CN206362837U - A kind of smart card dibit test device in parallel - Google Patents
A kind of smart card dibit test device in parallel Download PDFInfo
- Publication number
- CN206362837U CN206362837U CN201621333466.4U CN201621333466U CN206362837U CN 206362837 U CN206362837 U CN 206362837U CN 201621333466 U CN201621333466 U CN 201621333466U CN 206362837 U CN206362837 U CN 206362837U
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- China
- Prior art keywords
- smart card
- testing
- test
- testing needle
- dibit
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- 238000012360 testing method Methods 0.000 title claims abstract description 122
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000000428 dust Substances 0.000 abstract description 9
- 238000012797 qualification Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
A kind of smart card dibit test device in parallel, including for placing the lower mould of smart card and upper mould for being tested smart card, the bottom of the upper mould is provided with measuring head, and the measuring head tests faller gill provided with two rows, and often row's test faller gill is made up of some testing needle groups；Each testing needle group is made up of at least two testing needles.Smart card of the present utility model dibit test device in parallel, at least two testing needles are equipped with the contact of each smart card module, for M3 modules, there are 6 contacts, at least need 12 (6*2) root testing needles, for M2/M4 modules, there are 8 contacts, at least need 16 (8*2) root testing needles.Using the measuring head device of many test needle systems, it is possible to prevente effectively from single testing needle by caused by dust interference due to being judged by accident, and the erroneous judgement that single testing needle can be avoided to be caused due to fatigue, deformation failure, so as to ensure that the production for a large amount of smart card module products surveyed for a long time, less is smoothed out by mistake, product qualification rate is lifted, production cost is reduced.
Description
Technical field
The utility model is related to microelectronics Packaging field, and in particular to one kind is used for smart card chip module and produces and manufacture
The smart card in field dibit test device in parallel.
Background technology
Pair for smart card module manufacture, last one of critical process of usual module encapsulation is module testing, i.e.,
The chip module of finished product is encapsulated, according to technological requirement, parameter and functional test are carried out to module.
In production process, there are many factors to cause the possibility surveyed by mistake.Wherein there is a kind of main survey by mistake, be due to band sheet
Caused by the tape base material dust of body.Test machine on current smart card module production line, because last process is needed in glass
Electrical equipment clearance hole is rushed on fiber tape base, glass fiber dust, and the carrier ribbon of smart card module can be inevitably generated,
It is continuous anury, coiled band.All it is the continuously transmission operation in mechanical tracks per procedure, in this case,
It is that can not avoid the appearance of dust completely.Although some equipment has the device for removing chalk dust removing, a small number of dust are still suffered from
Enter the test surfaces of module.Another common mistake is surveyed caused by being testing needle fatigue damage.In high-frequency, for a long time
In continual test process, the situation for the tired or corrupted that test syringe needle follows the string is frequently encountered.Such case is big
Amount production, happens occasionally.These situations can be all produced for the underproof erroneous judgement of smart card module, cause a large amount of waves of product
Take, had a strong impact on product qualification rate and caused great waste, added production cost.
Utility model content
The purpose of this utility model is that there is provided a kind of smart card dibit test dress in parallel in order to overcome the deficiencies in the prior art
Put, its contact pin to test machine is improved.The smart card module product for making script performance qualified is avoided because testing needle connects
Touch it is bad and by defective work is judged into by accident, reduce and survey by mistake, improve the yield rate of smart card module product.
Realizing a kind of technical scheme of above-mentioned purpose is：A kind of smart card dibit test device in parallel, including for placing
The lower mould of smart card and the upper mould for being tested smart card, the bottom of the upper mould are provided with measuring head, the test
Head tests faller gill provided with two rows, and often row's test faller gill is made up of some testing needle groups；Each testing needle group is by least two surveys
Test point is constituted.
Further, for M3 smart card modules, often arrange the test faller gill and be made up of three testing needle groups.
Further, for M2/M4 smart card modules, often arrange the test faller gill and be made up of four testing needle groups.
Further, every testing needle of testing needle group described in every group is mutually in parallel access test system.
Further, the position of testing needle group described in every group is respectively positioned on surveys relative to the standard contacts of I SO/I EC 10373
The position of test point.
Further, height all same of the every testing needle of testing needle group described in every group apart from smart card to be measured.
Smart card of the present utility model dibit test device in parallel, is equipped with least on the contact of each smart card module
Two testing needles, for M3 modules, there is 6 contacts, at least need 12 (6*2) root testing needles, for M2/M4 modules, there is 8
Contact, at least needs 16 (8*2) root testing needles.Using the measuring head device of many test needle systems, it is possible to prevente effectively from single
Testing needle by caused by dust interference due to being judged by accident, and the mistake that single testing needle can be avoided to be caused due to fatigue, deformation failure
Sentence, so as to ensure that the production for a large amount of smart card module products surveyed for a long time, less is smoothed out by mistake, lift product qualification rate,
Reduce production cost.
Brief description of the drawings
Fig. 1 is a kind of structural representation of smart card parallel connection dibit test device of the present utility model；
Fig. 2 tests design sketch for the smart card module of normal procedure intelligent card test device；
Fig. 3 is a kind of test effect of smart card parallel connection dibit test device of the present utility model.
Embodiment
In order to be able to preferably understand the technical solution of the utility model, below by specifically embodiment and combine
Accompanying drawing is described in detail：
Smart card module, have passed through after chip welding, gold ball bonding and final package, last procedure on a production line
It is exactly that function and parameter testing are carried out to packaged module, to the module of test failure, one jiao in module is stamped bad hole
It is used as mark.Because the tape base of flex tape is typically what is be made of glass fabric.This tape base is usually FR4, G10's
Glass fibre epoxy cloth is constituted, before being tested, before testing, it is necessary to connect to the technique being mutually conducted originally on electrical equipment
Line is punched out, to make original all contacts being electrically mutually conducted individually separated.While electrical isolation hole is punched,
Inevitably bring the dust of epoxy glass fabric；And glass bar band can also produce dust in continuously transmitting procedure.In height
In frequency, prolonged continual test process, the feelings for the tired or corrupted that test syringe needle follows the string also are frequently encountered
Condition.
Referring to Fig. 1, a kind of smart card dibit test device in parallel of the present utility model, including for placing smart card 6
Lower mould 1 and upper mould 2 for being tested smart card 6, the bottom of upper mould 2 is provided with measuring head 3, and measuring head is provided with two
Row's test faller gill, often row's test faller gill is made up of some testing needle groups 4, and each testing needle group is made up of two testing needles 5.For
M3 modules have six contacts, and measuring head, which needs two rows, often to be arranged three groups and amount to six groups of 12 testing needles；And M2/M4 modules have
There are eight contacts, measuring head, which needs two rows, often to be arranged four groups and amount to eight group of ten six roots of sensation testing needle.
Fig. 2 and Fig. 3 are referred to, by taking the test device of M3 smart card modules as an example：
In Fig. 2, conventional test device has a testing needle for the contact 61 of each module, during test, under upper mould
Drop drives testing needle contact contact measured module, and the test for module is realized with this.Producing easily occurs in such mode
The underproof erroneous judgement of raw module, causes to waste.
In Fig. 3, smart card of the present utility model dibit test device in parallel is adopted for each contact 62 of each module
With one group of two testing needle, the position of every group of testing needle is respectively positioned on the test position of the single testing needle of conventional test device,
To meet the requirement of the testing standards of I SO/I EC 10373；The high settings such as the testing needle of every group of testing needle group, it is ensured that testing needle is same
When contact contact；The testing needle of every group of testing needle group is parallel with one another, when carrying out module testing, if touching any one of module contact
Root testing needle has obtained qualified test judgement, you can judge that the contact is qualified.Single testing needle so be effectively prevent because of powder
Testing needle fails caused by dirt or testing needle fatigue, and dual needle system also improves the fatigue life of contact pilotage, so as to effectively carry
The reliability of high testing needle, then improves the qualification rate of product test, has saved production cost.
Every group of testing needle group of every group of test root employs 2 testing needles in parallel in the present embodiment.But not only office in the application
It is limited to 2, can is the testing needle simultaneously bit test needle system in parallel of more than 2.
Those of ordinary skill in the art is it should be appreciated that the embodiment of the above is intended merely to illustrate that this practicality is new
Type, and be not used as limiting of the present utility model, as long as in spirit of the present utility model, to described above
Change, the modification of embodiment will all fall in Claims scope of the present utility model.
Claims (6)
1. a kind of smart card dibit test device in parallel, including for placing the lower mould of smart card and for being carried out to smart card
The upper mould of test, the bottom of the upper mould is provided with measuring head, it is characterised in that：
The measuring head tests faller gill provided with two rows, and often row's test faller gill is made up of some testing needle groups；Each testing needle group
It is made up of at least two testing needles.
2. a kind of smart card dibit test device in parallel according to claim 1, it is characterised in that for the intelligent snap gauges of M3
Block, often arranges the test faller gill and is made up of three testing needle groups.
3. a kind of smart card dibit test device in parallel according to claim 1, it is characterised in that for M2/M4 intelligence
Card module, often arranges the test faller gill and is made up of four testing needle groups.
4. a kind of smart card dibit test device in parallel according to claim 1, it is characterised in that testing needle described in every group
Every testing needle of group is mutually in the access smart card dibit test device in parallel of parallel connection.
5. a kind of smart card dibit test device in parallel according to claim 1, it is characterised in that testing needle described in every group
The position of group is respectively positioned on the position relative to the standard contacts testing needles of ISO/IEC 10373.
6. a kind of smart card dibit test device in parallel according to claim 1, it is characterised in that testing needle described in every group
Height all same of the every testing needle of group apart from smart card to be measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621333466.4U CN206362837U (en) | 2016-12-07 | 2016-12-07 | A kind of smart card dibit test device in parallel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621333466.4U CN206362837U (en) | 2016-12-07 | 2016-12-07 | A kind of smart card dibit test device in parallel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206362837U true CN206362837U (en) | 2017-07-28 |
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ID=59373800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621333466.4U Expired - Fee Related CN206362837U (en) | 2016-12-07 | 2016-12-07 | A kind of smart card dibit test device in parallel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206362837U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108957053A (en) * | 2018-06-23 | 2018-12-07 | 四川峰哲精密设备有限公司 | A kind of test contact chip for testing needle assemblies and its composition |
| CN113917319A (en) * | 2021-12-06 | 2022-01-11 | 新恒汇电子股份有限公司 | Chip packaging switching test device and method |
-
2016
- 2016-12-07 CN CN201621333466.4U patent/CN206362837U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108957053A (en) * | 2018-06-23 | 2018-12-07 | 四川峰哲精密设备有限公司 | A kind of test contact chip for testing needle assemblies and its composition |
| CN113917319A (en) * | 2021-12-06 | 2022-01-11 | 新恒汇电子股份有限公司 | Chip packaging switching test device and method |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170728 |
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| CF01 | Termination of patent right due to non-payment of annual fee |