CN112187352A

CN112187352A - Connecting equipment and test system

Info

Publication number: CN112187352A
Application number: CN202011024551.3A
Authority: CN
Inventors: 王晓杰
Original assignee: Ruijie Networks Co Ltd
Current assignee: Ruijie Networks Co Ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2021-01-05
Anticipated expiration: 2040-09-25
Also published as: CN112187352B

Abstract

The invention discloses a connecting device and a test system. Because the optical connector on the connecting device is connected with the optical module and the golden finger interface connected with the optical connector through the test circuit is connected with the switch, the information interaction between the optical module and the switch through the connecting device is ensured, the test circuit is provided with a test point which is connected with a measuring device, the measuring device can measure the information interaction between the optical module and the switch when the information interaction between the optical module and the switch is carried out under the condition of not damaging the interaction environment between the switch and the optical module, the electrical interface parameter of the optical module is measured through the test point, the process of measuring the electrical interface parameter of the optical module is simplified, the test efficiency is improved, the actual working scene of the optical module is not damaged, the measured electrical interface parameters are closer to the electrical interface parameters generated when the optical module and the switch perform normal information interaction, and the accuracy of the measured electrical interface parameters is improved.

Description

Connecting equipment and test system

Technical Field

The invention relates to the technical field of optical fiber communication, in particular to connecting equipment and a testing system.

Background

In an actual application scenario, after the optical module is inserted into the optical port cage on the switch, the golden finger of the optical module and the reed needle of the switch are sealed in the optical cage, and the optical module is tightly attached to the optical port cage, so that test equipment such as an oscilloscope and the like cannot directly detect the optical module interface in the optical port cage. Therefore, when the working voltage, current and power consumption of each part of the optical module are measured, or data interaction and state control between the switch and the optical module are tested, the electrical interface parameters of the optical module are measured, and the optical module or the switch generally needs to be disassembled, so that the testing process is not only low in efficiency, but also the actual working scene of the optical module is damaged, and the accuracy of the obtained testing data is not high. Therefore, a testing device that does not damage the actual working scene of the optical module is urgently needed to test the electrical interface parameters of the optical module.

In the prior art, a high-speed signal of a port of an exchanger can be led out to a shielded wire connector through a host computer compatibility test board (HCB), so that the high-speed signal test can be carried out by matching with an oscilloscope. In another method, a low-speed signal of an optical module interface is connected to a microprocessor of an optical module compatibility test board (MCB) through the MCB, the microprocessor of the MCB is accessed through an upper computer, and the low-speed signal is analyzed by software so as to acquire state information of the optical module. For the two methods, only the high-speed signal or the state information of the host or the optical module in the mutually independent state, that is, in the non-communication state, can be measured, and the obtained electrical interface parameters are inaccurate and cannot feed back the real situation in the information interaction process between the switch and the optical module.

Disclosure of Invention

The embodiment of the invention provides a connecting device and a testing system, which are used for solving the problem that the electrical interface parameters of an optical module cannot be measured in the conventional working scene without damaging the normal information interaction between a switch and the optical module.

An embodiment of the present invention provides a connection device, where the connection device includes: the device comprises an optical connector, a golden finger interface and a test point;

the optical connector is connected with the golden finger interface through a test line and is used for being connected with an optical module so as to enable the optical module to perform information interaction with the switch through the connecting equipment;

the golden finger interface is used for being connected with the switch so as to enable the switch to perform information interaction with the optical module through the connecting equipment;

the test point is arranged on the test circuit and used for being connected with the measuring equipment, so that the measuring equipment can measure the electrical interface parameters of the optical module through the test point when the optical module and the switch carry out information interaction.

Further, the test point includes at least one of a power supply test point, a signal test point and a status test point.

Further, the connection device further includes: a single-pole double-throw switch and an external power interface;

a first power supply pin is arranged on the optical port connector and connected with the moving end of the single-pole double-throw switch;

a second power supply pin is arranged on the golden finger interface and is connected with a first fixed end of the single-pole double-throw switch;

and an external power supply pin is arranged on the external power supply interface and is connected with the second immobile end of the single-pole double-throw switch.

Further, if the test point comprises a power supply test point, the first power supply pin is connected with the moving end of the single-pole double-throw switch through a power supply line, and the power supply test point is arranged on the power supply line;

the power supply test point is specifically used for being connected with the measuring equipment, so that the measuring equipment measures the actual voltage and noise of the optical module through the power supply test point when the optical module and the switch perform information interaction.

Furthermore, the test point also comprises an input power supply test point;

a resistor is arranged on a power supply circuit which is connected with the first power supply pin and the moving end of the single-pole double-throw switch, the input power supply test point is positioned between the resistor and the moving end, and the power supply test point is positioned between the resistor and the first power supply pin;

the input power supply test point is specifically used for being connected with the measuring equipment so that the measuring equipment measures a first input voltage of the optical module through the input power supply test point when the optical module and the switch perform information interaction;

the power supply test point is specifically used for being connected with the measuring equipment, so that the measuring equipment measures the second input voltage of the optical module through the power supply test point when the optical module and the switch perform information interaction.

Furthermore, the power supply test points comprise a control chip power supply test point, a transmitting module power supply test point and a receiving module power supply test point;

the first power supply pins comprise a control power supply pin, a transmitting power supply pin and a receiving power supply pin;

the single-pole double-throw switch comprises a first single-pole double-throw switch, a second single-pole double-throw switch and a third single-pole double-throw switch;

the power supply line comprises a control power supply line, a transmitting power supply line and a receiving power supply line;

the control power supply pin is connected with the movable end of the first single-pole double-throw switch through the control power supply circuit, and a control chip power supply test point is arranged on the control power supply circuit;

the transmitting power supply pin is connected with the movable end of the second single-pole double-throw switch through the transmitting power supply circuit, and the transmitting power supply circuit is provided with the transmitting module power supply test point;

the receiving power supply pin is connected with the moving end of the third single-pole double-throw switch through the receiving power supply line, and the receiving power supply line is provided with the receiving module power supply test point.

Further, if the test point includes the signal test point, a first signal pin is arranged on the optical connector, a second signal pin is arranged on the golden finger interface, the first signal pin is connected with the second signal pin through a signal line, and the signal test point is arranged on the signal line;

the signal test point is specifically configured to be connected to the measurement device, so that when the optical module performs information interaction with the switch, the measurement device measures a voltage amplitude and a voltage timing sequence of a signal transmitted by the optical module on the signal line through the signal test point.

Further, the signal test point is located on one side of the signal line close to the first signal pin.

Furthermore, the signal test points comprise data line signal test points and control line signal test points;

the first signal pins comprise a first data signal pin and a first control signal pin;

the second signal pins comprise a second data signal pin and a second control signal pin;

the signal lines comprise data line signal lines and control line signal lines;

the first data signal pin is connected with the second data signal pin through the data line signal circuit, the data line signal circuit transmits a data line signal, and the data line signal circuit is provided with the data line signal test point;

the first control signal pin is connected with the second control signal pin through the control line signal circuit, the control line signal circuit transmits a control line signal, and the control line signal circuit is provided with the control line signal test point.

Further, if the test point includes the state test point, a first state control pin is arranged on the optical connector, a second state control pin is arranged on the golden finger interface, the first state control pin is connected with the second state control pin through a state control circuit, and the state test point is arranged on the state control circuit;

the state test point is specifically configured to be connected to the measurement device, so that the measurement device measures the voltage amplitude and the voltage timing of a signal transmitted on the state control line through the state test point when the optical module performs information interaction with the switch.

Further, the state test point is located on one side of the state control circuit close to the first state control pin.

Further, the state test points comprise an optical module chip selection test point, an optical module power consumption control test point, an optical module reset test point, an optical module on-site test point and an optical module interruption test point;

the first state control pins comprise a first chip selection pin, a first power consumption control pin, a first reset pin, a first in-place line pin and a first interrupt pin;

the second state control pin comprises a second chip selection pin, a second power consumption control pin, a second reset pin, a second in-place line pin and a second interrupt pin;

the state control circuit comprises a chip selection circuit, a power consumption control circuit, a reset circuit, an in-place circuit and an interrupt circuit;

the first chip selection pin is connected with the second chip selection pin through the chip selection line, the chip selection line transmits an optical module chip selection signal, and the chip selection line is provided with the optical module chip selection test point;

the first power consumption control pin is connected with the second power consumption control pin through the power consumption control circuit, the power consumption control circuit transmits an optical module power consumption control signal, and the power consumption control circuit is provided with the optical module power consumption control test point;

the first reset pin is connected with the second reset pin through the reset circuit, the reset circuit transmits an optical module reset signal, and the reset circuit is provided with the optical module reset test point;

the first in-place pin is connected with the second in-place pin through the in-place line, the in-place line transmits an in-place signal of an optical module, and the in-place test point of the optical module is arranged on the in-place line;

the first interrupt pin is connected with the second interrupt pin through the interrupt line, the interrupt line transmits an optical module interrupt signal, and the terminal line is provided with the optical module interrupt test point.

An embodiment of the present invention provides a test system, where the system includes: the device comprises a connecting device, an optical module, a switch and a measuring device;

the optical module is connected with an optical connector on the connecting device and used for carrying out information interaction with the switch through the connecting device;

the switch is connected with a golden finger interface on the connecting equipment and used for carrying out information interaction with the optical module through the connecting equipment;

the measuring equipment is connected with the test point on the connecting equipment and used for measuring the electrical interface parameters of the optical module through the test point on the connecting equipment when the optical module and the switch carry out information interaction.

Further, the test system further comprises: an external power supply;

the external power supply is connected with an external power supply interface on the connecting equipment and used for supplying power to the optical module by using different power supply parameters.

Further, the measurement device is specifically configured to measure, if the test point includes the power supply test point, an actual voltage and a second noise of the optical module through the power supply test point on the connection device when the optical module performs information interaction with the switch.

Further, if the test point also comprises an input power supply test point;

the measuring device is specifically configured to measure a first input voltage of the optical module through the input power supply test point on the connection device when the optical module performs information interaction with the switch; when the optical module and the switch carry out information interaction, a second input voltage of the optical module is measured through the power supply test point on the connecting equipment; and determining the power consumption current of the optical module according to the first input voltage and the second input voltage.

Further, the measurement device is specifically configured to measure, if the test point includes the signal test point, a voltage amplitude and a voltage timing sequence of a signal transmitted by the optical module on the signal line through the signal test point on the connection device when the optical module performs information interaction with the switch.

Further, the signal test point is located at a position close to the optical module.

Further, the measurement device is specifically configured to measure, if the test point includes the state test point, a voltage amplitude and a voltage timing of a signal transmitted on the state control line through the state test point on the connection device when the optical module performs information interaction with the switch.

Because the optical connector on the connecting device provided by the embodiment of the invention can be connected with the optical module, and the golden finger interface connected with the optical connector through the test circuit can be connected with the switch, the optical module can be ensured to carry out information interaction with the switch through the connecting device, the test circuit is provided with the test point which can be connected with the measuring device, so that the measuring device can measure the electrical interface parameter of the optical module through the test point when the optical module and the switch carry out information interaction under the condition of not damaging the interaction environment between the switch and the optical module, namely not disassembling the optical module or the switch, the process of measuring the electrical interface parameter of the optical module is simplified, the test efficiency is improved, the actual working scene of the optical module is not damaged, and the measured electrical interface parameter is closer to the electrical interface parameter generated when the optical module and the switch carry out normal information interaction And the accuracy of the measured electrical interface parameters is improved by the interface parameters.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a connection device according to an embodiment of the present invention;

FIG. 2 is a schematic circuit diagram of a power supply line according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a circuit connection of a power supply line on a connection device according to an embodiment of the present invention;

FIG. 4 is a schematic circuit diagram of a signal line according to an embodiment of the present invention;

FIG. 5 is a schematic circuit diagram of a state control circuit according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a connection device according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a test system according to an embodiment of the present invention.

Detailed Description

The embodiment of the invention provides a connecting device and a testing system, which are used for conveniently and accurately measuring the electrical interface parameters of an optical module when the optical module and a switch perform normal information interaction.

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In recent years, application markets of big data, 5G, Internet of things, unmanned driving and the like are rapidly developed, explosive growth is brought to data traffic, and data center interconnection gradually develops to become a research hotspot of optical communication. The data center cluster requires cooperative operation among data centers in order to realize normal work of various internet services and application markets. However, with the development of science and technology, people have higher and higher requirements on data center internet, and how to realize real-time mass interaction of information generated between data centers is a problem that people pay more attention in recent years. Optical fiber communication is a necessary means for solving the above technical problems. The optical module for realizing optical-electrical/electrical-optical conversion is an important device in an optical fiber communication system, is a core factor for realizing higher efficiency, lower power consumption and more miniaturized switching equipment, and determines whether larger and denser information transmission can be realized in the information interaction process between data centers.

The optical module mainly comprises a photoelectric conversion device, a control chip and an interface. The interface mainly comprises an electrical interface and an optical interface, wherein the electrical interface is used for realizing electric signal transmission between the optical module and a switch or other equipment, and the optical interface is used for transmitting optical signals between the optical module and the optical module. The optical module electrical interface mainly comprises a power supply interface, an Inter-Integrated Circuit (I2C) interface for register configuration and status reading, a TX DATA BUS interface for DATA transmission, an RX DATA BUS interface for DATA reception, and other control and status monitoring signals. The power supply interface comprises a VCC1 for supplying power to the module control chip, a VCCT for supplying power to the transmitting module and a VCCR for supplying power to the receiving module. In addition, the I2C data signal is frequently used as a register allocation and status reading signal between the switch and the optical module.

Example 1:

fig. 1 is a schematic structural diagram of a connection device according to an embodiment of the present invention, where the connection device includes: an optical connector 11, a golden finger interface 12 and a test point 13;

the optical connector 11 is connected with the golden finger interface 12 through a test line, and is used for connecting with an optical module, so that the optical module performs information interaction with a switch through the connection device;

the golden finger interface 12 is configured to be connected to the switch, so that the switch performs information interaction with the optical module through the connection device;

the test point 13 is arranged on the test line, and the test point 13 is used for connecting with a measuring device, so that the measuring device measures the electrical interface parameters of the optical module through the test point 13 when the optical module and the switch perform information interaction.

In the present embodiment, the connection device includes an optical connector 11, a gold finger interface 12, and a test point 13. The connecting device is provided with a bottom plate, the optical connector 11 and the golden finger interface 12 are both positioned on the bottom plate, the optical connector 11 is connected with the golden finger interface 12 through a test circuit, and a test point 13 is arranged on the test circuit. The optical connector 11 can be connected to an optical module, and the gold finger interface 12 can be connected to a switch. Wherein, there are 38 grooves on this golden finger interface 12, inlay the golden conductive contact in each groove. The optical module can perform information interaction with the switch through the connecting device through the optical connector 11 and the golden finger interface 12 which are connected through the test line. And a test point 13 is arranged on the test circuit, and the test point 13 can be connected with the measuring equipment, so that the measuring equipment can conveniently measure the electrical interface parameters of the optical module through the test point 13 when the optical module and the switch perform information interaction.

The bottom plate can be a Printed Circuit Board (PCB), the PCB can encapsulate a test circuit in the bottom plate to establish communication connection between the switch and the optical module through the connection device, and the bottom plate can be used for assembling components, devices and test points 13 required by the connection device.

In the specific implementation process, in order to implement the measurement of the electrical interface parameters of the optical module, a worker needs to insert a gold finger interface (for convenience of description, distinguished from a gold finger interface 12 on the connection device, and denoted as a first gold finger interface) of the optical module into an optical connector 11 of the connection device, the pogo pins on the optical connector 11 of the connection device will respectively overlap in the grooves on the first gold finger interface on the optical module, then, the golden finger interface 12 of the connection device connected with the optical module is inserted into the optical connector of the switch (for convenience of description, distinguished from the optical connector 11 on the connection device, and denoted as the first optical connector), the pogo pins on the first optical connector will also be respectively snapped into the grooves on the gold finger interface 12 on the connection device, through the connection of the steps, the information interaction between the optical module and the switch through the connecting equipment can be realized.

