CN206179849U - Fingerprint sensor's packaging structure - Google Patents
Fingerprint sensor's packaging structure Download PDFInfo
- Publication number
- CN206179849U CN206179849U CN201621126490.0U CN201621126490U CN206179849U CN 206179849 U CN206179849 U CN 206179849U CN 201621126490 U CN201621126490 U CN 201621126490U CN 206179849 U CN206179849 U CN 206179849U
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- chip
- fingerprint sensor
- substrate
- companion
- encapsulating structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The utility model relates to a chip package technical field discloses a fingerprint sensor's packaging structure. The utility model discloses in, fingerprint sensor's packaging structure includes: base plate, fingerprint sensor chip, at least one supplementary chip, support membrane and plastic -sealed body, supplementary chip is located on the base plate, on the fingerprint sensor chip was located supplementary chip, just with base plate electric connection, the surface area of supplementary chip was less than the surface area of fingerprint sensor chip, the support membrane is located between supplementary chip and the fingerprint sensor chip, and the supplementary chip of parcel, the plastic -sealed body just wraps up fingerprint sensor chip, supplementary chip and support membrane on being located the base plate. Compared with the prior art, can improve fingerprint sensor's signal collection ability, simultaneously, can also ensure that image acquisition is correct to improve and gather efficiency.
Description
Technical field
This utility model is related to chip encapsulation technology field, more particularly to a kind of encapsulating structure of fingerprint sensor.
Background technology
With consumer's requirement more and more various to fingerprint sensor outward appearance, fingerprint sensor surface-assembled will arrange in pairs or groups more
The cover plate (such as ceramics, glass) of multiple material, this requires that fingerprint sensor will possess higher penetration capacity, and this wears
Thoroughly ability is specifically embodied on fingerprint sensor package.
During the present invention is realized, inventor has found at least there is problems with prior art：Currently, fingerprint is passed
Chip package is carried out using single fingerprint sensor and common capsulation material more than sensor, such encapsulation scheme cannot meet fingerprint biography
The demand of sensor penetration power, it is difficult to guarantee image acquisition correctly and collecting efficiency.
Utility model content
The purpose of this utility model is to provide a kind of encapsulating structure of fingerprint sensor, can improve fingerprint sensor receipts
The ability of collection fingerprint signal；At the same time it can also guarantee that image acquisition is correct, and improve collecting efficiency.
To solve above-mentioned technical problem, embodiment of the present utility model provides a kind of encapsulation of fingerprint sensor and ties
Structure, including：Substrate, fingerprint sensor chip, at least one companion chip, support membrane and plastic-sealed body；The companion chip is located at
On the substrate；The fingerprint sensor chip is located on the companion chip, and is connected with the electrical property of substrate, described
Surface area of the surface area of companion chip less than the fingerprint sensor chip；The support membrane is located at the companion chip and institute
State between fingerprint sensor chip, and wrap up the companion chip；The plastic-sealed body is located on the substrate, and wraps up described
Fingerprint sensor chip, companion chip and support membrane.
In terms of existing technologies, companion chip is located on substrate this utility model embodiment, fingerprint sensor
Chip is located on companion chip, and support membrane is located between companion chip and fingerprint sensor chip, and wraps up companion chip, is moulded
Envelope body is located on substrate, and wraps up fingerprint sensor chip, companion chip and support membrane.Fingerprint sensor chip is located at
On companion chip, the distance between surface to plastic-sealed body surface of fingerprint sensor chip can be reduced, and then, improve fingerprint
The ability of sensor collection fingerprint signal.Meanwhile, support membrane is located between fingerprint sensor chip and companion chip, and wraps up auxiliary
Help chip so that the encapsulating structure of fingerprint sensor is more stable.
In addition, companion chip at least two；At least two companion chip is arranged in parallel on the substrate.By
In companion chip area less than fingerprint sensor chip area, thus, companion chip is arranged in parallel on substrate, can be with
Effectively utilizes space, improves space availability ratio.
In addition, fingerprint sensor chip is connected by bonding wire with the electrical property of substrate, and the bonding wire is anti-routing.This reality
In applying mode, the distance between surface to plastic-sealed body surface of fingerprint sensor chip can further be reduced using anti-routing,
Further improve the ability that fingerprint sensor collects fingerprint signal.
