CN110501533A - A kind of QSFP28 optical module test switching device and test method - Google Patents
A kind of QSFP28 optical module test switching device and test method Download PDFInfo
- Publication number
- CN110501533A CN110501533A CN201910745917.7A CN201910745917A CN110501533A CN 110501533 A CN110501533 A CN 110501533A CN 201910745917 A CN201910745917 A CN 201910745917A CN 110501533 A CN110501533 A CN 110501533A
- Authority
- CN
- China
- Prior art keywords
- high speed
- optical module
- switching device
- signal pad
- speed signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 115
- 230000003287 optical effect Effects 0.000 title claims abstract description 92
- 238000010998 test method Methods 0.000 title claims abstract description 7
- 230000005540 biological transmission Effects 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 8
- 230000006872 improvement Effects 0.000 description 6
- 230000009467 reduction Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000035772 mutation Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
- H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The present invention discloses a kind of QSFP28 optical module test switching device and test method, which includes pcb board, and be set on pcb board for connecting the connector of optical module；It include the first connecting portion for wire jumper on pcb board, for the second connecting portion of connecting test equipment, and the third interconnecting piece for connecting the connector.QSFP28 optical module test switching device according to the present invention, the information and state of optical module are obtained by the testing needle of first connecting portion, the inconvenience for no longer needing to dismantle optical module on-the-spot test caused by also avoiding breaking because of wire jumper to carry out wire jumper movement, has saved the testing time.When carrying out the test of QSFP28 optical module; QSFP28 optical module need to be only plugged in the connector of QSFP28 optical module test switching device, no longer need to be plugged in a test device, be effectively protected test equipment; the impedance of pcb board is improved, it is more accurate to test.
Description
Technical field
The invention belongs to optical module testing field more particularly to a kind of QSFP28 optical module test switching device and test sides
Method.
Background technique
When testing optical module, usually optical module is plugged in test equipment, when needing to analyze optical module
When data and state, the method generallyd use is exactly to dismantle optical module, finds the test point of coherent signal in the inside of optical module,
Then fly line comes out, and carries out the mark and insulation of signal wire, then closes the shell of optical module, finally takes in test equipment and grabs again
The number of winning the confidence.Test and signal acquisition work belt to optical module come greatly inconvenient.Simultaneously, interchanger etc. is tested
Equipment, testing single-board have plug number limitation, damage plug reaches a certain amount of herein after.
Summary of the invention
The object of the present invention is to provide a kind of QSFP28 optical module test switching devices, being capable of simple and quick completion pair
The test of optical module and signal acquisition work, reduce the plug number of opposite test equipment, protect test equipment.
The present invention is achieved through the following technical solutions: a kind of QSFP28 optical module test switching device is provided, it is described
QSFP28 optical module test switching device includes pcb board, and the connector for being used to connect optical module being set on pcb board；
It include the first connecting portion for wire jumper on pcb board, for the second connecting portion of connecting test equipment, Yi Jiyong
In the third interconnecting piece for connecting the connector；
Second connecting portion has multiple high speed signal pads for being used for transmission high speed signal, corresponds in the second connecting portion
The reference layer in the region of high speed signal pad hollows out, each high speed signal pad of the multiple high speed signal pad to pcb board
The length at edge is 1.55 to 1.75mm, the width of each high speed signal pad of the multiple high speed signal pad be 0.3 to
0.5mm；
Third interconnecting piece has the multiple high speed connector pads for being used for transmission high speed signal being connected with connector, institute
The length for stating each high speed connector pad of multiple high speed connector pads is 1.4 to 1.6mm.
As a further improvement of the above technical scheme, the first connecting portion includes multiple for obtaining QSFP28 light
The testing needle of module status information.
As a further improvement of the above technical scheme, each high speed connector weldering of the multiple high speed connector pad
The length of disk is 1.4mm.
As a further improvement of the above technical scheme, each high speed signal pad of the multiple high speed signal pad is extremely
The length at pcb board edge is 1.65mm, and the width of each high speed signal pad of the multiple high speed signal pad is 0.4mm.
As a further improvement of the above technical scheme, each high speed signal pad of the multiple high speed signal pad is extremely
The length at pcb board edge is 1.75mm, and the width of each high speed signal pad of the multiple high speed signal pad is 0.3mm.
