CN205941988U - Same axle type electro optical assembly - Google Patents
Same axle type electro optical assembly Download PDFInfo
- Publication number
- CN205941988U CN205941988U CN201620846299.7U CN201620846299U CN205941988U CN 205941988 U CN205941988 U CN 205941988U CN 201620846299 U CN201620846299 U CN 201620846299U CN 205941988 U CN205941988 U CN 205941988U
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- China
- Prior art keywords
- pad
- trans
- pin
- pin diode
- impedance amplifier
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Abstract
The utility model discloses a same axle type electro optical assembly, including the tube socket with install in the mirror tube cap thoroughly of tube socket, still be provided with transimpedance amplifier and PIN diode thoroughly in the mirror tube cap, transimpedance amplifier's top surface is provided with PINA pad, PINK pad and pin pad, transimpedance amplifier paste the bottom surface in the tube socket surface, the PIN diode paste in stride ` and hinder the top surface of amplifier, the positive negative pole of PIN diode passes through pin connection respectively the PINA pad with the PINK pad, the pin pad passes through pin connection the pin on tube socket surface. The lead wire of avoiding connecting transimpedance amplifier and PIN diode is close to the lead wire of connecting transimpedance amplifier and tube socket, prevents that it crosstalks to produce the electricity between each lead wire, reduces noise power, carries high sensitivity.
Description
Technical field
This utility model is related to photoelectric communication field, more particularly to a kind of coaxial type photoelectric subassembly.
Background technology
Coaxial type photoelectric subassembly, is widely used in photoelectric communication field, such as EPON, Technical on SDH Network,
Ethernet, optical fiber transport channel or other long-haul transmission systems, transfer rate is up to 10Gb/s..Its structure refer to Fig. 1 and Tu
2, Fig. 1 is the axonometric schematic diagram of coaxial type photoelectric subassembly in prior art；Fig. 2 is the bowing of coaxial type photoelectric subassembly in prior art
Depending on schematic diagram.Lens pipe cap 02 is provided with base 01, be provided with lens pipe cap 02 trans-impedance amplifier 03, PIN diode 04,
Carrier 05 and electric capacity 06.Wherein PIN diode 04 adds low-doped intrinsic of a thin layer between P and N semi-conducting material
(Intrinsic) semiconductor layer forms the diode of P-I-N structure, and trans-impedance amplifier 03 and carrier 05 are pasted on base 01 respectively
The both sides on surface, PIN diode 04 is pasted on carrier 05, the positive pole of PIN diode 04 and negative pole respectively by lead connect across
The PINA pad of impedance amplifier 03 and PINK pad.Pin pad on trans-impedance amplifier 03 or directly base is connected by lead
Pin on 01, or electric capacity 06 is connected by lead, electric capacity reconnects pin.
But, because trans-impedance amplifier 03 and PIN diode 04 belong to separation parallel position, each part is connected by lead
Afterwards, connect trans-impedance amplifier 03 and the lead of PIN diode 04 can be near the lead connecting trans-impedance amplifier 03 and base 01, respectively
Electrical crosstalk can be produced between lead.PIN needle using OUTP and OUTN to product for the equipment is tested, part trans-impedance amplifier
03 and PIN diode 04 mate unsuccessful, the noise power that product test draws is close to 2uW.When carrying out sensitivity test, mistake
Big noise power can have very big interference to signal transmission, and sensitivity is very low, and impact uses.
Therefore, how to provide a kind of it can be avoided that the coaxial type photoelectric subassembly producing electrical crosstalk between lead is this area skill
The current technical issues that need to address of art personnel.
Utility model content
The purpose of this utility model is to provide a kind of coaxial type photoelectric subassembly, it can be avoided that producing electrical crosstalk between lead,
Reduce noise power, improve sensitivity.
For solve above-mentioned technical problem, this utility model provide a kind of coaxial type photoelectric subassembly, include base be installed on
The lens pipe cap of described base, is additionally provided with trans-impedance amplifier and PIN diode, described trans-impedance amplifier in described lens pipe cap
Top surface be provided with PINA pad, PINK pad and pin pad, described trans-impedance amplifier bottom surface is pasted on described base surface,
Described PIN diode is pasted on the top surface of described trans-impedance amplifier, and the both positive and negative polarity of described PIN diode is connected by lead respectively
Described PINA pad and described PINK pad, described pin pad connects the pin on described base surface by lead.
Preferably, described lead is specially spun gold lead.
Preferably, described spun gold lead is specially arc spun gold lead.
Preferably, described trans-impedance amplifier underrun epoxy resin is pasted on described base surface, described PIN diode
It is pasted on the top surface of described trans-impedance amplifier by epoxy resin.
Preferably, described lens pipe cap and described base resistance welding.
Preferably, described lens pipe cap is specially globe lenss pipe cap.
Preferably, the centrage of described trans-impedance amplifier top surface is overlapped with the centrage of described base.
Preferably, the photosurface centrage of described PIN diode is overlapped with the centrage of described base.
Preferably, the described PINA pad center and described PINK pad center photosurface center away from described PIN diode
Distance be respectively less than or be equal to 0.3mm.