In addition, companion chip is one or more in high-voltage chip, control chip or storage chip.Present embodiment
In, high-voltage chip can be used to strengthen the detection signal intensity of fingerprint sensor chip, and control chip can be used to control detection signal,
Storage chip can be used for the control program used by storage control chip.Wherein, companion chip can be high-voltage chip, so, can
Further to improve the ability that fingerprint sensor chip collects signal.
In addition, in the encapsulating structure of fingerprint sensor, the thickness of the support membrane is less than or equal to 150 microns.Support
Film can realize the lamination of fingerprint sensor chip and companion chip, reduce the package dimension of chip.The thickness of support membrane is less than
Or equal to 150 microns, can further reduce the package dimension of chip.
In addition, in the encapsulating structure of fingerprint sensor, the surface on the plastic-sealed body surface to the fingerprint sensor chip
Distance be less than or equal to 90 microns.As such, it is possible to further reduce the surface of fingerprint sensor chip to plastic-sealed body surface
The distance between, further improve the ability that fingerprint sensor chip collects signal.
In addition, in the encapsulating structure of fingerprint sensor, the dielectric constant of the plastic-sealed body is more than 5.As such, it is possible to further
Improve fingerprint signal capacity gauge.
In addition, the substrate is printed circuit board or hollow metal framework.
In addition, the substrate is printed circuit board, wherein, the printed circuit board is 2 laminates or 4 laminates；Or, institute
It is hollow metal framework to state substrate, wherein, the hollow metal framework is supplied materials of the surrounding without pin flat package hollow out
Conducting wire plate or support etching hollow out that framework, the supplied materials of quad flat package have been electroplated on the framework of hollow out, support plate
And possess the conductive plate of shielding layer.
Description of the drawings
Fig. 1 is the structure chart of the encapsulating structure of the fingerprint sensor according to first embodiment of the invention；
Fig. 2 is the schematic diagram of the fingerprint sensor chip according to first embodiment of the invention；
Fig. 3 is the structure chart of the encapsulating structure of the fingerprint sensor according to second embodiment of the invention；
Fig. 4 is the structure chart of the encapsulating structure of the fingerprint sensor according to third embodiment of the invention.
Specific embodiment
It is new to this practicality below in conjunction with accompanying drawing to make the purpose of this utility model, technical scheme and advantage clearer
Each embodiment of type is explained in detail.However, it will be understood by those skilled in the art that each in this utility model
In embodiment, in order that reader more fully understands the application and proposes many ins and outs.But, even if without these skills
Art details and many variations based on following embodiment and modification, it is also possible to realize that each claim of the application is required and protect
The technical scheme of shield.
In embodiment of the present utility model, the encapsulating structure of fingerprint sensor, including：Substrate, fingerprint sensor chip,
At least one companion chip, support membrane and plastic-sealed body.It is introduced by taking 3 specific embodiments as an example below.
First embodiment of the present utility model is related to a kind of encapsulating structure of fingerprint sensor, the envelope of the fingerprint sensor
Assembling structure includes at least one companion chip, in present embodiment, illustrates by taking two companion chips as an example.As shown in figure 1,
The encapsulating structure of fingerprint sensor includes：Substrate 101, fingerprint sensor chip 102, the first companion chip 104, the second auxiliary wick
Piece 106, support membrane 103 and plastic-sealed body 105, wherein, the first companion chip 104, the surface area of the second companion chip 106 are less than
The surface area of fingerprint sensor chip 102.
First companion chip 104 and the second companion chip 106 are located on substrate 101, and support membrane 103 is located at the first auxiliary wick
On the companion chip 106 of piece 104 and second, and wrap up the first companion chip 104 and the second companion chip 106, fingerprint sensor
Chip 102 is located on support membrane 103.Fingerprint sensor chip 102 is electrically connected with substrate 101.Plastic-sealed body 105 is located at substrate
On 101, and wrap up fingerprint sensor chip 102, the first companion chip 104, the second companion chip 106 and support membrane
103.Wherein, support membrane can protect fingerprint sensor chip and companion chip, also, can be used to support and be placed on the auxiliary of its surface
Help chip.Specifically, the first companion chip 104 can be control chip, and the second companion chip 106 can be storage chip.
