CN206179896U - 发光二极管封装结构 - Google Patents
发光二极管封装结构 Download PDFInfo
- Publication number
- CN206179896U CN206179896U CN201620937058.3U CN201620937058U CN206179896U CN 206179896 U CN206179896 U CN 206179896U CN 201620937058 U CN201620937058 U CN 201620937058U CN 206179896 U CN206179896 U CN 206179896U
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- led chip
- wire
- substrate holder
- light
- led
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- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- 239000000758 substrate Substances 0.000 claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000741 silica gel Substances 0.000 claims abstract description 11
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 11
- 239000010931 gold Substances 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000009877 rendering Methods 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000002834 transmittance Methods 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 abstract description 2
- 230000008676 import Effects 0.000 abstract 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000005611 electricity Effects 0.000 abstract 1
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620937058.3U CN206179896U (zh) | 2016-08-25 | 2016-08-25 | 发光二极管封装结构 |
Applications Claiming Priority (1)
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CN201620937058.3U CN206179896U (zh) | 2016-08-25 | 2016-08-25 | 发光二极管封装结构 |
Publications (1)
Publication Number | Publication Date |
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CN206179896U true CN206179896U (zh) | 2017-05-17 |
Family
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Family Applications (1)
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CN201620937058.3U Active CN206179896U (zh) | 2016-08-25 | 2016-08-25 | 发光二极管封装结构 |
Country Status (1)
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CN (1) | CN206179896U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111312882A (zh) * | 2020-03-02 | 2020-06-19 | 合肥彩虹蓝光科技有限公司 | 一种发光二极管芯片的封装结构及封装方法 |
-
2016
- 2016-08-25 CN CN201620937058.3U patent/CN206179896U/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111312882A (zh) * | 2020-03-02 | 2020-06-19 | 合肥彩虹蓝光科技有限公司 | 一种发光二极管芯片的封装结构及封装方法 |
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Denomination of utility model: Surface adhesion type LED packaging structure Effective date of registration: 20180605 Granted publication date: 20170517 Pledgee: China Everbright Bank Limited by Share Ltd. Tianjin branch Pledgor: TIANJIN TIANXING ELECTRONICS Co.,Ltd. Registration number: 2018120000017 |
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Date of cancellation: 20190712 Granted publication date: 20170517 Pledgee: China Everbright Bank Limited by Share Ltd. Tianjin branch Pledgor: TIANJIN TIANXING ELECTRONICS Co.,Ltd. Registration number: 2018120000017 |
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Denomination of utility model: Surface adhesion type LED packaging structure Effective date of registration: 20190905 Granted publication date: 20170517 Pledgee: Bank of Communications Ltd. Tianjin branch Pledgor: TIANJIN TIANXING ELECTRONICS Co.,Ltd. Registration number: Y2019120000004 |
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Date of cancellation: 20201009 Granted publication date: 20170517 Pledgee: Bank of Communications Ltd. Tianjin branch Pledgor: TIANJIN TIANXING ELECTRONICS Co.,Ltd. Registration number: Y2019120000004 |
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Denomination of utility model: LED packaging structure Effective date of registration: 20210531 Granted publication date: 20170517 Pledgee: Bank of China Limited by Share Ltd. Tianjin Xiqing branch Pledgor: TIANJIN TIANXING ELECTRONICS Co.,Ltd. Registration number: Y2021980004193 |
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