, (Crosstalk) index of particularly crosstalking to the electricity function index of connector.Usually in system, crosstalk power and can being controlled at-the 40dB@ fundamental frequency of expectation connector is to guarantee that error code does not take place high-speed link.
Crosstalk (Crosstalk) be the coupling, the mutual inductance between the holding wire between two signal line and hold the noise that causes on the line mutually.The capacitive coupling causes couple current, and inductive coupled initiation coupled voltages, the electrical characteristic of the parameter of pcb board layer, holding wire spacing, drive end and receiving terminal and line end connect mode all certain influence to crosstalking.Crosstalking is a signal a kind of unwelcome energy value that coupling is produced to the another one signal, according to Maxwell's law, as long as the existence of electric current is arranged, just has magnetic field and exists, and the interference between the magnetic field is exactly the source of crosstalking.This induced signal may cause losing of transfer of data and error of transmission, so crosstalk for comprehensive wiring, has very big influence.
The main crosstalk components of high speed connector is all introduced by adjacent several signals usually, and according to the connector construction characteristics, the source of crosstalk couplings comprises in the same thin slice (Wafer), also comprises crosstalking of adjacent Wafer.For example a differential signal that is in the center not only will be subjected to the interference of adjacent two signals in the same Wafer, and is subjected to two six tunnel adjacent influences of crosstalking that adjacent Wafer is interior up and down simultaneously.
In the curved female connectors of existing ZD+,, can effectively control the crosstalk couplings between the adjacent Wafer owing between adjacent Wafer, there is complete ground shield blade to isolate.But, in same Wafer inside, signal between the pin without any quarantine measures, be connected with PCB on the PIN pin disposal, between adjacent signals is to pin, the ground shield blade has designed two ground pins, and two ground connection effects that realization is connected with PCB have the isolation effect of crosstalking preferably thereby reach signal on PCB.
But, still exist following weak point in the curved female connectors of existing ZD+:
1, in same Wafer, it is bigger to crosstalk between the adjacent signals, can't satisfy the more critical 10Gbps high-speed applications of application;
2 and on the shield blade in the very narrow space, draw two ground pins on a ground, very high to the connector requirement on machining accuracy, rate of finished products is low, the cost height.
Summary of the invention
The utility model promptly is at present connector above shortcomings part, design provides a kind of can effectively reduce the bigger problem of crosstalking between the adjacent signals in the same thin slice, and reduces the realization connector of connector wafer processes required precision and the device of pcb board ground shielding harness intercommunication.
A kind of device of realizing connector and the shielding harness intercommunication of pcb board ground described in the utility model, mentality of designing is as follows:
1. curved female connectors printed circuit board (PCB) (PCB) side, signal is to only designing wherein some ground pin between the pin, be used for and the conducting of PCB stratum, on complete shield blade basis, ground, signal in thin slice (Wafer) between increase the ground cabling, make the electric intercommunication of ground wire in ground shield blade and the Wafer, make up the better connector ground shielding harness of performance;
2. in PCB encapsulated, the signal in the Wafer was to hole, 2 ground of design between the via hole, and one of them hole, ground can receive also ground pin of the curved female connectors of conducting, thereby realized the mutual conducting of ground system and PCB ground system of connector.
Specifically, a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground described in the utility model, described device comprises that connector thin slice, connector ground shielding harness, pcb board, PCB grounding system and signal are to pin, it is characterized in that: also comprise ground pin and hole, PCB ground, wherein
1. adjacent signal is set up a ground pin that is used to realize connector ground shielding harness and the conducting of PCB grounding system between to pin in the connector thin slice, and described ground pin is electrically connected with connector ground shielding harness;
2. in being used to receive and setting up hole, two PCB ground between the telltale hole of adjacent signals to pin of described pcb board, one of them hole, PCB ground is connected with described ground pin, can receive and described ground of conducting pin.
Like this, ground wire and ground shield blade just can be passed through ground pin and the conducting of PCB grounding system, and hole, PCB ground is connected with the ground pin, thereby connector is realized ground shielding harness and the conducting of PCB grounding system.
Described a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground, it is characterized in that: in described device, with adjacent signals line that signal is connected pin between increase ground wire, ground wire is electrically connected with ground shield blade in ground pin and the connector ground shielding harness.
Described a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground is characterized in that: be provided with the connecting terminal that is used to connect ground wire and ground shield blade in described device.
Described a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground is characterized in that: the connected mode of described ground wire and ground shield blade comprises welding, stress shell fragment, buckle, harpoon or crimping.
A kind of device of realizing connector and the shielding harness intercommunication of pcb board ground described in the utility model has following advantage:
1, in the same Wafer of described connector, crosstalking between the signal is lower than-the 40dB@ fundamental frequency, satisfies the high-speed applications of 10Gbps;
2, reduce the requirement on machining accuracy of connector Wafer, improve the connector rate of finished products, reduce cost.
