CN103886299A - Packaging structure of capacitive fingerprint sensor - Google Patents

Packaging structure of capacitive fingerprint sensor Download PDF

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CN103886299A
CN103886299A CN201410117837.4A CN201410117837A CN103886299A CN 103886299 A CN103886299 A CN 103886299A CN 201410117837 A CN201410117837 A CN 201410117837A CN 103886299 A CN103886299 A CN 103886299A
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substrate
sensor
die
pins
capacitive fingerprint
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CN103886299B (en
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吴磊
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Chengdu Finger Microelectronic Technology Co ltd
Chengdu Image Design Technology Co Ltd
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CHENGDU FEIENGEER MICROELECTRONICS TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
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Abstract

一种半导体电容式指纹传感器的封装结构,包括半导体传感器管芯、由绝缘材料制成的凹槽式基板、连接导线、接插件和注封结构;基板凹槽的底部用于承载并通过粘合剂固定传感器管芯,其正面、背面或侧面具有多层互连引线和电性连接多层互连引线之间的接触通孔,以及其开槽面上印制有由一条或多条导电金属边条组成的连接焊盘;连接导线用于连接传感器管芯的管脚和基板的连接焊盘;接插件用于凹槽式基板和印制电路板之间的电气连接;连接焊盘通过形成于基板正面或背面且处于其各层中的互连引线和接插件的一个或多个接地管脚相连,接插件的一个或多个接地管脚和印制电路板的地平面电性相连;管芯管脚、基板导电金属边条和连接导线通过注封结构进行封装。

A packaging structure of a semiconductor capacitive fingerprint sensor, including a semiconductor sensor die, a grooved substrate made of insulating material, a connecting wire, a connector and an injection sealing structure; the bottom of the substrate groove is used for bearing and is bonded An agent-fixed sensor die has multilayer interconnect leads on the front, back or sides and contact vias electrically connecting the multilayer interconnect leads, and one or more conductive metal strips are printed on the slotted surface. The connection pad composed of side strips; the connection wire is used to connect the pin of the sensor die and the connection pad of the substrate; the connector is used for the electrical connection between the grooved substrate and the printed circuit board; the connection pad is formed by forming The interconnection leads on the front or back of the substrate and in each layer thereof are connected to one or more ground pins of the connector, and the one or more ground pins of the connector are electrically connected to the ground plane of the printed circuit board; The die pins, the conductive metal side strips of the substrate and the connecting wires are packaged through the injection molding structure.

Description

一种电容式指纹传感器的封装结构Packaging structure of a capacitive fingerprint sensor

技术领域technical field

本发明涉及集成电路封装技术领域,更具体地说,涉及一种半导体电容式指纹传感器的封装结构。The invention relates to the technical field of integrated circuit packaging, and more specifically, relates to a semiconductor capacitive fingerprint sensor packaging structure.

背景技术Background technique

近年来,随着指纹识别技术的发展,指纹识别系统越来越多地应用在日常生活中,例如指纹识别门禁系统、指纹门锁和指纹保险箱柜等,尤其在对私人设备(例如笔记本电脑、平板电脑、智能手机、个人数字助理(PersonalDigital Assistant,简称PDA)设备、指纹USBKey)等验证人的身份目的的应用变得十分常见。In recent years, with the development of fingerprint recognition technology, fingerprint recognition systems are increasingly used in daily life, such as fingerprint recognition access control systems, fingerprint door locks and fingerprint safes, etc., especially for private devices (such as laptops, Tablet PCs, smart phones, Personal Digital Assistant (PDA) devices, fingerprint USBKeys) and other applications for the purpose of verifying a person's identity have become very common.

指纹传感器按传感原理(指纹成像原理和技术),可以分为光学指纹传感器、半导体电容传感器、半导体热敏传感器、半导体压感传感器、超声波传感器和射频(Radio Frequency,简称RF)传感器等;按外观形状又可以分为条状指纹传感器和面状指纹传感器。According to the sensing principle (fingerprint imaging principle and technology), fingerprint sensors can be divided into optical fingerprint sensors, semiconductor capacitive sensors, semiconductor thermal sensors, semiconductor pressure sensors, ultrasonic sensors and radio frequency (Radio Frequency, RF) sensors, etc.; The appearance shape can be divided into strip fingerprint sensor and planar fingerprint sensor.

基于半导体工艺的电容式指纹传感器包括硅材质的管芯,其正面形成有传感器采集单元阵列、驱动电路和读出电路。在传感器采集单元阵列中集成大约有100000个电容式传感器(外层绝缘),传感器采集单元阵列每一点是个金属电极,相当于电容器的阳极,手指放在该阳极上面时,手指的皮肤变成了电容另一极,它们之间的传感面形成了两极间的介电层。A capacitive fingerprint sensor based on a semiconductor process includes a die made of silicon, on the front of which is formed an array of sensor acquisition units, a drive circuit and a readout circuit. There are about 100,000 capacitive sensors (outer insulation) integrated in the sensor acquisition unit array. Each point of the sensor acquisition unit array is a metal electrode, which is equivalent to the anode of the capacitor. When the finger is placed on the anode, the skin of the finger becomes The other pole of the capacitor, the sensing surface between them forms the dielectric layer between the two poles.

电容值随脊(近的)和谷(远的)相对于传感器采集单元阵列的距离而改变。人类的指纹由紧密相邻的凹凸纹路构成,通过对每个像素点上施加标准参考放电电流,便可检测到指纹的纹路状况。The capacitance value varies with the distance of the ridges (near) and valleys (far) relative to the array of sensor acquisition elements. Human fingerprints are composed of closely adjacent concave and convex lines. By applying a standard reference discharge current to each pixel, the condition of the fingerprint lines can be detected.

每个像素预先充电到某一参考电压,然后,由参考电流放电。电容阳极上电压的改变率与其上的电容成下面的比例关系:Each pixel is pre-charged to a certain reference voltage and then discharged by a reference current. The rate of change of the voltage on the anode of the capacitor is proportional to the capacitance on it as follows:

ref=C×dv/dtref=C×dv/dt

处于指纹的凸起下的像素(电容量高)放电较慢,而处于指纹的凹处下的像素(电容量低)放电较快。这种不同的放电率可通过采样保持电路(S/H)检测并转换成一个8位输出,这种检测方法对指纹凸起和低凹具有较高的敏感性,并可形成非常好的原始指纹图像。封装后,传感器单元阵列裸露出来,以供与用户手指接触;或者其上覆盖保护材料与手指接触,从而保护传感器不受物理和环境损伤、磨损等。Pixels under the bumps of the fingerprint (high capacitance) discharge more slowly, while pixels under the depressions of the fingerprint (low capacitance) discharge faster. This different discharge rate can be detected and converted into an 8-bit output by a sample-and-hold circuit (S/H). This detection method has high sensitivity to fingerprint protrusions and depressions, and can form a very good original fingerprint image. After packaging, the sensor unit array is exposed for contact with the user's finger; or it is covered with a protective material for contact with the finger, thereby protecting the sensor from physical and environmental damage, abrasion, and the like.

半导体管芯通常具有在其表面上通过光刻(或其他方式)形成的传感器采集单元阵列。传感器管芯通常相当小,其接触焊盘也相应的小,因而必须采用辅助结构以实现管芯和组件的封装,以实现与印刷电路板(PCB)之间的电气连接。这样的辅助结构包括引线框架和芯片载具等。A semiconductor die typically has an array of sensor acquisition elements formed by photolithography (or other means) on its surface. The sensor die is usually quite small, and its contact pads are correspondingly small, so auxiliary structures must be used to realize the packaging of the die and components for electrical connection to the printed circuit board (PCB). Such auxiliary structures include lead frames and chip carriers, among others.

在常见半导体封装工艺中,管芯附着至引线框架,通过细小的连接导线实现管芯的小尺寸焊盘与大尺寸引线框架之间的互连。通常,管芯、引线框架和连接导线包裹在包封材料中,其通过已经连接了导线的管芯和引线框架放到模具内,向模具内注入包封材料并使包封材料硬化而实现的。In a common semiconductor packaging process, the die is attached to a lead frame, and the interconnection between the small-sized pads of the die and the large-sized lead frame is realized through small connecting wires. Typically, the die, lead frame, and connecting wires are encased in an encapsulation material, which is achieved by placing the die and lead frame already connected to the wires into a mold, injecting the encapsulation material into the mold, and allowing the encapsulation material to harden .

为解决静电击穿对传感器造成的损坏,业界通常采用的一种制备方法是在硅材质管芯表面的非指纹采集区,采用镀金工艺制作一很薄的金材质的金属导电层,再由硅通孔将管芯表明的金属层连接至管芯的静电泄放焊盘上,该静电泄放焊盘再焊接至印制电路板上的系统接地端。当手指靠近传感器,手指上的静电通过传感器表面的金属经上述导电路径泄放到系统地。In order to solve the damage to the sensor caused by electrostatic breakdown, a preparation method commonly used in the industry is to use a gold-plating process to make a very thin gold metal conductive layer on the non-fingerprint collection area on the surface of the silicon core, and then cover it with silicon. The vias connect the metal plane on the die surface to the static drain pad on the die, which is soldered to the system ground on the printed circuit board. When the finger is close to the sensor, the static electricity on the finger is released to the system ground through the metal on the surface of the sensor through the above-mentioned conductive path.

然而,该制备方法的最大难题是镀金工艺,因引入金属元素金和标准的半导体工艺不兼容,可生产可制造性很差,良率很低,生产成本非常高。However, the biggest problem of this preparation method is the gold plating process. Because the introduction of the metal element gold is incompatible with the standard semiconductor process, the manufacturability is poor, the yield is very low, and the production cost is very high.

Robert Henry Bond等人的美国专利US8378508B2中公开了用于指纹传感器等的集成模制管芯和镶条结构,其中,形成有传感器采集单元阵列的管芯以及至少一个导电镶条安装在衬底上。管芯和镶条包覆在一体包封结构内,以保护这些元件不受机械、电和环境损伤,而传感器采集单元阵列和镶条的一部分则露出,或者由保护涂层材料所覆盖。此制备方法需要制作一辅助结构的导电镶条,制作的导电镶条不仅增加额外的成本,还很难在封装工艺中进行机器装配,需要人工将导电镶条粘贴在印制电路板衬底上,大大增加了封装难度。The United States patent US8378508B2 of Robert Henry Bond et al. discloses an integrated molded die and inlay structure for fingerprint sensors and the like, wherein a die formed with an array of sensor acquisition units and at least one conductive inlay are mounted on a substrate . The die and the inlay are encapsulated in an integral encapsulation structure to protect these elements from mechanical, electrical and environmental damage, while part of the sensor acquisition unit array and inlay are exposed or covered by a protective coating material. This preparation method needs to make a conductive strip with an auxiliary structure. The conductive strip not only increases additional costs, but also is difficult to machine assemble in the packaging process, and the conductive strip needs to be manually pasted on the printed circuit board substrate. , greatly increasing the difficulty of packaging.

发明内容Contents of the invention

为了解决上述技术问题,本发明目的在于提供一种具有低成本、封装工艺简单、易规模化生产、具有抗静电功能的半导体电容式指纹传感器的封装结构。In order to solve the above technical problems, the object of the present invention is to provide a packaging structure of a semiconductor capacitive fingerprint sensor with low cost, simple packaging process, easy large-scale production, and antistatic function.

为实现上述目的,本发明的技术方案如下:To achieve the above object, the technical scheme of the present invention is as follows:

一种半导体电容式指纹传感器的封装结构,所述传感器为面状传感器或条状传感器,其包括半导体传感器管芯、由绝缘材料制成的凹槽式基板、连接导线、接插件和注封结构;所述半导体传感器管芯用于采集指纹且具有图像存储单元、图像读取电路单元、管脚以及传感器像素阵列;所述基板凹槽的底部用于承载并通过粘合剂固定所述传感器管芯,其正面、背面或侧面具有多层互连引线和电性连接多层互连引线之间的接触通孔,以及其开槽面上印制有由一条或多条导电金属边条组成的连接焊盘;所述连接导线用于连接所述传感器管芯的管脚和基板的连接焊盘;所述接插件用于凹槽式基板和印制电路板之间的电气连接;其中,所述连接焊盘通过形成于基板正面或背面并且处于其各层中的互连引线和所述接插件的一个或多个接地管脚相连,所述接插件的一个或多个接地管脚和印制电路板的地平面电性相连;所述传感器管芯管脚、基板导电金属边条和连接导线通过注封结构进行封装,所述注封材料填满基板凹槽四周的空隙以使基板和管芯紧密贴合在一起。A packaging structure of a semiconductor capacitive fingerprint sensor, the sensor is a planar sensor or a strip sensor, which includes a semiconductor sensor die, a grooved substrate made of insulating material, a connecting wire, a connector and an injection sealing structure The semiconductor sensor die is used to collect fingerprints and has an image storage unit, an image reading circuit unit, pins and a sensor pixel array; the bottom of the substrate groove is used to carry and fix the sensor tube through an adhesive The core has multilayer interconnection leads on its front, back or sides and contact vias electrically connecting between the multilayer interconnection leads, and its grooved surface is printed with one or more conductive metal edge strips Connecting pads; the connecting wires are used to connect the pins of the sensor die and the connecting pads of the substrate; the connector is used for electrical connection between the grooved substrate and the printed circuit board; wherein, the The connection pads are connected to one or more ground pins of the connector through interconnection leads formed on the front or back of the substrate and in each layer thereof, and the one or more ground pins of the connector are connected to the printed circuit boards. The ground plane of the circuit board is electrically connected; the sensor core pins, the substrate conductive metal edge strips and the connecting wires are packaged through the injection sealing structure, and the injection sealing material fills the gaps around the groove of the substrate so that the substrate and The dies fit tightly together.

优选地,所述传感器像素阵列面与所述凹槽式基板的开槽面平行。Preferably, the sensor pixel array surface is parallel to the grooved surface of the grooved substrate.

优选地,所述传感器管芯由一层或多层的硅基半导体制成;所述传感器管芯表面覆盖有一层保护涂层;所述保护涂层材料为无机材料或有机聚合物材料。Preferably, the sensor die is made of one or more layers of silicon-based semiconductors; the surface of the sensor die is covered with a layer of protective coating; the material of the protective coating is an inorganic material or an organic polymer material.

优选地,所述无机材料为氮化硅、碳化硅、硅酸铝、钛酸钡、钛酸锶、氧化坦或无定形金刚石;所述有机聚合物材料为聚酰亚胺或聚四氟乙烯。Preferably, the inorganic material is silicon nitride, silicon carbide, aluminum silicate, barium titanate, strontium titanate, titanium oxide or amorphous diamond; the organic polymer material is polyimide or polytetrafluoroethylene .

优选地,所述接插件设置在所述凹槽式基板的背面,用于将所述基板和印制电路板之间进行电气连接。Preferably, the connector is arranged on the back of the recessed substrate for electrical connection between the substrate and the printed circuit board.

优选地,所述凹槽式基板的材料为树脂、塑料或陶瓷;所述注封结构的材料为环氧树脂或塑料等绝缘材料;所述注封结构是通过注胶技术、注模技术或集成电路模制技术之一形成。Preferably, the material of the recessed substrate is resin, plastic or ceramics; the material of the injection sealing structure is insulating materials such as epoxy resin or plastic; the injection sealing structure is made by injection technology, injection molding technology or One of the integrated circuit molding techniques is formed.

优选地,所述连接导线采用几十微米直径的金属材质铝或金制成;通过所述连接导线将管芯正面较窄一侧的管脚电性连接至所述基板正面其中一侧或两侧开槽面的连接焊盘。Preferably, the connecting wires are made of metal aluminum or gold with a diameter of tens of microns; the pins on the narrower side of the front side of the die are electrically connected to one or both sides of the front side of the substrate through the connecting wires. Connection pads on the side slotted side.

优选地,所述基板为长方形,用于承载面状传感器管芯;所述长方形基板凹槽长宽尺寸大于面状传感器管芯的长宽尺寸,开槽深度高于面状传感器管芯的高度,并通过所述连接导线将管芯正面较窄一侧的管脚电气连接至基板正面其中两侧开槽面的连接焊盘。Preferably, the substrate is rectangular and is used to carry the planar sensor die; the length and width of the groove of the rectangular substrate are greater than the length and width of the planar sensor die, and the groove depth is higher than the height of the planar sensor die , and electrically connect the pins on the narrower side of the front side of the die to the connection pads on the slotted sides on both sides of the front side of the substrate through the connecting wires.

优选地,所述基板为条状,用于承载条状传感器管芯;所述条状基板凹槽长宽尺寸大于条状传感器管芯的长宽尺寸,开槽的深度高于条状传感器管芯的高度,并通过所述连接导线将管芯正面较窄两侧的管脚电气连接至基板正面其中两侧开槽面的连接焊盘。Preferably, the substrate is strip-shaped, and is used to carry the strip sensor tube core; the length and width of the strip-shaped substrate groove are greater than the length and width dimensions of the strip sensor tube core, and the depth of the groove is higher than that of the strip sensor tube. The height of the core, and the pins on the narrower sides of the front side of the tube core are electrically connected to the connection pads on the slotted sides on both sides of the front side of the substrate through the connecting wires.

