CN206226821U - High-heat-conductionaluminum aluminum base copper clad board - Google Patents
High-heat-conductionaluminum aluminum base copper clad board Download PDFInfo
- Publication number
- CN206226821U CN206226821U CN201621268869.5U CN201621268869U CN206226821U CN 206226821 U CN206226821 U CN 206226821U CN 201621268869 U CN201621268869 U CN 201621268869U CN 206226821 U CN206226821 U CN 206226821U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat conduction
- copper
- carbon fiber
- clad board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 48
- 239000010949 copper Substances 0.000 title claims abstract description 48
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 28
- 239000004411 aluminium Substances 0.000 claims abstract description 28
- 239000004917 carbon fiber Substances 0.000 claims abstract description 28
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 28
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000005476 soldering Methods 0.000 claims abstract description 18
- 230000000694 effects Effects 0.000 claims abstract description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 229910002804 graphite Inorganic materials 0.000 claims description 18
- 239000010439 graphite Substances 0.000 claims description 18
- 238000009827 uniform distribution Methods 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of high-heat-conductionaluminum aluminum base copper clad board, including copper coin, the copper coin is provided with copper-based soldering tin block, the copper-based soldering tin block is provided with conductive weld leg, also include aluminium base, the aluminium base includes heat conduction carbon fiber layer, and the heat conduction carbon fiber layer is provided with heat conduction pin, and the utility model radiating effect is more preferable.
Description
Technical field
The utility model is related to copper-clad plate technical field, specially a kind of high-heat-conductionaluminum aluminum base copper clad board.
Background technology
Traditional metal-based copper-clad plate is made up of Copper Foil, insulating barrier and metal substrate, and wherein insulating barrier is by polymer structure
Into, typically all thicker, particularly stress levels require metal-based copper-clad plate higher, and insulating barrier is just thicker, insulating layer thickness
Thermal resistance increase is resulted in, thermal conduction rate is hindered, heat conduction is slow, and continuous cumulative rises are not distributed not go out, and such postorder makes
The product for going out just is under a kind of condition of high temperature for a long time, and the reliability and service life of its end product also receive certain shadow
Ring.
In order to solve the above technical problems, Application No.：The Chinese patent of CN201420095353.X discloses a kind of radiating
The silver copper-clad plate of type aluminium, including：Copper coin, aluminium base, silver coating, tin pull side, and shown copper coin bottom is provided with polyimide insulative layer, gather
Acid imide insulating barrier is fixed on aluminium base by adhesive layer, and aluminium base bottom is coated with silver coating, and silver coating, copper coin outside are provided with tin
Side is pulled, the aluminium base in the middle part of copper coin is provided with aluminium base soldering tin block, copper coin middle part is provided with copper-based soldering tin block, aluminium base soldering tin block upper surface
Heat conduction leg is provided with, copper-based soldering tin block upper surface is provided with conductive weld leg, and component is connected by aluminium base soldering tin block, copper-based soldering tin block
On copper coin.
The heat conduction leg of component is welded direct to aluminium base by above-mentioned patent document by the aluminium base soldering tin block of circuit board
On, the thermal impedance of polyimide insulative layer is bypassed, realize more efficient heat transfer.But meanwhile, the conductive weld leg of component leads to
Copper-based soldering tin block is crossed to be welded on copper coin, and the thermal conductivity factor of copper can be arrived more quickly more than the thermal conductivity factor of aluminium, therefore heat
Up to copper coin, rather than aluminium base, such heat is concentrated near component, is unfavorable for distributing for heat；And in aluminium base
During upper welding block tin, the surface of metallic aluminium is heated and easily aoxidize, and the alumina refractory generated after oxidation can hinder the weldering of block tin
Connect, thus it is to be improved.
Utility model content
In view of the shortcomings of the prior art, the utility model covers copper there is provided a kind of more preferable high thermal conductivity aluminum matrix of radiating effect
Plate.
To achieve the above object, the utility model provides following technical scheme：A kind of high-heat-conductionaluminum aluminum base copper clad board, including
Copper coin, the copper coin is provided with copper-based soldering tin block, and the copper-based soldering tin block is provided with conductive weld leg, described also including aluminium base
Aluminium base includes heat conduction carbon fiber layer, and the heat conduction carbon fiber layer is provided with heat conduction pin.
Further, the heat conduction pin is conductive graphite piece.
Further, the conductive graphite piece includes that the integrally formed vertical component effect for heat transfer is parallel with for what is be heated
Portion；One end of the vertical component effect is connected with heat conduction carbon fiber layer, and its other end is connected with parallel portion.
Further, the conductive graphite piece has several, and some conductive graphite piece circumference uniform distributions are set.
In sum, the heat that component is produced passes to heat conduction carbon fiber layer, the heat conduction of heat conduction carbon fiber by heat conduction pin
Coefficient is more than copper, therefore heat can be conducted and be distributed by heat conduction carbon fiber layer rapidly；And replace aluminium with heat conduction carbon fiber, no longer
Aluminium base soldering tin block is needed, is processed simple and convenient, it is easy to implement.
Brief description of the drawings
Fig. 1 is the front view of the utility model high-heat-conductionaluminum aluminum base copper clad board；
Fig. 2 is the sectional view of the utility model high-heat-conductionaluminum aluminum base copper clad board；
Fig. 3 is the three dimensional structure diagram of the utility model high-heat-conductionaluminum aluminum base copper clad board.
Brief description of the drawings：1st, copper coin；2nd, conductive weld leg；3rd, heat conduction carbon fiber layer；4th, heat conduction pin；5th, vertical component effect；6th, parallel portion；
7th, component.
Specific embodiment
The embodiment of the utility model high-heat-conductionaluminum aluminum base copper clad board is described further referring to figs. 1 to Fig. 3.
A kind of high-heat-conductionaluminum aluminum base copper clad board, including copper coin 1, the copper coin 1 are provided with copper-based soldering tin block, the copper-based scolding tin
Block is provided with conductive weld leg 2, and also including aluminium base, the aluminium base includes heat conduction carbon fiber layer 3, the heat conduction carbon fiber layer 3
It is provided with heat conduction pin 4.
By using above-mentioned technical proposal, the heat that component 7 is produced passes to heat conduction carbon fiber layer 3, leads by heat conduction pin 4
The thermal conductivity factor of hot carbon fiber is more than copper, therefore heat can be conducted and be distributed by heat conduction carbon fiber layer 3 rapidly, and radiating effect is more
It is good；And replace aluminium with heat conduction carbon fiber, it is no longer necessary to aluminium base soldering tin block, process simple and convenient, it is easy to implement.
The present embodiment is preferred, and the heat conduction pin 4 is conductive graphite piece.
By using above-mentioned technical proposal, conductive graphite piece X-Y axles（Length and width direction）Thermal conductivity factor it is reachable
1500 W/M-K, heat can conduct rapidly along the length and width direction of conductive graphite piece, quick to reach heat conduction carbon fiber layer 3,
Then distributed by heat conduction carbon fiber layer 3, so as to efficiently radiate.
Heat conduction pin 4 can also be made up using heat conductive isolation sheet or of other Heat Conduction Materials except using conductive graphite piece.
The present embodiment is preferred, and the conductive graphite piece includes the integrally formed vertical component effect 5 for conducting heat and for receiving
The parallel portion 6 of heat；One end of the vertical component effect 5 is connected with heat conduction carbon fiber layer 3, and its other end is connected with parallel portion 6.
By using above-mentioned technical proposal, parallel portion 6 is conducive to receiving heat to a greater degree, and vertical component effect 5 is then favourable
In conduction heat, as shown in Fig. 2 heat transfer is to after parallel portion 6, due to conductive graphite piece X-Y axles（Length and width direction）
Thermal conductivity factor（1500 W/M-K）Much larger than its thermal conductivity factor in a thickness direction（10 W/M-K）, heat is rapidly along heat conduction
The length and width direction conduction of graphite flake, it is quick to reach vertical component effect 5, then conduct to heat conduction carbon fiber layer 3, it is fine by heat conduction carbon
Dimension layer 3 is distributed, so as to more efficiently radiate.
Parallel portion 6 can also be also provided between vertical component effect 5 and heat conduction carbon fiber layer 3, as shown in Fig. 2 being so conducive to
Heat is transferred to heat conduction carbon fiber layer 3 from heat conduction pin 4.
The present embodiment is preferred, and the conductive graphite piece has several, and some conductive graphite piece circumference uniform distributions are set.
By using above-mentioned technical proposal, as shown in figure 3, conductive graphite piece is divided into several, so facilitate single
Shape, intensity is higher, during single damage can independent dismounting and change, maintenance maintenance cost is relatively low.
In sum, the heat that component 7 is produced passes to heat conduction carbon fiber layer 3 by heat conduction pin 4, and heat conduction carbon fiber is led
Hot coefficient is more than copper, therefore heat can be conducted and be distributed by heat conduction carbon fiber layer 3 rapidly, and radiating effect is more preferable；And use heat conduction
Carbon fiber replaces aluminium, it is no longer necessary to aluminium base soldering tin block, processes simple and convenient, it is easy to implement.
The above is only preferred embodiment of the present utility model, and protection domain of the present utility model is not limited merely to
Above-described embodiment, all technical schemes belonged under the utility model thinking belong to protection domain of the present utility model.Should refer to
Go out, for those skilled in the art, some improvement under the premise of the utility model principle is not departed from and
Retouching, these improvements and modifications also should be regarded as protection domain of the present utility model.
Claims (4)
1. a kind of high-heat-conductionaluminum aluminum base copper clad board, including copper coin, the copper coin is provided with copper-based soldering tin block, on the copper-based soldering tin block
It is provided with conductive weld leg, it is characterised in that also including aluminium base, the aluminium base includes heat conduction carbon fiber layer, the heat conduction carbon is fine
Dimension layer is provided with heat conduction pin.
2. high-heat-conductionaluminum aluminum base copper clad board according to claim 1, it is characterised in that the heat conduction pin is conductive graphite piece.
3. high-heat-conductionaluminum aluminum base copper clad board according to claim 2, it is characterised in that the conductive graphite piece include one into
The parallel portion for the vertical component effect of heat transfer and for being heated of type；One end of the vertical component effect is connected with heat conduction carbon fiber layer, its
The other end is connected with parallel portion.
4. high-heat-conductionaluminum aluminum base copper clad board according to claim 3, it is characterised in that the conductive graphite piece has several,
Some conductive graphite piece circumference uniform distributions are set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621268869.5U CN206226821U (en) | 2016-11-23 | 2016-11-23 | High-heat-conductionaluminum aluminum base copper clad board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621268869.5U CN206226821U (en) | 2016-11-23 | 2016-11-23 | High-heat-conductionaluminum aluminum base copper clad board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206226821U true CN206226821U (en) | 2017-06-06 |
Family
ID=58791242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621268869.5U Expired - Fee Related CN206226821U (en) | 2016-11-23 | 2016-11-23 | High-heat-conductionaluminum aluminum base copper clad board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206226821U (en) |
-
2016
- 2016-11-23 CN CN201621268869.5U patent/CN206226821U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 311800 Zhejiang city of Shaoxing province Zhuji City Tao Street LITE-ON Road No. 1 Patentee after: Zhejiang Yuanji New Material Co.,Ltd. Address before: 311800 Zhejiang city of Shaoxing province Zhuji City Tao Street LITE-ON Road No. 1 Patentee before: ZHEJIANG YUANJI NEW MATERIAL TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170606 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |