CN201904535U - Novel ceramic sheet used for TO packaging of 10G laser - Google Patents
Novel ceramic sheet used for TO packaging of 10G laser Download PDFInfo
- Publication number
- CN201904535U CN201904535U CN2010206844716U CN201020684471U CN201904535U CN 201904535 U CN201904535 U CN 201904535U CN 2010206844716 U CN2010206844716 U CN 2010206844716U CN 201020684471 U CN201020684471 U CN 201020684471U CN 201904535 U CN201904535 U CN 201904535U
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- China
- Prior art keywords
- coating
- laser
- metal
- pin
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 claims abstract description 57
- 238000000576 coating method Methods 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 10
- 238000004891 communication Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 208000021032 Finnish upper limb-onset distal myopathy Diseases 0.000 description 2
- 208000013776 distal muscular dystrophy 3 Diseases 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
Images
Abstract
The utility model discloses a novel ceramic sheet used for TO (transistor) packaging of a 10G laser. The novel ceramic sheet used for bearing a main chip and achieving the connection of the main chip and pins comprises a ceramic body and a metal coating arranged on the ceramic body, wherein the metal coating is provided with a first coating, a second coating, a third coating and a fourth coating; the first coating is used for arranging the main chip; and the second coating, the third coating and the fourth coating are respectively distributed on the periphery of the first coating and respectively used for the main chip to be connected with a laser anode pin, an MPD anode pin and a laser cathode pin via metal conducting wires. The novel ceramic sheet has the advantage that high frequency signal attenuation of the laser, which is caused by overlong metal conducting wires, is reduced, thereby ensuring that high frequency signals can normally pass through the conducting wires.
Description
Technical field
The utility model relates to field of optoelectronic devices, more specifically to a kind of new ceramics sheet that is used for 10G laser TO encapsulation.
Background technology
What the world communication field was with fastest developing speed is Fibre Optical Communication Technology and wireless communication technology, and the main light source that semiconductor laser is optical fiber communication to be used, be the core devices of photoelectron element, the 10G semiconductor laser Primary Component of extra long distance, vast capacity optical fiber telecommunications system especially wherein.
As shown in Figure 1, it is the structural representation of existing semiconductor laser 9, this semiconductor laser 9 comprises master chip 91 and pin 92 and the base 931 used as outer enclosure, simultaneously in order to realize the normal output of luminous power and electric current to be monitored, this semiconductor laser 9 comprises that also MPD(is a Monitoring Photodiode monitor photo-diode) 94, this MPD94 is used to receive the light that base 931 top light splitting piece (not shown)s reflect and plays feedback effect, concrete, these base 931 tops also are provided with potsherd 932, this base 931 is the carrying main body of entire semiconductor device 9,932 of this potsherds are used to place master chip 91 and MPD, and this master chip 91 then directly links to each other with pin 92 by the mode of plain conductor with MPD.
But when above-mentioned encapsulating structure was applicable to 10G semiconductor laser 9, this moment, the mode of aforementioned metal lead can produce larger interference, and made high-frequency signal decay, and then made high speed signal to export normally.
In view of this, the inventor has this case to produce at the above-mentioned defective further investigation in the existing laser 9 then.
The utility model content
The purpose of this utility model is to provide a kind of new ceramics sheet of the 10G of being used for laser TO encapsulation, makes the problem that signal can't normally be exported because of the high-frequency signal decay when being applied in the 10G laser to solve encapsulating structure of the prior art.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of new ceramics sheet that is used for 10G laser TO encapsulation, be used to carry master chip and realize being connected between master chip and the pin, wherein, comprise ceramic body and be arranged on the coat of metal on the ceramic body that this coat of metal has for first coating of master chip setting and is laid in first coating periphery respectively and respectively for second coating, the 3rd coating and the 4th coating that link to each other through plain conductor with the anodal pin of laser, the anodal pin of MPD and laser negative pole pin.
Further, also be provided with the film resistor of coupling over the ground between this first coating and the 4th coating.