As a further improvement of the above technical scheme, each high speed signal pad of the multiple high speed signal pad is extremely
The length at pcb board edge is 1.75mm, and the width of each high speed signal pad of the multiple high speed signal pad is 0.5mm.
As a further improvement of the above technical scheme, the QSFP28 optical module test switching device further includes having pedestal
And the shell for cooperating with test equipment, the pcb board are fixed between pedestal and shell.
The present invention also provides a kind of QSFP28 light module test methods, including
QSFP28 optical module test switching device is plugged in test equipment by step S1；
QSFP28 optical module is plugged in QSFP28 optical module test switching device by step S2；
Wire jumper is plugged in the first connecting portion of QSFP28 optical module test switching device by step S3；
Step S4 obtains QSFP28 optical mode block state information.
Beneficial effects of the present invention include at least: QSFP28 optical module test switching device of the invention, connect by first
The testing needle of socket part obtains the information and state of optical module, no longer needs to dismantle optical module to carry out wire jumper movement, also avoid because
The inconvenience of on-the-spot test caused by wire jumper is broken, has saved the testing time.Carry out QSFP28 optical module test when, only need by
QSFP28 optical module is plugged in the connector of QSFP28 optical module test switching device, no longer needs to carry out in a test device slotting
It pulls out, is effectively protected test equipment.The impedance of pcb board is improved, it is more accurate to test.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of QSFP28 optical module test switching device according to an embodiment of the invention；
Fig. 2 is the decomposition diagram of QSFP28 optical module test switching device according to an embodiment of the invention；
Fig. 3 is the three-dimensional signal of QSFP28 optical module test switching device and shielding case according to an embodiment of the invention
Figure；
Fig. 4 is the pcb board and connector of QSFP28 optical module test switching device according to an embodiment of the invention
Stereoscopic schematic diagram；
Fig. 5 is the vertical view signal of the pcb board of QSFP28 optical module test switching device according to an embodiment of the invention
Figure；
Fig. 6 is the enlarged diagram according to the B area of Fig. 5；
Fig. 7 is the enlarged diagram according to the a-quadrant of Fig. 4；
Fig. 8 be according to an embodiment of the present invention in the parallel branch of connector pad illustrate schematic diagram；
Fig. 9 is the enlarged diagram according to the region C of Fig. 5；
Figure 10 be according to an embodiment of the present invention in the parallel branch of signal pad illustrate schematic diagram；
Figure 11 is the impedance curve schematic diagram of pcb board according to a first embodiment of the present invention；
Figure 12 is the impedance curve schematic diagram of pcb board according to a second embodiment of the present invention；
Figure 13 is the impedance curve schematic diagram of pcb board according to a third embodiment of the present invention；
Figure 14 is the flow diagram of QSFP28 light module test method according to an embodiment of the invention.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually
The component for the embodiment of the present invention being described and illustrated herein in the accompanying drawings can be arranged and be designed with a variety of different configurations.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
In the present invention, " codes and standards " refer to by Global Network Storage Industry Association (Storage Networking
Industry Association, SNIA) publication ID be SFF-8662, entitled " QSFP+4X 28Gb/s Connector
(Style A) " codes and standards.It issues network address are as follows:
https://www.snia.org/technology-communities/sff/specifications
Such as Fig. 1 to Fig. 5, a kind of QSFP28 optical module test switching device, the QSFP28 optical module test switching device
Including pcb board 1, and the connector 2 for being used to connect optical module being set on pcb board 1.
It include the first connecting portion 11 for wire jumper on pcb board 1, for the second connecting portion 12 of connecting test equipment,
And the third interconnecting piece 13 for connecting the connector 2.
Second connecting portion 12 has multiple high speed signal pads 121 for being used for transmission high speed signal, the second connecting portion
The reference layer that the region of high speed signal pad 121 is corresponded in 12 hollows out, each high speed letter of the multiple high speed signal pad 121
The length L1 at number pad 121 to the edge of pcb board 1 is 1.55 to 1.75mm, the multiple high speed signal pad 121 it is each high
The width W1 of fast signal pad is 0.3 to 0.5mm.Certainly, second connecting portion 12 further includes having other for connecting power supply, ground connection
And the signal pad of other signals is transmitted, since these signal pads make according to codes and standards, details are not described herein.
Third interconnecting piece 13 has the multiple high speed connector pads for being used for transmission high speed signal being connected with connector 2
131, the length L2 of each high speed connector pad 131 of the multiple high speed connector pad 131 is 1.4 to 1.6mm.It is described
Connector 2 is QSFP28 connector.Certainly, third interconnecting piece 12 further includes having other for connecting power supply, ground connection and transmission
The connector pad of other signals, since these connector pads make according to codes and standards, details are not described herein.
The first connecting portion 11 includes multiple for obtaining the testing needle 111 of optical mode block state information.Optical mode is blocky
State information includes electrifying timing sequence, the control sequential of the communication timing of I2C and control pin and state etc..Testing needle 111 is in one
Word arrangement, the quantity of testing needle 111 are less than or equal to the quantity of pin 21 on the connector 2；By by multiple testing needles 111
The different pins 21 of the connector 2 are separately connected, to obtain the information for the QSFP28 optical module being connected with connector 2.
The quantity of the testing needle 111 can be modified according to specific testing requirement, it is not limited here.
Refering to Fig. 3, the QSFP28 optical module test switching device further includes having pedestal 4 and for matching with test equipment
The shell 3 of conjunction, the pcb board 1 are fixed between pedestal 4 and shell 3.It is usually all in light when testing optical module
It is carried out on the service board of transmission cabinets, 2~20 left sides is had according to the unusual of type of service above each service board
The slot position of right QSFP28 optical module, each optical module slot position are designed with shielding case 5.By by QSFP28 optical module test adaptor
Device is plugged in the test groove of test equipment, when carrying out the test of QSFP28 optical module, need to only be inserted QSFP28 optical module
It is connected in the connector 2 of QSFP28 optical module test switching device, no longer needs to be plugged in a test device, be effectively protected
Test equipment.
The present invention also provides a kind of QSFP28 light module test methods, including
QSFP28 optical module test switching device is plugged in test equipment by step S1.By by QSFP28 optical module
Test switching device is plugged in test equipment, is avoided plug operation when test QSFP28 optical module every time, is effectively protected
Test equipment is protected.
QSFP28 optical module is plugged in QSFP28 optical module test switching device by step S2.By QSFP28 optical module
It is plugged in the connector 2 of QSFP28 optical module test switching device, to test QSFP28 optical module.
Wire jumper is plugged in the first connecting portion 11 of QSFP28 optical module test switching device by step S3.By that will jump
Line is plugged on the testing needle 111 of first connecting portion 11, and testing needle 111 is separately connected the different pins 21 of the connector 2, is led to
Cross the information that testing needle 111 obtains the QSFP28 optical module being connected with connector 2.
Step S4 obtains QSFP28 optical mode block state information.QSFP28 optical module test result is obtained by test equipment,
QSFP28 optical module is obtained by the wire jumper being plugged on testing needle 111 when needing to obtain QSFP28 optical mode block state information
Information.
First embodiment
Firstly, being illustrated referring to figs. 1 to Figure 11 to the A that the first embodiment of the present invention is related to.
As shown in Fig. 5 to Fig. 8, in the present embodiment, each high speed connector of the multiple high speed connector pad 131
The length L2 of pad 131 is 1.4mm.
Length of the length L2 of high speed connector pad 131 in the present embodiment compared to the connector pad in codes and standards
Degree reduces 0.4mm, and the mode of reduction is to be reduced from the end of the parallel branch of high speed connector pad 131 to middle part
0.4mm.The length of the parallel branch of high speed connector pad 131 of high speed signal is used for transmission by reducing, to improve
Impedance and the mutation for reducing impedance.
Refering to Fig. 7 and Fig. 8, the pin 21 on connector 2 is connected with the connector pad on pcb board 1, contact point two
Side can be considered in parallel, and signal is transmitted on connector 2 by connector pad, the other side of signal input direction on connector pad
It is then the parallel branch on the connector pad.
As shown in figs. 5 and 9, each high speed signal pad 121 of the multiple high speed signal pad 121 is to pcb board 1
The length L1 at edge is 1.65mm, and the width W1 of each high speed signal pad of the multiple high speed signal pad 121 is
0.4mm。
The length of high speed signal pad 121 in the present embodiment is reduced compared to the length of the signal pad in codes and standards
The mode of 0.2mm, reduction are carry out reducing 0.2mm from the end of the parallel branch of high speed signal pad 121 to middle part,
To increase the length L1 of high speed signal pad 121 to the edge of pcb board 1.
The width of high speed signal pad 121 in the present embodiment is reduced compared to the width of the signal pad in codes and standards
0.2mm, the mode of reduction are to reduce 0.1mm to middle part respectively from the two sides of width direction.Height is used for transmission by reduction
The length of the parallel branch of the high speed signal pad 121 of fast signal and the width W1 of high speed signal pad, to improve impedance
And reduce the mutation of impedance.
Refering to fig. 10, the elastic slice in test equipment is connected with the signal pad on pcb board 1, and contact point two sides are visual
For parallel connection, signal is transmitted on signal pad by the elastic slice in test equipment, on signal pad output side signal to the other side
It is then the parallel branch on the signal pad.
It is as shown in figure 11 1 impedance plot of pcb board, wherein dotted line is the resistance of the pcb board 1 made according to codes and standards
Anti- curve (reference layer for having hollowed out the region of corresponding high speed signal pad 121), solid line are the QSFP28 light according to the present embodiment
The impedance curve of the pcb board 1 of module testing switching device.
Impedance according to the high speed signal pad 121 of the pcb board 1 of codes and standards production is 75.95Ohm, with 2 phase of connector
The impedance of the high speed connector pad 131 of connection is 91.08Ohm.Wherein, the length L2 of high speed connector pad 131 is
The length L1 of 1.8mm, high speed signal pad 121 to the edge of pcb board 1 are 1.45mm, and the width W1 of high speed signal pad is
0.6mm。
According to the impedance of the high speed signal pad 121 of the pcb board 1 of the QSFP28 optical module test switching device of the present embodiment
For 92.37Ohm, the impedance for the high speed connector pad 131 being connected with connector 2 is 100.36Ohm.Wherein, high speed connects
The length L2 of device pad 131 is 1.4mm, and the length L1 of high speed signal pad 121 to the edge of pcb board 1 is 1.65mm, and high speed is believed
The width W1 of number pad is 0.4mm.
Second embodiment
Then, referring to Fig.1 2, the A that the second embodiment of the present invention is related to is illustrated.In addition, unless stated otherwise,
The composition for the A that second embodiment is related to is identical as the composition illustrated in first embodiment referring to figs. 1 to Figure 10.Hereinafter, main right
The composition part being different from the first embodiment in the composition for the A that second embodiment is related to is illustrated, and is related to first embodiment
And the identical structure of A carry out schematic illustration.
In the present embodiment, each high speed signal pad 121 of the multiple high speed signal pad 121 is to the side of pcb board 1
The length L1 of edge is 1.75mm, and the width W1 of each high speed signal pad of the multiple high speed signal pad 121 is 0.3mm.
It is as shown in figure 12 1 impedance plot of pcb board of the present embodiment, the impedance of high speed signal pad 121 is
99.70Ohm, the impedance for the high speed connector pad 131 being connected with connector 2 are 96.73Ohm.
3rd embodiment
Then, referring to Fig.1 3, the A that the third embodiment of the present invention is related to is illustrated.In addition, unless stated otherwise,
The composition for the A that second embodiment is related to is identical as the composition illustrated in first embodiment referring to figs. 1 to Figure 10.Hereinafter, main right
The composition part being different from the first embodiment in the composition for the A that second embodiment is related to is illustrated, and is related to first embodiment
And the identical structure of A carry out schematic illustration.
In the present embodiment, the length L2 of each high speed connector pad 131 of the multiple high speed connector pad 131
For 1.6mm.The length L1 at edge of each high speed signal pad 121 of the multiple high speed signal pad 121 to pcb board 1 is
1.75mm, the width W1 of each high speed signal pad of the multiple high speed signal pad 121 are 0.5mm.
It is as shown in figure 13 1 impedance plot of pcb board of the present embodiment, the impedance of high speed signal pad 121 is
90.75Ohm, the impedance for the high speed connector pad 131 being connected with connector 2 are 95.28Ohm.
QSFP28 optical module is mostly the module of 100G high transfer rate, very high to 1 resistance requirements of pcb board of test, impedance
Highly significant is influenced on high-speed module test result, wherein impedance value is the reason that industry generally believes in 100Ohm ± 10%
The impedance ranges thought.
Beneficial effects of the present invention include at least:
1, the information and state that optical module is obtained by the testing needle 111 of first connecting portion 11, no longer need to dismantle optical module
It carries out wire jumper movement, also avoids the inconvenience of on-the-spot test caused by breaking because of wire jumper, saved the testing time.
2, when carrying out the test of QSFP28 optical module, QSFP28 optical module need to be only plugged to the test of QSFP28 optical module and turned
In the connector 2 of connection device, no longer needs to be plugged in a test device, be effectively protected test equipment.
3, the impedance of pcb board 1 is improved, it is more accurate to test.
In the description of the present invention, it is to be understood that, term " first ", " second " etc. are used for description purposes only, without
It can be interpreted as indication or suggestion relative importance.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.In addition, in the description of the present invention, unless otherwise indicated, the meaning of " plurality " is
Two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " connected " " connects
Connect " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected；It can be machine
Tool connection, is also possible to be electrically connected；It can be directly connected, it can also be indirectly connected through an intermediary.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.In addition, of the invention
In description, unless otherwise indicated, the meaning of " plurality " is two or more.
In the description of embodiments of the present invention, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length
Degree ", " width ", " thickness ", " height ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top",
The orientation or positional relationship of the instructions such as "bottom", "inner", "outside", " clockwise ", " counterclockwise " be orientation based on the figure or
Positional relationship is merely for convenience of description embodiments of the present invention and simplifies description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to reality of the invention
Apply the limitation of mode.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", specific examples or " some examples " etc. means the tool described in conjunction with the embodiment or example
Body characteristics, structure, material or feature are contained at least one embodiment or example of the invention.In the present specification,
Schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot
Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.
Claims (8)
1. a kind of QSFP28 optical module test switching device, which is characterized in that the QSFP28 optical module test switching device packet
Pcb board is included, and the connector for being used to connect optical module being set on pcb board；
It include the first connecting portion for wire jumper on pcb board, for the second connecting portion of connecting test equipment, and for connecting
Connect the third interconnecting piece of the connector；
Second connecting portion has multiple high speed signal pads for being used for transmission high speed signal, corresponding high speed in the second connecting portion
The reference layer in the region of signal pad hollows out, each high speed signal pad of the multiple high speed signal pad to pcb board edge
Length be 1.55 to 1.75mm, the width of each high speed signal pad of the multiple high speed signal pad be 0.3 to
0.5mm；
Third interconnecting piece has the multiple high speed connector pads for being used for transmission high speed signal being connected with connector, described more
The length of each high speed connector pad of a high speed connector pad is 1.4 to 1.6mm.
2. QSFP28 optical module test switching device according to claim 1, which is characterized in that the first connecting portion packet
It includes multiple for obtaining the testing needle of QSFP28 optical mode block state information.
3. QSFP28 optical module test switching device according to claim 1, which is characterized in that the multiple high speed connection
The length of each high speed connector pad of device pad is 1.4mm.
4. QSFP28 optical module test switching device according to claim 1 or 3, which is characterized in that the multiple high speed
Each high speed signal pad of signal pad to pcb board edge length be 1.65mm, the multiple high speed signal pad it is each
The width of a high speed signal pad is 0.4mm.
5. QSFP28 optical module test switching device according to claim 1 or 3, which is characterized in that the multiple high speed
Each high speed signal pad of signal pad to pcb board edge length be 1.75mm, the multiple high speed signal pad it is each
The width of a high speed signal pad is 0.3mm.
6. QSFP28 optical module test switching device according to claim 1 or 3, which is characterized in that the multiple high speed
Each high speed signal pad of signal pad to pcb board edge length be 1.75mm, the multiple high speed signal pad it is each
The width of a high speed signal pad is 0.5mm.
7. QSFP28 optical module test switching device according to claim 1, which is characterized in that the QSFP28 optical module
Test switching device further includes having pedestal and the shell for cooperating with test equipment, and the pcb board is fixed on pedestal and outer
Between shell.
8. a kind of QSFP28 light module test method, which is characterized in that including
QSFP28 optical module test switching device is plugged in test equipment by step S1；
QSFP28 optical module is plugged in QSFP28 optical module test switching device by step S2；
Wire jumper is plugged in the first connecting portion of QSFP28 optical module test switching device by step S3；
Step S4 obtains QSFP28 optical mode block state information.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910745917.7A CN110501533A (en) | 2019-08-13 | 2019-08-13 | A kind of QSFP28 optical module test switching device and test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910745917.7A CN110501533A (en) | 2019-08-13 | 2019-08-13 | A kind of QSFP28 optical module test switching device and test method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110501533A true CN110501533A (en) | 2019-11-26 |
Family
ID=68586450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910745917.7A Pending CN110501533A (en) | 2019-08-13 | 2019-08-13 | A kind of QSFP28 optical module test switching device and test method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110501533A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112187352A (en) * | 2020-09-25 | 2021-01-05 | 锐捷网络股份有限公司 | Connecting equipment and test system |
| CN112272053A (en) * | 2020-10-16 | 2021-01-26 | 苏州浪潮智能科技有限公司 | Optical module health detection method, device, equipment and readable storage medium |
| CN112636820A (en) * | 2020-11-19 | 2021-04-09 | 苏州浪潮智能科技有限公司 | Optical module stability testing device and method |
| CN114923404A (en) * | 2022-04-15 | 2022-08-19 | 深圳市一博科技股份有限公司 | Method for testing length of golden finger bonding pad |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201336411Y (en) * | 2008-12-24 | 2009-10-28 | 杭州华三通信技术有限公司 | Bonding pad group for SFP connector and communication device |
| CN103983821A (en) * | 2014-04-18 | 2014-08-13 | 烽火通信科技股份有限公司 | High-frequency performance test structure for pluggable optical module connector |
| CN104158025A (en) * | 2014-08-26 | 2014-11-19 | 苏州祥龙嘉业电子科技有限公司 | Connector socket used for transmitting high-definition digital signals |
| CN105430873A (en) * | 2009-12-23 | 2016-03-23 | 上海贝尔股份有限公司 | High-speed connector package and packaging method |
| CN106646777A (en) * | 2016-12-14 | 2017-05-10 | 青岛海信宽带多媒体技术有限公司 | Optical module and design method thereof |
| CN206602524U (en) * | 2017-02-21 | 2017-10-31 | 深圳市迅特通信技术有限公司 | A kind of change-over panel tested for optical module |
| CN107404802A (en) * | 2017-08-21 | 2017-11-28 | 广东欧珀移动通信有限公司 | Printed circuit board, the preparation method of printed circuit board and electronic equipment |
| CN108259084A (en) * | 2017-12-26 | 2018-07-06 | 武汉电信器件有限公司 | A kind of assessment harden structure of high-speed light receiver test and its test system |
| CN209028173U (en) * | 2018-09-12 | 2019-06-25 | 深圳市菲菱科思通信技术股份有限公司 | A kind of optical module switching test device |
| CN210665811U (en) * | 2019-08-13 | 2020-06-02 | 深圳市迅特通信技术有限公司 | QSFP28 optical module test switching device |
-
2019
- 2019-08-13 CN CN201910745917.7A patent/CN110501533A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201336411Y (en) * | 2008-12-24 | 2009-10-28 | 杭州华三通信技术有限公司 | Bonding pad group for SFP connector and communication device |
| CN105430873A (en) * | 2009-12-23 | 2016-03-23 | 上海贝尔股份有限公司 | High-speed connector package and packaging method |
| CN103983821A (en) * | 2014-04-18 | 2014-08-13 | 烽火通信科技股份有限公司 | High-frequency performance test structure for pluggable optical module connector |
| CN104158025A (en) * | 2014-08-26 | 2014-11-19 | 苏州祥龙嘉业电子科技有限公司 | Connector socket used for transmitting high-definition digital signals |
| CN106646777A (en) * | 2016-12-14 | 2017-05-10 | 青岛海信宽带多媒体技术有限公司 | Optical module and design method thereof |
| CN206602524U (en) * | 2017-02-21 | 2017-10-31 | 深圳市迅特通信技术有限公司 | A kind of change-over panel tested for optical module |
| CN107404802A (en) * | 2017-08-21 | 2017-11-28 | 广东欧珀移动通信有限公司 | Printed circuit board, the preparation method of printed circuit board and electronic equipment |
| CN108259084A (en) * | 2017-12-26 | 2018-07-06 | 武汉电信器件有限公司 | A kind of assessment harden structure of high-speed light receiver test and its test system |
| CN209028173U (en) * | 2018-09-12 | 2019-06-25 | 深圳市菲菱科思通信技术股份有限公司 | A kind of optical module switching test device |
| CN210665811U (en) * | 2019-08-13 | 2020-06-02 | 深圳市迅特通信技术有限公司 | QSFP28 optical module test switching device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112187352A (en) * | 2020-09-25 | 2021-01-05 | 锐捷网络股份有限公司 | Connecting equipment and test system |
| CN112187352B (en) * | 2020-09-25 | 2022-05-20 | 锐捷网络股份有限公司 | Connecting equipment and test system |
| CN112272053A (en) * | 2020-10-16 | 2021-01-26 | 苏州浪潮智能科技有限公司 | Optical module health detection method, device, equipment and readable storage medium |
| CN112636820A (en) * | 2020-11-19 | 2021-04-09 | 苏州浪潮智能科技有限公司 | Optical module stability testing device and method |
| CN114923404A (en) * | 2022-04-15 | 2022-08-19 | 深圳市一博科技股份有限公司 | Method for testing length of golden finger bonding pad |
| CN114923404B (en) * | 2022-04-15 | 2023-08-18 | 深圳市一博科技股份有限公司 | Golden finger bonding pad length testing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110501533A (en) | A kind of QSFP28 optical module test switching device and test method | |
| US11327248B2 (en) | Optical assemblies with managed connectivity | |
| CN105701050A (en) | Peripheral component interconnect express (pcie) card having multiple pcie connectors | |
| US20130034998A1 (en) | Straddle mount connector for a pluggable transceiver module | |
| CN105680245A (en) | Socket electric connector | |
| CN109088200A (en) | Multi-contact electric connector and electronic equipment | |
| CN103235372A (en) | Photoelectric-separated intelligent optical fiber connector | |
| CN205565053U (en) | High -speed back panel connector of two ground connection | |
| US20130034972A1 (en) | Straddle mount connector for a pluggable transceiver module | |
| CN203690612U (en) | Connector | |
| US8777673B2 (en) | Socket and plug for high-speed connector | |
| CN204333327U (en) | Electronic card coupler and Kato thereof | |
| CN209401906U (en) | Modular structure and high speed connector for high speed connector | |
| US9680266B2 (en) | High density connector | |
| CN105405280B (en) | A kind of implementation method for debugging electric power acquisition terminal and obtaining amr message | |
| CN104994040A (en) | Ethernet switch and port multiplexing method applied to Ethernet switch | |
| CN107707362B (en) | Adapter card, structure and method supporting 100G network | |
| CN210665811U (en) | QSFP28 optical module test switching device | |
| CN105242355B (en) | A kind of optical fiber connector plug with dual orientation function and preparation method thereof | |
| CN209418860U (en) | Modular structure and high speed connector for high speed connector | |
| CN204992147U (en) | Internet access module and network connector | |
| CN207938888U (en) | Hot swap type interface connector | |
| CN203288900U (en) | Electric connector | |
| CN108899720B (en) | Cable with improved structure | |
| US8552711B2 (en) | Device for testing serial attached small computer system interface signal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 701, 801, building C3, Nanshan wisdom garden, 1001 Xueyuan Avenue, Changyuan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong 518000 Applicant after: Shenzhen Xunte Communication Technology Co.,Ltd. Address before: Room 805, East Tower Building, Nanshan Software Park, 10128 Shennan Avenue, Nantou Street, Nanshan District, Shenzhen City, Guangdong Province, 518000 Applicant before: SHENZHEN SONT TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information |