CN113917319A - Chip packaging switching test device and method - Google Patents

Abstract

The invention relates to the field of chip packaging, in particular to a chip packaging switching test device and a chip packaging switching test method. The test device comprises a test bottom plate, a test needle connecting plate is arranged above the test bottom plate, the test bottom plate is connected with the test needle connecting plate through a guide device arranged between the test bottom plate and the test needle connecting plate, a golden finger is arranged on a test adapter plate, a test needle correspondingly connected with the golden finger is arranged on the test needle connecting plate, and the golden finger is connected with the test needle through a flat cable. The invention has simple operation, light structure and convenient carrying; the test of a single module of the strip is realized; the test efficiency of the experimental sample is improved; the method reduces the false detection rate of the sample and improves the accuracy of the experimental result.

Description

Chip packaging switching test device and method

Technical Field

The invention relates to the field of chip packaging, in particular to a chip packaging switching test device and a chip packaging switching test method.

Background

In the chip packaging process, generally, a test is required for testing the quality of a chip, however, a card reader can only perform an electrical performance test on a finished card, but cannot perform an electrical performance test on a smart card module.

A new test program needs to be written before a new product is produced, the product can only be debugged by putting the product on a mass production test machine during verification, the sample needs to be aligned and pressed below a test plate, and the debugging can be carried out after the position of a test head is confirmed, so that the debugging process consumes long time, and the normal product capacity is influenced.

In addition, the samples return to the original state after the experiment and need to be tested and verified, and abnormal conditions such as certain dirt and scratches are easily caused in the experiment process, so that the apparent quality of the product is influenced. If the measuring needle is just pressed to an abnormal position, the error measurement is bad, and the accuracy of the experimental result is influenced.

In summary, the existing test equipment has the following problems: (1) only finished cards can be tested, and strips cannot be tested; (2) the trial production sample can only be debugged by using test equipment, the alignment is needed, the productivity is affected, and the efficiency is low; (3) after the experiment of the experimental sample, the metal surfaces of some samples have the conditions of scratch and dirt; (4) the test equipment stylus presses against the defect area and cannot determine whether such a sample has failed.

Disclosure of Invention

The invention provides a chip packaging transfer test device and a chip packaging transfer test method, which can solve the problems.

In order to realize the purpose, the following technical scheme is provided:

the chip packaging switching test device comprises a test base plate, a test needle connecting plate is arranged above the test base plate, the test base plate is connected with the test needle connecting plate through a guide device arranged between the test base plate and the test needle connecting plate, a golden finger is arranged on the test switching plate, a test needle correspondingly connected with the golden finger is arranged on the test needle connecting plate, and the golden finger and the test needle are connected through a flat cable.

Preferably, the distribution of the golden fingers conforms to the distribution of the minimum distance specified in the ISO7816 transmission protocol, and the positioning size of the golden fingers is consistent with the card reading position of the test equipment.

Preferably, the guide device comprises two guide columns, one ends of the guide columns are arranged on the test bottom plate, and the other ends of the guide columns penetrate through the test needle connecting plate; and the test needle connecting plate and the guide columns of the test bottom plate are provided with return springs.

Preferably, the test bottom plate is provided with a limit clamping groove.

Preferably, one end of the test adapter plate is connected with the test equipment, and the other end of the test adapter plate is connected with the test needle on the test needle connecting plate through the ox horn seat and the flat cable.

The chip packaging switching test method comprises the following steps:

s1, inserting the test adapter plate into the test equipment;

s2, placing the carrier tape with the chip in a limiting clamping groove on a test base plate;

s3, pressing down the connecting plate of the test needle to make the test needle contact with the chip for testing;

s4, loosening the connecting plate of the test needle after the test is finished;

s5, moving the carrier tape, and moving the next chip to the limiting clamping groove;

and S6, repeating the steps S3-S5 until the test is completed.

Compared with the prior art, the invention has the beneficial effects that:

1. the operation is simple, the structure is light and handy, and the carrying is convenient;

2. the test of a single module of the strip is realized;

3. the test efficiency of the experimental sample is improved;

4. the method reduces the false detection rate of the sample and improves the accuracy of the experimental result.

Drawings

FIG. 1 is a schematic view of the structural connection of the present application;

FIG. 2 is a schematic view of a golden finger according to the present application;

FIG. 3 is a schematic diagram of the present application;

FIG. 4 is a block chip diagram according to the present application;

wherein, 1, testing the bottom plate; 2. a first support; 3. a second support; 4. a guide device; 5. a test pin connecting plate; 6. a bushing; 7. a circuit board; 8. a test pin; 9. a screw; 10. testing the adapter plate; 11. a horn base; 12. arranging wires; 13. testing equipment; 14. carrying a belt; 15. a smart card module.

Detailed Description

Example 1:

referring to the description attached drawings, the chip packaging switching test device comprises a test base plate 1, wherein a first support 2 and a second support 3 are respectively arranged at the bottom of the test base plate 1; a test needle connecting plate 5 is arranged above the test bottom plate 1, and the test bottom plate 1 is connected with the test needle connecting plate 5 through a guide device 4 arranged between the test bottom plate and the test needle connecting plate; the test adapter plate 10 is provided with a golden finger, the test pin connecting plate 5 is provided with a test pin 8 corresponding to the golden finger, and the test pin 8 is connected with the golden finger through a flat cable 12.

The guide device 4 comprises two guide columns, one ends of the guide columns are arranged on the test bottom plate 1, the guide columns are provided with bushings 6, and the other ends of the guide columns penetrate through the test needle connecting plate 5; and reset springs are arranged on the guide posts of the test needle connecting plate 5 and the test bottom plate 1.

The test bottom plate 1 is provided with a limit clamping groove. Spacing draw-in groove mainly is used for spacing module chip on test bottom plate 1, and the draw-in groove is specific spacing to use module chip right side edge as the central point: the limiting position in the X direction is 3.55 +/-0.05 cm leftward from the central point, and the limiting position in the Y direction is 1.50 +/-0.05 cm upward from the central point.

One end of a test adapter plate 10 is connected with test equipment, a golden finger of the test adapter plate 10 is connected with a test needle 8 on a test needle connecting plate 5 through a horn base 11 and a flat cable 12, a circuit board 7 and the test needle 8 are fixed on the upper surface and the lower surface of the test needle connecting plate 5 through screws 9, and the flat cable 12 and the test needle 8 are correspondingly welded through the circuit board 7.

The corresponding golden fingers on the test adapter plate 10 correspond to the 8 test needles 8 respectively, and the distribution of the golden fingers conforms to the distribution of the minimum distance specified in the ISO7816 transmission protocol. The ISO7816 transport protocol specifies the relevant specifications of the contact smart card including physical characteristics, interface specifications, transport protocol, and command exchange format. The circuit board 7 is realized by double-sided wiring of a PCB and adopts a via hole mode. The positioning size of the golden finger is matched with the card reading position of the card reader, and the golden finger positioning device has the advantages of being simple in installation and stable in test.

As the module chips all accord with the ISO7816 transmission protocol, the requirement of the test can be met only by welding 6 test needles in the subsequent practical application, and the other two test needles are standby.

As shown in fig. 3 and 4, in product testing, the carrier tape 14 is placed on the test pin junction plate 5 for testing. Each carrier tape 14 is provided with a plurality of smart card modules 15, each smart card module 15 comprises a module area and a module chip, and C1, C2, C3, C5 and C7 in the module area are in one-to-one correspondence with VCC, REST, CLOK, GND and IO of the module chip respectively through wires;

the 6 test pins 8 respectively correspond to C1, C2, C3, C5, C6 and C7 in the module area, and the test pins 8 corresponding to C6 test the SWP of the module chip, where the SWP is a single-wire protocol, that is, a single-thread connection line is added between the NFC module and the SIM card to read data. The 6 test needles 8 are positioned on the test needle connecting plate 5 and distributed according to an ISO7816 transmission protocol, the flat cable 12 and the test needles 8 are welded in a manual tinning mode, and the heat shrink tube is fixedly welded on the peripheral sleeve.

On mechanical lifting, 2 guide posts and spring limiting are adopted for realizing. Prevent that test needle 8 and test needle connecting plate 5 from falling the destruction that causes too fast in the use. The limiting clamping groove on the test bottom plate 1 can realize quick positioning of the intelligent card module, and the test efficiency of the intelligent card module is improved. In some special cases, the smart card module position can be fine-tuned to avoid the apparent defect area for testing.

Example 2:

the test adapter plate 10 is inserted into the test equipment, then the horn base 11 with the specification of 5 pins by 2 rows is welded at the other end of the test adapter plate 10, the flat cable 12 is connected to the horn base 11, and the other end of the flat cable 12 is respectively separated and welded on the corresponding position of the test pin 8 on the test pin connecting plate 5. The test equipment adopts a tester or a card reader, and the communication between the module chip and the test equipment is realized through the invention.

The most important advantage of the device is that the point measurement of the strip is realized, and the analysis of the rapid electrical property of a small number of strips such as test production, experimental samples, failure samples and the like is facilitated.

The spot measurement of the strip can be realized by carrying out the spot measurement of a certain 6pin/8pin strip sample. And (5) verifying the electrical property condition. Meanwhile, the quick test of the 6pin/8pin white card sample can be met, and the failure position is reflected through test software.

Example 3:

the chip package transfer test method based on the embodiments 1 and 2 includes the following steps:

s1, inserting the test adapter plate 10 into the test equipment 13; the test device 13 here employs a contact IC card reader, complying with the ISO7816 interface standard.

The transfer test board 10 is welded with a gold finger in the manner shown in fig. 2, and one end of the transfer test board 10 after the gold finger is welded can be inserted into a card reader to match with an inner interface of the card reader; generally speaking, the module chip is disassembled individually and then made into a finished product to be inserted into the card reader for data reading, and the invention directly connects the module chip data into the card reader through the transfer test board 10 without disassembling the module chip on the carrier tape 14.

S2, placing an intelligent card module 15 on the carrier tape 14 in a limit card slot on the test base plate 1;

s3, manually pressing down the test pin connecting plate 5 by a tester, and moving the test pin connecting plate 5 downwards along the guide post of the guide device 4 to enable the test pin 8 to be in contact test with C1, C2, C3, C5, C6 and C7 in the module area of the smart card module 15; the card reader can read the data of the module chip of the intelligent card module 15 through the conduction of the test pin connecting plate 10, the flat cable 12 and the test pin 8, and further, the purpose of testing can be achieved without disassembling the module chip.

S4, loosening the test needle connecting plate 10 after the test is finished, and resetting the test needle connecting plate 10 under the action of the reset spring;

s5, moving the carrier tape, and moving the next smart card module 15 to the limiting card slot;

and S6, repeating the steps S3-S5 until the test of the whole carrier tape is completed.

The above-mentioned solutions are not described in detail in the prior art, and are described in detail herein.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (6)

1. The utility model provides a chip package switching testing arrangement, its characterized in that, includes test bottom plate (1), and test bottom plate (1) top is equipped with test needle connecting plate (5), and test bottom plate (1) is connected through setting up guider (4) between the two with test needle connecting plate (5), is equipped with the golden finger on test keysets (10), is equipped with on test needle connecting plate (5) to correspond test needle (8) of being connected with the golden finger, connect through winding displacement (12) between golden finger and test needle (8).

2. The device of claim 1, wherein the golden fingers are distributed according to the minimum distance specified in the ISO7816 protocol and the positioning size of the golden fingers is matched with the card reading position of the testing equipment.

3. The chip package switching test device according to claim 1, wherein the guide means (4) comprises two guide posts, one ends of which are arranged on the test base plate (1), and the other ends of which penetrate through the test pin connecting plate (5); and reset springs are arranged on the guide columns of the test needle connecting plate (5) and the test bottom plate (1).

4. The chip package switching test device according to claim 1, wherein the test base plate (1) is provided with a limit slot.

5. The chip package switching test device according to claim 1, wherein one end of the test switch board (10) is connected to a test device, and the other end is connected to the test pins (8) on the test pin connection board (5) through the horn base (11) and the flat cable (12).

6. A chip package transfer test method according to any one of claims 1 to 5, comprising the steps of:

s1, inserting the test adapter plate (10) into test equipment;

s2, placing the intelligent card module (15) of the carrier tape (14) in a limiting card slot on the test base plate (1);

s3, pressing down the test pin connecting plate (5) to enable the test pin (8) to be in contact test with the intelligent card module (15);

s4, loosening the test needle connecting plate (5) after the test is finished;

s5, moving the carrier tape (14) and moving the next smart card module (15) to the limiting card slot;

and S6, repeating the steps S3-S5 until the test is completed.

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