CN205846436U - Single TO encapsulates BOSA - Google Patents
Single TO encapsulates BOSA Download PDFInfo
- Publication number
- CN205846436U CN205846436U CN201620631128.2U CN201620631128U CN205846436U CN 205846436 U CN205846436 U CN 205846436U CN 201620631128 U CN201620631128 U CN 201620631128U CN 205846436 U CN205846436 U CN 205846436U
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- China
- Prior art keywords
- boss
- chip
- base
- bosa
- pick
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- 238000004020 luminiscence type Methods 0.000 claims abstract description 32
- 239000000523 sample Substances 0.000 claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000012536 packaging technology Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000004891 communication Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
This utility model provides a kind of single TO and encapsulates BOSA, including: base, described base includes a base platform and the base boss being convexly equipped on described base platform, and described base boss includes a forward boss and with the described vertically disposed side of forward boss to boss；Luminescence chip, is arranged on described forward boss；Pick-up probe chip, is arranged on described lateral boss, and the light path of laser that described luminescence chip is launched is positioned at approximately the same plane with the light path of the laser of described pick-up probe chip reception.This utility model list TO encapsulation BOSA is by arranging base platform and base boss, by luminescence chip and pick-up probe chip package on same base, simplify packaging technology, improve packaging efficiency, and reduce the overall dimensions of device, reach the purpose of miniaturization.
Description
Technical field
This utility model relates to the components and parts of optical communication field, particularly relates to a kind of single TO and encapsulates BOSA.
Background technology
In optical communication field, coaxial packaging technique is highly developed.General sequence is: first make reception PD TO CAN,
Launch LD TO CAN, PD TO CAN and LD TO CAN is analyzed couple the most again, be finally fabricated to device BOSA.
The metal material that wherein PD TO CAN uses includes the TO46 base of filled gold material, metal material
TO52 Cap etc..They broadly fall into the packaging technology of " metal glass ".The material side of including part that BOSA uses, diaphragm,
Contact pin etc..Optic communication enterprise typically can set up two separately and produce line, makes TO CAN and BOSA respectively, and packaging technology is more complicated,
Cause packaging efficiency low.
So need to design a kind of Simplified flowsheet BOSA device.
Utility model content
The purpose of this utility model is to provide a kind of single TO to encapsulate BOSA, it is intended to be used for solving existing BOSA device envelope
Dress complex process, the problem that packaging efficiency is low.
This utility model is achieved in that
This utility model provides a kind of single TO to encapsulate BOSA, it is characterised in that including: base, described base includes an end
Seat platform and the base boss being convexly equipped on described base platform, described base boss includes a forward boss and with described
The vertically disposed side of forward boss is to boss；Luminescence chip, is arranged on described forward boss；Pick-up probe chip, if
Put on described lateral boss, and the light path of the laser of described luminescence chip transmitting is sharp with what described pick-up probe chip received
The light path of light is positioned at approximately the same plane.
Further, described luminescence chip is mounted on described forward boss by a luminescence chip is heat sink, described reception
Detector chip is mounted on described lateral boss by a detector chip pad.
Further, between described forward boss and described lateral boss, form a turning, described luminescence chip and described
Pick-up probe chip is respectively positioned in described turning.
Further, including an Amici prism, described Amici prism is mounted on described forward boss and is positioned at described sending out
Above optical chip.
Further, having one 45 degree of reflectings surface inside described Amici prism, what described pick-up probe chip received swashs
Light is through described 45 degree of reflectings surface.
Further, including a trans-impedance amplifier, described trans-impedance amplifier be fixed on described base boss top and with
Described pick-up probe chip is connected.
Further, including a back light detector chip, described back light detector chip is fixed on described base platform
And be positioned at below described luminescence chip.
Further, multiple the cutting down having connection corresponding with the pin below base platform above described base platform is drawn
Line, multiple described can cut down lead-in wire connection corresponding with the element on base.
This utility model has the advantages that
This utility model list TO encapsulation BOSA is by arranging base platform and base boss, by luminescence chip and reception detection
Device chip package, on same base, simplifies packaging technology, improves packaging efficiency, and reduces the overall dimensions of device,
Reach the purpose of miniaturization；And base boss includes that an orthogonal forward boss and side, to boss, are respectively intended to fix
Luminescence chip and pick-up probe chip, make the light path of the laser that described luminescence chip launches connect with described pick-up probe chip
The light path of the laser received is positioned at approximately the same plane, it is achieved what the laser that luminescence chip is launched and pick-up probe chip accepted swashs
The same axiation of light.
Accompanying drawing explanation
The structural representation of a kind of single TO encapsulation BOSA that Fig. 1 provides for this utility model embodiment.
Description of reference numerals: 1-base platform, 10-base boss, 11-forward boss, the lateral boss of 12-, 2-luminescence core
Sheet, 21-luminescence chip is heat sink, 3-pick-up probe chip, 31-detector chip pad, 4-Amici prism, 41-45 degree reflection
Face, 5-trans-impedance amplifier, 6-back light detector chip, 7-can cut down lead-in wire, 8-pin.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The all other embodiments obtained, broadly fall into the scope of this utility model protection.
Such as Fig. 1, this utility model embodiment provides a kind of single TO to encapsulate BOSA, including: base, described base includes an end
Seat platform 1 and the base boss 10 being convexly equipped on described base platform 1, described base boss 10 includes a base boss 11
And with the described vertically disposed side of base boss 11 to boss 12；Luminescence chip 2, is arranged on the one of described base boss 11
Side；Pick-up probe chip 3, is arranged on the side of described lateral boss 12, and the light path of the laser of described luminescence chip 2 transmitting
It is positioned at approximately the same plane with the light path of the laser of described pick-up probe chip 3 acceptance.
Specifically, described luminescence chip 2 is mounted on the side of described base boss 11, institute by a luminescence chip heat sink 21
State pick-up probe chip 3 and be mounted on the side of described lateral boss 12, and described luminescence by a detector chip pad 31
Chip 2 and described pick-up probe chip 3 are respectively positioned in a turning of described base boss 11 and the formation of described lateral boss 12,
The position of described luminescence chip 2 is less than the position of described pick-up probe chip 3.
Such as Fig. 1, this utility model embodiment farther includes an Amici prism 4, and described Amici prism 4 is mounted on the described end
Seat boss 11 on and be positioned at above described luminescence chip 2, roughly equal with the height of described pick-up probe chip 3, described point
The inside of light prism 4 has one 45 degree of reflectings surface 41.The position of described Amici prism 4 needs accurate placement, on the one hand, described luminescence
The laser that chip 2 is launched can be wholly transmissive by described Amici prism 4, during transmission, and this laser not side of change
To, the most linearly propagate, on the other hand, the laser that described pick-up probe chip 3 receives is through described 45 degree of reflectings surface 41
Described pick-up probe chip 3 is entered after being totally reflected.
Such as Fig. 1, this utility model embodiment also includes trans-impedance amplifier 5 and a back light detector chip 6, described across
Impedance amplifier 5 is connected with described pick-up probe chip 3, for optimizing the performance of described pick-up probe chip 3, described across
Impedance amplifier 5 is fixed on the top of described base boss 11, further saves space.Described back light detector chip 6 is fixed
On described base platform 1 and be positioned at below described luminescence chip 2, for receiving the backlight that described luminescence chip 2 produces.Described
Having multiple lead-in wires 7 that cut down of connection corresponding with the pin 8 below base platform 1 above base platform 1, multiple described can cutting down are drawn
Line 7 is corresponding with each element on base to be connected.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this
Within the spirit of utility model and principle, any modification, equivalent substitution and improvement etc. made, should be included in this utility model
Protection domain within.
Claims (8)
1. a single TO encapsulates BOSA, it is characterised in that including:
Base, described base includes a base platform and the base boss being convexly equipped on described base platform, described base
Boss includes a forward boss and with the described vertically disposed side of forward boss to boss；
Luminescence chip, is arranged on described forward boss；
Pick-up probe chip, is arranged on described lateral boss, and the light path of the laser of described luminescence chip transmitting is with described
The light path of the laser that pick-up probe chip receives is positioned at approximately the same plane.
2. single TO as claimed in claim 1 encapsulates BOSA, it is characterised in that: described luminescence chip is heat sink by a luminescence chip
Being mounted on described forward boss, described pick-up probe chip is mounted on described lateral boss by a detector chip pad
On.
3. single TO as claimed in claim 1 encapsulates BOSA, it is characterised in that: between described forward boss and described lateral boss
Form a turning, described luminescence chip and described pick-up probe chip to be respectively positioned in described turning.
4. single TO as claimed in claim 1 encapsulates BOSA, it is characterised in that: farther include an Amici prism, described light splitting
Prism is mounted on described forward boss and is positioned at above described luminescence chip.
5. single TO as claimed in claim 4 encapsulates BOSA, it is characterised in that: there are inside described Amici prism one 45 degree of reflections
Face, the laser that described pick-up probe chip receives is through described 45 degree of reflectings surface.
6. TO as claimed in claim 1 single encapsulates BOSA, it is characterised in that: farther include a trans-impedance amplifier, described across
Impedance amplifier is fixed on the top of described base boss and is connected with described pick-up probe chip.
7. single TO as claimed in claim 1 encapsulates BOSA, it is characterised in that: farther include a back light detector chip, institute
State back light detector chip to be fixed on described base platform and be positioned at below described luminescence chip.
8. single TO as claimed in claim 1 encapsulates BOSA, it is characterised in that: have and base platform above described base platform
Multiple lead-in wires that cut down that the pin correspondence of lower section connects, multiple described can cut down lead-in wire connection corresponding with the element on base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620631128.2U CN205846436U (en) | 2016-06-24 | 2016-06-24 | Single TO encapsulates BOSA |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620631128.2U CN205846436U (en) | 2016-06-24 | 2016-06-24 | Single TO encapsulates BOSA |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205846436U true CN205846436U (en) | 2016-12-28 |
Family
ID=57620346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620631128.2U Active CN205846436U (en) | 2016-06-24 | 2016-06-24 | Single TO encapsulates BOSA |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205846436U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109541762A (en) * | 2018-12-29 | 2019-03-29 | 广东瑞谷光网通信股份有限公司 | The high speed list TO-CAN optical transceiving device and its processing method of coaxial packaging |
| CN111865430A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver |
-
2016
- 2016-06-24 CN CN201620631128.2U patent/CN205846436U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109541762A (en) * | 2018-12-29 | 2019-03-29 | 广东瑞谷光网通信股份有限公司 | The high speed list TO-CAN optical transceiving device and its processing method of coaxial packaging |
| CN111865430A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221026 Address after: 438000 Nanhu Industrial Park, Huangzhou District, Wuhan, Hubei Patentee after: Hubei Ruichuang Xinda Optoelectronics Co.,Ltd. Address before: 430223 Hubei city of Wuhan province Huazhong University of Science and Technology science and Technology Park of East Lake high tech Development Zone Zhengyuan photon Industrial Park Patentee before: WUHAN HUAGONG GENUINE OPTICS TECH Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221123 Address after: Nanhu Industrial Park, Huangzhou District, Huanggang City, Hubei Province 438000 Patentee after: Hubei Ruichuang Xinda Optoelectronics Co.,Ltd. Patentee after: WUHAN HUAGONG GENUINE OPTICS TECH Co.,Ltd. Address before: 438000 Nanhu Industrial Park, Huangzhou District, Wuhan, Hubei Patentee before: Hubei Ruichuang Xinda Optoelectronics Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231026 Address after: Nanhu Industrial Park, Huangzhou District, Huanggang City, Hubei Province 438000 Patentee after: Hubei Ruichuang Xinda Optoelectronics Co.,Ltd. Address before: Nanhu Industrial Park, Huangzhou District, Huanggang City, Hubei Province 438000 Patentee before: Hubei Ruichuang Xinda Optoelectronics Co.,Ltd. Patentee before: WUHAN HUAGONG GENUINE OPTICS TECH Co.,Ltd. |
|
| TR01 | Transfer of patent right |