The coaxial type photoelectric subassembly that this utility model provides, including base and the lens pipe cap being installed on base, lens tube
It is additionally provided with trans-impedance amplifier and PIN diode, the top surface of trans-impedance amplifier is provided with PINA pad, PINK pad and pipe in cap
Foot pad, trans-impedance amplifier bottom surface is pasted on base surface, and PIN diode is pasted on the top surface of trans-impedance amplifier, PIN diode
Both positive and negative polarity respectively PINA pad and PINK pad are connected by lead, pin pad passes through the pipe of lead connecting tube seating face
Foot.Because PIN diode is pasted and the top surface of trans-impedance amplifier, the lead being connected to PIN diode from trans-impedance amplifier be to
Trans-impedance amplifier center extends, and the lead being connected to the pin of base from trans-impedance amplifier is to prolong to trans-impedance amplifier surrounding
Stretch, so that the set location of two kinds of leads is mutually staggered, it is to avoid connect the close connection of lead of trans-impedance amplifier and PIN diode
Trans-impedance amplifier and the lead of base, prevent from producing electrical crosstalk between each lead, so that product, when carrying out noise testing, is made an uproar
Acoustical power remains nW number of levels, reduces noise power, improves sensitivity.
Brief description
Fig. 1 is the axonometric schematic diagram of coaxial type photoelectric subassembly in prior art；
Fig. 2 is the schematic top plan view of coaxial type photoelectric subassembly in prior art；
Fig. 3 is a kind of axonometric schematic diagram of specific embodiment of coaxial type photoelectric subassembly provided by the utility model；
Fig. 4 is a kind of schematic top plan view of specific embodiment of coaxial type photoelectric subassembly provided by the utility model.
Specific embodiment
Core of the present utility model is to provide a kind of coaxial type photoelectric subassembly, it can be avoided that producing electrical crosstalk between lead,
Reduce noise power, improve sensitivity.
In order that those skilled in the art more fully understand this utility model scheme, below in conjunction with the accompanying drawings and be embodied as
The utility model is described in further detail for mode.
Refer to Fig. 3 and Fig. 4, Fig. 3 is a kind of specific embodiment party of coaxial type photoelectric subassembly provided by the utility model
The axonometric schematic diagram of formula；Fig. 4 is a kind of vertical view of specific embodiment of coaxial type photoelectric subassembly provided by the utility model
Schematic diagram.
The coaxial type photoelectric subassembly that this utility model specific embodiment provides, includes base 1 and is installed on the saturating of base 1
Telescope cap 2, is provided with trans-impedance amplifier 3 and PIN diode 4 in the space being formed by both.The top surface setting of trans-impedance amplifier 3
There are PINA pad, PINK pad and pin pad, trans-impedance amplifier 3 bottom surface is pasted on base 1 surface, and PIN diode 4 is pasted on
The top surface of trans-impedance amplifier 3, the both positive and negative polarity of PIN diode 4 connects PINA pad and PINK pad by lead respectively, and pin welds
Disk connects the pin on base 1 surface by lead, achieves signal of telecommunication transmission by the connection of lead.Wherein trans-impedance amplifier 3
On be provided with PINA pad, PINK pad and pin pad and to paste the one side of PIN diode 4 be top surface, corresponding thereto and glue
Patch and the one side on base 1 surface are bottom surface, and two sides only represents relative position relation, do not represent actually used during position
Relation.
Because PIN diode 4 is pasted on the top surface of trans-impedance amplifier 3, connected from trans-impedance amplifier 3 to PIN diode 4
Lead is to extend to trans-impedance amplifier 3 center, and the lead being connected to the pin of base 1 from trans-impedance amplifier 3 is to across resistance
Amplifier 3 extends around, and so that the set location of two kinds of leads is mutually staggered, it is to avoid connect trans-impedance amplifier 3 and PIN diode
4 lead, near the lead connecting trans-impedance amplifier 3 and base 1, prevents from producing electrical crosstalk between each lead, so that product exists
When carrying out noise testing, noise power remains nW number of levels, reduces noise power, improves sensitivity.This side simultaneously
Formula eliminates ceramic gasket and ceramic condenser, decreases material, reduce further cost.
Specifically, lead is spun gold lead, for proof strength and as much as possible shortens length, is arc spun gold lead,
Picked using thermosonic bonding and carry out gold ball bonding, due to very sensitive to the horizontal length of spun gold and camber, so the water of spun gold
Flat length and camber should be short and low as best one can.Other kinds of lead may also be employed, all in protection domain of the present utility model
Within.Specifically, lens pipe cap 2 can be globe lenss pipe cap, cost-effective further, alternatively other kinds of lens tube
Cap.
In the coaxial type photoelectric subassembly that this utility model specific embodiment provides, trans-impedance amplifier 3 underrun ring
Oxygen tree fat is pasted on base 1 surface, and PIN diode 4 is pasted on the top surface of trans-impedance amplifier 3 by epoxy resin.In base 1
Appropriate epoxy resin is dripped in precalculated position, is got up using the first trans-impedance amplifier of the soft rubber of vac sorb 3 absorption, pastes
On base 1, then PIN diode 4 absorption is got up, paste on trans-impedance amplifier 3 again by epoxy resin.Placement completes
Afterwards, using ultramicroscopic observation, chip lower limb all has epoxy resin to overflow, chip no epoxy resin pollution, position coordinateses
Verification, and put into baking in vacuum oven, complete to paste.Other bonding method may also be employed, all in protection of the present utility model
Within the scope of.
After the completion of stickup, lens pipe cap 2 and base 1 can be installed by resistance welding.Complete the pipe of gold ball bonding
Seat 1 and lens pipe cap 2 are put into after carrying out in high-temperature vacuum baking box toasting some time, are then transferred to the behaviour full of high-purity nitrogen
Make in room, now the display test number of dew point hygrometer should be less than -40 DEG C, and base 1 and lens pipe cap 2 are carried out coaxial electric resistance welding
Connect.
On the basis of the coaxial type photoelectric subassembly that above-mentioned each specific embodiment provides, in trans-impedance amplifier 3 top surface
Heart line is overlapped with the centrage of base 1.The length of the lead connecting trans-impedance amplifier 3 and base 1 can be shortened, prevent further
Electrical crosstalk, reduces parasitic capacitance and the resistance of lead simultaneously, enhances product performance.
Further, the photosurface centrage of PIN diode 4 is overlapped with the centrage of base 1.Connection can be shortened across resistance
The length of the lead of amplifier 3 and PIN diode 4, specifically, makes PINA pad center and PINK pad center away from PIN bis- pole
The distance at the photosurface center of pipe 4 is respectively less than or is equal to 0.3mm, i.e. no more than 0.3mm.Prevent electrical crosstalk further, subtract simultaneously
The parasitic capacitance of few lead and resistance, enhance product performance.The set-up mode of each part can be adjusted according to practical situation, all at this
Within the protection domain of utility model.
Above coaxial type photoelectric subassembly provided by the utility model is described in detail.Used herein specifically
Individual example is set forth to principle of the present utility model and embodiment, and the explanation of above example is only intended to help understand this
The method of utility model and its core concept.It should be pointed out that for those skilled in the art, without departing from
On the premise of this utility model principle, this utility model can also be carried out with some improvement and modify, these improve and modify
Fall in this utility model scope of the claims.
Claims (9)
1. a kind of coaxial type photoelectric subassembly, including base (1) with the lens pipe cap (2) that is installed on described base (1), described lens
It is additionally provided with trans-impedance amplifier (3) and PIN diode (4) it is characterised in that the top of described trans-impedance amplifier (3) in pipe cap (2)
Face is provided with PINA pad, PINK pad and pin pad, and described trans-impedance amplifier (3) bottom surface is pasted on described base (1) table
Face, described PIN diode (4) is pasted on the top surface of described trans-impedance amplifier (3), and the both positive and negative polarity of described PIN diode (4) is respectively
Described PINA pad and described PINK pad are connected by lead, described pin pad connects described base (1) table by lead
The pin in face.
2. coaxial type photoelectric subassembly according to claim 1 is it is characterised in that described lead is specially spun gold lead.
3. coaxial type photoelectric subassembly according to claim 2 is it is characterised in that described spun gold lead is specially arc spun gold
Lead.
4. coaxial type photoelectric subassembly according to claim 1 is it is characterised in that described trans-impedance amplifier (3) underrun
Epoxy resin is pasted on described base (1) surface, and described PIN diode (4) is pasted on by epoxy resin described amplifies across resistance
The top surface of device (3).
5. coaxial type photoelectric subassembly according to claim 1 is it is characterised in that described lens pipe cap (2) and described base
(1) resistance welding.
6. coaxial type photoelectric subassembly according to claim 5 is it is characterised in that described lens pipe cap (2) specially ball is saturating
Telescope cap.
7. the coaxial type photoelectric subassembly according to claim 1 to 6 any one is it is characterised in that described trans-impedance amplifier
(3) centrage of top surface is overlapped with the centrage of described base (1).
8. coaxial type photoelectric subassembly according to claim 7 is it is characterised in that in the photosurface of described PIN diode (4)
Heart line is overlapped with the centrage of described base (1).
9. coaxial type photoelectric subassembly according to claim 8 is it is characterised in that described PINA pad center and described PINK
The distance at the photosurface center away from described PIN diode (4) for the pad center is respectively less than or is equal to 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620846299.7U CN205941988U (en) | 2016-08-04 | 2016-08-04 | Same axle type electro optical assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620846299.7U CN205941988U (en) | 2016-08-04 | 2016-08-04 | Same axle type electro optical assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205941988U true CN205941988U (en) | 2017-02-08 |
Family
ID=57921831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620846299.7U Expired - Fee Related CN205941988U (en) | 2016-08-04 | 2016-08-04 | Same axle type electro optical assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205941988U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111865429A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver and manufacturing method thereof |
-
2016
- 2016-08-04 CN CN201620846299.7U patent/CN205941988U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111865429A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver and manufacturing method thereof |
| CN111865429B (en) * | 2019-04-30 | 2022-05-27 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170208 |