CN208240624U - Semiconductor assembly and test device - Google Patents
Semiconductor assembly and test device Download PDFInfo
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- CN208240624U CN208240624U CN201820677880.XU CN201820677880U CN208240624U CN 208240624 U CN208240624 U CN 208240624U CN 201820677880 U CN201820677880 U CN 201820677880U CN 208240624 U CN208240624 U CN 208240624U
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Abstract
This application discloses a kind of semiconductor assembly and test devices, including preceding road production equipment, rear road production equipment, optical detector, test socket, computer, controller, multimeter, cylinder sensor, key, indicator light and Switching Power Supply.Present apparatus mode of operation is easy, greatly reduces artificial intervention.It is with multiple functions such as voltage measurement, square wave generation, parameter measurement, communication, relay switching, fictitious load and semiconductor input detections, test content is abundant, it is able to achieve automation debugging test job, greatly reduce the time that bad products are reprocessed, production efficiency is improved, has preferable market application prospect.
Description
Technical field
The utility model relates to technical field of semiconductors, and in particular to a kind of semiconductor assembly and test device.
Background technique
Semiconductor packages, which refers to, to process to obtain individual chips according to product type and functional requirement by the wafer tested
Process.Encapsulation process are as follows: the wafer from the preceding road technique of wafer is cut into small chip (Die) after passing through scribing process,
Then the chip of well cutting glue is mounted onto the island of corresponding substrate (lead frame) frame, recycles ultra-fine metal
The landing pad (Bond Pad) of chip is connected to the respective pins of substrate by (golden tin copper aluminium) conducting wire or electroconductive resin
(Lead), and required circuit is constituted；Then packaging protection is subject to plastic shell to independent chip again, is gone back after plastic packaging
Sequence of operations is carried out, carries out finished product test after the completion of encapsulation, is generally gone through into inspection Incoming, test Test and packaging
The processes such as Packing, are finally put in storage shipment.
Semiconductor assembly and test production-line technique step is various, and machine number is big, while the product category produced is general
Up to ten is several, and the processing step of this ten several prods will appear different degrees of difference, it is assumed that machinery equipment failure etc.
Uncertain factor generation so that the abnormal state of semiconductor assembly and test manufacture system is complicated.
Summary of the invention
The object of the present invention is to provide a kind of semiconductor assembly and test devices, realize packaging and testing automation, substantially reduce
The time that bad products are reprocessed, production efficiency is improved, has preferable market application prospect.
The present invention is implemented as follows:
A kind of semiconductor assembly and test device, including preceding road production equipment, rear road production equipment, optical detector, test
Slot, computer, controller, multimeter, cylinder sensor, key, indicator light and Switching Power Supply；
Preceding road production equipment includes wafer lapping machine, loader, scribing machine, chip mounter, baking machine and gold thread bonding machine；Preceding road is raw
Produce equipment between by transmission band connection, the exit of wafer lapping machine, chip mounter and gold thread bonding machine respectively with optical detector
Detection mouth connection, optical detector are connect with computer；Road production equipment is connect with gold thread bonding machine and test socket respectively afterwards；
It is equipped with main control module in controller, communication module, programmable device, square wave generation module, relay control panel, simulates and bears
Load and protective module；Communication module, programmable device, square wave generation module and multimeter are connect with computer and main control module respectively,
Relay control panel is connect with fictitious load, and relay control panel, protective module, cylinder sensor, key, refers to fictitious load
Show that lamp and Switching Power Supply are connect with main control module respectively；Test socket is connect with fictitious load.
Preferably, rear road production equipment include plastic packaging machine, cutting machine, electroplating machine, apparatus for baking, printing equipment and
Molding machine passes through transmission band connection between rear road production equipment.
Preferably, main control module is integrated circuit, PLC controller or single-chip microcontroller.
Preferably, indicator light is equipped with work light and malfunction indicator lamp.
Preferably, power module of voltage regulation is equipped in Switching Power Supply.
Preferably, computer uses windows10 operating system；32 or 64 storages can be used in hardware architecture
Server, 4G-8G memory, 4 core high-performance CPU, 128 strong encryption firewalls.
The advantages of the application, is as follows:
1, the application semiconductor assembly and test device is integrated with nearly all function required for semiconductor assembly and test, drop
The low frequency participated in by hand maximumlly realizes automatic test, effectively solves various existing for current semiconductor assembly and test
Problem；
2, the key of the application semiconductor assembly and test device, which is equipped with, starts key, cancels key and stop key, convenient
Operation, it is very easy to use, all test items can be completed by simple key；
3, the application semiconductor assembly and test device, mode of operation is easy, greatly reduces artificial intervention.It has
A variety of function such as voltage measurement, square wave generation, parameter measurement, communication, relay switching, fictitious load and semiconductor input detection
Can, test content is abundant, is able to achieve automation debugging test job, improves testing efficiency, save the testing time, meets batch and go out
Goods requirement；
4, the application semiconductor assembly and test device realizes packaging and testing automation, greatly reduces bad products and reprocess
Time, improve production efficiency, have preferable market application prospect
5, protective module has also been devised to protect load in the application semiconductor assembly and test device.
Detailed description of the invention
Fig. 1 is the general frame of the application semiconductor assembly and test device.
Specific embodiment
The application semiconductor assembly and test device is further described below in conjunction with attached drawing.
As shown in Figure 1, a kind of semiconductor assembly and test device, including the inspection of preceding road production equipment, rear road production equipment, optics
Survey instrument, test socket, computer, controller, multimeter, cylinder sensor, key, indicator light and Switching Power Supply；
Preceding road production equipment includes wafer lapping machine, loader, scribing machine, chip mounter, baking machine and gold thread bonding machine；Preceding road is raw
Produce equipment between by transmission band connection, the exit of wafer lapping machine, chip mounter and gold thread bonding machine respectively with optical detector
Detection mouth connection, optical detector are connect with computer；Road production equipment is connect with gold thread bonding machine and test socket respectively afterwards；
It is equipped with main control module in controller, communication module, programmable device, square wave generation module, relay control panel, simulates and bears
Load and protective module；Communication module, programmable device, square wave generation module and multimeter are connect with computer and main control module respectively,
Relay control panel is connect with fictitious load, and relay control panel, protective module, cylinder sensor, key, refers to fictitious load
Show that lamp and Switching Power Supply are connect with main control module respectively；Test socket is connect with fictitious load.
Road production equipment includes plastic packaging machine, cutting machine, electroplating machine, apparatus for baking, printing equipment and molding machine, rear road afterwards
Pass through transmission band connection between production equipment.
Main control module is integrated circuit, PLC controller or single-chip microcontroller.
Indicator light is equipped with work light and malfunction indicator lamp.
Power module of voltage regulation is equipped in Switching Power Supply.
Computer uses windows10 operating system；32 or 64 storage servers, 4G-8G can be used in hardware architecture
Memory, 4 core high-performance CPU, 128 strong encryption firewalls.
It is not only in the description and the implementation although the embodiments of the present invention have been disclosed as above
Listed utilization, it can be applied to various fields suitable for the present invention completely, for those skilled in the art,
Other modifications may be easily implemented, therefore without departing from the general concept defined in the claims and the equivalent scope, this reality
It is not limited to specific details and legend shown and described herein with novel.
Claims (4)
1. a kind of semiconductor assembly and test device, it is characterised in that: including preceding road production equipment, rear road production equipment, optics inspection
Survey instrument, test socket, computer, controller, multimeter, cylinder sensor, key, indicator light and Switching Power Supply；
Preceding road production equipment includes wafer lapping machine, loader, scribing machine, chip mounter, baking machine and gold thread bonding machine；Preceding road production is set
By transmission band connection between standby, the exit of wafer lapping machine, chip mounter and gold thread bonding machine respectively with the detection of optical detector
Mouth connection, optical detector are connect with computer；Road production equipment is connect with gold thread bonding machine and test socket respectively afterwards；
Be equipped in controller main control module, communication module, programmable device, square wave generation module, relay control panel, fictitious load and
Protective module；Communication module, programmable device, square wave generation module and multimeter are connect with computer and main control module respectively, relay
Device control panel is connect with fictitious load, relay control panel, fictitious load, protective module, cylinder sensor, key, indicator light
It is connect respectively with main control module with Switching Power Supply；Test socket is connect with fictitious load；
The main control module is integrated circuit, PLC controller or single-chip microcontroller；
The computer uses windows10 operating system；32 or 64 storage servers, 4G-8G can be used in hardware architecture
Memory, 4 core high-performance CPU, 128 strong encryption firewalls.
2. semiconductor assembly and test device according to claim 1, it is characterised in that: road production equipment includes modeling after described
Envelope machine, cutting machine, electroplating machine, apparatus for baking, printing equipment and molding machine pass through transmission band connection between rear road production equipment.
3. semiconductor assembly and test device according to claim 1, it is characterised in that: the indicator light is indicated equipped with work
Lamp and malfunction indicator lamp.
4. semiconductor assembly and test device according to claim 1, it is characterised in that: be equipped with pressure stabilizing in the Switching Power Supply
Power module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820677880.XU CN208240624U (en) | 2018-05-08 | 2018-05-08 | Semiconductor assembly and test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820677880.XU CN208240624U (en) | 2018-05-08 | 2018-05-08 | Semiconductor assembly and test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208240624U true CN208240624U (en) | 2018-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820677880.XU Active CN208240624U (en) | 2018-05-08 | 2018-05-08 | Semiconductor assembly and test device |
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| CN (1) | CN208240624U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109298307A (en) * | 2018-09-26 | 2019-02-01 | 广西桂芯半导体科技有限公司 | Semiconductor packages detection system |
| CN112505523A (en) * | 2020-11-23 | 2021-03-16 | 邓文言 | PCBA function test system |
-
2018
- 2018-05-08 CN CN201820677880.XU patent/CN208240624U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109298307A (en) * | 2018-09-26 | 2019-02-01 | 广西桂芯半导体科技有限公司 | Semiconductor packages detection system |
| CN112505523A (en) * | 2020-11-23 | 2021-03-16 | 邓文言 | PCBA function test system |
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