In present embodiment, the principle of fingerprint sensor chip is as shown in Fig. 2 input signal is entered by amplifier 202
Driving ring 203.After plastic-sealed body on the pressing fingerprint sensor chip of finger 201, fingerprint sensing circuit passes through electric capacity 207, electric capacity
208 and electric capacity 209 obtain finger print information, wherein, electric capacity 207 is coupled capacitor between finger 201 and driving ring 203, electricity
Hold 208 for the coupled capacitor between finger 201 and fingerprint sensor 205, electric capacity 209 is the coupling electricity between finger 201 and ground
Hold.Specifically, fingerprint sensor 205 by obtain carrying finger print information analog signal output to analog-digital converter 206, modulus
The analogue signal of acquisition can be converted to digital signal by transducer 206, and the incoming main frame 204 of digital signal is processed,
Obtain finger print information.
In the present embodiment, the original signal data RawData for getting of fingerprint sensor can be expressed as：
RawData=K0+K1*N*C,
Wherein, K0 is constant, and K1 is gain, and N is stamp number, and C is inductance capacitance.Inductance capacitance C can be expressed as：
C=ε S/4 π kd,
Wherein, ε is dielectric constant, and S is the area of pole plate, and d is polar plate spacing, i.e. fingerprint sensor chip surface is to modeling
The thickness in envelope body surface face.
RawData=K0+A/d,
Wherein, A can be expressed as：K1*N*εS/4πk.As can be seen that RawData and d is inversely proportional to from above formula, i.e. refer to
Stricture of vagina sensor chip surface to the thickness on plastic-sealed body surface has a great impact to the effect of fingerprint sensor, specifically, thickness
Thinner, the effect of fingerprint sensor is better.
In terms of existing technologies, companion chip is located on substrate this utility model embodiment, fingerprint sensor
Chip is located on companion chip, and support membrane is located between companion chip and fingerprint sensor chip, and wraps up companion chip, is moulded
Envelope body is located on substrate, and wraps up fingerprint sensor chip, companion chip and support membrane.Fingerprint sensor chip is located at
On companion chip, the distance between surface to plastic-sealed body surface of fingerprint sensor chip can be reduced, and then, improve fingerprint
The ability of sensor collection fingerprint signal.Meanwhile, support membrane is located between fingerprint sensor chip and companion chip, and wraps up auxiliary
Help chip so that the encapsulating structure of fingerprint sensor is more stable.
Second embodiment of the present utility model is related to a kind of encapsulating structure of fingerprint sensor.Second embodiment is
Further improvement is made on the basis of one embodiment, has mainly theed improvement is that：In this utility model second embodiment
In, the encapsulating structure of fingerprint sensor also includes the high-voltage chip for strengthening fingerprint sensor chip detection signal intensity, tool
Body is as shown in figure 3, the ability that fingerprint sensor chip collects signal can be improved further.
In the present embodiment, in the encapsulating structure of fingerprint sensor, companion chip at least two.Specifically, this reality
In applying mode, the encapsulating structure of fingerprint sensor includes：Substrate 101, fingerprint sensor chip 102, the first companion chip 104,
Second companion chip 106, the 3rd companion chip 107, support membrane 103, plastic-sealed body 105 and bonding wire 108.
First companion chip 104, the second companion chip 106, the 3rd companion chip 107 are located on substrate 101, support membrane
103 are located on the first companion chip 104, the second companion chip 106, the 3rd companion chip 107, and wrap up the first auxiliary wick
Piece 104, the second companion chip 106, the 3rd companion chip 107.Fingerprint sensor chip 102 is located on support membrane 103.Fingerprint
Sensor chip 102 is electrically connected with substrate 101.Plastic-sealed body 105 is located on substrate 101, and wraps up fingerprint sensor core
Piece 102, the first companion chip 104, the second companion chip 106, the 3rd companion chip 107 and support membrane 103.
First companion chip 104, the second companion chip 106, the 3rd companion chip 107 are arranged in parallel on substrate 101.
Specifically, the first companion chip 104, the second companion chip 106, the 3rd companion chip 107 can be arranged in parallel in substrate 101
On, as shown in Figure 2.Because the area of companion chip is less than the area of fingerprint sensor chip, thus, companion chip is arranged parallel
It is listed on substrate, can more effectively utilization space.
First companion chip 104, the second companion chip 106, the surface area of the 3rd companion chip 107 are less than fingerprint sensor
The surface area of chip 102.Meanwhile, the first companion chip 104, the second companion chip 106, the parallel arranged of the 3rd companion chip 107
The gross area afterwards can be less than the surface area of fingerprint sensor chip 102, i.e. fingerprint sensor chip can cover all auxiliary
Chip.As such, it is possible to reduce fingerprint sensor be taken up space, be conducive to further save space.
In the present embodiment, fingerprint sensor chip 102 can be electrically connected with by bonding wire 108 with substrate 101, its
In, bonding wire 108 can be anti-routing.Specifically, fingerprint sensor chip can be connected by positive routing technique and electrical property of substrate
Connect, i.e. bonding wire is beaten to substrate from fingerprint sensor chip.Fingerprint sensor chip can also be by anti-routing technique and substrate electricity
Property connection, i.e. bonding wire is beaten to fingerprint sensor chip from substrate.Wherein, anti-routing technique can realize less routing camber,
It is thus possible to reduce fingerprint sensor chip surface to the distance on plastic-sealed body surface, and then, fingerprint sensor collection can be improved
The ability of fingerprint signal.In addition, the bonding wire between spread groove sensor chip and substrate, its material can be gold thread, copper cash with
And alloy wire, or other materials.
In the present embodiment, the first companion chip 104, the second companion chip 106, the 3rd companion chip 107 can divide
Be not for strengthen the high-voltage chip of the detection signal intensity of fingerprint sensor, for control the control chip of detection signal with
And for the storage chip of control program used by storage control chip.Wherein, high-voltage chip, can further improve fingerprint sensing
Device chip collects the ability of signal.
In the present embodiment, the thickness of support membrane can be less than or equal to 150 microns.As such, it is possible to reduce fingerprint
The distance between the surface of sensor chip to plastic-sealed body surface, and then, improve the ability that fingerprint sensor collects fingerprint signal.
Meanwhile, support membrane can realize the lamination of fingerprint sensor chip and companion chip, reduce the package dimension of fingerprint sensor.
During practical application, support membrane can use FOD (Film on Die) packaging technology.
In the present embodiment, plastic-sealed body surface can be less than or equal to the distance on the surface of fingerprint sensor chip
90 microns.Specifically, distance of the plastic-sealed body surface to fingerprint sensor chip surface, i.e. plastic-sealed body is in fingerprint sensor core
The thickness on piece surface, can be less than or equal to 90 microns.For example, the thickness of the plastic-sealed body can be 80 microns.Wherein, plastic packaging
The thickness that body can go out 80 microns with straight forming, it is also possible to be shaped to thicker thickness, afterwards by mode realities such as surface polishings
Existing 80 microns thickness.Specific polishing mode can be grinding wheel type polishing, disk polishing etc..
In the present embodiment, the dielectric constant of plastic-sealed body is more than 5.Specifically, plastic-sealed body can use dielectric constant
Capsulation material more than 5.Wherein, capsulation material of the dielectric constant more than 5 can be by the doping oxidation in common capsulation material
Aluminum or other alloys are obtained.
In this utility model embodiment, companion chip can be in high-voltage chip, control chip or storage chip
One or more, in present embodiment, high-voltage chip can be used to strengthen the detection signal intensity of fingerprint sensor chip, control core
Piece can be used to control detection signal, and storage chip can be used for the control program used by storage control chip.Wherein, companion chip can
High-voltage chip is thought, as such, it is possible to further improve the ability that fingerprint sensor chip collects signal.The encapsulation of fingerprint sensor
In structure, the distance on plastic-sealed body surface to fingerprint sensor chip surface is less than or equal to 90 microns, can reduce fingerprint biography
Sensor chip surface the distance between to plastic-sealed body surface, and then, improve the ability that fingerprint sensor collects fingerprint signal.This reality
In applying mode, fingerprint sensor chip is connected using the bonding wire of anti-routing technique with electrical property of substrate, can be realized using anti-routing
Less routing camber, it is thus possible to reduce fingerprint sensor chip surface to the distance on plastic-sealed body surface, and then, Ke Yiti
High fingerprint sensor collects the ability of fingerprint signal.In the encapsulating structure of fingerprint sensor, using plastic packaging of the dielectric constant more than 5
Material can further improve the ability that fingerprint sensor collects fingerprint signal as plastic-sealed body.
The embodiment of this utility model the 3rd is related to a kind of encapsulating structure of fingerprint sensor, as shown in figure 4, including：Base
Plate 101, fingerprint sensor chip 102, the first companion chip 104, the second companion chip 107, the 3rd companion chip 108, support
Film 103, plastic-sealed body 105 and bonding wire 106.
In present embodiment, substrate 101 can be printed circuit board or hollow metal framework.
Specifically, when substrate 101 is printed circuit board, printed circuit board can be 2 laminates or 4 laminates.Substrate 101
For hollow metal framework when, hollow metal framework can be supplied materials of the surrounding without the pin flat package framework of hollow out, square
The supplied materials of Flat type packaged framework of hollow out etc..
Additionally, substrate 101 can also be that the conducting wire plate of plating or support etch hollow out and possess masking on support plate
The conductive plate of layer.
In this utility model embodiment, substrate can use 2 layers or 4 layers of printed circuit board, as shown in figure 4, base
Plate uses 4 layers of printed circuit board.Substrate uses 2 layers of printed circuit board, better reliability, at the same time it can also cost-effective.Base
Plate uses 4 layers of printed circuit board, and processing technology is simple, and wiring is easier, and can shield interference signal.
It will be understood by those skilled in the art that the respective embodiments described above are to realize of the present utility model being embodied as
Example, and in actual applications, can in the form and details to it, various changes can be made, without departing from spirit of the present utility model
And scope.
Claims (9)
1. a kind of encapsulating structure of fingerprint sensor, it is characterised in that include：It is substrate, fingerprint sensor chip, at least one auxiliary
Help chip, support membrane and plastic-sealed body；
The companion chip is located on the substrate；
The fingerprint sensor chip is located on the companion chip, and is connected with the electrical property of substrate, the companion chip
Surface area less than the fingerprint sensor chip surface area；
The support membrane is located between the companion chip and the fingerprint sensor chip, and wraps up the companion chip；
The plastic-sealed body is located on the substrate, and wraps up the fingerprint sensor chip, companion chip and support membrane.
2. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the companion chip is at least two
It is individual；
At least two companion chip is arranged in parallel on the substrate.
3. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the fingerprint sensor chip leads to
Cross bonding wire to be connected with the electrical property of substrate, and the bonding wire is anti-routing.
4. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the companion chip is high pressure core
One or more in piece, control chip or storage chip.
5. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the thickness of the support membrane is less than
Or equal to 150 microns.
6. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the plastic-sealed body surface is to described
The distance on the surface of fingerprint sensor chip is less than or equal to 90 microns.
7. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the dielectric constant of the plastic-sealed body
More than 5.
8. the encapsulating structure of fingerprint sensor according to claim 1, it is characterised in that the substrate is printed circuit board
Or hollow metal framework.
9. the encapsulating structure of fingerprint sensor according to claim 8, it is characterised in that the substrate is printed circuit
Plate, wherein, the printed circuit board is 2 laminates or 4 laminates；Or,
The substrate be hollow metal framework, wherein, the hollow metal framework be supplied materials of the surrounding without pin flat package
Conducting wire plate or support erosion that the framework of hollow out, the supplied materials of quad flat package have been electroplated on the framework of hollow out, support plate
Carve hollow out and possess the conductive plate of shielding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621126490.0U CN206179849U (en) | 2016-10-14 | 2016-10-14 | Fingerprint sensor's packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621126490.0U CN206179849U (en) | 2016-10-14 | 2016-10-14 | Fingerprint sensor's packaging structure |
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| CN206179849U true CN206179849U (en) | 2017-05-17 |
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| CN201621126490.0U Active CN206179849U (en) | 2016-10-14 | 2016-10-14 | Fingerprint sensor's packaging structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109417081A (en) * | 2018-09-29 | 2019-03-01 | 深圳市汇顶科技股份有限公司 | Chip-packaging structure, method and electronic equipment |
| WO2021000311A1 (en) * | 2019-07-04 | 2021-01-07 | 深圳市汇顶科技股份有限公司 | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
-
2016
- 2016-10-14 CN CN201621126490.0U patent/CN206179849U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109417081A (en) * | 2018-09-29 | 2019-03-01 | 深圳市汇顶科技股份有限公司 | Chip-packaging structure, method and electronic equipment |
| WO2020062140A1 (en) * | 2018-09-29 | 2020-04-02 | 深圳市汇顶科技股份有限公司 | Chip packaging structure, method, and electronic device |
| WO2021000311A1 (en) * | 2019-07-04 | 2021-01-07 | 深圳市汇顶科技股份有限公司 | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
| US11288481B2 (en) | 2019-07-04 | 2022-03-29 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
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