优选地,所述接插件为连接盘栅格阵列或球栅阵列,由所述金属边条组成的连接焊盘通过形成于基板正面或背面且处于其各层中的互连引线和连接盘栅格阵列或球栅阵列的一个或多个接地管脚相连,所述连接盘栅格阵列或球栅阵列用于基板和印制电路板之间的电气连接,所述连接盘栅格阵列或球栅阵列的一个或多个接地管脚和印制电路板的地平面相连接。。Preferably, the connector is a land grid array or a ball grid array, and the connection pads composed of the metal edge strips pass through the interconnection leads and the land grids formed on the front or back of the substrate and in each layer thereof. One or more ground pins of a land grid array or ball grid array used for electrical connection between the substrate and the printed circuit board, the land grid array or ball grid array One or more ground pins of the grid array are connected to the ground plane of the printed circuit board. .

从上述技术方案可以看出,本发明提供的半导体电容式指纹传感器的封装结构,其通过采用将半导体电容式指纹传感器管芯的基板嵌入且印制于基板上的一个或多个金属边条组件中的结构,不仅具有低成本、封装工艺简单、易规模化生产,同时还具有抗静电功能。It can be seen from the above technical solutions that the packaging structure of the semiconductor capacitive fingerprint sensor provided by the present invention adopts one or more metal side strip components that embed the substrate of the semiconductor capacitive fingerprint sensor die and print on the substrate. The structure in the invention not only has low cost, simple packaging process, easy large-scale production, but also has antistatic function.

附图说明Description of drawings

图1所示为本发明半导体电容式指纹传感器的封装结构第一实施例的结构示意图,其中,该封装结构中包括面状指纹传感器组件;FIG. 1 is a schematic structural view of the first embodiment of the packaging structure of the semiconductor capacitive fingerprint sensor of the present invention, wherein the packaging structure includes a planar fingerprint sensor assembly;

图2所示为本发明半导体电容式指纹传感器的封装结构第一实施例的结构局部剖视图;Fig. 2 shows the structural partial sectional view of the first embodiment of the packaging structure of the semiconductor capacitive fingerprint sensor of the present invention;

图3所示为本发明半导体电容式指纹传感器的封装结构第一实施例的结构正剖面示意图;FIG. 3 is a frontal cross-sectional schematic view of the first embodiment of the package structure of the semiconductor capacitive fingerprint sensor of the present invention;

图4所示为本发明半导体电容式指纹传感器的封装结构第一实施例的结构侧剖面示意图;FIG. 4 is a schematic side cross-sectional view of the first embodiment of the packaging structure of the semiconductor capacitive fingerprint sensor of the present invention;

图5所示为本发明半导体电容式指纹传感器的封装结构第二实施例的结构示意图,其中,该封装结构中包括条状指纹传感器组件;FIG. 5 is a schematic structural view of the second embodiment of the package structure of the semiconductor capacitive fingerprint sensor of the present invention, wherein the package structure includes a strip fingerprint sensor component;

图6所示为本发明半导体电容式指纹传感器的封装结构第一实施例的结构正剖面示意图Fig. 6 shows the front cross-sectional schematic view of the first embodiment of the package structure of the semiconductor capacitive fingerprint sensor of the present invention

图7所示为本发明第二实施例条状传感器组件的具有栅格阵列连接盘的背面示意图Fig. 7 is a schematic diagram of the rear surface of the strip sensor assembly with grid array lands according to the second embodiment of the present invention

图8所示为本发明第二实施例条状传感器组件的具有球栅阵列的背面示意图Fig. 8 is a schematic diagram of the rear surface of the strip sensor assembly with a ball grid array according to the second embodiment of the present invention

图9所示为本发明第二实施例条状传感器组件的具有球栅阵列的侧面示意图Fig. 9 is a schematic side view of a strip sensor assembly with a ball grid array according to the second embodiment of the present invention

【图中符号说明】[Description of symbols in the figure]

100、面状传感器组件100. Surface sensor components

101、长方形基板101. Rectangular substrate

101a、长方形基板的凹槽101a, the groove of the rectangular substrate

102、半导体面状传感器管芯102. Semiconductor planar sensor die

102a、半导体面状传感器管芯正面的传感器像素阵列102a, the sensor pixel array on the front side of the semiconductor planar sensor die

102b、半导体面状传感器管芯正面一侧的管脚102b, pins on the front side of the semiconductor planar sensor die

103、印制于长方形基板上的金属边条103. Metal edge strips printed on rectangular substrates

104、印制于长方形基板其中一侧开槽面的连接焊盘104. The connection pads printed on the grooved surface on one side of the rectangular substrate

105、接插件105. Connector

200、条状传感器组件200. Strip sensor assembly

201、条状形基板201. Strip substrate

201a、条状形基板的凹槽201a, the groove of the strip-shaped substrate

202、半导体条状传感器管芯202. Semiconductor strip sensor die

202a、半导体条状传感器管芯正面的传感器像素阵列202a, the sensor pixel array on the front side of the semiconductor strip sensor die

202b、半导体条状传感器管芯正面两侧的管脚202b. Pins on both sides of the front side of the semiconductor strip sensor die

203、印制于条状形基板上的金属边条203. Metal edge strips printed on strip-shaped substrates

204、印制于条状形基板正面两侧开槽面的连接焊盘204. The connection pads printed on the grooved surfaces on both sides of the front side of the strip-shaped substrate

205、连接盘栅格阵列205. Land grid array

206、球栅阵列206. Ball grid array

300、手指300. finger

301、连接导线301, connecting wire

302、注封结构302. Injection sealing structure

303、保护涂层303. Protective coating

具体实施方式Detailed ways

通过结合附图详细描述示范性实施例,本发明的上述特点和优点将变得更加明显,在附图中,在各个附图之间采用类似的附图标记表示类似的元件。所述附图只是示范性的而不是按比例绘制的。The above-mentioned features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments with reference to the accompanying drawings, in which like reference numerals are used to designate like elements among the various drawings. The drawings described are merely exemplary and not drawn to scale.

需要说明的是,本发明半导体电容式指纹传感器的封装结构,其通过将半导体电容式指纹传感器管芯嵌入凹槽式基板的凹槽中,并通过印制于基板上的一个或多个金属边条组件,将传感器管芯和外部接插件电连接,最后封装成一体的传感器管芯产品结构。本发明的传感器封装结构可以适用于封装电容式指纹传感器面状传感器或电容式指纹传感器条状传感器。下面结合附图1至4,对本发明电容式指纹传感器面状传感器的第一实施方式作进一步的详细说明,结合附图5至9,对本发明电容式指纹传感器条状传感器的第二实施方式作进一步的详细说明。It should be noted that the packaging structure of the semiconductor capacitive fingerprint sensor of the present invention is achieved by embedding the die of the semiconductor capacitive fingerprint sensor in the groove of the grooved substrate, and by printing one or more metal edges on the substrate. The sensor die is electrically connected to the external connector, and finally packaged into an integrated sensor die product structure. The sensor packaging structure of the present invention can be suitable for packaging capacitive fingerprint sensor planar sensors or capacitive fingerprint sensor strip sensors. Below in conjunction with accompanying drawing 1 to 4, the first embodiment of capacitive fingerprint sensor area sensor of the present invention is described in further detail, in conjunction with accompanying drawing 5 to 9, the second embodiment of capacitive fingerprint sensor strip sensor of the present invention is described Further details.

【实施例一】[Example 1]

请参阅图1至图4,其中,图1所示为本发明半导体电容式指纹传感器的封装结构第一实施例的结构示意图,其中,该封装结构中包括面状指纹传感器组件100。如图所示,面状传感器组件100主要包括长方形基板101和面状传感器管芯102,该凹槽式基板101的正面开有凹槽101a,其凹槽101a的长宽尺寸略大于面状传感器管芯102,凹槽101a的开槽深度略高于面状传感器管芯102的高度。在本实施例中,该封装结构可以将传感器管芯102嵌入到基板凹槽101a底部的面状传感器管芯102固定区域,并使面状传感器管芯102的正面在水平面上略低于基板101的开槽面。长方形基板101可以采用本领域所公知的树脂、塑料或陶瓷等绝缘材料制成,其可以具有从正面、背面或侧面将处于其各层中的互连引线(图未示)。Please refer to FIG. 1 to FIG. 4 , wherein FIG. 1 is a schematic structural diagram of a first embodiment of a packaging structure of a semiconductor capacitive fingerprint sensor according to the present invention, wherein the packaging structure includes a planar fingerprint sensor assembly 100 . As shown in the figure, the planar sensor assembly 100 mainly includes a rectangular substrate 101 and a planar sensor die 102. A groove 101a is opened on the front side of the grooved substrate 101, and the length and width of the groove 101a are slightly larger than that of the planar sensor. In the die 102 , the depth of the groove 101 a is slightly higher than the height of the planar sensor die 102 . In this embodiment, the packaging structure can embed the sensor die 102 into the fixed area of the planar sensor die 102 at the bottom of the substrate groove 101a, and make the front surface of the planar sensor die 102 slightly lower than the substrate 101 on the horizontal plane. slotted surface. The rectangular substrate 101 can be made of insulating materials such as resin, plastic or ceramics known in the art, and it can have interconnection leads (not shown) in each layer from the front, back or sides.

面状传感器管芯102通常是具有形成于一层或多层的硅基半导体,在这些层中可以分别布设包括如晶体管、电容、电阻和互连线等集成电路器件,该集成电路器件通常可以通过光刻或者其他半导体制造工艺形成。The planar sensor die 102 usually has a silicon-based semiconductor formed in one or more layers, and integrated circuit devices including transistors, capacitors, resistors, and interconnections can be arranged in these layers, and the integrated circuit devices can usually be Formed by photolithography or other semiconductor manufacturing processes.

具体而言,面状传感器管芯102具有形成于其上的图像存储单元(图未示)、图像读取电路(图未示)和传感器像素的二维阵列102a。通过面状传感器管芯102的背面和基板凹槽101a的底部之间的粘合剂,面状传感器管芯102可以物理连接至基板凹槽101a。面状传感器管芯102的正面通常为长方形,连接导线301可以将面状传感器管芯102正面较窄一侧的管脚(PAD)102b电气连接至基板101正面其中一侧开槽面的连接焊盘104,连接导线301可以采用几十微米直径的铝或金等金属材质。Specifically, the areal sensor die 102 has an image storage unit (not shown), an image reading circuit (not shown) and a two-dimensional array 102 a of sensor pixels formed thereon. The areal sensor die 102 may be physically connected to the substrate recess 101a through an adhesive between the backside of the areal sensor die 102 and the bottom of the substrate recess 101a. The front side of the planar sensor die 102 is generally rectangular, and the connecting wire 301 can electrically connect the pin (PAD) 102b on the narrower side of the front side of the planar sensor die 102 to the connecting solder on one side of the slotted surface on the front side of the substrate 101. The plate 104 and the connecting wire 301 can be made of metal materials such as aluminum or gold with a diameter of tens of microns.

基板101的开槽面印制有一条或多条金属边条103,这些金属边条103采用导电的铜、铝或金等金属材质制成。金属边条103通过形成于基板101正面或背面并且有可能处于其各层中的互连引线(图未示)和基板101背面的接插件105的一个或多个接地管脚相连(图未示)。One or more metal edge strips 103 are printed on the grooved surface of the substrate 101, and these metal edge strips 103 are made of conductive copper, aluminum or gold and other metal materials. The metal edge strip 103 is connected to one or more grounding pins (not shown) of the connector 105 on the back of the substrate 101 through an interconnection lead (not shown) formed on the front or back of the substrate 101 and possibly in each layer thereof. ).

接插件105用于基板101和印制电路板之间的电气连接,接插件105的一个或多个接地管脚和印制电路板的地平面相连接,由此形成ESD静电泄放通路。例如,当手指300按压面状传感器管芯102正面的二维像素阵列102a的时候,因面状传感器管芯102在水平面上略低于基板101的开槽面,手指300会首先接触基板101的开槽面印制的一条或多条导电金属边条103,其携带的静电会通过上述ESD静电泄放通路泄放到地,有效避免静电对硅材质的传感器管芯102造成严重损害。The connector 105 is used for electrical connection between the substrate 101 and the printed circuit board, and one or more grounding pins of the connector 105 are connected to the ground plane of the printed circuit board, thereby forming an ESD discharge path. For example, when the finger 300 presses the two-dimensional pixel array 102a on the front of the planar sensor die 102, because the planar sensor die 102 is slightly lower than the grooved surface of the substrate 101 on the horizontal plane, the finger 300 will first touch the surface of the substrate 101. The static electricity carried by one or more conductive metal strips 103 printed on the grooved surface will be released to the ground through the above-mentioned ESD static electricity discharge path, so as to effectively prevent the static electricity from causing serious damage to the silicon sensor die 102 .

面状传感器管芯102正面较窄一侧的管脚102b和基板101正面其中一侧开槽面的连接焊盘104以及连接导线301都包裹在注封结构302内,使面状传感器管芯102的正面(尤其是传感器像素阵列102a部分)裸露出来。The pins 102b on the narrower side of the front side of the planar sensor die 102 and the connection pads 104 on the grooved side of the front side of the substrate 101 and the connecting wires 301 are all wrapped in the injection sealing structure 302, so that the planar sensor die 102 The front side (especially the part of the sensor pixel array 102a) is exposed.

面状传感器在管芯102的正面上覆盖有一层保护涂层303,该保护涂层303材料可以采用无机材料涂层;例如,氮化硅、碳化硅、硅酸铝或无定形金刚石,这样可以使与手指接触的表面大大增强耐磨性,尤其对于研磨颗粒。The planar sensor is covered with a layer of protective coating 303 on the front surface of the die 102, and the material of the protective coating 303 can be coated with an inorganic material; for example, silicon nitride, silicon carbide, aluminum silicate or amorphous diamond, which can The surface in contact with the fingers greatly enhances wear resistance, especially for abrasive particles.

当然,保护涂层303材料也可以采用其他有机聚合物材料,例如,聚酰亚胺(Polyimide(KaptonTM))或聚四氟乙烯(PTFF(TeflonTM)),这样可以使与手指接触的表面具有很好的疏水性、耐腐蚀、耐酸碱、耐磨等优良特性。Certainly, protective coating 303 material also can adopt other organic polymer materials, for example, polyimide (Polyimide (KaptonTM)) or polytetrafluoroethylene (PTFF (TeflonTM)), can make the surface that contacts with finger have very good like this. Good hydrophobicity, corrosion resistance, acid and alkali resistance, wear resistance and other excellent characteristics.

形成注封结构302的材料可以是本领域所公知的环氧树脂或塑料等绝缘材料。注封可以通过注胶或注模技术实现,也可采用本领域已知的各种集成电路模制技术之一来形成注封结构302。注封结构302包裹住管芯102的管脚102b、基板101的连接焊盘104、连接导线301,并使注封材料填满基板凹槽101a四周的空隙使得基板101和面状传感器管芯102紧密贴合在一起。注封结构302可保护面状传感器管芯102的管脚102b、基板101的焊盘104和连接导线301不受机械、电和环境损伤。The material forming the potting structure 302 may be an insulating material such as epoxy resin or plastic known in the art. The encapsulation can be realized by glue injection or injection molding technology, and one of various integrated circuit molding techniques known in the art can also be used to form the encapsulation structure 302 . The injection molding structure 302 wraps the pin 102b of the die 102, the connection pad 104 of the substrate 101, and the connection wire 301, and makes the injection molding material fill the space around the substrate groove 101a so that the substrate 101 and the planar sensor die 102 fit snugly together. The potting structure 302 can protect the pins 102b of the planar sensor die 102, the pads 104 of the substrate 101 and the connecting wires 301 from mechanical, electrical and environmental damage.

基板101的背面设有接插件105,用于将基板101和印制电路板之间进行电气连接,作为最终装置构造的一部分的其他部件安装组件的背面互连,从而允许传感器组件100在另一电系统内的电互连。由此获得了完整的基于基板嵌入以及印制于基板上的一个或多个金属边条结构和传感器管芯的用于指纹采集的面状传感器组件100。The back of the substrate 101 is provided with a connector 105 for electrically connecting the substrate 101 and the printed circuit board, interconnecting the back of other parts mounted components as part of the final device construction, thereby allowing the sensor assembly 100 to be mounted on another Electrical interconnections within electrical systems. In this way, a complete planar sensor assembly 100 for fingerprint collection based on one or more metal edge structures and sensor dies embedded in the substrate and printed on the substrate is obtained.

【实施例二】[Example 2]

请参图5至图9,其中,图5所示为本发明半导体电容式指纹传感器的封装结构第二实施例的结构示意图,其中,该封装结构中包括条状指纹传感器组件200。条状指纹传感器组件200主要包括该凹槽式条状基板201和条状传感器管芯202,具有形成于其正面或背面并且有可能处于其各层中的互连引线(画未示),该凹槽式条状基板201的正面开有凹槽201a,其凹槽201a长宽尺寸略大于条状传感器管芯202,凹槽201a的开槽深度略高于管芯202的高度。在本实施例中,条状传感器管芯202嵌入到基板凹槽201a底部的条状传感器管芯202固定区域,并使条状传感器管芯202的正面在水平面上略低于基板201的开槽面。条状基板201可以采用本领域所公知的树脂、塑料或陶瓷等绝缘材料制成,其可以从正面、背面或侧面将处于其各层中的互连引线(画未示)。Please refer to FIG. 5 to FIG. 9 , wherein FIG. 5 is a schematic structural diagram of a second embodiment of the package structure of the semiconductor capacitive fingerprint sensor of the present invention, wherein the package structure includes a strip-shaped fingerprint sensor assembly 200 . The strip fingerprint sensor assembly 200 mainly includes the grooved strip substrate 201 and the strip sensor die 202, with interconnection leads (not shown) formed on its front or back and possibly in each layer thereof, the A groove 201 a is formed on the front of the grooved strip substrate 201 . The length and width of the groove 201 a are slightly larger than the strip sensor die 202 , and the groove depth of the groove 201 a is slightly higher than the height of the die 202 . In this embodiment, the strip-shaped sensor die 202 is embedded in the strip-shaped sensor die 202 fixing area at the bottom of the substrate groove 201a, and the front surface of the strip-shaped sensor die 202 is slightly lower than the groove of the substrate 201 on the horizontal plane. noodle. The strip substrate 201 can be made of insulating materials such as resin, plastic or ceramics known in the art, and it can lead the interconnections in its layers from the front, back or side (not shown).

条状传感器管芯202通常是具有形成于一层或多层的硅基半导体,在这些层中可以分别布设包括如晶体管、电容、电阻和互连线等集成电路器件,该集成电路器件通常可以通过光刻或者其他半导体制造工艺形成。The strip sensor die 202 usually has a silicon-based semiconductor formed in one or more layers, and integrated circuit devices such as transistors, capacitors, resistors, and interconnections can be arranged in these layers, and the integrated circuit devices can usually be Formed by photolithography or other semiconductor manufacturing processes.

具体而言,条状传感器管芯202具有形成于其上的图像存储单元(图未示)、图像读取电路(图未示)和传感器像素的二维阵列202a。通过管芯202的背面和基板凹槽201a的底部之间的粘合剂,管芯202物理连接至基板凹槽201a。连接导线301可以将管芯202正面较窄两侧的管脚202b电气连接至基板201正面其中两侧开槽面的连接焊盘204,连接导线301采用几十微米直径的铝或金等金属材质。Specifically, the strip sensor die 202 has an image storage unit (not shown), an image reading circuit (not shown) and a two-dimensional array 202 a of sensor pixels formed thereon. Die 202 is physically connected to substrate recess 201a by an adhesive between the backside of die 202 and the bottom of substrate recess 201a. The connecting wire 301 can electrically connect the pins 202b on the narrower sides of the front of the die 202 to the connecting pads 204 on the grooved surface on both sides of the front of the substrate 201, and the connecting wire 301 is made of metal materials such as aluminum or gold with a diameter of tens of microns. .

基板201的开槽面印制有一条或多条金属边条203,这些金属边条203采用导电的铜、铝或金等金属材质制成。金属边条203通过形成于基板201正面或背面并且有可能处于其各层中的互连引线(图未示)和基板201背面长条型两侧均匀分布有连接盘栅格阵列205或球栅阵列206的一个或多个接地管脚相连(图未示),连接盘栅格阵列205或球栅阵列206用于基板201和印制电路板之间的电气连接,连接盘栅格阵列205或球栅阵列206的一个或多个接地管脚和印制电路板的地平面相连接,由此形成ESD静电泄放通路。One or more metal edge strips 203 are printed on the grooved surface of the substrate 201, and these metal edge strips 203 are made of conductive copper, aluminum or gold and other metal materials. The metal edge strip 203 passes through the interconnection leads (not shown) formed on the front or back of the substrate 201 and may be in each layer, and the back side of the substrate 201 is strip-shaped and evenly distributed on both sides of the land grid array 205 or ball grid. One or more ground pins of the array 206 are connected (not shown), the land grid array 205 or the ball grid array 206 is used for the electrical connection between the substrate 201 and the printed circuit board, and the land grid array 205 or One or more ground pins of the BGA 206 are connected to the ground plane of the printed circuit board, thereby forming an ESD discharge path.

例如,当手指300滑过条状传感器管芯202正面的二维像素阵列202a的时候,因管芯202在水平面上略低于基板201的开槽面,手指300会首先接触基板201的开槽面印制的一条或多条导电金属边条203,其携带的静电会通过上述ESD静电泄放通路泄放到地,有效避免静电对硅材质的传感器管芯202造成严重损害。For example, when the finger 300 slides over the two-dimensional pixel array 202a on the front side of the strip sensor die 202, because the die 202 is slightly lower than the grooved surface of the substrate 201 on the horizontal plane, the finger 300 will first touch the groove of the substrate 201 One or more conductive metal strips 203 printed on the surface, the static electricity carried by it will be released to the ground through the above-mentioned ESD static electricity discharge path, effectively preventing the static electricity from causing serious damage to the sensor die 202 made of silicon.

管芯202正面较窄两侧的管脚202b和基板201正面其中两侧开槽面的连接焊盘204以及连接导线301都包裹在注封结构302内,使管芯202的正面(尤其是传感器像素阵列202a)裸露出来。The pins 202b on the narrower sides of the front side of the die 202 and the connection pads 204 on both sides of the front side of the substrate 201 and the connecting wires 301 are all wrapped in the injection sealing structure 302, so that the front side of the die 202 (especially the sensor) Pixel array 202a) is exposed.

