CN213093205U - Image sensor packaging structure - Google Patents

Abstract

The utility model provides an image sensor packaging structure, which relates to the technical field of semiconductor packaging and comprises a packaging substrate and an image sensing chip, wherein the packaging substrate comprises a top surface, a bottom surface and a side surface, and the packaging substrate is arranged as a silicon carbide substrate; the image sensing chip comprises a photosensitive area for receiving optical sensing signals, one surface of the image sensing chip, which comprises the photosensitive area, is the upper surface of the image sensing chip, and the surface opposite to the upper surface is the lower surface of the image sensing chip; the lower surface of the image sensing chip is attached to the top surface of the packaging substrate and fixed. The utility model provides an image sensor packaging structure does not relate to complicated encapsulation equipment and packaging technology, can improve jumbo size image sensing chip's heat-sinking capability betterly, is favorable to promoting image sensing chip operational reliability and life under high temperature environment.

Description

Image sensor packaging structure

Technical Field

The utility model relates to a semiconductor package field especially relates to an image sensor packaging structure.

Background

As an image device core component for converting an optical sensing signal into an electronic signal, an image sensor is rapidly developed and widely applied to various intelligent terminals. In the prior art, when a large-chip image sensor chip (for example, 100mm × 100mm) is packaged, ceramic is generally used as a package substrate, but an image sensor package structure made of the ceramic package substrate has poor heat dissipation performance when working for a long time, and needs to be subjected to secondary processing when applied as the package substrate, specifically, a conductive copper foil is covered on the package substrate to realize the function of a PCB. After secondary processing, the ceramic packaging substrate is often low in flatness (the surface of the ceramic packaging substrate is warped to +/-30-50 microns), and the working reliability of the image sensing chip in the whole packaging structure is affected.

SUMMERY OF THE UTILITY MODEL

To the problem that exists, the utility model provides an image sensor packaging structure, this structure does not relate to complicated encapsulation equipment and packaging technology, can improve the heat-sinking capability of image sensing chip, promotes operational reliability and the life of image sensing time measuring.

In order to achieve the above purpose, the utility model provides a technical scheme does:

the utility model provides an image sensor packaging structure, include:

the packaging substrate comprises a top surface, a bottom surface and side surfaces, wherein the top surface is opposite to the bottom surface; the packaging substrate is a silicon carbide substrate;

the image sensing chip comprises a photosensitive area for receiving optical sensing signals, one surface of the image sensing chip, which comprises the photosensitive area, is an upper surface of the image sensing chip, and the surface of the image sensing chip, which is opposite to the upper surface, is a lower surface of the image sensing chip; the lower surface of the image sensing chip is attached to the top surface of the packaging substrate and fixed.

The utility model provides an image sensor packaging structure, preferably, still include a conducting layer; the conducting layer comprises a conducting upper surface, a conducting lower surface and a positioning side face; wherein the conductive upper surface and the conductive lower surface are opposite; the conductive upper surface is provided with a first electrical connection point, and the conductive layer is fixedly attached to the side surface of the packaging substrate through the positioning side surface; the image sensing chip is electrically connected with the first electrical connection point.

The utility model provides an image sensor packaging structure, preferably, the conducting layer adopts PCB circuit board machine-shaping.

The utility model provides an image sensor packaging structure, preferably, the conducting layer is fixed through an insulating glue layer on packaging substrate's the side.

The utility model provides an image sensor packaging structure, preferably, the electrically conductive lower surface of conducting layer sets up the second electric connection point that is used for switching on with outside electronic circuit.

The utility model provides an image sensor packaging structure, preferably, the image sensing chip with first electrical connection point lead bonding.

The utility model provides an image sensor packaging structure, preferably, the lower surface of image sensing chip with packaging substrate's top surface is fixed through the heat conduction glue bonding.

The utility model provides an image sensor packaging structure, preferably, the height of conducting layer is unanimous with the height of encapsulation base plate, electrically conductive upper surface with the top surface of encapsulation base plate is flush; the conductive lower surface is flush with the bottom surface of the package substrate.

The utility model provides an image sensor packaging structure, which relates to the technical field of semiconductor packaging and comprises a packaging substrate and an image sensing chip, wherein the packaging substrate comprises a top surface, a bottom surface and a side surface, and the packaging substrate is arranged as a silicon carbide substrate; the image sensing chip comprises a photosensitive area for receiving optical sensing signals, one surface of the image sensing chip, which comprises the photosensitive area, is the upper surface of the image sensing chip, and the surface opposite to the upper surface is the lower surface of the image sensing chip; the lower surface of the image sensing chip is attached to the top surface of the packaging substrate and fixed. The utility model provides an image sensor packaging structure does not relate to complicated encapsulation equipment and packaging technology, can improve the heat-sinking capability of image sensing chip betterly, is favorable to promoting image sensing chip operational reliability and life under high temperature environment.