Further, this plain conductor adopts two lines that are arranged side by side.
What further, this plain conductor adopted is gold thread.
Further, this coat of metal is a Gold plated Layer.
What further, this ceramic body adopted is aluminium oxide ceramics.
After adopting said structure, the new ceramics sheet of a kind of 10G of being used for laser TO encapsulation that the utility model relates to, it is owing to have additional the coat of metal, and this coat of metal has second coating, the 3rd coating and the 4th coating that is positioned at the first coating periphery, be clipped between the anodal pin of laser, the anodal pin of MPD and the laser negative pole pin apart from having obtained shortening to a great extent from second coating, the 3rd coating and the 4th coating branch thus, make the high-frequency signal of laser decay thereby reduce, and then guarantee that high-frequency signal can normally pass through because of plain conductor is long.
Description of drawings
Fig. 1 is the structural representation of semiconductor laser in the prior art;
The perspective view of the new ceramics sheet that a kind of 10G of being used for laser TO that Fig. 2 relates to for the utility model encapsulates;
Fig. 3 is the vertical view of Fig. 2;
Structural representation when Fig. 4 is applied in the semiconductor laser for the new ceramics sheet shown in Fig. 2.
Among the figure:
Laser 100 master chips 1
The anodal pin two 1 of pin two laser
The anodal pin two 2 laser negative pole pins 23 of MPD
MPD 3 potsherds 4
First coating, 421 second coating 422
The 3rd coating 423 the 4th coating 424
Plain conductor 43 film resistors 44
Semiconductor laser 9 master chips 91
MPD?94。
Embodiment
In order further to explain the technical solution of the utility model, the utility model is elaborated below by specific embodiment.
Extremely shown in Figure 4 as Fig. 2, the new ceramics sheet 4 that a kind of 10G of the being used for laser TO that relates to for the utility model shown in it encapsulates, it is used to carry master chip 1, and realizes simultaneously being connected between master chip 1 and the pin two (being specially the anodal pin two 1 of following laser).
This new ceramics sheet 4, comprise the ceramic body 41 and the coat of metal 42, this coat of metal 42 is arranged on the ceramic body 41, this coat of metal 42 has first coating 421, second coating 422, the 3rd coating 423 and the 4th coating 424, this first coating 421 is provided with master chip 1, this second coating 422, the 3rd coating 423 and the 4th coating 424 all are laid in the periphery of first coating 421, wherein, second coating 422 links to each other with the anodal pin two 1 of laser by plain conductor 43, also be provided with MPD3 on the 3rd coating 423, and link to each other with the anodal pin two 2 of MPD by plain conductor 43, thereby can be convenient to MPD3 monitors, the 4th coating 424 links to each other with laser negative pole pin 23 by plain conductor 43, preferably, in order to realize the earth impedance coupling, also be provided with film resistor 44 between this first coating 421 and the 4th coating 424, specifically the reference resistance of this film resistor 44 is 30 Ω.And these plain conductor 43 preferred gold threads that adopt, these coat of metal 42 preferred Gold plated Layer that adopt, thus having the good effect of conductive effect, this ceramic body 41 then is preferably aluminium oxide ceramics; Simultaneously, in order to reduce of the influence of the long bring of plain conductor 43 length as far as possible, specifically be influence of parasitic contribution inductance capacitance and skin effect to the high-frequency signal decay.
Like this, the utility model is owing to have additional the coat of metal 42, and this coat of metal 42 has second coating 422, the 3rd coating 423 and the 4th coating 424 that is positioned at first coating, 421 peripheries, be clipped in 424 minutes between the anodal pin two 1 of laser, the anodal pin two 2 of MPD and the laser negative pole pin 23 apart from having obtained shortening to a great extent from second coating 422, the 3rd coating 423 and the 4th coating thus, decay thereby reduce, can satisfy the transmission requirement of high-frequency signal thus because of the plain conductor 43 long high-frequency signals of whole laser 100 that make.
The foregoing description and graphic and non-limiting product form of the present utility model and style, any person of an ordinary skill in the technical field all should be considered as not breaking away from patent category of the present utility model to its suitable variation or modification of doing.
Claims (6)
1. one kind is used for the new ceramics sheet that 10G laser TO encapsulates, be used to carry master chip and realize being connected between master chip and the pin, it is characterized in that, comprise ceramic body and be arranged on the coat of metal on the ceramic body that this coat of metal has for first coating of master chip setting and is laid in first coating periphery respectively and respectively for second coating, the 3rd coating and the 4th coating that link to each other through plain conductor with the anodal pin of laser, the anodal pin of MPD and laser negative pole pin.
2. a kind of new ceramics sheet that is used for 10G laser TO encapsulation as claimed in claim 1 is characterized in that, also is provided with the film resistor of coupling over the ground between this first coating and the 4th coating.
3. a kind of new ceramics sheet that is used for 10G laser TO encapsulation as claimed in claim 1 is characterized in that this plain conductor adopts two lines that are arranged side by side.
4. a kind of new ceramics sheet that is used for 10G laser TO encapsulation as claimed in claim 1 is characterized in that what this plain conductor adopted is gold thread.
5. a kind of new ceramics sheet that is used for 10G laser TO encapsulation as claimed in claim 1 is characterized in that this coat of metal is a Gold plated Layer.
6. a kind of new ceramics sheet that is used for 10G laser TO encapsulation as claimed in claim 1 is characterized in that what this ceramic body adopted is aluminium oxide ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206844716U CN201904535U (en) | 2010-12-28 | 2010-12-28 | Novel ceramic sheet used for TO packaging of 10G laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206844716U CN201904535U (en) | 2010-12-28 | 2010-12-28 | Novel ceramic sheet used for TO packaging of 10G laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201904535U true CN201904535U (en) | 2011-07-20 |
Family
ID=44275128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206844716U Expired - Lifetime CN201904535U (en) | 2010-12-28 | 2010-12-28 | Novel ceramic sheet used for TO packaging of 10G laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201904535U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103986058A (en) * | 2014-05-20 | 2014-08-13 | 深圳市易飞扬通信技术有限公司 | Can-shaped packaging structure and method of vertical-cavity surface emitting laser device |
| WO2022156489A1 (en) * | 2021-01-25 | 2022-07-28 | 华为技术有限公司 | Laser carrier and manufacturing method therefor |
| WO2023023907A1 (en) * | 2021-08-23 | 2023-03-02 | 华为技术有限公司 | Receiver optical subassembly, optical module, and communication device |
-
2010
- 2010-12-28 CN CN2010206844716U patent/CN201904535U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103986058A (en) * | 2014-05-20 | 2014-08-13 | 深圳市易飞扬通信技术有限公司 | Can-shaped packaging structure and method of vertical-cavity surface emitting laser device |
| WO2022156489A1 (en) * | 2021-01-25 | 2022-07-28 | 华为技术有限公司 | Laser carrier and manufacturing method therefor |
| WO2023023907A1 (en) * | 2021-08-23 | 2023-03-02 | 华为技术有限公司 | Receiver optical subassembly, optical module, and communication device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: XIAMEN SAN-U OPTRONICS CO., LTD. Free format text: FORMER NAME: SANYOU OPTO-ELECTROMECHANICAL SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD., XIAM |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 361000 N505 room, Weiye building, pioneer zone, torch hi tech Zone, Xiamen, Fujian Patentee after: XIAMEN SAN-U OPTRONICS CO., LTD. Address before: 361000 N505 room, Weiye building, pioneer zone, torch hi tech Zone, Xiamen, Fujian Patentee before: Sanyou Opto-Electromechanical Science and Technology Development Co., Ltd., Xiam |
|
| CX01 | Expiry of patent term |
Granted publication date: 20110720 |
|
| CX01 | Expiry of patent term |