CN207366793U - A kind of light receiving element structure - Google Patents
A kind of light receiving element structure Download PDFInfo
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- CN207366793U CN207366793U CN201721081989.9U CN201721081989U CN207366793U CN 207366793 U CN207366793 U CN 207366793U CN 201721081989 U CN201721081989 U CN 201721081989U CN 207366793 U CN207366793 U CN 207366793U
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- chip
- receiving element
- light receiving
- heat sink
- pad
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Abstract
It the utility model is related to optical device technical field, more particularly to a kind of light receiving element structure.Structure includes chip pad 31, detection chip 32, amplifier chip 33, heat sink 34 and sealing cap 35, specifically：Described heat sink 34 on the base, and heat sink 34 fix the detection chip 32 close to the side at 31 center of chip pad, wherein, the window in the receipts smooth surface and sealing cap 35 of the detection chip 32 is in a straight line；The amplifier chip 33 is fixed on the base, the amplifier chip 33, the pin in chip pad 31 and is welded to connect between detection chip 32 by spun gold.The utility model proposes a kind of light receiving element structure, the structure is by being multiplexed the understructure of existing light emitting devices, the layout cost of production line and the cost of fund of dispensing are simplified, improves the multiplexing performance and cost performance of the base that the utility model is proposed.
Description
Technical field
It the utility model is related to optical device technical field, more particularly to a kind of light receiving element structure.
Background technology
With flourishing for optical communication, people are higher and higher to the demand of network, while the requirement to cost is also more next
It is harsher.As optical communication core optical module, its most of cost is determined by optical device.Optical communication device is by light emitting TO-CAN
Formed with light-receiving TO-CAN.At present, global package of optical device producer often invests two kinds of production line production TO-CAN, one kind
It is light emitting TO-CAN (being commonly called as TO56) production line, another light-receiving TO-CAN (being commonly called as TO46) production line.This means envelope
It is huge to fill producer's early investment, and production line resource is underused and wasting phenomenon occurs；And produce the factory of sealed in unit
Family is also required to design different type equipment to support the different process demand of encapsulation producer, this causes the resource wave of whole industrial chain
Take.Traditional TO56 encapsulating structures as shown in Figure 1, including base 1, heat sink 2, laser chip 3 and back light detector 4, wherein, swash
Optical chip 3 is fixed on heat sink 2, to produce perpendicular to 1 plane of base and outside signal laser at the same time, what it was produced
It can be received perpendicular to 1 plane of base and the inside laser for detection by the back light detector 4 on base 1.Traditional
The encapsulating structure of T046 is as shown in Fig. 2, including base 21, detection chip 22, amplifier chip 23 and electric capacity chip 24, wherein visiting
Survey chip 22 and amplifier chip 23 is arranged on base 21.
Utility model content
One of the purpose of this utility model is to overcome to be required to set for existing light emitting devices and light receiving element
Two sets of production lines are counted, cause production line resource to underuse and wasting phenomenon occurs；And produce the producer of sealed in unit
Need to design different type equipment to support the different process demand of encapsulation producer, this causes the wasting of resources of whole industrial chain.
The utility model is realized in this way：
The utility model provides a kind of light receiving element structure, and structure includes chip pad 31, detection chip 32, amplification
Device chip 33, heat sink 34 and sealing cap 35, specifically：
Described heat sink 34 on the base, and heat sink 34 fix the detection core close to the side at 31 center of chip pad
Piece 32, wherein, the window in the receipts smooth surface and sealing cap 35 of the detection chip 32 is in a straight line；
The amplifier chip 33 is fixed on the base, the pin on the amplifier chip 33, chip pad 31
And it is welded to connect between detection chip 32 by spun gold.
Preferably, the window in the receipts smooth surface of the detection chip 32 and sealing cap 35 in a straight line, is specially：
Lens 351, the focus of the lens 351 and the detection chip 32 are provided with the window at 35 center of sealing cap
Receipts luminous point overlap.
Preferably, the detection chip 32 is fixed on described heat sink 34, and the amplifier chip 33 be fixed on it is described
After in chip pad 31, the pin of the pin of detection chip 32 and the amplifier chip 33 is at a distance of pre-determined distance；Wherein, it is described
Pre-determined distance is 500um~1000um.
Preferably, amplifier chip 33 is specially trans-impedance amplifier.
Preferably, 1-2 chip capacitor patches are additionally provided with the chip pad 31, the capacitive plates connect the amplification
Device chip 33.
