CN204696445U - For the novel base of laser coaxial encapsulation - Google Patents
For the novel base of laser coaxial encapsulation Download PDFInfo
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- CN204696445U CN204696445U CN201520056923.9U CN201520056923U CN204696445U CN 204696445 U CN204696445 U CN 204696445U CN 201520056923 U CN201520056923 U CN 201520056923U CN 204696445 U CN204696445 U CN 204696445U
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Abstract
The utility model relates to a kind of novel base for laser coaxial encapsulation, comprise device body, circuit substrate and circuit, described circuit substrate is fixed on described device body, and from top to bottom through described device body, described circuit substrate and described device body adopt coaxial packaging, described circuit is located on described circuit substrate, described device body adopts teleoseal to make, described circuit substrate adopts aluminium nitride to make, described circuit has four pins, four pins adopt the arrangement mode of golden finger, it is respectively detector anode pin, detector negative electrode pin and two high speed signal input pins.The described novel base for laser coaxial encapsulation adopts coaxial packaging, combines, reduces cost, various build-out resistor can be integrated in circuit simultaneously, thus improve the high-frequency transmission performance of this base with existing technique platform.
Description
Technical field
The utility model relates to a kind of novel base for laser coaxial encapsulation, belongs to optical communication field.
Background technology
As shown in Figure 3, because pin is long lead, all can introduce stray inductance at pin and device inside gold wire bonding, stray inductance brings filter effect to cause bandwidth of a device to decline to traditional TO encapsulation base plate.Owing to adopting this base inevitably to bring impedance mismatching, cause the decay of high-frequency signal, therefore, this base is not suitable for high-frequency transmission.
Therefore be necessary to design a kind of novel base for laser coaxial encapsulation, to overcome the problems referred to above.
Utility model content
The purpose of this utility model is the defect overcoming prior art, provides a kind of novel base for laser coaxial encapsulation realizing high-frequency transmission.
The utility model is achieved in that
The utility model provides a kind of novel base for laser coaxial encapsulation, comprise device body, circuit substrate and circuit, described circuit substrate is fixed on described device body, and from top to bottom through described device body, described circuit substrate and described device body adopt coaxial packaging, described circuit is located on described circuit substrate, described device body adopts teleoseal to make, described circuit substrate adopts aluminium nitride to make, described circuit has four pins, four pins adopt the arrangement mode of golden finger, it is respectively detector anode pin, detector negative electrode pin and two high speed signal input pins.
Further, fixed by glass insulator between described device body and described circuit substrate.
Further, described circuit comprises build-out resistor and co-planar waveguide line.
Further, the surface of described device body is Gold plated Layer.
Further, the thickness of the Gold plated Layer of described device body is not less than 0.3 μm.
Further, described circuit adopts the mode of evaporation to be arranged on described circuit substrate.
Further, described device body adopts mechanical stamping shaping.
The utility model has following beneficial effect:
The described novel base for laser coaxial encapsulation, comprise device body, circuit substrate and circuit, described circuit substrate is fixed on described device body, and from top to bottom through described device body, adopt coaxial packaging, combine with existing technique platform, reduce cost, various build-out resistor can be integrated in circuit simultaneously, thus improve the high-frequency transmission performance of this base.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The stereogram of the novel base for laser coaxial encapsulation that Fig. 1 provides for the utility model embodiment;
The end view of the novel base for laser coaxial encapsulation that Fig. 2 provides for the utility model embodiment;
Fig. 3 is the structural representation of existing traditional TO encapsulation base plate.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, other embodiments all that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belong to the scope of the utility model protection.
As Fig. 1 to Fig. 2, the utility model embodiment provides a kind of novel base for laser coaxial encapsulation, comprise device body A, circuit substrate B and circuit C, described circuit substrate B is fixed on described device body A, and from top to bottom through described device body A, both adopt coaxial packaging.Described circuit C is located on described circuit substrate B.
As Fig. 1 to Fig. 2, described device body A adopts teleoseal to make, and described device body A adopts mechanical stamping shaping, and its overall dimension is consistent with conventional coaxial encapsulation base plate, the surface of described device body A is Gold plated Layer, and the thickness of the Gold plated Layer of described device body A is not less than 0.3 μm.Be fixed together by glass insulator between described device body A and described circuit substrate B.
As Fig. 1 to Fig. 2, described circuit substrate B adopts aluminium nitride to make, and the high speed circuit making substrate with this material has good high frequency characteristics.
As Fig. 1 to Fig. 2, described circuit C has four pins, and four pins adopt the arrangement mode of golden finger, and it is respectively detector anode pin C1, a detector negative electrode pin C2 and two high speed signal input pin (C3, C4).The reverse Gold plated Layer of described circuit C is ground area.Described circuit C adopts titanium (Ti), platinum (Pt) and gold (Au) material to make.Concrete, circuit C material is Ti (0.2um)/Pt (0.2um)/Au (0.5um).Black region surface in circuit C is solder layer, and material is Au:Sn.Described circuit C is containing build-out resistor and co-planar waveguide line.Described circuit C adopts the mode of evaporation to be arranged on described circuit substrate B.
The described novel base for laser coaxial encapsulation adopts coaxial packaging, combines, reduces costs, build-out resistor be integrated in circuit C, can improve the high-frequency transmission performance of this base with existing technique platform.
Four pins of described circuit C take golden finger arrangement mode, simplify technological process, and medium base needs 4 pin glass high temperature sinterings, and the utility model is then reduced to one.
Negative electrode and the circuit substrate B of laser diode are weldingly connected by eutectic, the anode of laser diode by gold wire bonding to circuit.This bonding line can be controlled in 100um, and when the stray inductance of laser diode spun gold is more than 0.3nH, frequency response will significantly decline, and affects high-frequency transmission performance.And the utility model embodiment provides a kind of stray inductance of the novel base introducing for laser coaxial encapsulation to be no more than 0.1nH, performance has certain advantage.
The utility model embodiment provides a kind of pin arrangement mode of the novel base for laser coaxial encapsulation to be beneficial to light path coupling, more more convenient than the device of conventional coaxial encapsulation.
According to different transmission rates (10Gb/s, 25Gb/s), can integrated different build-out resistor and transmission line in circuit, meet the demand of different drive circuit for laser.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (7)
1. the novel base for laser coaxial encapsulation, it is characterized in that, comprise device body, circuit substrate and circuit, described circuit substrate is fixed on described device body, and from top to bottom through described device body, described circuit substrate and described device body adopt coaxial packaging, described circuit is located on described circuit substrate, described device body adopts teleoseal to make, described circuit substrate adopts aluminium nitride to make, described circuit has four pins, four pins adopt the arrangement mode of golden finger, it is respectively detector anode pin, detector negative electrode pin and two high speed signal input pins.
2., as claimed in claim 1 for the novel base of laser coaxial encapsulation, it is characterized in that: fixed by glass insulator between described device body and described circuit substrate.
3., as claimed in claim 1 for the novel base of laser coaxial encapsulation, it is characterized in that: described circuit comprises build-out resistor and co-planar waveguide line.
4., as claimed in claim 1 for the novel base of laser coaxial encapsulation, it is characterized in that: the surface of described device body is Gold plated Layer.
5., as claimed in claim 4 for the novel base of laser coaxial encapsulation, it is characterized in that: the thickness of the Gold plated Layer of described device body is not less than 0.3 μm.
6. as claimed in claim 1 for the novel base of laser coaxial encapsulation, it is characterized in that: described circuit adopts the mode of evaporation to be arranged on described circuit substrate.
7. as claimed in claim 1 for the novel base of laser coaxial encapsulation, it is characterized in that: described device body adopts mechanical stamping shaping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520056923.9U CN204696445U (en) | 2015-01-28 | 2015-01-28 | For the novel base of laser coaxial encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520056923.9U CN204696445U (en) | 2015-01-28 | 2015-01-28 | For the novel base of laser coaxial encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204696445U true CN204696445U (en) | 2015-10-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520056923.9U Active CN204696445U (en) | 2015-01-28 | 2015-01-28 | For the novel base of laser coaxial encapsulation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107508141A (en) * | 2017-08-16 | 2017-12-22 | 青岛海信宽带多媒体技术有限公司 | The laser and optical module of a kind of coaxial packaging |
| US10819084B2 (en) | 2017-06-02 | 2020-10-27 | Hisense Broadband Multimedia Technologies Co., Ltd. | TO-CAN packaged laser and optical module |
-
2015
- 2015-01-28 CN CN201520056923.9U patent/CN204696445U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10819084B2 (en) | 2017-06-02 | 2020-10-27 | Hisense Broadband Multimedia Technologies Co., Ltd. | TO-CAN packaged laser and optical module |
| CN107508141A (en) * | 2017-08-16 | 2017-12-22 | 青岛海信宽带多媒体技术有限公司 | The laser and optical module of a kind of coaxial packaging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |