CN213149157U

CN213149157U - High-precision microchip testing jig

Info

Publication number: CN213149157U
Application number: CN202021085669.2U
Authority: CN
Inventors: 张本伍; 郗旭斌
Original assignee: Intelligent Automation Equipment Zhuhai Co Ltd
Current assignee: Intelligent Automation Equipment Zhuhai Co Ltd; Intelligent Automation Zhuhai Co Ltd
Priority date: 2020-06-13
Filing date: 2020-06-13
Publication date: 2021-05-07
Anticipated expiration: 2030-06-13

Abstract

The utility model aims at providing a can enough improve production efficiency, can realize probe and test point accurate positioning again, can also prolong probe life's high accuracy microchip test fixture simultaneously. The utility model discloses a faller module and support plate module, the faller module includes the connecting block, the needle module, PCB keysets and a plurality of probe, the PCB keysets sets up on the connecting block, the needle module sets up on the PCB keysets, the top of needle module is provided with a plurality of pinhole, the probe passes and sets up on the PCB keysets after the pinhole, the support plate module includes the connecting plate, the fixed plate and with the locating component of the chip looks adaptation that awaits measuring, locating component sets up on the fixed plate, the fixed plate floats to be connected on the connecting plate, the connecting plate is passed with the connecting plate continuous back needle module to the connecting block and fixed plate, the probe adaptation is on the test point of the chip that await. The utility model discloses be applied to electronic chip's test field.

Description

High-precision microchip testing jig

Technical Field

The utility model discloses be applied to electronic chip's test field, in particular to miniature chip test fixture of high accuracy.

Background

With the rapid development of the mobile internet technology, the internet of things technology and the 5G technology, electronic products are continuously developed towards the directions of high integration and miniaturization, the sizes of chip electronic components are continuously reduced, the sizes of corresponding electronic chips are also continuously reduced, and the quality is continuously improved, so that higher requirements are provided for the positioning of the electronic chip products in the testing process, the needle inserting operation of the testing points and the like, but the traditional needle inserting mode of the testing points cannot meet the current testing requirements.

The test mode that the electronic chip product is commonly used at present only places the product on the test fixture, the probe is installed on the needle mould, make the probe contact with test point of the product through moving the needle mould while testing, and this kind of defect of this kind of mode is that probe and test point positioning accuracy are low, and the probe is damaged easily, can only use some electronic chip products that test point size is bigger. If a high-precision microchip testing jig which can improve the production efficiency, realize the accurate positioning of the probe and the test point and prolong the service life of the probe can be designed, the problems can be well solved.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that overcome prior art not enough, provide one kind and can enough improve production efficiency, can realize probe and test point accurate positioning again, can also prolong probe life's high accuracy microchip test fixture simultaneously.

The utility model adopts the technical proposal that: the utility model discloses a faller module and support plate module, the faller module includes connecting block, needle module, PCB keysets and a plurality of probe, the PCB keysets sets up on the connecting block, the needle module sets up on the PCB keysets, the top of needle module is provided with a plurality of pinhole, the probe passes set up behind the pinhole on the PCB keysets, the support plate module include connecting plate, fixed plate and with the locating component of the chip looks adaptation that awaits measuring, locating component sets up on the fixed plate, the fixed plate is floated and is connected on the connecting plate, the connecting block with the connecting plate links to each other the back the needle module passes the connecting plate with the fixed plate, the probe adaptation is on the test point of the chip that awaits measuring.

It is obvious by above-mentioned scheme, through being provided with locating component, can fix the chip that awaits measuring to the chip that awaits measuring can not rock or drop at the in-process of test, guarantees to test steadily, and through pressing down the fixed plate after, each test point of the chip that awaits measuring will contact the point portion of each probe, thereby tests. Wherein, because the point portion of probe is transition fit in the pinhole, consequently the pinhole has certain protection and guide effect to probe point portion, has both prolonged the life of probe, can ensure the accuracy of probe position again, ensures the probe point portion and the accurate counterpoint of the chip test point that awaits measuring. Therefore, the utility model discloses a press the test that the chip that awaits measuring just can be realized to the action, not only can improve raw tea efficiency widely, can realize accurate positioning again moreover, can also prolong probe life simultaneously.

Further, the locating component comprises a locating plate, a pushing block, a limiting block and a first spring, the locating plate is arranged on the fixing plate, a locating hole matched with the chip to be tested is formed in the locating plate, the pushing block is arranged on the locating plate and abuts against the chip to be tested, the limiting block is matched with the groove of the pushing block, and the pushing block is connected with the limiting block through the first spring. Therefore, the chip to be tested is placed in the positioning hole, the pushing block can push the chip to be tested against two positioning edges of the fixing plate under the action of the first spring, a certain clamping force is applied to the chip to be tested, the chip to be tested can be accurately positioned, the chip to be tested can be prevented from shaking or falling in the testing process, and stable testing is facilitated.

Furthermore, the fixed plate is connected with the connecting plate through a plurality of second springs. It can be seen that by pressing the fixing plate, the second spring between the fixing plate and the connecting plate is compressed, and when the pressing force is removed, the fixing plate can be reset under the action of the second spring.

Further, the needle module includes last needle piece, needle mould and needle tail piece, the needle tail piece sets up on the PCB keysets, the needle mould sets up on the needle tail piece, the needle piece sets up on the needle mould, it sets up to go up the needle piece on the needle piece, a plurality of the pinhole all sets up on the needle piece, the probe passes in proper order go up the needle piece the pinhole the needle mould and set up behind the needle tail piece on the PCB keysets, it is in to go up needle piece adaptation in the locating hole and be located the below of the chip that awaits measuring. Therefore, the probe tip is excessively matched in the needle hole of the upper needle block, the probe tip is positioned below the chip to be tested, and the distance between the probe tip and the test point of the chip to be tested is 0.4mm before the chip to be tested begins to be tested. The probe setting is on the PCB keysets and with PCB keysets signal connection, consequently the utility model discloses can carry out data transmission through PCB keysets and outside test equipment, the performance data of the chip that awaits measuring of real-time detection.

Further, the needle plate module further comprises a fixed seat and a pressing block, the fixed seat is connected with the connecting block, the PCB adapter plate is located between the fixed seat and the connecting block, and the pressing block is connected with the fixed seat and located below the fixed seat. Therefore, the PCB adapter plate is located between the fixing seat and the connecting block, the PCB adapter plate can be protected, and the PCB adapter plate is prevented from being damaged.

Furthermore, a pressing plate is arranged between the connecting plate and the fixing plate and connected with the fixing plate, and the needle module penetrates through the pressing plate.

Furthermore, a thermistor is arranged on the positioning plate, and a plurality of semiconductor refrigerators are arranged between the positioning plate and the fixing plate. Therefore, the semiconductor refrigerator is an electronic component with heating and refrigerating functions, provides required temperature for the test process, and can detect the temperature change in the test process in real time by arranging the thermistor.

Furthermore, the high-precision microchip testing jig also comprises a base connected with the connecting plate. Therefore, the utility model discloses can install in the external equipment through the base.

Drawings

Fig. 1 is a perspective view of the present invention;

FIG. 2 is an exploded view of a pin plate module;

FIG. 3 is an exploded view of a carrier module;

fig. 4 is a perspective view of the positioning assembly.

Detailed Description

As shown in fig. 1 to 4, in the present embodiment, the present invention includes a needle board module 1 and a carrier board module 2, the needle plate module 1 comprises a connecting block 3, a needle module 4, a PCB adapter plate 5 and a plurality of probes 6, the PCB adapter plate 5 is arranged on the connecting block 3, the pin module 4 is arranged on the PCB adapter plate 5, the top of the needle module 4 is provided with a plurality of needle holes, the probes 6 are arranged on the PCB adapter plate 5 after penetrating through the needle holes, the carrier module 2 comprises a connecting board 7, a fixing board 8 and a positioning component matched with the chip to be tested, the positioning component is arranged on the fixing plate 8, the fixing plate 8 is connected on the connecting plate 7 in a floating way, after the connecting block 3 is connected with the connecting plate 7, the needle module 4 penetrates through the connecting plate 7 and the fixing plate 8, and the probe 6 is matched on a test point of a chip to be tested.

In this embodiment, locating component includes locating plate 9, ejector pad 10, stopper 11 and first spring 12, locating plate 9 sets up on the fixed plate 8, be provided with the locating hole with the chip looks adaptation that awaits measuring on the locating plate 9, ejector pad 10 sets up on the locating plate 9 and the top leans on the chip that awaits measuring, stopper 11 adaptation is in on the recess of ejector pad 10, ejector pad 10 pass through first spring 12 with stopper 11 links to each other.

In this embodiment, the fixing plate 8 is connected to the connecting plate 7 via a plurality of second springs 13.

In this embodiment, the pin module 4 includes an upper pin block 41, a pin block 42, a pin die 43 and a pin tail block 44, the pin tail block 44 is disposed on the PCB interposer 5, the pin die 43 is disposed on the pin tail block 44, the pin block 42 is disposed on the pin die 43, the upper pin block 41 is disposed on the pin block 42, a plurality of pin holes are disposed on the pin block 42, the probe 6 sequentially passes through the upper pin block 41, the pin holes, the pin die 43 and the pin tail block 44 and then is disposed on the PCB interposer 5, and the upper pin block 41 is adapted in the positioning hole and located below the chip to be tested.

In this embodiment, the needle plate module 1 further includes a fixing seat 14 and a pressing block 15, the fixing seat 14 is connected to the connecting block 3, the PCB adapter board 5 is located between the fixing seat 14 and the connecting block 3, and the pressing block 15 is connected to the fixing seat 14 and located below the fixing seat 14.

In this embodiment, a pressing plate 16 is disposed between the connecting plate 7 and the fixing plate 8, the pressing plate 16 is connected to the fixing plate 8, and the needle module 4 passes through the pressing plate 16.

In this embodiment, a thermistor 17 is disposed on the positioning plate 9, and a plurality of semiconductor refrigerators 18 are disposed between the positioning plate 9 and the fixing plate 8.

In this embodiment, the high-precision microchip testing fixture further includes a base 19 connected to the connecting board 7.

In this embodiment, the working principle of the present invention is as follows:

the chip 20 to be tested is placed in the positioning hole, the push block 10 can be used for pushing the chip 20 to be tested against two positioning edges of the fixing plate 8 under the action of the first spring 12, a certain clamping force is given to the chip 20 to be tested, the chip 20 to be tested can be accurately positioned, the chip 20 to be tested can be prevented from shaking or falling in the testing process, stable testing is facilitated, and after the fixing plate 8 is pressed, each testing point of the chip 20 to be tested can be in contact with each tip of the probe 6, so that testing is conducted. Wherein, because the point portion of probe is transition fit in the pinhole, consequently the pinhole has certain protection and guide effect to the point portion of probe, has both prolonged the life of probe, can ensure the accuracy of probe position again, ensures the probe point portion and the accurate counterpoint of the chip test point that awaits measuring.

Claims

1. The utility model provides a little chip test fixture of high accuracy which characterized in that: the probe pin plate comprises a pin plate module (1) and a carrier plate module (2), wherein the pin plate module (1) comprises a connecting block (3), a pin module (4), a PCB (printed circuit board) adapter plate (5) and a plurality of probes (6), the PCB adapter plate (5) is arranged on the connecting block (3), the pin module (4) is arranged on the PCB adapter plate (5), a plurality of pinholes are arranged at the top of the pin module (4), the probes (6) are arranged on the PCB adapter plate (5) after penetrating through the pinholes, the carrier plate module (2) comprises a connecting plate (7), a fixing plate (8) and a positioning component matched with a chip to be detected, the positioning component is arranged on the fixing plate (8), the fixing plate (8) is connected on the connecting plate (7) in a floating manner, the pin module (4) penetrates through the connecting plate (7) and the fixing plate (8) after the connecting block (3) is connected with the connecting plate (7), the probe (6) is adapted to a test point of a chip to be tested.

2. The tool of claim 1, wherein: locating component includes locating plate (9), ejector pad (10), stopper (11) and first spring (12), locating plate (9) set up on fixed plate (8), be provided with the locating hole with the chip looks adaptation that awaits measuring on locating plate (9), ejector pad (10) set up on locating plate (9) and the top lean on the chip that awaits measuring, stopper (11) adaptation is in on the recess of ejector pad (10), ejector pad (10) pass through first spring (12) with stopper (11) link to each other.

3. The tool of claim 1, wherein: the fixed plate (8) is connected with the connecting plate (7) through a plurality of second springs (13).

4. The tool of claim 2, wherein: needle module (4) are including last needle piece (41), needle piece (42), needle mould (43) and needle tail piece (44), needle tail piece (44) sets up on PCB keysets (5), needle mould (43) set up on needle tail piece (44), needle piece (42) set up on needle mould (43), it sets up to go up needle piece (41) set up on needle piece (42), a plurality of the pinhole all sets up on needle piece (42), probe (6) pass in proper order go up needle piece (41) the pinhole needle mould (43) and set up behind needle tail piece (44) on PCB keysets (5), it is in to go up needle piece (41) adaptation in the locating hole and be located the below of the chip that awaits measuring.

5. The tool of claim 1, wherein: the needle plate module (1) further comprises a fixed seat (14) and a pressing block (15), the fixed seat (14) is connected with the connecting block (3), the PCB adapter plate (5) is located between the fixed seat (14) and the connecting block (3), and the pressing block (15) is connected with the fixed seat (14) and located below the fixed seat (14).

6. The tool of claim 1, wherein: a pressing plate (16) is arranged between the connecting plate (7) and the fixing plate (8), the pressing plate (16) is connected with the fixing plate (8), and the needle module (4) penetrates through the pressing plate (16).

7. The tool of claim 2, wherein: the positioning plate (9) is provided with a thermistor (17), and a plurality of semiconductor refrigerators (18) are arranged between the positioning plate (9) and the fixing plate (8).

8. The tool of claim 1, wherein: the high-precision microchip testing jig also comprises a base (19) connected with the connecting plate (7).