Preferably, the quantity of the pin of the chip pad 31 is 2,3,4 or 5.
Preferably, described heat sink 34 surfaces for being used to fix the detection chip 32 are additionally provided with light absorbent.
Preferably, the chip pad 31, heat sink 34 and sealing cap 35 make according to the specification of TO56.
The utility model embodiment proposes a kind of light receiving element structure, and the structure is by being multiplexed existing light emitting
The understructure of device, simplifies the layout cost of production line and the cost of fund of dispensing, improves the utility model and proposed
Base multiplexing performance and cost performance.
Brief description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 provides a kind of existing light emitting devices structure diagram for the utility model；
Fig. 2 provides a kind of existing light receiving element structure diagram for the utility model；
Fig. 3 is a kind of light receiving element structure diagram that the utility model embodiment provides；
Fig. 4 is a kind of sealing cap structure diagram for light receiving element that the utility model embodiment provides；
Fig. 5 is a kind of light receiving element noise light-path schematic diagram that the utility model embodiment provides.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the premise of creative work
Lower obtained all other embodiment, shall fall within the protection scope of the present invention.
The utility model embodiment provides a kind of light receiving element structure, and as shown in Figure 3 and Figure 4, structure includes chip
Base 31, detection chip 32, amplifier chip 33, heat sink 34 and sealing cap 35, specifically：
Described heat sink 34 on the base, and heat sink 34 fix the detection core close to the side at 31 center of chip pad
Piece 32, wherein, the window in the receipts smooth surface and sealing cap 35 of the detection chip 32 is in a straight line；
The amplifier chip 33 is fixed on the base, the pin on the amplifier chip 33, chip pad 31
And it is welded to connect between detection chip 32 by spun gold.
The utility model embodiment proposes a kind of light receiving element structure, and the structure is by being multiplexed existing light emitting
The understructure of device, simplifies the layout cost of production line and the cost of fund of dispensing, improves the utility model and proposed
Base multiplexing performance and cost performance.
Traditional detector chip structure is that light is received in front；The detector chip that the utility model embodiment is proposed is side
Receive light in face.Further, the utility model embodiment additionally provides a kind of feasible detector chip model, such as：Model
WGPD10, main specifications parameter：Size is 250um*250um*150um；Re=0.8A/W；Id=10nA.
In the utility model embodiment, there are a kind of preferable implementation, can ensure corresponding laser device originally
The light receiving element that compatible can equally be proposed to the utility model embodiment of sealing cap 35, specifically, the detection
The receipts smooth surface of chip 32 in a straight line, is specially with the window on sealing cap 35：
Lens 351, the focus of the lens 351 and the detection chip 32 are provided with the window at 35 center of sealing cap
Receipts luminous point overlap.
Since the light receiving element that the utility model embodiment is proposed needs to support the speed such as 2.5G, 10G, 25G, just need
The distance that spun gold welds between 33 pin of detection chip 32 and amplifier chip is compressed, therefore, is implemented with reference to the utility model
Example, also there are one kind to answer actual demand and improvement project, specifically, the detection chip 32 is fixed on described heat sink 34, and
After the amplifier chip 33 is fixed in the chip pad 31, the pin of detection chip 32 and the amplifier chip 33
Pin is at a distance of pre-determined distance；Wherein, the pre-determined distance is 500um~1000um.
In the utility model embodiment, the amplifier chip 33 is specially trans-impedance amplifier.Such as：10G TIA (types
Number：MAX24005).
During the utility model embodiment realization, the amplifier chip 33 can be high integration, can also
Peripheral circuit auxiliary is needed to realize, for the scheme for needing peripheral circuit auxiliary to realize, specifically, the chip pad 31
On be additionally provided with 1-2 chip capacitor patches, the capacitive plates connect the amplifier chip 33.By taking two capacitances as an example, with reference to
(specific amplifier chip 33 is 10G TIA (models to structure described in the utility model embodiment：When MAX24005)), it can use
One is 470pF (models：SL05X7R1H471M15)；One is 1nF (models：SL10X7R2A102M25).
31 type of chip pad can be a variety of used in the utility model embodiment, such as：The chip pad 31
Pin quantity be 2,3,4 or 5.