Drawings

The invention and its features, aspects and advantages will become more apparent from a reading of the following detailed description of non-limiting embodiments with reference to the attached drawings. Like reference symbols in the various drawings indicate like elements. The drawings are not intended to be drawn to scale, emphasis instead being placed upon illustrating the principles of the invention.

Fig. 1 is a schematic cross-sectional view of a package substrate in an image sensor package structure provided in embodiment 1 of the present invention;

fig. 2 is a schematic cross-sectional view of embodiment 1 of the present invention, which is attached to an image sensing chip based on the structure of fig. 1;

fig. 3 is a schematic cross-sectional view of embodiment 1 of the present invention, which is provided with an insulating adhesive layer on the basis of the structure shown in fig. 2;

fig. 4 is a schematic cross-sectional view illustrating the embodiment 1 of the present invention bonding a conductive layer to a package substrate based on the structure of fig. 3;

fig. 5 is a schematic cross-sectional view illustrating an image sensor chip electrically connected to a conductive layer according to embodiment 1 of the present invention based on the structure shown in fig. 4;

fig. 6 is a schematic overall cross-sectional structural diagram of an image sensor package structure provided in embodiment 1 of the present invention.

Detailed Description

In the following, the technical solutions in the embodiments of the present invention are clearly and completely described with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

Example 1:

the embodiment of the utility model provides an image sensor packaging structure understands with reference to 1 ~ 2, include:

the package substrate comprises a package substrate 1, wherein the package substrate 1 comprises a top surface 11, a bottom surface 12 and a side surface 13, wherein the top surface 11 is opposite to the bottom surface 12; the packaging substrate 1 is a silicon carbide substrate;

the image sensing chip 2, the image sensing chip 2 includes a photosensitive area 21 for receiving an optical sensing signal, a surface of the image sensing chip 2 including the photosensitive area 21 is an upper surface 22 of the image sensing chip 2, and a surface of the image sensing chip 2 opposite to the upper surface 22 is a lower surface 23 of the image sensing chip; the lower surface 23 of the image sensing chip 2 is fixed to the top surface 11 of the package substrate 1.

The embodiment 1 of the present invention provides an image sensor package structure, wherein an image sensing chip 2 (a large chip with a size of 100mm x 100mm in this embodiment 1) is disposed on a package substrate 1, and the package substrate 1 is packaged by using silicon carbide, so as to solve the problem of poor heat dissipation performance when a ceramic is used as a substrate in the package of an image sensor in the prior art, the silicon carbide semiconductor material has stable chemical properties and a small thermal expansion coefficient, and when the package substrate is used as a package base of the image sensing chip 2, the package substrate has high stability, can endure temperature peaks, can better adapt to the severe high-temperature working environment, has a forbidden bandwidth (WBG) three times that of a silicon material, has good thermal conductivity and electronic drift velocity, can effectively relieve the thermal stress of the image sensing chip 2 during operation at high temperature, and ensures good high-temperature resistance, air tightness and stable high-temperature electrical performance, the heat dissipation characteristic of the whole image sensor packaging structure is enhanced, and the working stability and the service life of the image sensing chip 2 are enhanced.

Further, considering that the conventional image sensor package structure using ceramic as a package base has the following problems: when the ceramic substrate is used as a base, the flatness of the ceramic substrate is not high, and when the image sensing chip is electrically connected, secondary processing is needed, namely, a layer of conductive copper foil (similar to a PCB function) needs to be covered on the substrate to realize signal communication between the pins of the image sensing chip 2 and a copper foil circuit covered on the substrate so as to realize the image sensing function. When the ceramic substrate after secondary processing is applied to an image sensing chip packaging structure, a warping error of 30-50 μm exists on the surface of a packaging base fixed by the image sensing chip 2, so that the levelness of the image sensing chip 2 during image sensing is influenced, certain influence is caused on imaging precision, on the other hand, the arrangement of the conductive copper foil is troublesome, and the packaging efficiency of the packaging structure is also influenced by carrying out secondary processing on the provided ceramic substrate by using the copper foil. In order to solve this problem, as will be understood with reference to fig. 4, embodiment 1 of the present invention provides an image sensor package structure including a conductive layer 3; the conductive layer 3 comprises a conductive upper surface 31, a conductive lower surface 32 and a positioning side surface 33; wherein the conductive upper surface 31 and the conductive lower surface 32 are opposite; the conductive upper surface 31 is provided with a first electrical connection point (not shown), and the conductive layer 3 is attached and fixed to the side surface 13 of the package substrate 1 through the positioning side surface 33; the image sensing chip 2 is electrically connected to the first electrical connection point.

The embodiment of the utility model provides a when the image sensor packaging structure implements, the side 13 of fixing at packaging substrate 1 is attached to the location side 33 of conducting layer 3, the first electrical connection point electric connection of pin on the image sensing chip 2 and the electrically conductive upper surface 31 of conducting layer 3, therefore, on the one hand, the lower surface 23 of image sensing chip 2 can be fully attached and carry out heat transfer on the top surface 11 of silicon carbide packaging substrate 1, the heat is transmitted away from the bottom surface 12 of silicon carbide packaging substrate 1, the radiating effect of image sensing chip 2 has been strengthened, simultaneously conducting layer 3 encapsulates in the lateral part of packaging substrate 1, can make full use of the lateral part space of packaging substrate 1, be favorable to promoting whole packaging structure's frivolity degree; on the other hand, for the traditional mode of the sensing circuit electric connection to the base plate upper surface with image sensing chip 2, the utility model provides an image sensor packaging structure sets up electric connection image sensing chip 2 and external circuit's conducting layer 3 on packaging substrate 1's side 13, has not only promoted the roughness of image sensing chip 2 when image sensing, has promoted the sensing precision, has attenuate the thickness of packaging body, can also be through the mode of processing conducting layer 3 and carborundum packaging substrate 1 in advance respectively, the encapsulation efficiency when promoting image sensing chip 2 encapsulation. The utility model discloses well conducting layer 3 is not limited to specific implementation mode, as long as can realize transmitting the operating signal of the image sensing chip 2 that receives on the first electric connection point to the external circuit can, for example, can set up the second electric connection point that is used for switching on with external electronic circuit at the electrically conductive lower surface 23 of conducting layer 3, also can further set up the mode of extending lead wire 6 (refer to fig. 6, electrically conductive metal lead wire such as gold thread, silver wire) on the second electric connection point for example and draw forth the electrode on the second electric connection point, in order to regard as the outer pin of being connected with external electronic circuit electricity. As an optimal implementation mode, because the technology of the current printed circuit is mature, the conductive layer 3 is specifically formed by processing a PCB, which is relatively flat and has relatively low implementation cost and relatively high batch processing efficiency. The conductive layer 3 is fixed on the side 13 of the package substrate 1 by the positioning side 33, and the present invention is not particularly limited, and preferably, it is understood by referring to fig. 3, the conductive layer 3 is fixed on the side 13 of the package substrate 1 by an insulating adhesive layer 4, and the meaning of the insulating adhesive layer 4 is: the package substrate 1 and the positioning side 33 of the conductive layer 3 are fixed by adhesion and are made of insulating material, so that the misconduction of the related circuit pins is avoided. The packaging substrate 1 and the conducting layer 3 are fixed by coating the insulating glue layer 4, so that the implementation cost is low, the packaging efficiency is high, accurate control is not needed, the packaging substrate 1 and the conducting layer 3 are not easy to fall off as long as the packaging substrate 1 and the conducting layer 3 can be tightly fixed, and the implementation is convenient.

Referring to fig. 5, in the image sensor package structure provided in embodiment 1 of the present invention, the electrically conductive upper surface 31 of the conductive layer 3 is not limited to a specific form, as long as the pin signal of the image sensing chip 2 is transmitted to the first electrically conductive point on the electrically conductive upper surface 31 of the conductive layer 3, and then the signal of the sensing circuit is transmitted to the outside through the second electrically conductive point on the electrically conductive lower surface 32 by the conductive layer 3 via the internal conduction circuit. Preferably, the image sensing chip 2 is electrically connected to the conductive upper surface 31 of the conductive layer 3 through the plurality of metal leads 5, the wire bonding process is mature, the implementation cost is low, no additional circuit needs to be laid or pre-buried in the package substrate 1, and the reliability and the packaging efficiency are high.

The embodiment 1 of the utility model provides an image sensor packaging structure, refer to fig. 2, the mode that the image sensing chip 2 is attached to be fixed on packaging substrate 1 is not limited to specific form, as long as can realize leveling fixed can. For example, the lower surface 23 of the image sensing chip 2 may be attached to the package substrate 1 by bonding or adhesion, as a preferred embodiment, the lower surface 23 of the image sensing chip 2 and the package substrate 1 are fixed by adhesion of a thermal conductive adhesive, so that the thermal resistance between the package base 1 and the image sensing chip 2 can be reduced to a certain extent by the thermal conductive adhesive while the flat attachment and fixation are realized, and thus, heat is more effectively dissipated from the chip, and the influence of heat accumulation on the image sensing performance is prevented. Preferably, the height of the conductive layer 3 is consistent with that of the package substrate 1, and the conductive upper surface 31 is flush with the top surface of the package substrate 1; the conductive lower surface 32 is flush with the bottom surface 12 of the package substrate 1. Specifically, the utility model discloses the electrically conductive upper surface 31 to the electrically conductive lower surface 32's of the electrically conductive layer 3 that highly specifically indicates of the electrically conductive layer 3 distance, packaging substrate 1's the distance of top surface 11 to bottom surface 12 that highly indicates packaging substrate 1, through size and position relation between further restraint electrically conductive layer 3 and the packaging substrate 1, can make holistic image sensor packaging structure obtain comparatively regular appearance, when being applied to in the terminal electronic circuit, can further reduce and occupy the volume of terminal circuit, be convenient for assemble according to terminal circuit's reference plane, it is fixed, operations such as electric connection, be favorable to promoting packaging structure's integration and compactness.

The embodiment of the utility model provides an image sensor packaging structure when implementing, can implement according to following encapsulation method: s10 providing a package substrate; s20, attaching and fixing the image sensing chip on the packaging substrate; s30, coating an insulating glue layer on the side surface of the packaging substrate; s40, attaching the conducting layer on the insulating glue layer, and tightly fixing the packaging substrate and the conducting layer; s50, electrically connecting the image sensing chip and the conductive layer; s60 leads out an electric signal of the conductive layer. The embodiment 1 of the utility model provides an image sensor packaging structure, overall structure is simple reliable, and the integrated level is higher, has good heat dispersion and image sensing roughness, is favorable to promoting image sensing chip 2's image sensing performance and the ability of tolerating high temperature, does not relate to complicated encapsulation flow and packaging material, and the implementation cost is lower, can combine traditional packaging technology to encapsulate, has higher packaging efficiency, is fit for popularizing and applying.

Those skilled in the art will appreciate that variations may be implemented by those skilled in the art in combination with the prior art and the above-described embodiments, and will not be described in detail herein. Such variations do not affect the essence of the present invention, and are not described herein.

The above description is directed to the preferred embodiment of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that devices and structures not described in detail are understood to be implemented in a manner common in the art; the person skilled in the art, without affecting the essence of the invention, may make numerous possible variations and modifications, or may modify the equivalent embodiments, without departing from the technical solution of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments by the technical entity of the present invention all still fall within the protection scope of the technical solution of the present invention, where the technical entity does not depart from the content of the technical solution of the present invention.

Claims (8)

1. An image sensor package structure, comprising:

the packaging substrate comprises a top surface, a bottom surface and side surfaces, wherein the top surface is opposite to the bottom surface; the packaging substrate is a silicon carbide substrate;

the image sensing chip comprises a photosensitive area for receiving optical sensing signals, one surface of the image sensing chip, which comprises the photosensitive area, is an upper surface of the image sensing chip, and the surface of the image sensing chip, which is opposite to the upper surface, is a lower surface of the image sensing chip; the lower surface of the image sensing chip is attached to the top surface of the packaging substrate and fixed.

2. The image sensor package of claim 1, further comprising a conductive layer; the conducting layer comprises a conducting upper surface, a conducting lower surface and a positioning side face; wherein the conductive upper surface and the conductive lower surface are opposite; the conductive upper surface is provided with a first electrical connection point, and the conductive layer is fixedly attached to the side surface of the packaging substrate through the positioning side surface; the image sensing chip is electrically connected with the first electrical connection point.

3. The image sensor package structure of claim 2, wherein the conductive layer is formed using a PCB.

4. The image sensor package structure of claim 2, wherein the conductive layer is fixed on the side of the package substrate by an insulating glue layer.

5. The image sensor package of claim 2, wherein the conductive lower surface of the conductive layer is provided with a second electrical connection point for conducting with an external electronic circuit.

6. The image sensor package structure of claim 2, wherein the image sensing chip and the first electrical connection point are wire bonded.

7. The image sensor package structure of any of claims 1 to 6, wherein the lower surface of the image sensing chip and the top surface of the package substrate are bonded and fixed by a thermal conductive adhesive.

8. The image sensor package structure of claim 2, wherein the conductive layer has a height corresponding to a height of a package substrate, the conductive upper surface being flush with a top surface of the package substrate; the conductive lower surface is flush with the bottom surface of the package substrate.

Images