CN206379376U - High-power LED composite aluminum substrate - Google Patents
High-power LED composite aluminum substrate Download PDFInfo
- Publication number
- CN206379376U CN206379376U CN201720119435.7U CN201720119435U CN206379376U CN 206379376 U CN206379376 U CN 206379376U CN 201720119435 U CN201720119435 U CN 201720119435U CN 206379376 U CN206379376 U CN 206379376U
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- CN
- China
- Prior art keywords
- led chip
- aluminum substrate
- composite aluminum
- mounting groove
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of high-power LED composite aluminum substrate, including composite aluminum substrate body, LED chip mounting groove is provided with the composite aluminum substrate body, the inside of the LED chip mounting groove is fixed with LED chip, and specular aluminium is installed on the madial wall of LED chip mounting groove, the composite aluminum substrate body includes thermally conductive insulating layer, insulating barrier, protective layer, conductive layer and aluminium sheet, and aluminium sheet is located between thermally conductive insulating layer and insulating barrier, the top of fixed heat conduction stem is connected through the bottom of insulating barrier and LED chip inside the aluminium sheet, the insulating barrier is located between aluminium sheet and conductive layer, and conductive layer is located between insulating barrier and protective layer.The utility model is provided with heat conduction stem, the bottom of heat conduction stem is inserted to the inside of aluminium sheet, top is directly contacted with LED chip, the direct heat transfer for producing LED chip of insulating barrier can be avoided to aluminium sheet, the heat dispersion of aluminium base is improved, specular aluminium is provided with also on the madial wall of LED chip mounting groove in addition.
Description
Technical field
The utility model is related to semiconductor luminaire technical field, specially a kind of high-power LED composite aluminum substrate.
Background technology
High-power aluminum substrate is the extraordinary material of heat conductivility, and it has thermal conductivity high, and good object amount performance (is not received
Contracting, indeformable), good insulating properties and heat conductivility.Therefore, will be that following LED product is developed using high-power aluminum substrate
Main trend.Radiating and reliability are to influence the principal element such as high-power, in order to solve heat dissipation problem, under LED lamp bead
Face has used radiating and the energy-conservation of aluminium base solution itself.High-power aluminum substrate is divided into according to its packaging technology difference:Large scale
Epoxy encapsulation, imitative Piranha formula epoxy encapsulation, the encapsulation of aluminium base (MCPCB) formula, TO encapsulation, power-type SMD encapsulation,
MCPCB integrated packages etc..
At present, what is particularly paid attention in existing LED device is exactly heat dissipation problem, and heat dispersion is directly affected not by force
The service life of LED device, and the heat dissipation problem of high-power LED aluminum substrate is also always the problem of people need to solve, tradition
The radiating bottleneck of high-power aluminum substrate is its insulating barrier so that radiating efficiency is not high.
Utility model content
The purpose of this utility model is to provide high-power LED composite aluminum substrate, to solve to propose in above-mentioned background technology
The problem of, had an advantageous effect in that：The equipment is provided with heat conduction stem, and the bottom of heat conduction stem is inserted in aluminium sheet
Portion, top is directly contacted with LED chip, just can so avoid the direct heat transfer for producing LED chip of insulating barrier to aluminium sheet,
So as to substantially increase the heat dispersion of aluminium base.
To achieve the above object, the utility model provides following technical scheme：A kind of high-power LED composite aluminum substrate, bag
Include and LED chip mounting groove is provided with composite aluminum substrate body, the composite aluminum substrate body, the LED chip mounting groove
Inside, which is fixed with LED chip, and the madial wall of LED chip mounting groove, is provided with specular aluminium, the composite aluminum substrate body bag
Thermally conductive insulating layer, insulating barrier, protective layer, conductive layer and aluminium sheet are included, and aluminium sheet is located between thermally conductive insulating layer and insulating barrier, it is described
The top of fixed heat conduction stem is connected through the bottom of insulating barrier and LED chip inside aluminium sheet, and the insulating barrier is located at aluminium sheet
Between conductive layer, and conductive layer is located between insulating barrier and protective layer.
It is preferred that, the LED chip is connected with conductive layer by wire.
It is preferred that, the specular aluminium is provided with two altogether, and two specular aluminiums are separately mounted to the both sides of LED chip.
It is preferred that, LED chip and the LED chip mounting groove is respectively arranged with several, and LED chip and LED chip
The number that mounting groove is set is equal.
It is preferred that, the thermally conductive insulating layer is alumina insulating layer.
It is preferred that, the LED chip mounting groove is inverted trapezoidal structure.
Compared with prior art, the beneficial effects of the utility model are：The equipment, there is provided heat conduction stem, by heat conduction core
The inside of aluminium sheet is inserted in the bottom of post, and top is directly contacted with LED chip, just can so avoid insulating barrier directly by LED chip
The heat transfer of generation is to aluminium sheet, so that the heat dispersion of aluminium base is substantially increased, in addition also in LED chip mounting groove
Specular aluminium is provided with the wall of side, the light produced by specular aluminium to LED chip is reflected, forms a reflecting cup structure,
Reduce thermal resistance.
Brief description of the drawings
Fig. 1 is top view of the present utility model；
Fig. 2 is side view of the present utility model.
In figure：1- composite aluminum substrate bodies；2-LED chips；3- thermally conductive insulating layer；4- insulating barriers；5- protective layers；6-LED
Chip mounting groove；7- heat conduction stems；8- specular aluminiums；9- conductive layers；10- aluminium sheets.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Refer to Fig. 1 and Fig. 2, a kind of high-power LED composite aluminum substrate that the utility model is provided, including composite aluminum substrate
LED chip mounting groove 6 is provided with body 1, composite aluminum substrate body 1, the inside of LED chip mounting groove 6 is fixed with LED chip
Specular aluminium 8 is installed, composite aluminum substrate body 1 includes thermally conductive insulating layer 3, insulation on 2, and the madial wall of LED chip mounting groove 6
Layer 4, protective layer 5, conductive layer 9 and aluminium sheet 10, and aluminium sheet 10, positioned between thermally conductive insulating layer 3 and insulating barrier 4, the inside of aluminium sheet 10 is solid
The top of fixed heat conduction stem 7 is connected through insulating barrier 4 with the bottom of LED chip 2, and insulating barrier 4 is located at aluminium sheet 10 and conductive layer 9
Between, and conductive layer 9 is positioned between insulating barrier 4 and protective layer 5.
LED chip 2 is connected with conductive layer 9 by wire；Specular aluminium 8 is provided with two altogether, and two specular aluminiums 8 are pacified respectively
Mounted in the both sides of LED chip 2；LED chip 2 and LED chip mounting groove 6 are respectively arranged with several, and LED chip 2 and LED core
The number that piece mounting groove 6 is set is equal；Thermally conductive insulating layer 3 is alumina insulating layer；LED chip mounting groove 6 is inverted trapezoidal structure.
Operation principle：In use, LED chip 2 is arranged in corresponding LED chip mounting groove 6, and make LED chip 2
Bottom is directly contacted with the top of heat conduction stem 7, and LED chip 2 is connected with conductive layer 9 by wire, is switched on power, when
When LED chip 2 works, by heat conduction stem 7 directly by LED chip 2 work generation heat transfer to aluminium sheet 10, then pass through aluminium
Plate 10 removes heat in air, so as to substantially increase the radiating efficiency of LED composite aluminum substrates, extends LED chip 2
Service life, the light produced by specular aluminium 8 to LED chip is reflected, and a reflecting cup structure is formed, so as to reduce
Thermal resistance.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation
Involved claim.
Claims (6)
1. a kind of high-power LED composite aluminum substrate, including composite aluminum substrate body (1), it is characterised in that：The composite aluminum substrate
LED chip mounting groove (6) is provided with body (1), the inside of the LED chip mounting groove (6) is fixed with LED chip (2), and
Specular aluminium (8) is installed, the composite aluminum substrate body (1) includes thermally conductive insulating layer on the madial wall of LED chip mounting groove (6)
(3), insulating barrier (4), protective layer (5), conductive layer (9) and aluminium sheet (10), and aluminium sheet (10) is located at thermally conductive insulating layer (3) and insulation
Between layer (4), the top of fixed heat conduction stem (7) passes through insulating barrier (4) and LED chip (2) inside the aluminium sheet (10)
Bottom is connected, and the insulating barrier (4) is located between aluminium sheet (10) and conductive layer (9), and conductive layer (9) positioned at insulating barrier (4) and
Between protective layer (5).
2. high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The LED chip (2) and conduction
Layer (9) is connected by wire.
3. high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The specular aluminium (8) is provided with altogether
Two, and two specular aluminiums (8) are separately mounted to the both sides of LED chip (2).
4. high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The LED chip (2) and LED core
Piece mounting groove (6) is respectively arranged with several, and LED chip (2) is equal with the number that LED chip mounting groove (6) is set.
5. high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The thermally conductive insulating layer (3) is oxygen
Change aluminum insulation layer.
6. high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The LED chip mounting groove (6)
For inverted trapezoidal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720119435.7U CN206379376U (en) | 2017-02-08 | 2017-02-08 | High-power LED composite aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720119435.7U CN206379376U (en) | 2017-02-08 | 2017-02-08 | High-power LED composite aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206379376U true CN206379376U (en) | 2017-08-04 |
Family
ID=59400372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720119435.7U Expired - Fee Related CN206379376U (en) | 2017-02-08 | 2017-02-08 | High-power LED composite aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206379376U (en) |
-
2017
- 2017-02-08 CN CN201720119435.7U patent/CN206379376U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170804 Termination date: 20190208 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |