CN206314058U - A kind of inserted local conductive structure - Google Patents
A kind of inserted local conductive structure Download PDFInfo
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- CN206314058U CN206314058U CN201621377525.8U CN201621377525U CN206314058U CN 206314058 U CN206314058 U CN 206314058U CN 201621377525 U CN201621377525 U CN 201621377525U CN 206314058 U CN206314058 U CN 206314058U
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- circuit board
- base circuit
- ceramic base
- assembled substrate
- utility
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Abstract
The utility model is related to electronic technology field, specifically a kind of inserted local conductive structure, including assembled substrate and ceramic base circuit board, the LED welding region of assembled substrate is provided with void region, ceramic base circuit board is inlaid with void region, bonded using polypropylene between assembled substrate and ceramic base circuit board, conducting is connected using plated copper structure between assembled substrate and ceramic base circuit board.The utility model is compared with the existing technology, devise inserted local conductive structure, the ceramic base circuit board for possessing high thermal conductivity coefficient, breakdown voltage resistant property high is inlayed in the LED welding region of assembled substrate, produced heat passes through ceramic base circuit board during light emitting diode use derives；Ceramic base circuit board is completely encapsulated in inside assembled substrate, solves the problems, such as ceramic fragmentation.Production cost of the present utility model is greatly reduced, about the 1/10 of traditional ceramics base circuit board, more accords with the demands of the market.
Description
Technical field
The utility model is related to electronic technology field, specifically a kind of inserted local conductive structure.
Background technology
LED is gradually on popularization and application to automobile lamp now.Due to LED heat produced in use
Amount derive and lighting during the strong voltage that produces of moment, to automobile lamp wiring board thermal conductivity factor, electric-breakdown resistance, weather-proof
Property, shock resistance etc. require more and more higher.
The automobile lamp circuit panel products for making conventional at present include aluminum-based circuit board and ceramic base circuit board.Aluminium base circuit
The defect of plate is：Thermal conductivity factor 2-3W/M.K, breakdown voltage 2KV/MM, it is impossible to meet the demand of high-powered LED lamp radiating.And
The thermal conductivity factor of ceramic base circuit board>20W.MK, breakdown voltage 10-30kv/mm, breakdown voltage resistant performance and thermal conductivity factor can expire
The use of sufficient high-powered LED lamp.But easily split by ceramic material that ceramic base circuit board is used is frangible and production cost is high, it is difficult
To be acceptable to the market.
Accordingly, it would be desirable to designing one kind had both possessed high thermal conductivity coefficient, breakdown voltage resistant property high, ceramic fragmentation can be avoided again
Inserted local conductive structure.
The content of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, there is provided it is resistance to that one kind had both possessed high thermal conductivity coefficient, height
Breakdown voltage, can avoid the inserted local conductive structure of ceramic fragmentation again.
In order to achieve the above object, the utility model is a kind of inserted local conductive structure, including assembled substrate and pottery
Porcelain base circuit board, it is characterised in that：The LED welding region of assembled substrate is provided with void region, is inlayed in void region
It is embedded with ceramic base circuit board, is bonded using polypropylene between assembled substrate and ceramic base circuit board, assembled substrate and ceramic baseline
Conducting is connected using plated copper structure between the plate of road.
Described assembled substrate includes double-side copper glass-epoxy substrates, polypropylene layer and another double-side copper glass
Fibrous epoxy resin substrate, double-side copper glass-epoxy substrates and another double-side copper glass-epoxy substrates it
Between be provided with polypropylene layer.
The utility model compared with the existing technology, devises inserted local conductive structure, luminous the two of assembled substrate
Pole pipe welding region is inlayed and possesses high thermal conductivity coefficient, the ceramic base circuit board of breakdown voltage resistant property high, and light emitting diode was used
Produced heat passes through ceramic base circuit board in journey derives；Ceramic base circuit board is completely encapsulated in inside assembled substrate, is solved
The problem of ceramic fragmentation.Production cost of the present utility model is greatly reduced, about the 1/10 of traditional ceramics base circuit board, more
Accord with the demands of the market.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of the utility model assembled substrate.
Fig. 3 is the structural representation of the utility model ceramics base circuit board.
Referring to Fig. 1 and Fig. 2,1 is assembled substrate；2 is ceramic base circuit board；3 is double-side copper glass-epoxy base
Plate；4 is polypropylene layer；5 is another double-side copper glass-epoxy substrates.
Specific embodiment
The utility model is described further in conjunction with accompanying drawing.
Referring to Fig. 1, Fig. 2 and Fig. 3, the utility model is a kind of inserted local conductive structure, including assembled substrate and pottery
Porcelain base circuit board.The LED welding region of assembled substrate 1 is provided with void region, and ceramic base is inlaid with void region
Wiring board 2, is bonded between assembled substrate 1 and ceramic base circuit board 2 using polypropylene, assembled substrate 1 and ceramic base circuit board 2 it
Between using plated copper structure connect conducting, then optics shift by way of coordinate etching to be fabricated to the wire of needs.Assembled substrate 1
Void region is provided with, and by copper-plated mode by plated with copper in void region, to be led between layers after playing assembled substrate
It is logical.
In the utility model, assembled substrate 1 includes double-side copper glass-epoxy substrates 3, polypropylene layer 4 and another
Double-side copper glass-epoxy substrates 5, double-side copper glass-epoxy substrates 3 and another double-side copper glass fibre ring
Polypropylene layer 4 is provided between epoxy resin-based plate 5.Double-side copper glass-epoxy substrates 3 and another double-side copper glass fibre
Epoxy resin base plate 5 primarily serves insulation and wire line makes, and copper-plated mode is by layer and layer after follow-up process drills
Between connect formed conducting.Polypropylene layer 4 plays a part of insulation, the mode pressed by way of temperature and pressure,
Polypropylene is set to bond shape ceramics base circuit board 2 insert in gummosis.
The utility model in use, due to the heat conduction of ceramic base circuit board 2>20w.mk, breakdown voltage 10-
30KV/MM, produced heat passes through ceramic base circuit board 2 during use derives；Ceramic base circuit board 2 is completely encapsulated in group
Close inside substrate 1, solve the problems, such as ceramic fragmentation.
Production cost of the present utility model is greatly reduced, about the 1/10 of traditional ceramics base circuit board, more meets market
Demand.
Claims (2)
1. a kind of inserted local conductive structure, including assembled substrate and ceramic base circuit board, it is characterised in that：Assembled substrate
（1）LED welding region be provided with void region, ceramic base circuit board is inlaid with void region（2）, combine base
Plate（1）With ceramic base circuit board（2）Between using polypropylene bond, assembled substrate（1）With ceramic base circuit board（2）Between use
Plated copper structure connection conducting.
2. the inserted local conductive structure of one kind according to claim 1, it is characterised in that：Described assembled substrate（1）
Including double-side copper glass-epoxy substrates（3）, polypropylene layer（4）With another double-side copper glass-epoxy substrates
（5）, double-side copper glass-epoxy substrates（3）With another double-side copper glass-epoxy substrates（5）Between be provided with
Polypropylene layer（4）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621377525.8U CN206314058U (en) | 2016-12-15 | 2016-12-15 | A kind of inserted local conductive structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621377525.8U CN206314058U (en) | 2016-12-15 | 2016-12-15 | A kind of inserted local conductive structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206314058U true CN206314058U (en) | 2017-07-07 |
Family
ID=59252615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621377525.8U Active CN206314058U (en) | 2016-12-15 | 2016-12-15 | A kind of inserted local conductive structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206314058U (en) |
-
2016
- 2016-12-15 CN CN201621377525.8U patent/CN206314058U/en active Active
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