In the prior art because detection chip 32 is integrally fixed in chip pad 31, and smooth surface is received backwards to chip pad 31
, thus will not run into because chip pad 31 produce reflected light incide the reception smooth surface of detection chip 32 after, generation
Noise light influences.However, in the scheme that the utility model is released, it is solid due to being used on the light inlet of sealing cap 35, heat sink 34
The surface of the fixed detection chip 32, and there are possible optical channel between the receipts smooth surface of detection chip 32, such as band arrow in Fig. 5
Shown in the optical channel of head, therefore noise can be brought to detection chip 32.In order to improve the above problem, implement with reference to the utility model
Example, also there are a kind of improvement project, described heat sink 34 surfaces for being used to fix the detection chip 32 are additionally provided with light absorbent.
The absorption of different wave length optical signal, is adapted to the different light absorbent of selection, wherein, the selection of light absorbent belongs to prior art,
Details are not described herein.
The TO56 that the encapsulating structure for the light receiving element that the utility model is proposed is previously mentioned suitable for background technology, tool
Body：The chip pad 31, heat sink 34 and sealing cap 35 make according to the specification of TO56.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on, should be included in the utility model
Protection domain within.
Claims (8)
1. a kind of light receiving element structure, it is characterised in that structure includes chip pad (31), detection chip (32), amplification
Device chip (33), heat sink (34) and sealing cap (35), specifically：
Described heat sink (34) are located on the base, and heat sink (34) fix the detection close to the side at chip pad (31) center
Chip (32), wherein, the window in the receipts smooth surface and sealing cap (35) of the detection chip (32) is in a straight line；
The amplifier chip (33) is fixed on the base, the pipe on the amplifier chip (33), chip pad (31)
It is welded to connect between foot and detection chip (32) by spun gold.
2. light receiving element structure according to claim 1, it is characterised in that the receipts smooth surface of the detection chip (32) with
Window on sealing cap (35) in a straight line, be specially：
Lens (351), focus and the detection chip of the lens (351) are provided with the window at sealing cap (35) center
(32) receipts luminous point overlaps.
3. light receiving element structure according to claim 1, it is characterised in that the detection chip (32) is fixed on described
On heat sink (34), and after the amplifier chip (33) is fixed in the chip pad (31), the pad of detection chip (32)
Pad spacing with the amplifier chip (33) is pre-determined distance；Wherein, the pre-determined distance is 500um~1000um.
4. light receiving element structure according to claim 1, it is characterised in that amplifier chip (33) is specially to be put across resistance
Big device.
5. light receiving element structure according to claim 1, it is characterised in that be additionally provided with the chip pad (31)
1-2 chip capacitor patches, the capacitive plates connect the amplifier chip (33).
6. the light receiving element structure described in the claim 1, it is characterised in that the number of the pin of the chip pad (31)
Measure as 2,3,4 or 5.
7. the light receiving element structure described in the claim 1, it is characterised in that described heat sink (34) are used to fix the spy
The surface for surveying chip (32) is additionally provided with light absorbent.
8. the light receiving element structure described in the claim 1, it is characterised in that the chip pad (31), heat sink (34)
Made with sealing cap (35) according to the specification of TO56.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721081989.9U CN207366793U (en) | 2017-08-25 | 2017-08-25 | A kind of light receiving element structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721081989.9U CN207366793U (en) | 2017-08-25 | 2017-08-25 | A kind of light receiving element structure |
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| Publication Number | Publication Date |
|---|---|
| CN207366793U true CN207366793U (en) | 2018-05-15 |
Family
ID=62350762
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721081989.9U Active CN207366793U (en) | 2017-08-25 | 2017-08-25 | A kind of light receiving element structure |
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| CN (1) | CN207366793U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110412699A (en) * | 2019-07-24 | 2019-11-05 | 大连藏龙光电子科技有限公司 | A kind of EML Laser emission and receiver integrative packaging method and encapsulating structure |
| CN111865430A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver |
| WO2022213403A1 (en) * | 2021-04-06 | 2022-10-13 | 桂林芯飞光电子科技有限公司 | Visual cap-sealing system and cap-sealing method |
-
2017
- 2017-08-25 CN CN201721081989.9U patent/CN207366793U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111865430A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver |
| CN110412699A (en) * | 2019-07-24 | 2019-11-05 | 大连藏龙光电子科技有限公司 | A kind of EML Laser emission and receiver integrative packaging method and encapsulating structure |
| WO2022213403A1 (en) * | 2021-04-06 | 2022-10-13 | 桂林芯飞光电子科技有限公司 | Visual cap-sealing system and cap-sealing method |
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