CN215493794U - Isolated current sensor chip - Google Patents

Abstract

The utility model discloses an isolated current sensor chip, comprising: a current conductor to converge the magnetic field; the magnetic sensing device is used for sensing magnetic field size data generated by the current conductor and eliminating the influence of an external common-mode magnetic field on the measurement precision; the signal conditioning circuit is used for conditioning the magnetic field size data acquired by the magnetic sensor; the first side of the isolation material layer is provided with a magnetic sensor and a signal conditioning circuit to form an insulating layer for protecting the magnetic sensor and the signal conditioning circuit; the signal pins are arranged on the second side of the isolation material layer and are electrically connected with the magnetic sensor and the signal conditioning circuit through leads respectively; the package body is used for coating the part of the current conductor, the part of the signal pins, the isolating material layer, the magnetic sensor and the signal conditioning circuit. The isolated current sensor chip provided by the utility model can effectively realize the electrical isolation between the current acquisition side and the signal side.

Description

Isolated current sensor chip

Technical Field

The utility model belongs to the technical field of sensors, relates to a current sensor, and particularly relates to an isolated current sensor chip.

Background

How to effectively realize the electrical isolation between a current side and a signal side of a current sensor, especially an isolated current sensor chip internally integrated with a current conductor, is a difficult point, and a better solution does not exist at present.

In view of the above, there is a need to design a new current sensor chip to overcome at least some of the above-mentioned disadvantages of the existing current sensor chips.

SUMMERY OF THE UTILITY MODEL

The utility model provides an isolated current sensor chip which can effectively realize the electrical isolation between a current acquisition side and a signal side.

In order to solve the technical problem, according to one aspect of the present invention, the following technical solutions are adopted:

an isolated current sensor chip, comprising:

a current conductor to converge the magnetic field;

the magnetic sensing device is arranged on the upper part of the current conductor and used for sensing magnetic field size data generated by the current conductor and eliminating the influence of an external common-mode magnetic field on the measurement precision;

the signal conditioning circuit is connected with the magnetic sensor and is used for conditioning the magnetic field size data acquired by the magnetic sensor;

the magnetic sensor and the signal conditioning circuit are arranged on the first side of the isolation material layer, and an insulating layer is formed to protect the magnetic sensor and the signal conditioning circuit;

the signal pins are arranged on the second side of the isolation material layer and are electrically connected with the magnetic sensor and the signal conditioning circuit through leads respectively;

and the packaging body is used for coating the parts of the current conductors, the parts of the signal pins, the isolating material layer, the magnetic sensor and the signal conditioning circuit.

As an embodiment of the present invention, the magnetic sensor device comprises two sets of magnetic sensors, wherein one set of magnetic sensors is arranged in the central region of the U-shaped section of the current conductor and the other set is arranged in the outer region of the U-shaped section of the current conductor.

In one embodiment of the present invention, the magnetic sensor is a hall sensor or a magnetoresistive sensor.

As an embodiment of the present invention, a portion of the signal pin and a portion of the current conductor are exposed outside the package body.

In one embodiment of the present invention, the current conductor is made of copper alloy material, and the structure of the current conductor for generating the magnetic field is U-shaped, square or other shapes which are helpful for realizing the concentrated magnetic field.

In one embodiment of the present invention, the isolation material layer is a copper-free substrate, and the isolation material layer mainly comprises glass fibers and resin, and has a thickness of 20 to 200 μm.

As an embodiment of the present invention, the magnetic sensing device and the signal conditioning circuit form a first layer structure of a chip, the isolation material layer forms a second layer structure of the chip, and the current conductor forms a third layer structure of the chip; the first layer structure, the second layer structure and the third layer structure of the chip are arranged in sequence;

and a non-conductive bonding film or non-conductive bonding glue is arranged between the first layer structure of the chip and the second layer structure of the chip, and a non-conductive bonding film or non-conductive bonding glue is arranged between the second layer structure of the chip and the third layer structure of the chip.

As an embodiment of the present invention, the isolated current sensor chip includes: the device comprises a current conductor, a non-conductive bonding film or non-conductive bonding glue, a copper-free substrate, a non-conductive bonding film or non-conductive bonding glue, a magnetic sensor, a signal conditioning circuit and a plurality of signal pins; the rest part is filled with thermosetting epoxy resin.

The utility model has the beneficial effects that: the isolated current sensor chip provided by the utility model can effectively realize the electrical isolation between the current acquisition side and the signal side.

Drawings

Fig. 1 is a schematic structural diagram of an isolated current sensor chip according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of an isolated current sensor die in accordance with an embodiment of the present invention.

Detailed Description

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

For a further understanding of the utility model, reference will now be made to the preferred embodiments of the utility model by way of example, and it is to be understood that the description is intended to further illustrate features and advantages of the utility model, and not to limit the scope of the claims.

The description in this section is for several exemplary embodiments only, and the present invention is not limited only to the scope of the embodiments described. It is within the scope of the present disclosure and protection that the same or similar prior art means and some features of the embodiments may be interchanged.

"coupled" in this specification includes both direct and indirect connections, such as through some active device, passive device, or electrically conductive medium; but also may include connections through other active or passive devices, such as through switches, follower circuits, etc., that are known to those skilled in the art for achieving the same or similar functional objectives.

Fig. 1 is a schematic structural diagram of an isolated current sensor chip according to an embodiment of the present invention; referring to fig. 1, the isolated current sensor chip includes: the sensor comprises a current conductor 1, a magnetic sensing device 2, a signal conditioning circuit 3, an isolating material layer 4, a plurality of signal pins 5 and a packaging body 6.

The current conductor 1 is used for converging a magnetic field; the magnetic sensing device 2 is disposed above the current conductor 1 to induce magnetic field data generated by the current conductor 1.

The signal conditioning circuit 3 is connected with the magnetic sensing device 2 and is used for conditioning the magnetic field size data acquired by the magnetic sensing device 2. The magnetic sensor and the signal conditioning circuit 3 are arranged on a first side of the isolating material layer 4. The signal pins 5 are disposed on the second side of the isolation material layer 4, and the signal pins 5 are electrically connected to the magnetic sensor device 2 and the signal conditioning circuit 3 through leads, respectively. The package 6 is used to cover the current conductor 1, the signal pins 5, the isolation material layer 4, the magnetic sensor device 2, and the signal conditioning circuit 3.

In an embodiment of the present invention, the current conductor 1 is made of a copper alloy material (or other materials with high conductivity), and the internal structure of the current conductor 1 is U-shaped, square, or other shapes that facilitate the realization of the concentrated magnetic field.

As shown in fig. 1, in one embodiment, the magnetic sensor device 2 includes two sets of magnetic sensors, namely a first set of magnetic sensors 21 and a second set of magnetic sensors 22, the first set of magnetic sensors 21 being disposed in a central region of the U-shaped portion of the current conductor (referred to as the upper portion of the current conductor 1), and the second set of magnetic sensors 22 being disposed in an outer region of the U-shaped portion of the current conductor.

The magnetic sensor 2 may be arranged in the central area of the U-shaped part of the current conductor. In an embodiment, the first and second sets of magnetic sensors 21 and 22 may be hall sensors or magnetoresistive sensors. Portions of the signal pins 5 and portions of the current conductors 1 are exposed outside the package 6. The isolating material layer 4 can be a copper-free substrate, the main components of which are glass fiber and resin, and the thickness of the isolating material layer is 20-200 micrometers.

FIG. 2 is a cross-sectional view of an isolated current sensor die in accordance with an embodiment of the present invention; referring to fig. 2, the magnetic sensing device 2 and the signal conditioning circuit 3 form a first layer structure of a chip, the isolation material layer 4 forms a second layer structure of the chip, and the current conductor 1 forms a third layer structure of the chip; the first layer structure, the second layer structure and the third layer structure of the chip are sequentially arranged.