In order to ensure that normal information interaction can be performed between the optical module and the switch, the structure of the optical connector 11 of the connection device may be the same as that of the first optical connector on the switch, and the structure of the golden finger interface 12 of the connection device may be the same as that of the first golden finger interface of the optical module, so that information interaction between the optical module and the switch through the connection device can be performed without changing the structures of the existing optical module and the switch.

When the operator wishes to measure the electrical interface parameters of the light module, the measuring device can be connected to the test points 13 on the connecting device. The test equipment can measure the electrical interface parameters of the optical module when the optical module and the switch perform information interaction through the connected test point 13.

In order to facilitate connection between the measuring device and the test point 13 on the connection device, a probe or a lead for measurement may be led out from the test point 13, and the subsequent measuring device may be connected to the test point 13 through a probe or a wire clamp, or a test hole into which the probe of the measuring device is inserted may be provided in the test point 13. In the specific implementation process, the flexible setting can be performed according to the actual requirement, and is not specifically limited herein.

In the embodiment of the invention, the measuring equipment can be equipment such as an oscilloscope, a multimeter and the like, and can also be equipment such as a voltmeter, an ammeter and the like.

Because the optical connector 11 on the connection device provided by the embodiment of the invention can be connected with the optical module, and the golden finger interface 12 connected with the optical connector 11 through the test circuit can be connected with the switch, thereby ensuring that the optical module can carry out information interaction with the switch through the connection device, and the test circuit is provided with the test point 13 which can be connected with the measurement device through the test point 13, so that the measurement device can measure the electrical interface parameter of the optical module through the test point 13 when the information interaction is carried out between the optical module and the optical module under the condition that the interaction environment between the switch and the optical module is not damaged, namely the optical module or the switch is not disassembled, the process of measuring the electrical interface parameter of the optical module is simplified, the test efficiency is improved, and the actual working scene of the optical module is not damaged, the measured electrical interface parameters are closer to the electrical interface parameters generated when the optical module and the switch perform normal information interaction, and the accuracy of the measured electrical interface parameters is improved.

Example 2:

in an actual application scene, if the optical module is directly connected with the switch, the switch is lapped on a groove corresponding to a power supply interface pin on a first golden finger interface of the optical module through a reed corresponding to the power supply interface pin on the first optical connector so as to supply power to the optical module; the reed corresponding to the I2C interface pin on the first optical connector is lapped on the groove corresponding to the I2C interface pin on the first golden finger interface to read and write the register in the optical module, so that state monitoring information such as the temperature, the working voltage, the bias current of the laser, the luminous power, the receiving power and the like of the optical module is obtained; and the light-emitting state of the optical module can be controlled and initialized by overlapping the reed pin corresponding to the state control interface pin on the first golden finger interface on the groove corresponding to the state control interface pin on the first optical interface. Therefore, in the process of information interaction between the optical module and the switch, the switch and each interface pin on the optical module normally operate, such as a power supply interface pin, an I2C interface pin, a state control interface pin, and the like, which are basic conditions for normal information interaction between the switch and the optical module.

In order to enable the switch and the optical module to be mutually adaptive, the Electrical interface parameters of the optical module need to meet the index requirements of protocol specifications, and the SFF-8679QSFP +4X Base Electrical Specification protocol provides specific requirements for I2C interface pins, power supply interface pins, state control interface pins and the like of the QSFP28 optical module and the switch. For the I2C interface pin and the state control interface pin, the protocol mainly makes specific requirements on the high and low level amplitudes; for the pins of the power supply interface, the protocol makes specific requirements on the voltage amplitude, noise, power consumption current, hot plug transient peak current, hot plug steady state current value and the like. And according to the requirement of each index in the protocol and the electrical interface parameters measured by the measuring equipment on the test points, whether the current switch and the optical module work normally can be determined. Therefore, in the embodiment of the present invention, the test points include at least one of a power supply test point, a signal test point and a status test point on the connection device according to different types of interface pins. Based on the different test points, different electrical interface parameters may be tested.

In order to facilitate determining a specific failure condition of the optical module damage, on the basis of the above embodiment, in an embodiment of the present invention, the connection device further includes: a single-pole double-throw switch and an external power interface;

a first power supply pin is arranged on the optical port connector 11, and the first power supply pin is connected with the moving end of the single-pole double-throw switch;

a second power supply pin is arranged on the golden finger interface 12, and the second power supply pin is connected with a first fixed end of the single-pole double-throw switch;

In an actual application process, when power supply of an optical module interface of a switch is abnormal, for example, overvoltage, overcurrent, electrostatic discharge (ESD), and the like, fatal damage of an optical module is often caused. In order to prevent the optical module from being damaged again due to the similar faults, the specific failure conditions causing the damage of the optical module need to be further confirmed. If the power supply parameters for supplying power to the optical module can be accurately adjusted, the electrical interface parameters of the optical module in different power supply environments can be acquired, and therefore the specific failure condition causing damage in the interaction process of the optical module and the switch can be found out.

At present, although electrical interface parameters such as voltage, current and time sequence of an electrical interface of an optical module can be acquired through an MCB and an oscilloscope, the MCB integrates a large number of chips, active devices, passive devices and other components, and the MCB is high in manufacturing cost, and needs to supply power to a microprocessor of the MCB and other active devices besides supplying power to the optical module, in order to ensure the work of other active devices on the MCB and avoid damage conditions such as short circuit of other active devices, an interface capable of supplying power to the optical module on the MCB generally can only provide a power supply environment of one mode, and cannot modify power supply parameters which can be provided by the interface, so that different power supply environments are provided for the optical module, and the oscilloscope can conveniently acquire the electrical interface parameters of the optical module in different power supply environments. If different power supply environments are expected to be provided for the optical module, only the MCBs with different power supply parameters can be replaced, or one MCB with interfaces with a plurality of different power supply parameters is specially designed, so that the operation is very complicated and complex, and a large amount of manpower and material resources are required to be paid out.

In another possible implementation, the HCB may extract the high-speed signal and the low-speed signal output by the first optical connector on the switch from the first optical connector, which is equivalent to extending the interface pin on the optical connector 11 to a certain extent, so as to implement measurement of the signal output by the first optical connector of the switch, but since the high-speed signal and the low-speed signal are extracted from the first optical connector, the HCB occupies the first optical connector, so that the optical module cannot be connected to the switch, and therefore the HCB cannot measure the electrical interface parameter of the optical module during the information interaction between the switch and the optical module, and cannot provide the power supply environments with different power supply parameters for the optical module, and measure the electrical interface parameters of the optical module in different power supply environments.

Therefore, in the embodiment of the present invention, in order to provide power supply environments with different power supply parameters for the optical module, an external power interface may be provided on the connection device. Through the external power supply interface, the connection between the connecting equipment and an external power supply can be realized, so that the external power supply can provide power supply environments with different power supply parameters for the optical module, and the measuring equipment connected with the test points can measure the electrical interface parameters of the optical module in the information interaction process of the optical module and the switch under different power supply environments through the test points.

In the embodiment of the invention, if it is only desired to measure the electrical interface parameters of the optical module in the normal information interaction process of the optical module and the switch, an external power supply is generally not needed to supply power to the optical module, the switch can supply power to the optical module directly through the reed corresponding to the power supply interface pin on the first optical connector of the switch, and only when the specific failure condition of the optical module is determined, the connection device needs to be connected with the external power supply, so that the external power supply supplies power to the optical module with different power supply parameters. Therefore, in order to facilitate selection of a power supply currently supplying power to the optical module, in the embodiment of the present invention, the connection device further includes a single-pole double-throw switch, and a worker can switch the power supply by controlling the single-pole double-throw switch.

Specifically, a first power supply pin is arranged on the optical port connector 11, and the first power supply pin is connected with a moving end of the single-pole double-throw switch; a second power supply pin is arranged on the golden finger interface 12, and the second power supply pin is connected with a first fixed end of the single-pole double-throw switch; and an external power supply pin is also arranged on the external power supply interface and is connected with the second immobile end of the single-pole double-throw switch.

When the switchboard is expected to supply power to the optical module, a worker closes the single-pole double-throw switch to the first fixed end through controlling the single-pole double-throw switch, and connection between the first power supply pin and the second power supply pin is achieved. The reed needle that the power supply interface pin on the first optical connector of switch corresponds, the overlap joint is to the gold finger interface 12 of jointing equipment on the recess that the second power supply pin corresponds on, can transmit the electric current that the switch provided to first power supply pin department, and then the reed needle that first power supply pin corresponds on the optical connector 11 through jointing equipment supplies power to the optical module.

When desiring that the external power supply supplies power to the optical module, the staff connects the external power supply with the external power supply interface, and then closes the single-pole double-throw switch to the second stationary terminal through the control of the single-pole double-throw switch, so as to realize the connection between the external power supply pin and the second power supply pin, so that the external power supply can transmit the provided current to the first power supply pin through the external power supply pin, and then supply power to the optical module through the reed corresponding to the first power supply pin on the optical connector 11 of the connection device.

Example 3:

in order to ensure the diversity of the measured electrical interface parameters, on the basis of the above embodiments, in the embodiment of the present invention, if the test point includes a power supply test point, the first power supply pin is connected to the moving end of the single-pole double-throw switch through a power supply line, and the power supply test point is disposed on the power supply line;

In the embodiment of the invention, the first power supply pin is connected with the movable end of the single-pole double-throw switch through a power supply line, and a power supply test point is arranged on the power supply line, so that the electrical interface parameters of the optical module can be measured through the power supply test point.

In a specific implementation process, after the power supply supplies power to the optical module, namely the switch or an external power supply supplies power to the optical module, a worker connects the measuring equipment with the power supply test point on the connecting equipment, and the voltage and noise on a power supply line when the switch and the optical module perform information interaction can be measured at the power supply test point through the measuring equipment, namely the actual voltage and the existing noise of the optical module during working are measured.

In an actual application process, in order for the optical module to work, the power supply needs to supply power to the control chip module, the transmitting module and the receiving module in the optical module. Therefore, in the embodiment of the present invention, according to different modules that need to be powered in an optical module, a first power supply pin in the connection device may be divided into a control power supply pin, a transmission power supply pin, and a reception power supply pin, a single-pole double-throw switch on the connection device includes a first single-pole double-throw switch, a second single-pole double-throw switch, and a third single-pole double-throw switch, and a power supply line includes a control power supply line, a transmission power supply line, and a reception power supply line. The control power supply pin is connected with the movable end of the first single-pole double-throw switch through the control power supply circuit, and a control chip power supply test point is arranged on the control power supply circuit; the transmitting power supply pin is connected with the movable end of the second single-pole double-throw switch through the transmitting power supply circuit, and the transmitting power supply circuit is provided with the transmitting module power supply test point; the receiving power supply pin is connected with the moving end of the third single-pole double-throw switch through the receiving power supply circuit, and the receiving power supply circuit is provided with the receiving module power supply test point.

Fig. 2 is a schematic circuit connection diagram of a power supply line according to an embodiment of the present invention. As shown in fig. 2, the power supply lines in the connected device include a control (VCC1) power supply line, a transmit (VCCT) power supply line, and a receive (VCCR) power supply line, and the first single-pole double-throw switch 31 on the VCC1 power supply line, the first single-pole double-throw switch 32 on the VCCT power supply line, and the third single-pole double-throw switch 33 on the VCCR power supply line constitute a power transfer switch on the connected device. The VCC1 power supply pin is connected to the moving end of the first spdt switch 31 through the control power supply line, the VCCT power supply pin is connected to the moving end of the second spdt switch 32 through the transmit power supply line, and the VCCR power supply pin is connected to the moving end of the third spdt switch 33 through the receive power supply line.

The current generated by the power supply can be transmitted to a VCC1 power supply pin through the VCC1 power supply line, and the current is transmitted to a groove corresponding to a VCC1 pin of a control chip module interface on a first golden finger interface of the optical module through a reed corresponding to a VCC1 power supply pin on the optical connector 11 of the connection device, so that the current is transmitted to the optical module, and further the power is supplied to the control chip module in the optical module. After the VCC1 power supply test point arranged on the VCC1 power supply line is connected with the measuring equipment, when the optical module performs information interaction with the switch, the measuring equipment can measure the actual voltage and noise of the VCC1 power supply line, namely the actual voltage and noise of the control chip module interface on the optical module, through the VCC1 power supply test point on the VCC1 power supply line.

Similarly, the current generated by the power supply can be transmitted to the VCCT power supply pin through the VCCT power supply line, and the current is transmitted to the groove corresponding to the VCCT module interface pin on the first gold finger interface of the optical module through the reed corresponding to the VCCT power supply pin on the optical connector 11 of the connection device, so that the current is transmitted to the optical module, and the VCCT module in the optical module is further supplied with power. After the power supply test point of the VCCT module arranged on the VCCT power supply circuit is connected with the measuring equipment, when the optical module and the switch carry out information interaction, the measuring equipment can measure the actual voltage and noise of the VCCT power supply circuit, namely the actual voltage and noise of the VCCT module interface on the optical module through the power supply test point of the VCCT module on the VCCT power supply circuit.

The current generated by the power supply can be transmitted to the VCCR power supply pin through the VCCR power supply line, and is transmitted to the groove corresponding to the VCCR module interface pin on the first gold finger interface of the optical module through the reed pin corresponding to the VCCR power supply pin on the optical connector 11 of the connection device, so that the current is transmitted to the optical module, and the VCCR module in the optical module is further supplied with power. After the VCCR module power supply test point arranged on the VCCR power supply line is connected with the measuring equipment, when the optical module performs information interaction with the switch, the measuring equipment can measure the actual voltage and noise of the VCCR power supply line, namely the actual voltage and noise of the VCCR module interface on the optical module, through the VCCR module power supply test point on the VCCR power supply line.

In order to further ensure the diversity of the measured electrical interface parameters, the test points also comprise input power supply test points;

In the embodiment of the invention, in order to calculate the current on the power supply line conveniently and determine the power consumption current of the optical module, a resistor is arranged on the power supply line connecting the first power supply pin and the movable end of the single-pole double-throw switch, an input power supply test point is arranged between the resistor on the power supply line and the movable end of the single-pole double-throw switch, and a power supply test point is arranged between the resistor on the power supply line and the first power supply pin. Because the resistor exists between the two test points, the resistor can cause certain voltage drop, and the power consumption current on the power supply line can be determined according to the voltage drop between the two test points and the resistance value of the pre-configured resistor.

When the resistance value of the resistor is set, in order to measure the voltage drop between two test points by using the measuring equipment, the resistance value of the resistor is not too small and is at least larger than the voltage drop which can be measured by the minimum precision of the measuring equipment, and in order to avoid the overlarge resistor, the optical module cannot normally work, and the resistance value of the resistor is not too large.

In a specific implementation process, a worker can connect the measuring equipment with the input power supply test point on the power supply line, that is, when the measuring equipment measures information interaction between the optical module and the switch, the input voltage of the power supply input to the power supply line, that is, the first input voltage of the power supply input to the optical module. And the staff connects the measuring equipment with the power supply test point on the power supply line, namely, when the measuring equipment measures that the optical module and the switch carry out information interaction, the voltage provided by the power supply is subjected to voltage drop through the resistance on the power supply line, namely, the second input voltage which is actually input to the optical module by the power supply and is used for working.

After the first input voltage and the second input voltage measured by the measurement device are obtained based on the above embodiment, the measurement device may obtain a voltage difference between the first input voltage and the second input voltage; and the measuring equipment determines the power consumption current on the power supply line, namely the power consumption current provided by the optical module, by adopting an ohm law according to the voltage difference value and the resistance value of the pre-configured resistor.

Based on the same reason in the foregoing embodiments, in the embodiments of the present invention, according to different modules that need to supply power in an optical module, a first power supply pin in the connection device may be divided into a control power supply pin, a transmission power supply pin, and a reception power supply pin, a single-pole double-throw switch on the connection device includes a first single-pole double-throw switch, a second single-pole double-throw switch, and a third single-pole double-throw switch, a power supply line includes a control power supply line, a transmission power supply line, and a reception power supply line, and a power supply test point includes a control chip power supply test point, a transmission module power supply test point, and a reception module power.

Fig. 3 is a schematic circuit connection diagram of a power supply line connected to a device according to an embodiment of the present invention, and for convenience of description, the following description is made in detail with reference to fig. 3:

as shown in fig. 3, the VCC1 power supply line, VCCT power supply line, and VCCR power supply line form a power supply test network 4.

After the control chip power supply test point 43 and the input power supply test point 41 (for convenience of description, referred to as a first input power supply test point) arranged on the VCC1 power supply line are both connected to the measurement device, when the optical module performs information interaction with the switch through the first input power supply test point 41 on the VCC1 power supply line, the input voltage of the power supply on the VCC1 power supply line, that is, the first input voltage of the power supply input to the control chip module of the optical module, and through the control chip power supply test point 43 on the VCC1 power supply line, the voltage of the voltage provided by the power supply after the voltage drop through the resistor 42 on the VCC1 power supply line, that is, the second input voltage of the power supply actually input to the control chip module of the optical module for working; acquiring a voltage difference value between a first input voltage and a second input voltage; according to the voltage difference value and the resistance value of the resistor 42 arranged on the VCC1 power supply line, the power consumption current corresponding to the VCC1 power supply line, that is, the power consumption current of the control chip module of the optical module during operation, can be obtained by adopting ohm's law.

Similarly, after the VCCT power supply test point 46 and the input power supply test point 44 (for convenience of description, referred to as a second input power supply test point) arranged on the VCCT power supply line are both connected to the measurement device, when the optical module performs information interaction with the switch through the second input power supply test point 44 on the VCCT power supply line, the measurement device can measure the input voltage input by the power supply to the VCCT power supply line, namely the first input voltage input by the power supply to the emission module of the optical module, and can measure the voltage of the voltage provided by the power supply after the voltage drop through the resistor 45 on the VCCT power supply line through the VCCT power supply test point 46 on the VCCT power supply line, namely the second input voltage which is actually input by the power supply to the emission module of the optical module for operation; acquiring a voltage difference value between a first input voltage and a second input voltage; according to the voltage difference value and the resistance value of the resistor 45 arranged on the VCCT power supply line, the power consumption current corresponding to the VCCT power supply line, namely the power consumption current of the transmitting module of the optical module during working can be obtained by adopting ohm's law.

After the VCCR power supply test point 49 and the input power supply test point 47 (for convenience of description, referred to as a second input power supply test point) arranged on the receiving power supply line are both connected to the measurement device, the measurement device can measure, through the second input power supply test point 47 on the VCCR power supply line, when the optical module performs information interaction with the switch, the input voltage input by the power supply to the VCCR power supply line, that is, the first input voltage input by the power supply to the receiving module of the optical module, and can measure, through the VCCR power supply test point 49 on the VCCR power supply line, the voltage of the voltage provided by the power supply after the voltage drop through the resistor 48 on the VCCR power supply line, that is, the second input voltage actually input by the power supply to the receiving module of the; acquiring a voltage difference value between a first input voltage and a second input voltage; according to the voltage difference and the resistance value of the resistor 48 arranged on the VCCR power supply line, the power consumption current corresponding to the VCCR power supply line, that is, the power consumption current of the optical module when the receiving module operates, can be obtained by using the ohm's law.

In a possible implementation manner, in order to measure electrical interface parameters of an optical module in a hot plug process, the golden finger interface 12 of the connection device is a hot plug golden finger interface 12, and after a worker connects the measurement device with a power supply test point on any power supply line of the connection device, the worker can obtain parameters such as a hot plug transient peak current, a hot plug steady-state current value and the like generated on the power supply line by plugging and unplugging an optical port connection device connected with the optical connector 11 of the connection device and monitoring data measured by the measurement device through the power supply test point, that is, obtain the hot plug transient peak current, the hot plug steady-state peak current, and the hot plug steady-state current value corresponding to the power supply interface of the optical module.

Example 4:

in order to ensure the diversity of the measured electrical interface parameters, on the basis of the above embodiments, in the embodiment of the present invention, if the test point includes the signal test point, a first signal pin is arranged on the optical connector 11, a second signal pin is arranged on the gold finger interface 12, the first signal pin is connected to the second signal pin through a signal line, and the signal line is provided with the signal test point;

In the practical application process, in the process of information interaction between the switch and the optical module, signal transmission is inevitably performed. In order to realize normal information interaction between the switch and the optical module, a first signal pin is arranged on the optical connector 11, a second signal pin is arranged on the golden finger interface 12, the second signal pin is connected with the first signal pin through a signal line, and a signal test point is arranged on the signal line, so that when the switch and the optical module perform information interaction, the voltage amplitude and the voltage timing sequence of a signal transmitted on the signal line when the optical module works are measured through a measuring device connected with the signal test point.

In a specific implementation process, the optical module may transmit a signal to be transmitted to the signal line through the spring pin corresponding to the first signal pin on the optical connector 11 of the connection device through the groove corresponding to the I2C interface pin on the first gold finger interface, and then transmit the signal to the second signal pin on the connection device. Through the groove corresponding to the second signal pin on the golden finger interface 12 of the connection device, the signal to be transmitted is transmitted to the switch through the reed pin corresponding to the I2C interface pin on the first optical connector of the switch, so that the optical module transmits the generated signal to the switch.

Of course, the switch may also overlap the groove corresponding to the second signal pin on the gold finger interface 12 of the connection device through the pogo pin corresponding to the I2C interface pin on the first optical connector, so as to transmit the signal sent by the switch to the signal line of the connection device, and further to transmit the signal to the first signal pin on the connection device. The reed pin corresponding to the first signal pin on the optical connector 11 of the connection device is lapped on the groove corresponding to the I2C interface pin on the first golden finger interface of the optical module, so that the signal generated by the switch is transmitted to the optical module.

It should be noted that, because a loss inevitably occurs when a signal generated by an optical module is transmitted on a signal line in a connection device, in order to reduce the loss generated in the signal transmission process and improve the accuracy of the measured electrical interface parameter of the optical module, in the embodiment of the present invention, the signal test point is located on one side of the signal line close to the first signal pin.

In an actual application process, in order to facilitate information interaction between the optical module and the switch, an I2C interface in the optical module is mainly used for transmitting a data line (SDA) signal and a control line (SCL) signal. Therefore, in the embodiment of the present invention, according to the type of the signal transmitted by the I2C interface of the optical module, the first signal pin in the connection device may be divided into a first data signal pin and a first control signal pin, the second signal pin in the connection device includes a second data signal pin and a first control signal pin, and the signal test points include an SDA signal test point and an SCL signal test point. The SDA signal test point is used for testing an SDA signal corresponding to the I2C interface, and the SCL signal test point is used for testing an SCL signal corresponding to the I2C interface. The first data signal pin is connected with the second data signal pin through the SDA signal line, the SDA signal line transmits an SDA signal, and the SDA signal line is provided with the SDA signal test point; the first control signal pin is connected with the second control signal pin through the SCL signal line, the SCL signal line transmits an SCL signal, and the SCL signal line is provided with the SCL signal test point.

Fig. 4 is a schematic circuit connection diagram of a signal line according to an embodiment of the present invention, and for convenience of description, the following description is provided with reference to fig. 4:

as shown in fig. 4, the SDA signal line and the SCL signal line constitute the I2C interface test network 6.

After the connection device is connected with the optical module and the switch, the connection device can receive an SCL signal (for convenience of description, marked as a first SCL signal) generated by the switch through a groove corresponding to a second control signal pin on the connection device, transmit the first SCL signal to the first control signal pin through an SCL signal line, and transmit the transmitted first SCL signal to the optical module through a reed pin corresponding to the first control signal pin on the optical connector 11 of the connection device; the connection device may further receive an SCL signal (for convenience of description, it is denoted as a second SCL signal) generated by the optical module through a pogo pin corresponding to the first control signal pin on the optical port connector 11 of the connection device, and transmit the second SCL signal to the second control signal pin through an SCL signal line, and transmit the transmitted second SCL signal to the switch through a groove corresponding to the second control signal pin on the golden finger interface 12 of the connection device.

Based on the implementation process, the exchanger can transmit the SCL signal with the optical module through the connecting device. And the SCL signal test point 61 set on the SCL signal line is connected to the measuring equipment, and when the optical module performs information interaction with the switch, the measuring equipment can measure the voltage amplitude and the voltage timing of the SCL signal transmitted on the SCL signal line, that is, the voltage amplitude and the voltage timing of the I2C interface on the optical module, through the SCL signal test point 61 on the SCL signal line.

Similarly, after the connection device is connected to the optical module and the switch, the connection device may receive an SDA signal (for convenience of description, denoted as a first SDA signal) generated by the switch through the groove corresponding to the second data signal pin on the connection device, transmit the first SDA signal to the first data signal pin through an SDA signal line, and transmit the transmitted first SDA signal to the optical module through the reed pin corresponding to the first data signal pin on the optical connector 11 of the connection device; the connection device may further receive an SDA signal (for convenience of description, it is referred to as a second SDA signal) generated by the optical module through a pogo pin corresponding to the first data signal pin on the optical port connector 11 of the connection device, and transmit the second SDA signal to the second data signal pin through an SDA signal line, and transmit the transmitted second SDA signal to the switch through a groove corresponding to the second data signal pin on the gold finger interface 12 of the connection device.

Based on the implementation process, the switch can transmit the SDA signal through the connecting equipment and the optical module. The SDA signal test point 62 arranged on the SDA signal line is connected to the measurement device, and when the optical module performs information interaction with the switch, the measurement device can measure the voltage amplitude and the voltage timing of the SDA signal transmitted on the SDA signal line, that is, the voltage amplitude and the voltage timing of the I2C interface on the optical module, through the SDA signal test point 62 on the SDA signal line.

Example 5:

in order to ensure the diversity of the measured electrical interface parameters, on the basis of the above embodiments, in the embodiment of the present invention, if the test point includes the state test point, a first state control pin is arranged on the optical connector 11, a second state control pin is arranged on the gold finger interface 12, the first state control pin is connected to the second state control pin through a state control circuit, and the state test point is arranged on the state control circuit;

In the practical application process, in the process of information interaction between the switch and the optical module, signals and state control signals need to be transmitted. In order to realize normal information interaction between the switch and the optical module, a first state control pin is arranged on the optical connector 11, a second state control pin is arranged on the golden finger interface 12, the second state control pin is connected with the first state control pin through a state control line, and a state test point is arranged on the state control line, so that when the switch and the optical module perform information interaction, the voltage amplitude and the voltage time sequence of a signal transmitted on the state control line when the optical module works are measured through a measuring device connected with the state test point, namely the voltage amplitude and the voltage time sequence of the state control interface pin on the optical module are measured.

In a specific implementation process, the optical module can transmit a signal to the state control circuit through the spring pin corresponding to the first state control pin on the optical connector 11 of the connection device through the groove corresponding to the state control interface pin on the first gold finger interface, and further transmit the signal to the second state control pin on the connection device. Through the groove corresponding to the second state control pin on the golden finger interface 12 of the connection device, the signal is transmitted to the switch through the reed pin corresponding to the state control interface pin on the first optical connector of the switch, so that the optical module transmits the generated signal and the state monitoring signal to the switch.

Of course, the switch may also overlap the groove corresponding to the second state control pin on the gold finger interface 12 of the connection device through the reed pin corresponding to the state control interface pin on the first optical connector, so as to transmit the signal to the state control circuit of the connection device, and further to transmit the signal to the first state control pin on the connection device. The reed needle corresponding to the first state control pin on the optical connector 11 of the connection device is lapped on the groove corresponding to the state control interface pin on the first golden finger interface of the optical module, so that signals generated by the switch and state monitoring signals are transmitted to the optical module.

It should be noted that, because the signal generated by the optical module and the status monitoring signal are inevitably lost when transmitted on the status control line in the connection device, in order to reduce the loss generated in the signal transmission process and improve the accuracy of the measured electrical interface parameter of the optical module, in the embodiment of the present invention, the status test point is located on one side of the status control line close to the first status control pin.

In the practical application process, in order to facilitate information interaction between the optical module and the switch, the state control interface in the optical module is mainly used for an optical module chip selection signal, an optical module power consumption control signal, an optical module reset signal, an optical module in-place signal and an optical module interrupt signal. Therefore, in the embodiment of the present invention, according to the type of the signal transmitted by the state control interface of the optical module, the first state control pin in the connection device includes a first chip selection pin, a first power consumption control pin, a first reset pin, a first in-place line pin, and a first interrupt pin, the second state control pin in the connection device includes a second chip selection pin, a second power consumption control pin, a second reset pin, a second in-place line pin, and a second interrupt pin, the state control line includes a chip selection line, a power consumption control line, a reset line, an in-place line, and an interrupt line, and the state test point includes an optical module chip selection point, an optical module power consumption control test point, a reset test point, an optical module in-place test point, and an optical module interrupt test point.

The first chip selection pin is connected with the second chip selection pin through the chip selection line, the chip selection line transmits an optical module chip selection signal, and the chip selection line is provided with the optical module chip selection test point; the first power consumption control pin is connected with the second power consumption control pin through the power consumption control circuit, the power consumption control circuit transmits an optical module power consumption control signal, and the power consumption control circuit is provided with an optical module power consumption control test point; the first reset pin is connected with the second reset pin through the reset circuit, the reset circuit transmits an optical module reset signal, and the reset circuit is provided with the optical module reset test point; the first in-place pin is connected with the second in-place pin through the in-place line, the in-place line transmits an in-place signal of the optical module, and the in-place line is provided with an in-place test point of the optical module; the first interrupt pin is connected with the second interrupt pin through the interrupt line, the interrupt line transmits an optical module interrupt signal, and the terminal line is provided with the optical module interrupt test point.

Fig. 5 is a circuit connection schematic diagram of a state control circuit according to an embodiment of the present invention, and for convenience of description, the state control circuit is described with reference to fig. 5:

as shown in fig. 5, a chip select (ModSelL) line, a power consumption control (LPMode) line, a reset (Resetl) line, a bit in place (ModPresl) line, and an interrupt (Intl) line constitute the status control interface test network 7.

Specifically, after the connection device is connected to the optical module and the switch, the connection device can receive the ModSelL (for convenience, it is denoted as a first ModSelL) generated by the switch through the groove corresponding to the second chip select pin on the connection device, transmit the first ModSelL to the first chip select pin through the ModSelL line, and transmit the transmitted first ModSelL to the optical module through the reed pin corresponding to the first chip select pin on the optical connector 11 of the connection device; and the connecting device can also receive the ModSelL (for convenience of description, it is denoted as second ModSelL) generated by the optical module through the reed pin corresponding to the first chip select pin on the optical port connector 11 of the connecting device, and transmit the second ModSelL to the second chip select pin through the ModSelL line, and transmit the transmitted second ModSelL to the switch through the groove corresponding to the second chip select pin on the golden finger interface 12 of the connecting device.

Based on the implementation process, the ModSelL transmission between the switch and the optical module through the connecting device can be realized. The ModSelL test point 71 arranged on the ModSelL line is connected with the measuring equipment, and when the optical module performs information interaction with the switch, the measuring equipment can measure the voltage amplitude and the voltage timing of the ModSelL transmitted on the ModSelL line, namely the voltage amplitude and the voltage timing of the ModSelL transmitted by the state control interface on the optical module, through the ModSelL test point 71 on the ModSelL line.

Similarly, after the connection device is connected to the optical module and the switch, the LPMode (for convenience of description, referred to as a first LPMode) generated by the switch may be received through the groove corresponding to the second power consumption control pin on the connection device, and the first LPMode is transmitted to the first power consumption control pin through the LPMode line, and the first LPMode transmitted to the optical module may be transmitted through the reed pin corresponding to the first power consumption control pin on the optical connector 11 of the connection device; the connection device may further receive an LPMode (for convenience of description, referred to as a second LPMode) generated by the optical module through a pogo pin corresponding to the first power consumption control pin on the optical port connector 11 of the connection device, transmit the second LPMode to the second power consumption control pin through an LPMode line, and transmit the transmitted second LPMode to the switch through a groove corresponding to the second power consumption control pin on the gold finger interface 12 of the connection device.

Based on the implementation process, the switch can transmit the LPMode with the optical module through the connection device. The LPMode test point 72 disposed on the LPMode line is connected to the measurement device, and when the optical module performs information interaction with the switch, the measurement device can measure the voltage amplitude and the voltage timing of the LPMode transmitted on the LPMode line, that is, the voltage amplitude and the voltage timing of the LPMode transmitted by the state control interface on the optical module, through the LPMode test point 72 on the LPMode line.

After the connection device is connected with the optical module and the switch respectively, Resetl (for convenience of description, referred to as first Resetl) generated by the switch can be received through a groove corresponding to a second reset pin on the connection device, the first Resetl is transmitted to the first reset pin through a Resetl line, and the transmitted first Resetl can be transmitted to the optical module through a reed corresponding to the first reset pin on the optical connector 11 of the connection device; the connection device may further receive reset (for convenience of description, referred to as a second reset) generated by the optical module through a reed corresponding to the first reset pin on the optical port connector 11 of the connection device, transmit the second reset to the second reset pin through a reset line, and transmit the transmitted second reset to the switch through a groove corresponding to the second reset pin on the gold finger interface 12 of the connection device.

Based on the implementation process, the switch can transmit Resetl with the optical module through the connecting device. And connecting a Resetl test point 73 arranged on the Resetl line with a measuring device, wherein when the optical module performs information interaction with the switch, the measuring device can measure the voltage amplitude and the voltage timing sequence of the Resetl transmitted on the Resetl line, namely the voltage amplitude and the voltage timing sequence of the Resetl transmitted by the state control interface on the optical module, through the Resetl test point 73 on the Resetl line.

After the connection device is connected with the optical module and the switch, the ModPresl (for convenience of description, denoted as a first ModPresl) generated by the switch can be received through the groove corresponding to the second on-position pin on the connection device, the first ModPresl is transmitted to the first on-position pin through a ModPresl circuit, and the transmission of the transmitted first ModPresl to the optical module can be realized through the reed pin corresponding to the first on-position pin on the optical connector 11 of the connection device; and connecting device can also receive the ModPresl (for convenience of description note as second ModPresl) that optical module produced through the corresponding reed needle of first on-position pin on connecting device's optical port connector 11 to transmit this second ModPresl to the second on-position pin through the ModPresl circuit, through the recess that this second on-position pin on connecting device's golden finger interface 12 corresponds, can realize transmitting the second ModPresl of transmission to the switch.

Based on the implementation process, the ModPresl transmission between the switch and the optical module through the connecting device can be realized. And the ModPresl test point 74 arranged on the ModPresl line is connected with the measuring equipment, and when the optical module performs information interaction with the switch, the measuring equipment can measure the voltage amplitude and the voltage timing sequence of the ModPresl transmitted on the ModPresl line, namely the voltage amplitude and the voltage timing sequence of the ModPresl transmitted by the state control interface on the optical module, through the ModPresl test point 74 on the ModPresl line.

After the connection device is connected with the optical module and the switch respectively, the Intl (for convenience of description, denoted as a first Intl) generated by the switch can be received through the groove corresponding to the second interrupt pin on the connection device, the first Intl is transmitted to the first interrupt pin through an Intl line, and the transmitted first Intl can be transmitted to the optical module through the reed pin corresponding to the first interrupt pin on the optical connector 11 of the connection device; the connection device may further receive an Intl (for convenience of description, denoted as a second Intl) generated by the optical module through a pogo pin corresponding to the first interrupt pin on the optical port connector 11 of the connection device, transmit the second Intl to the second interrupt pin through an Intl line, and transmit the transmitted second Intl to the switch through a groove corresponding to the second interrupt pin on the gold finger interface 12 of the connection device.

Based on the implementation process, the Intl transmission between the switch and the optical module through the connecting device can be realized. The Intl test point 75 arranged on the Intl line is connected with the measuring equipment, and when the optical module performs information interaction with the switch, the measuring equipment can measure the voltage amplitude and the voltage time sequence of the Intl transmitted on the Intl line, namely the voltage amplitude and the voltage time sequence of the Intl transmitted by the state control interface on the optical module, through the Intl test point 75 on the Intl line.

Example 6:

for convenience of describing a workflow of the connection device provided in the embodiment of the present invention, fig. 6 is a schematic structural diagram of the connection device provided in the embodiment of the present invention, and a detailed description is now made with reference to fig. 6:

as shown in fig. 6, one end of the bottom board of the connection device is provided with a hot-plug gold finger interface 1 for connecting with the first optical connector of the switch, the other end of the connection device is provided with an optical connector 2 for connecting with the first gold finger interface of the optical module, and an external power interface 5 for connecting with an external power is arranged above the bottom board in the figure.

The VCC1 power supply line, the VCCT power supply line, and the VCCR power supply line constitute a power supply test network 4.

The control power supply pin on the optical connector is connected with the movable end of the first single-pole double-throw switch through a control power supply line VCC1, the second control power supply pin on the golden finger interface is connected with the first immovable end of the first single-pole double-throw switch, the external control power supply pin on the external power supply interface is connected with the second immovable end of the first single-pole double-throw switch, a resistor is arranged on the control power supply line VCC1, a control chip power supply test point is arranged between the resistor and the control power supply pin on the control power supply line, and a first input power supply test point is arranged between the resistor and the movable end.

The transmitting power supply pin on the optical connector is connected with the movable end of the second single-pole double-throw switch through a transmitting power supply line VCCT, the second transmitting power supply pin on the golden finger interface is connected with the first immovable end of the second single-pole double-throw switch, the external transmitting power supply pin on the external power supply interface is connected with the second immovable end of the second single-pole double-throw switch, a resistor is arranged on the transmitting power supply line VCCT, a transmitting module power supply test point is arranged between the resistor and the transmitting power supply pin on the transmitting power supply line VCCT, and a second input power supply test point is arranged between the resistor and the movable end.

The receiving power supply pin on the optical port connector is connected with the movable end of the third single-pole double-throw switch through a receiving power supply line VCCR, the second receiving power supply pin on the golden finger interface is connected with the first immovable end of the third single-pole double-throw switch, the external receiving power supply pin on the external power supply interface is connected with the second immovable end of the third single-pole double-throw switch, a resistor is arranged on the receiving power supply line VCCR, a receiving module power supply test point is arranged between the resistor and the receiving power supply pin on the receiving power supply line VCCR, and a third input power supply test point is arranged between the resistor and the movable end.

The single-pole double-throw switches on the control power supply line VCC1, the transmitting power supply line VCCT and the receiving power supply line VCCR can be combined into a power supply change-over switch, and a user can simultaneously adjust the stationary end connected with each single-pole double-throw switch by adjusting the power supply change-over switch 3, such as a key, a knob and the like, namely, the power supply for supplying power to the optical module is switched.

Wherein, the SDA signal line and the SCL signal line form an I2C interface test network 6.

A first data signal pin on the optical connector is connected with a second data signal pin on the golden finger interface through an SDA (serial data architecture) line, the SDA line transmits SDA, and an SDA test point is arranged on the SDA line; the first control signal pin on the optical connector is connected with the second control signal pin on the golden finger interface through an SCL circuit, the SCL circuit transmits SCL, and an SCL test point is arranged on the SCL circuit.

The state control interface test network 7 is composed of a chip select (ModSelL) line, a power consumption control (LPMode) line, a reset (Resetl) line, a bit in place (ModPresl) line, and an interrupt (Intl) line.

A first chip selection pin on the optical connector is connected with a second chip selection pin on the golden finger interface through a ModSelL line, the ModSelL line transmits ModSelL, and a ModSelL test point is arranged on the ModSelL line; a first power consumption control pin on the optical connector is connected with a second power consumption control pin on the golden finger interface through an LPMode line, the LPMode line transmits LPMode, and an LPMode test point is arranged on the LPMode line; a first reset pin on the optical connector is connected with a second reset pin on the golden finger interface through a Resetl line, the Resetl line transmits Resetl, and a Resetl test point is arranged on the Resetl line; a first in-place pin on the optical connector is connected with a second in-place pin on the golden finger interface through a ModPresl circuit, the ModPresl circuit transmits ModPresl, and a ModPresl test point is arranged on the ModPresl circuit; the first interrupt pin on the optical connector is connected with the second interrupt pin on the golden finger interface through an Intl line, the Intl line transmits Intl, an Intl test point is arranged on the terminal line, and a high-speed signal line group for transmitting high-speed electric signals between the optical module and the switch is formed by the ModSelL line, the LPMode line, the Resetl line, the ModPresl line and the Intl line.

In the specific implementation process, the golden finger interface of the connecting device is inserted into the first optical connector of the switch, the first golden finger interface of the optical module is inserted into the optical connector of the connecting device, the measuring device is connected with each test point on the connecting device, and the electrical interface parameters of the optical module can be measured through each test point of the connecting device under the condition that normal information interaction between the optical module and the switch is not influenced.

Optionally, under the cooperation of the power supply change-over switch, the optical module can be connected with an external power supply through an external power supply interface, so that power supply environments with different power supply parameters are provided for the optical module through the external power supply, further, electrical interface parameters of the optical module in different power supply environments are tested, and the working stability of the optical module in different power supply environments is determined.

In the prior art, the SFF-8679QSFP +4X Base Electrical Specification protocol also puts forward specific requirements on the antistatic level of all interface pins of an optical module and a switch. Therefore, in the embodiment of the present invention, after the optical module is connected to the connection device, static electricity may be introduced to the optical module through each test point on the connection device. After static electricity is introduced to the optical module, the connecting device connected with the optical module is connected with the switch, the measuring device is connected with each test point of the connecting device, and the measuring device can determine whether the optical module can carry out normal information communication with the switch according to data measured at each test point at present, so that whether the real static electricity prevention level of the optical module meets the requirements in the protocol or not is determined.

Example 7:

an embodiment of the present invention provides a test system, and fig. 7 is a schematic structural diagram of a test system provided in an embodiment of the present invention, where the test system includes: a connection device 71, an optical module 72, a switch 73, and a measurement device 74;

the optical module 72 is connected with an optical connector on the connection device 71, and is used for performing information interaction with the switch 73 through the connection device 71;

the switch 73 is connected with a gold finger interface on the connection device 71, and is used for performing information interaction with the optical module 72 through the connection device 71;

the measuring device 74 is connected to the test point on the connecting device 71, and is configured to measure the electrical interface parameter of the optical module 72 through the test point on the connecting device 71 when the optical module 72 and the switch 73 perform information interaction.

Further, the test system further comprises: an external power supply;

the external power supply is connected to an external power interface on the connection device 71, and is configured to supply power to the optical module 72 with different power supply parameters.

Further, the measuring device 74 is specifically configured to measure the actual voltage and the second noise of the optical module 72 through the power supply test point on the connecting device 71 when the optical module 72 and the switch 73 perform information interaction if the test point includes the power supply test point.

Further, if the test point also comprises an input power supply test point;

the measuring device 74 is specifically configured to measure a first input voltage of the optical module 72 through the input power supply test point on the connecting device 71 when the optical module 72 and the switch 73 perform information interaction; when the optical module 72 and the switch 73 perform information interaction, measuring a second input voltage of the optical module 72 through the power supply test point on the connection device 71; determining a power consumption current of the light module 72 according to the first input voltage and the second input voltage.

Further, the measuring device 74 is specifically configured to, if the test point includes the signal test point, measure the voltage amplitude and the voltage timing of the signal transmitted by the optical module 72 on the signal line through the signal test point on the connecting device 71 when the optical module 72 and the switch 73 perform information interaction.

Further, the signal test points are located at positions close to the optical module 72.

Further, the measuring device 74 is specifically configured to, if the test point includes the state test point, measure the voltage amplitude and the voltage timing of the signal transmitted on the state control line through the state test point on the connecting device 71 when the optical module 72 and the switch 73 perform information interaction.

Because the optical connector on the connection device provided by the embodiment of the invention can be connected with the optical module, and the golden finger interface connected with the optical connector through the test circuit can be connected with the switch, the optical module can be ensured to carry out information interaction with the switch through the connection device, the test circuit is provided with the test point, and the test circuit can be connected with the measurement device through the test point, so that the measurement device can measure the electrical interface parameter of the optical module through the test point when the optical module and the switch carry out information interaction under the condition of not damaging the interaction environment between the switch and the optical module, namely, under the condition of not disassembling the optical module or the switch, the process of measuring the electrical interface parameter of the optical module is simplified, the test efficiency is improved, the actual working scene of the optical module is not damaged, and the measured electrical interface parameter is closer to the electrical interface parameter generated when the optical module and the switch carry out normal information interaction And the accuracy of the measured electrical interface parameters is improved.

As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.

The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. A connection device, characterized in that the connection device comprises: the device comprises an optical connector, a golden finger interface and a test point;

2. The connection apparatus of claim 1, wherein the test points comprise at least one of a power supply test point, a signal test point, and a status test point.

3. The connection apparatus according to claim 2, further comprising: a single-pole double-throw switch and an external power interface;

4. The connection device according to claim 3, wherein if the test point comprises a power supply test point, the first power supply pin is connected to the moving end of the single-pole double-throw switch through a power supply line, and the power supply test point is provided on the power supply line;

5. The connection device of claim 4, wherein the test point further comprises an input power supply test point;

6. The connection device according to any one of claims 3 to 5, wherein the power supply test points include a control chip power supply test point, a transmitting module power supply test point, and a receiving module power supply test point;

7. The connection device according to claim 2, wherein if the test point comprises the signal test point, a first signal pin is disposed on the optical connector, a second signal pin is disposed on the gold finger interface, the first signal pin is connected to the second signal pin through a signal line, and the signal test point is disposed on the signal line;

8. The connection device of claim 7, wherein the signal test point is located on the signal line on a side proximate to the first signal pin.

9. The connection device according to claim 7 or 8, wherein the signal test points include a data line signal test point and a control line signal test point;

the signal lines comprise data line signal lines and control line signal lines;

10. The connection device according to claim 2, wherein if the test point includes the status test point, a first status control pin is disposed on the optical connector, a second status control pin is disposed on the gold finger interface, the first status control pin is connected to the second status control pin through a status control circuit, and the status test point is disposed on the status control circuit;

11. The connection device of claim 10, wherein the state test point is located on the state control line on a side proximate the first state control pin.

12. The connection device according to claim 10 or 11, wherein the status test point comprises an optical module chip selection test point, an optical module power consumption control test point, an optical module reset test point, an optical module on-site test point and an optical module interrupt test point;

13. A test system, the system comprising: the device comprises a connecting device, an optical module, a switch and a measuring device;