Description of drawings
Fig. 1 is the syndeton schematic diagram of an embodiment of a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground described in the utility model;
Fig. 2 is the syndeton schematic diagram of another embodiment of a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground described in the utility model;
Fig. 3 is a kind of schematic diagram of realizing connector and the corresponding PCB of connector of the device of pcb board ground shielding harness intercommunication described in the utility model;
Wherein, 1 for ground shield blade, 20 be first connecting terminal, 21 be second connecting terminal, 22 be the 3rd connecting terminal, 3 for ground wire, 40 for signal to pin AB, 41 for signal to pin CD, 42 for signal to pin EF, 43 for signal to pin GH, 50 for ground pin BG, 51 for ground pin DG, 52 is ground pin FG, 50 ' be ground pin CG, 51 ' for ground pin EG, 52 ' for ground pin GG, 53 for ground pin AG, 54 for pin HG.
Embodiment
Embodiment one
Fig. 1 has provided single sheet (Wafer) design diagram of connector prioritization scheme, and as can be seen from the figure, prioritization scheme has kept complete ground shield blade 1, thereby can effectively control the crosstalk couplings between the adjacent Wafer.Simultaneously, in same Wafer inside, at signal pin AB40, signal being increased a ground wire to pin CD41, signal between to pin GH43 to pin EF42, signal (only marks among the figure at signal pin EF42 and signal the ground wire between the pin GH43 3, other is in like manner), as the quarantine measures of crosstalking in the Wafer, can effectively reduce crosstalking between the adjacent signals in the Wafer.
In order to guarantee that ground wire and ground shielding conductor have good electric the contact, with the connecting terminal that guarantees the isolation effect of ground wire, in Wafer, designed to be used to realize that ground wire is connected with the ground shield blade.At the two ends of Wafer, all ground wires have all designed connecting terminal, reduce ground wire one end open circuit as far as possible and form isolated copper conductor, the problem that causes electric property to descend.Is example to pin EF42 and signal to the ground wire between the pin GH43 3 with signal, and ground wire 3 has designed connecting terminal 20 in PCB pin one side, to ground wire 3 processing of windowing, ground shield blade 1 is made a shell fragment, can be buckled on the ground wire 3.In order to guarantee the reliable connection between ground wire 3 and the ground shield blade 1, can adopt welding manner, also can adopt stress shell fragment mode, modes such as buckle, crimping, harpoon realize that both reliably connect.Ground wire 3 has designed connecting terminal 21 equally cooperating a side with straight public connector, to ground wire 3 processing of windowing, ground shield blade 1 is made a shell fragment, can be buckled on the ground wire 3.In the Wafer center, ground wire 3 has designed connecting terminal 22 equally, and ground wire 3 is windowed, and ground shield blade 1 is made a shell fragment, thereby ground shield blade 1 can be buckled on the ground wire 3.By connecting terminal, realize that curved female connectors Wafer forms complete ground shielding harness.
Between signal was to pin AB, CD, EF and GH, the Wafer design had only kept a ground pin.In example, kept ground pin BG50 wherein, pin DG51 and ground pin FG52, simultaneously, in the outside of signal to pin AB and GH, also have two ground pin AG53 and ground pin HG54, and these ground pins are to be drawn by ground wire separately, link to each other with PCB by the PIN pin.
In order to guarantee the curved female connectors of ZD+ on PCB, AB, CD, EF and GH signal have the isolation effect of crosstalking preferably on PCB, and PCB encapsulation figure and ZD+ keep compatible, still adopt the encapsulation figure of two via holes.At this moment, BG, DG and FG among ground pin BG, the DG of reservation and FG and the PCB encapsulation figure mate mutually, thereby realize ground shield blade and the ground wire and the conducting of PCB ground system of curved female connectors.Concrete encapsulating structure, as shown in Figure 3, wherein, the telltale hole on AB, CD, the corresponding PCB of EF, GH difference, the hole, ground on AG, BG/CG, DG/EG, FG/GG, the corresponding PCB of HG difference.
AB, CD, EF and GH signal have the isolation effect of crosstalking preferably on PCB, be lower than-the 49dB@ fundamental frequency, satisfy the requirement of 10Gbps high-speed applications.
Embodiment two
As shown in Figure 2, another embodiment described in the utility model mainly is with the difference of embodiment one: the ground pin of reservation is to be drawn by shielding ground sheet, design of Grounding Connections, ground wire with the shield blade connected mode remain unchanged.
Signal to pin AB40, signal to pin CD41, signal to pin EF42, signal to pin GH43 between between, the Wafer design has only kept a ground pin, kept wherein pin CG50 ', pin EG51 ', pin GG52 ', and these ground pins are drawn by ground shield blade 1, link to each other with PCB by the PIN pin.At this moment, CG, DG and FG among ground pin CG, the EG of reservation and GG and the embodiment one encapsulation figure mate mutually, thereby realize ground shield blade and the ground wire and the conducting of PCB ground system of curved female connectors.
A kind of device of realizing connector and the shielding harness intercommunication of pcb board ground described in the utility model realizes that crosstalking between signal AB, CD, EF, the GH is lower than-the 40dB@ fundamental frequency, satisfies the 10Gbps high-speed applications in the curved same Wafer of female connectors of ZD+; And reduce connector Wafer requirement on machining accuracy, and improve the connector rate of finished products, reduce cost.
Should be clear and definite be; above-mentioned be a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground described in the utility model preferred embodiment; rather than to the restriction of described technology contents; in fact; in invention spirit of the present utility model, to increase and decrease, replacement and the improvement of described structure all within the utility model technical scheme required for protection.
Claims (4)
1. device of realizing connector and the shielding harness intercommunication of pcb board ground, described device comprises that connector thin slice, connector ground shielding harness, pcb board, PCB grounding system and signal to pin, is characterized in that: also comprise ground pin and hole, PCB ground, wherein,
1) adjacent signal is set up a ground pin that is used to realize connector ground shielding harness and the conducting of PCB grounding system between to pin in the connector thin slice, and described ground pin is electrically connected with connector ground shielding harness;
2) in being used to receive and setting up hole, two PCB ground between the telltale hole of adjacent signals to pin of described pcb board, one of them hole, PCB ground is connected with described ground pin, can receive and described ground of conducting pin.
2. a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground according to claim 1, it is characterized in that: in described device, with adjacent signals line that signal is connected pin between increase ground wire, ground wire is electrically connected with ground shield blade in ground pin and the connector ground shielding harness.
3. a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground according to claim 2 is characterized in that: be provided with the connecting terminal that is used to connect ground wire and ground shield blade in described device.
4. a kind of device of realizing connector and the shielding harness intercommunication of pcb board ground according to claim 2 is characterized in that: the connected mode of described ground wire and ground shield blade comprises welding, stress shell fragment, buckle, harpoon or crimping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206582501U CN201956543U (en) | 2010-12-14 | 2010-12-14 | Device capable of realizing intercommunication of connector with PCB (printed circuit board) ground shielding system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206582501U CN201956543U (en) | 2010-12-14 | 2010-12-14 | Device capable of realizing intercommunication of connector with PCB (printed circuit board) ground shielding system |
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| Publication Number | Publication Date |
|---|---|
| CN201956543U true CN201956543U (en) | 2011-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206582501U Expired - Fee Related CN201956543U (en) | 2010-12-14 | 2010-12-14 | Device capable of realizing intercommunication of connector with PCB (printed circuit board) ground shielding system |
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| CN (1) | CN201956543U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102570192A (en) * | 2012-02-17 | 2012-07-11 | 四川华丰企业集团有限公司 | Electric connector shielding structure and producing method |
| CN103403955A (en) * | 2013-01-06 | 2013-11-20 | 华为技术有限公司 | Circulator, isolator and circuit assembly |
| CN103474839A (en) * | 2013-09-26 | 2013-12-25 | 深圳格力浦电子有限公司 | High-speed connector capable of transmitting 25G signals |
| WO2016115741A1 (en) * | 2015-01-24 | 2016-07-28 | 深圳市鑫龙上通讯科技有限公司 | Pcb and mobile communications device thereof |
| CN104039074B (en) * | 2014-05-28 | 2017-10-13 | 杭州乐荣电线电器有限公司 | A kind of pcb board with four-way SFP interfaces |
| CN108987972A (en) * | 2018-07-05 | 2018-12-11 | 欧品电子(昆山)有限公司 | High speed connector component, socket connector and its female terminal |
-
2010
- 2010-12-14 CN CN2010206582501U patent/CN201956543U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102570192A (en) * | 2012-02-17 | 2012-07-11 | 四川华丰企业集团有限公司 | Electric connector shielding structure and producing method |
| CN102570192B (en) * | 2012-02-17 | 2015-03-18 | 四川华丰企业集团有限公司 | Electric connector shielding structure and producing method |
| CN103403955A (en) * | 2013-01-06 | 2013-11-20 | 华为技术有限公司 | Circulator, isolator and circuit assembly |
| CN103474839A (en) * | 2013-09-26 | 2013-12-25 | 深圳格力浦电子有限公司 | High-speed connector capable of transmitting 25G signals |
| CN103474839B (en) * | 2013-09-26 | 2015-09-09 | 深圳格力浦电子有限公司 | A kind of can transmis-sion communications frequency be the high speed connector of 25G signal |
| CN104039074B (en) * | 2014-05-28 | 2017-10-13 | 杭州乐荣电线电器有限公司 | A kind of pcb board with four-way SFP interfaces |
| WO2016115741A1 (en) * | 2015-01-24 | 2016-07-28 | 深圳市鑫龙上通讯科技有限公司 | Pcb and mobile communications device thereof |
| CN108987972A (en) * | 2018-07-05 | 2018-12-11 | 欧品电子(昆山)有限公司 | High speed connector component, socket connector and its female terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110831 Termination date: 20111214 |