And a non-conductive adhesive film or non-conductive adhesive glue 7 is arranged between the first layer structure of the chip and the second layer structure of the chip, and a non-conductive adhesive film or non-conductive adhesive glue 7 is arranged between the second layer structure of the chip and the third layer structure of the chip.

In one embodiment, the isolated current sensor chip comprises: the device comprises a current conductor, a non-conductive bonding film or non-conductive bonding glue, a copper-free substrate, a non-conductive bonding film or non-conductive bonding glue, a magnetic sensor, a signal conditioning circuit and a plurality of signal pins; the rest part is filled with thermosetting epoxy resin.

In summary, the isolated current sensor chip provided by the utility model can effectively realize the electrical isolation between the current collection side and the signal side.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The description and applications of the utility model herein are illustrative and are not intended to limit the scope of the utility model to the embodiments described above. Effects or advantages referred to in the embodiments may not be reflected in the embodiments due to interference of various factors, and the description of the effects or advantages is not intended to limit the embodiments. Variations and modifications of the embodiments disclosed herein are possible, and alternative and equivalent various components of the embodiments will be apparent to those skilled in the art. It will be clear to those skilled in the art that the present invention may be embodied in other forms, structures, arrangements, proportions, and with other components, materials, and parts, without departing from the spirit or essential characteristics thereof. Other variations and modifications of the embodiments disclosed herein may be made without departing from the scope and spirit of the utility model.

Claims (7)

1. An isolated current sensor chip, comprising:

a current conductor to converge the magnetic field;

the magnetic sensing device is arranged on the upper part of the current conductor and used for sensing magnetic field size data generated by the current conductor and eliminating the influence of an external common-mode magnetic field on the measurement precision;

the signal conditioning circuit is connected with the magnetic sensing device and used for conditioning the magnetic field size data acquired by the magnetic sensing device;

the magnetic sensing device and the signal conditioning circuit are arranged on the first side of the isolation material layer to form an insulating layer for protecting the magnetic sensing device and the signal conditioning circuit;

the signal pins are arranged on the second side of the isolation material layer and are electrically connected with the magnetic sensing device and the signal conditioning circuit through leads respectively;

and the packaging body is used for coating the parts of the current conductors, the parts of the signal pins, the isolating material layer, the magnetic sensing device and the signal conditioning circuit.

2. The isolated current sensor chip of claim 1, wherein:

the magnetic sensing device comprises two sets of magnetic sensors, wherein one set of magnetic sensors is arranged in the central area of the U-shaped part of the current conductor, and the other set of magnetic sensors is arranged in the outer area of the U-shaped part of the current conductor.

3. The isolated current sensor chip of claim 1, wherein:

the isolating material layer is a copper-free substrate, the main components of the isolating material layer are glass fibers and resin, and the thickness of the isolating material layer is 20-200 micrometers.

4. The isolated current sensor chip of claim 2, wherein:

the magnetic sensor is a Hall sensor or a magnetoresistive sensor.

5. The isolated current sensor chip of claim 1, wherein:

the signal pin and the current conductor are exposed out of the packaging body.

6. The isolated current sensor chip of claim 1, wherein:

the current conductor is made of copper alloy materials, and the structure of the current conductor, which generates a magnetic field, is U-shaped or square.

7. The isolated current sensor chip of claim 1, wherein:

the magnetic sensing device and the signal conditioning circuit form a first layer structure of a chip, the isolation material layer forms a second layer structure of the chip, and the current conductor forms a third layer structure of the chip; the first layer structure, the second layer structure and the third layer structure of the chip are arranged in sequence;

and a non-conductive bonding film or non-conductive bonding glue is arranged between the first layer structure of the chip and the second layer structure of the chip, and a non-conductive bonding film or non-conductive bonding glue is arranged between the second layer structure of the chip and the third layer structure of the chip.

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