CN112327134A

CN112327134A - Expandable quantum testing device

Info

Publication number: CN112327134A
Application number: CN202011180850.6A
Authority: CN
Inventors: 李生好; 雷国平; 吴媛媛
Original assignee: Chongqing Vocational Institute of Engineering
Current assignee: Chongqing Vocational Institute of Engineering
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-02-05

Abstract

The invention relates to the technical field of quantum testing, in particular to an extensible quantum testing device, which comprises a base, an upper mounting plate, a lower mounting plate and a control plate, wherein the base is provided with a plurality of through holes; the base is arranged on the ground, and the lower mounting plate is arranged at the top of the base; the control panel is arranged on the upper mounting plate, two groups of driving mechanisms are arranged on the control panel, and guide rods are arranged at the bottoms of the driving mechanisms; a detection probe is arranged on the guide rod; a guide pipe is inserted on the guide rod, and a loop bar is arranged at the bottom of the guide pipe; the detection probe comprises a sleeve, a transverse plate, a limiting plate and a probe; a first conducting strip is vertically arranged at the bottom of the transverse plate; the probe is arranged on the sleeve, and a limiting plate is arranged on one side of the probe; the invention reduces the damage to the quantum chip without using a bonding pad, and greatly improves the efficiency compared with the traditional manual detection mode; in addition, the mounting groove is customized according to the quantum chip, and the detection block and the base are mounted; all the other detection components do not need to be adjusted, so that the chips of different models can be conveniently expanded and detected, and the use is more convenient.

Description

Expandable quantum testing device

Technical Field

The invention relates to the technical field of quantum testing, in particular to an extensible quantum testing device.

Background

The quantum chip is a basic constitutional unit of a quantum computer, and is a processor which takes the superposition effect of quantum states as a principle and takes quantum bits as a carrier for information processing, wherein the quantum chip mainly comprises a superconducting quantum chip, a semiconductor quantum chip, a quantum dot chip, an ion trap, an NV (diamond) color center and the like;

the performance of the quantum chip needs to be detected before the quantum chip leaves a factory, which shows that whether the error between the quantum chip and the set parameters such as resistance, capacitance and the like is within an acceptable range. For example, when the quantum chip detects the resistor, a wire-bonding technology is usually adopted, however, when the wire-bonding technology is adopted to perform batch detection and screening on the quantum chip, the efficiency is not high, because at present, the wire-bonding technology is mainly used to manually connect the quantum circuit to the PCB board from the bonding pad on the quantum chip, and then the detection of the quantum chip led out of the packaging box is very time-consuming, which affects the test efficiency of the quantum chip; moreover, along with quantum chip's quantity increase, the bonding line that uses also correspondingly increases to be connected with the PCB structure, connect external connector more, quantum chip test performance is worse more, and wrie-bonding technique still can bring the pressure welding point for quantum chip's pad, and the pressure welding point can bring irreversible damage for the off-the-shelf quantum chip pad that needs the encapsulation.

To solve the above problems, an expandable quantum testing device is provided in the present application.

Disclosure of Invention

Objects of the invention

In order to solve the technical problems in the background art, the invention provides an expandable quantum testing device, which has the advantages that the damage to a quantum chip is reduced without using a bonding pad, and the efficiency is greatly improved compared with the traditional manual detection mode; in addition, the mounting groove is customized according to the quantum chip, and the detection block and the base are mounted; the rest detection components do not need to be adjusted, so that the chips of different models can be conveniently expanded and detected, and the use is more convenient.

(II) technical scheme

In order to solve the technical problem, the invention provides an expandable quantum testing device, which comprises a base, an upper mounting plate, a lower mounting plate and a control plate, wherein the base is provided with a plurality of through holes;

the base is arranged on the ground, and the lower mounting plate is arranged at the top of the base; the lower mounting plate is provided with an L-shaped second mounting frame, and the second mounting frame is provided with a second conveying device; the upper mounting plate is arranged right above the lower mounting plate, and an L-shaped first mounting frame is arranged on the upper mounting plate; a first conveying device is arranged on the first mounting frame; the first conveying device is provided with a plurality of mounting grooves, and each mounting groove is provided with a detection block; the second conveying device has the same structure as the first conveying device, and the detection block is provided with a detection hole;

the control panel is arranged on the upper mounting plate, two groups of driving mechanisms are arranged on the control panel, and guide rods are arranged at the bottoms of the driving mechanisms; a detection probe is arranged on the guide rod; a guide pipe is inserted into the guide rod, a loop bar is arranged at the bottom of the guide pipe, the top of the loop bar is contacted with the bottom of the upper mounting frame, and a detection probe is arranged at the bottom of the loop bar;

the detection probe comprises a sleeve, a transverse plate, a limiting plate and a probe; the transverse plate is fixedly arranged on the shell of the sleeve and is provided with a signal transmitting end; a first conducting strip is vertically arranged at the bottom of the transverse plate; the probe is arranged on the sleeve, a limiting plate is arranged on one side of the probe, and a vertical second conducting strip is arranged on the limiting plate; the periphery of the probe is provided with an elastic piece; the top of the elastic piece is fixedly arranged with the bottom of the sleeve, and the bottom of the elastic piece is fixedly arranged with the bottom of the limiting plate; the elastic piece stretches up and down along the vertical direction; the second conducting plate is positioned right below the first conducting plate; the first conducting strip is contacted with the second conducting strip to transmit electric signals.

Preferably, a plurality of supporting brackets are arranged between the upper mounting plate and the lower mounting plate.

Preferably, the control panel is provided with a display module for displaying data.

Preferably, a plurality of mounting grooves are formed in the first conveying device, and the mounting grooves are matched with the quantum chips to be tested.

Preferably, the mounting groove is provided with a contact contacted with the quantum chip.

Preferably, both sides of the mounting groove are provided with recessed parts.

Preferably, be provided with the base on the first conveyer, be provided with the connecting block on the base, be provided with a plurality of constant head tanks on the connecting block.

Preferably, the bottom of detecting the piece is provided with a plurality of terminals, and the terminal cooperation is inserted in the constant head tank on the connecting block.

Preferably, the connection block is provided with a signal line for transmitting data.

Preferably, the control panel is provided with a substrate; the guide rod passes through the base plate.

The technical scheme of the invention has the following beneficial technical effects:

1. a plurality of supports for supporting are arranged between the upper mounting plate and the lower mounting plate. The support is used for supporting the upper mounting plate and the lower mounting plate, and is convenient for the installation of the first conveying device and the second conveying device. The control panel is provided with a display module for displaying data. The signal transmitting end is in signal connection with the display module on the control panel and used for transmitting the detection data to the display module and judging whether the quantum chip is qualified or not through the display data on the display module.

2. Be provided with a plurality of mounting grooves on the first conveyer, the mounting groove with carry out the quantum chip looks adaptation of testing. Quantum chip places in the mounting groove, is convenient for transport. And a contact contacted with the quantum chip is arranged on the mounting groove. One end of the signal wire is in contact with the positive electrode and the negative electrode of the quantum chip through the contact; the probe is inserted into the detection hole and is electrically connected with the quantum chip through a signal wire, so that whether the quantum chip is qualified or not is detected. Both sides of the mounting groove are provided with depressed parts. The depressed part is convenient for take out the quantum chip of card in the mounting groove.

3. In the process that the detection probe moves downwards, the probe is inserted into the detection hole, the elastic piece keeps a contracted state, and the second conducting strip on the limiting plate is contacted with the first conducting strip at the bottom of the transverse plate to transmit an electric signal; the signal transmitting end receives the electric signal and transmits the electric signal to the display module on the control panel; judging whether the quantum chip is qualified or not according to data displayed on the display module; the invention reduces the damage to the quantum chip without using a bonding pad, and greatly improves the efficiency compared with the traditional manual detection mode; in addition, the mounting groove is customized according to the quantum chip, and the detection block and the base are mounted; all the other detection components do not need to be adjusted, so that the chips of different models can be conveniently expanded and detected, and the use is more convenient.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the installation positions of the first and second mounting frames according to the present invention;

FIG. 3 is a schematic view of the structure of the inspection probe of the present invention;

FIG. 4 is a schematic view of the installation position structure of the installation groove in the present invention;

fig. 5 is a schematic view of the installation position structure of the detection block and the first conveying device in the invention.

Reference numerals: 1. a control panel; 11. a display module; 12. a drive mechanism; 13. a substrate; 14. a guide bar; 15. a conduit; 16. a loop bar; 2. an upper mounting plate; 3. a first mounting bracket; 31. a first conveying device; 32. a detection hole; 33. a detection block; 34. mounting grooves; 35. a signal line; 36. a base; 37. connecting blocks; 38. a binding post; 4. a base; 5. a lower mounting plate; 6. a second mounting bracket; 61. a second conveying device; 7. detecting a probe; 71. a signal transmitting terminal; 72. a transverse plate; 73. a sleeve; 74. a first conductive sheet; 75. a second conductive sheet; 76. a limiting plate; 77. a probe; 78. an elastic member; 8. and (4) a bracket.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

As shown in fig. 1-5, the scalable quantum testing device provided by the present invention comprises a base 4, an upper mounting plate 2, a lower mounting plate 5 and a control plate 1;

the base 4 is arranged on the ground, and the lower mounting plate 5 is arranged at the top of the base 4; the lower mounting plate 5 is provided with an L-shaped second mounting frame 6, and the second mounting frame 6 is provided with a second conveying device 61; the upper mounting plate 2 is arranged right above the lower mounting plate 5, and the L-shaped first mounting frame 3 is arranged on the upper mounting plate 2; the first mounting frame 3 is provided with a first conveying device 31; the first conveying device 31 is provided with a plurality of mounting grooves 34, and each mounting groove 34 is provided with a detection block 33; the second conveying device 61 has the same structure as the first conveying device 31, and the detection block 33 is provided with a detection hole 32;

the control panel 1 is arranged on the upper mounting plate 2, two groups of driving mechanisms 12 are arranged on the control panel 1, and guide rods 14 are arranged at the bottoms of the driving mechanisms 12; the guide rod 14 is provided with a detection probe 7; a guide pipe 15 is inserted on the guide rod 14, a loop bar 16 is arranged at the bottom of the guide pipe 15, the top of the loop bar 16 is contacted with the bottom of the upper mounting frame, and a detection probe 7 is arranged at the bottom of the loop bar 16;

the detection probe 7 comprises a sleeve 73, a transverse plate 72, a limiting plate 76 and a probe 77; the transverse plate 72 is fixedly arranged on the shell of the sleeve 73, the transverse plate 72 is provided with a signal transmitting end 71, and the signal transmitting end 71 is in signal connection with the display module 11 on the control panel 1; a first conducting strip 74 is vertically arranged at the bottom of the transverse plate 72; the probe 77 is arranged on the sleeve 73, a limiting plate 76 is arranged on one side of the probe 77, and a vertical second conducting sheet 75 is arranged on the limiting plate 76; an elastic member 78 is provided on the outer periphery of the probe 77; the top of the elastic part 78 is fixedly arranged with the bottom of the sleeve 73, and the bottom of the elastic part 78 is fixedly arranged with the bottom of the limiting plate; the elastic member 78 extends and contracts vertically; the second conductive plate 75 is located directly below the first conductive plate 74; the first conductive plate 74 contacts the second conductive plate 75 to transmit electrical signals.

In the present embodiment, a plurality of brackets 8 for support are provided between the upper mounting plate 2 and the lower mounting plate 5.

It should be noted that the bracket 8 is used for supporting the upper mounting plate 2 and the lower mounting plate 5, and facilitating the installation of the first conveying device 31 and the second conveying device 61.

In the present embodiment, the control board 1 is provided with a display module 11 for displaying data.

It should be noted that the signal transmitting terminal 71 is in signal connection with the display module 11 on the control board 1, and is used for sending the detection data to the display module 11, and determining whether the quantum chip is qualified or not according to the display data on the display module 11.

In the present embodiment, the first conveying device 31 is provided with a plurality of mounting grooves 34, and the mounting grooves 34 are adapted to the quantum chips to be tested.

It should be noted that the quantum chip is placed in the mounting groove 34, which is convenient for transportation.

In the present embodiment, the mounting groove 34 is provided with a contact for contacting the quantum chip.

It should be noted that one end of the signal line 35 is in contact with the positive electrode and the negative electrode of the quantum chip through the contact; the probe 77 is inserted into the detection hole 32 and electrically connected with the quantum chip through the signal line 35, thereby detecting whether the quantum chip is qualified.

In the present embodiment, both sides of the mounting groove 34 are provided with recessed portions.

It should be noted that the recessed portion facilitates taking out the quantum chip clamped in the mounting groove 34.

In this embodiment, the first conveying device 31 is provided with a base 36, the base 36 is provided with a connecting block 37, and the connecting block 37 is provided with a plurality of positioning grooves. The bottom of the detection block 33 is provided with a plurality of terminals 38, and the terminals 38 are inserted into positioning grooves on the connection block 37 in a matching manner.

It should be noted that the terminal 38 is inserted into the positioning groove of the connecting block 37

In the present embodiment, the connection block 37 is provided with a signal line 35 for transmitting data.

In the present embodiment, the control board 1 is provided with a substrate 13; the guide bar 14 passes through the base plate 13.

The working principle and the using process of the invention are as follows: the upper mounting plate 2 and the lower mounting plate 5 are respectively provided with a first conveying device 31 and a second conveying device 61; the first conveying device 31 and the second conveying device 61 are both provided with a plurality of mounting grooves 34, and the mounting grooves 34 are matched with the quantum chips; each mounting groove 34 is correspondingly provided with a detection block 33, the detection block 33 is provided with a binding post 38, and the binding post 38 is inserted into a connecting block 37 on the base 36; the connecting block 37 is contacted with the contact on the mounting groove 34 through the signal line 35; placing the quantum chip in the mounting groove 34, and contacting the positive and negative electrodes of the quantum chip with the contacts; the first conveying device 31 and the second conveying device 61 drive the quantum chips to run right below the detection probe 7; the operation of the driving mechanism 12 is controlled manually;

the driving mechanism 12 drives the guide rod 14 to move downwards, and in the process that the guide rod 14 moves downwards, the detection probe 7 at the bottom of the guide rod 14 is inserted into the detection hole 32 on the first conveying device 31 to transmit an electric signal through the signal wire 35, so that the quantum chip is detected; meanwhile, the detection probe 7 at the bottom of the loop bar 16 is inserted into the detection hole 32 on the second conveying device 61, and transmits an electric signal through the signal wire 35, so that the quantum chip is detected; in the process that the detection probe 7 moves downwards, the probe 77 is inserted into the detection hole 32, the elastic piece 78 keeps a contracted state, and the second conductive piece 75 on the limiting plate 76 is in contact with the first conductive piece 74 at the bottom of the transverse plate 72 to transmit an electric signal; the signal transmitting terminal 71 receives the electric signal and transmits the electric signal to the display module 11 on the control panel 1; judging whether the quantum chip is qualified or not through data displayed on the display module 11; the invention reduces the damage to the quantum chip without using a bonding pad, and greatly improves the efficiency compared with the traditional manual detection mode; in addition, the mounting groove 34 is customized according to the quantum chip, and the detection block 33 and the base 36 are mounted; all the other detection components do not need to be adjusted, so that the chips of different models can be conveniently expanded and detected, and the use is more convenient.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. An expandable quantum testing device is characterized by comprising a base (4), an upper mounting plate (2), a lower mounting plate (5) and a control plate (1);

the base (4) is arranged on the ground, and the lower mounting plate (5) is arranged at the top of the base (4); an L-shaped second mounting rack (6) is arranged on the lower mounting plate (5), and a second conveying device (61) is arranged on the second mounting rack (6); the upper mounting plate (2) is arranged right above the lower mounting plate (5), and the L-shaped first mounting frame (3) is arranged on the upper mounting plate (2); a first conveying device (31) is arranged on the first mounting frame (3); the first conveying device (31) is provided with a plurality of mounting grooves (34), and each mounting groove (34) is provided with a detection block (33); the second conveying device (61) has the same structure as the first conveying device (31), and the detection block (33) is provided with a detection hole (32);

the control panel (1) is arranged on the upper mounting plate (2), two groups of driving mechanisms (12) are arranged on the control panel (1), and guide rods (14) are arranged at the bottoms of the driving mechanisms (12); a detection probe (7) is arranged on the guide rod (14); a guide pipe (15) is inserted into the guide rod (14), a loop bar (16) is arranged at the bottom of the guide pipe (15), the top of the loop bar (16) is contacted with the bottom of the upper mounting frame, and a detection probe (7) is arranged at the bottom of the loop bar (16);

the detection probe (7) comprises a sleeve (73), a transverse plate (72), a limiting plate (76) and a probe (77); a transverse plate (72) is fixedly arranged on the shell of the sleeve (73), and a signal transmitting end (71) is arranged on the transverse plate (72); a first conducting strip (74) is vertically arranged at the bottom of the transverse plate (72); the probe (77) is arranged on the sleeve (73), a limiting plate (76) is arranged on one side of the probe (77), and a vertical second conducting strip (75) is arranged on the limiting plate (76); an elastic member (78) is arranged on the periphery of the probe (77); the top of the elastic piece (78) is fixedly installed with the bottom of the sleeve (73), and the bottom of the elastic piece (78) is fixedly installed with the bottom of the limiting plate; the elastic piece (78) stretches up and down along the vertical direction; the second conducting plate (75) is positioned right below the first conducting plate (74); the first conducting strip (74) is contacted with the second conducting strip (75) to transmit electric signals.

2. An expandable quantum testing device according to claim 1, characterised in that a plurality of supports (8) for support are arranged between the upper mounting plate (2) and the lower mounting plate (5).

3. The scalable quantum test device according to claim 1, wherein the control board (1) is provided with a display module (11) for displaying data.

4. The scalable quantum test device of claim 1, wherein the first conveyor (31) is provided with a plurality of mounting slots (34), and the mounting slots (34) are adapted to the quantum chips to be tested.

5. The scalable quantum test device of claim 4, wherein the mounting slot (34) is provided with contacts for contacting the quantum chip.

6. The scalable quantum test device of claim 4, wherein both sides of the mounting groove (34) are provided with recesses.

7. The scalable quantum test device of claim 1, wherein the first transport device (31) is provided with a base (36), the base (36) is provided with a connecting block (37), and the connecting block (37) is provided with a plurality of positioning grooves.

8. The scalable quantum test device of claim 1, wherein the bottom of the test block (33) is provided with a plurality of terminals (38), and the terminals (38) are fittingly inserted into positioning grooves on the connecting block (37).

9. The scalable quantum test device of claim 7, wherein the connection block (37) is provided with signal lines (35) for transmitting data.

10. The scalable quantum test device of claim 1, wherein the control board (1) is provided with a substrate (13); the guide rod (14) passes through the base plate (13).