条状传感器在管芯202的正面上覆盖有一层保护涂层303,保护涂层303材料可以用无机涂层;例如,氮化硅、碳化硅、硅酸铝或无定形金刚石,这样可以使与手指接触的表面大大增强耐磨性,尤其对于研磨颗粒。The strip sensor is covered with a layer of protective coating 303 on the front side of the die 202. The material of the protective coating 303 can be an inorganic coating; for example, silicon nitride, silicon carbide, aluminum silicate or amorphous diamond, which can make it compatible with The finger contact surface greatly enhances wear resistance, especially for abrasive particles.

当然,保护涂层303材料也可以采用其他有机聚合物材料,例如,聚酰亚胺(Polyimide(KaptonTM))或聚四氟乙烯(PTFF(TeflonTM)),这样可以使与手指接触的表面具有很好的疏水性、耐腐蚀、耐酸碱、耐磨等优良特性。Certainly, protective coating 303 material also can adopt other organic polymer materials, for example, polyimide (Polyimide (KaptonTM)) or polytetrafluoroethylene (PTFF (TeflonTM)), can make the surface that contacts with finger have very good like this. Good hydrophobicity, corrosion resistance, acid and alkali resistance, wear resistance and other excellent characteristics.

形成注封结构302的材料可以是本领域所公知的环氧树脂或塑料等绝缘材料。注封可以通过注胶或注模技术实现,也可采用本领域已知的各种集成电路模制技术之一来形成注封结构302。注封结构302包裹住管芯202的管脚202b、基板201的连接焊盘204、连接导线301,并使注封材料填满基板凹槽201a四周的空隙使得基板201和管芯202紧密贴合在一起。注封结构302可保护管芯202的管脚202b、基板201的焊盘204和连接导线301不受机械、电和环境损伤。The material forming the potting structure 302 may be an insulating material such as epoxy resin or plastic known in the art. The encapsulation can be realized by glue injection or injection molding technology, and one of various integrated circuit molding techniques known in the art can also be used to form the encapsulation structure 302 . The injection molding structure 302 wraps the pin 202b of the die 202, the connection pad 204 of the substrate 201, and the connection wire 301, and makes the injection molding material fill the space around the groove 201a of the substrate so that the substrate 201 and the die 202 are closely attached. together. The potting structure 302 can protect the pins 202 b of the die 202 , the pads 204 of the substrate 201 and the connecting wires 301 from mechanical, electrical and environmental damage.

基板201的背面长条型两侧均匀分布有连接盘栅格阵列205或球栅阵列206,用于将基板201和印制电路板之间进行电气连接,作为最终装置构造的一部分的其他部件安装组件的背面互连,从而允许传感器组件200在另一电系统内的电互连。由此获得了完整的基于基板嵌入以及印制于基板上的一个或多个金属边条结构和传感器管芯的用于指纹采集的条状传感器组件200。Land grid arrays 205 or ball grid arrays 206 are evenly distributed on both sides of the back side of the substrate 201 in a strip shape, for electrically connecting the substrate 201 and the printed circuit board, and installing other components as a part of the final device structure The backside of the assembly is interconnected, allowing electrical interconnection of the sensor assembly 200 within another electrical system. Thus, a complete strip-shaped sensor assembly 200 for fingerprint collection based on one or more metal edge strip structures and sensor dies embedded in and printed on the substrate is obtained.

以上所述的仅为本发明的优选实施例,所述实施例并非用以限制本发明的专利保护范围,因此凡是运用本发明的说明书及附图内容所作的等同结构变化,同理均应包含在本发明的保护范围内。The above are only preferred embodiments of the present invention, and the embodiments are not intended to limit the scope of patent protection of the present invention. Therefore, all equivalent structural changes made by using the description and accompanying drawings of the present invention should be included in the same way. Within the protection scope of the present invention.

Claims (10)

1.一种半导体电容式指纹传感器的封装结构,所述传感器为面状传感器或条状传感器,其特征在于,包括:1. A packaging structure of a semiconductor capacitive fingerprint sensor, wherein the sensor is a planar sensor or a strip sensor, characterized in that it comprises: 半导体传感器管芯,用于采集指纹且具有图像存储单元、图像读取电路单元、管脚以及传感器像素阵列;A semiconductor sensor die for collecting fingerprints and having an image storage unit, an image reading circuit unit, pins and a sensor pixel array; 由绝缘材料制成的凹槽式基板,其凹槽的底部用于承载并通过粘合剂固定所述传感器管芯,其正面、背面或侧面具有多层互连引线和电性连接多层互连引线之间的接触通孔,以及其开槽面上印制有由一条或多条导电金属边条组成的连接焊盘;A grooved substrate made of insulating material, the bottom of the groove is used to carry and fix the sensor die by adhesive, and the front, back or side has multilayer interconnection leads and electrical connection multilayer interconnections. The contact through hole between the leads and the connection pad composed of one or more conductive metal strips are printed on the grooved surface; 连接导线,用于连接所述传感器管芯的管脚和基板的连接焊盘;connecting wires for connecting the pins of the sensor die and the connecting pads of the substrate; 接插件,用于凹槽式基板和印制电路板之间的电气连接;Connectors for electrical connection between recessed substrates and printed circuit boards; 其中,所述连接焊盘通过形成于基板正面或背面并且处于其各层中的互连引线和所述接插件的一个或多个接地管脚相连,所述接插件的一个或多个接地管脚和印制电路板的地平面电性相连;所述传感器管芯管脚、基板导电金属边条和连接导线通过注封结构进行封装,所述注封材料填满基板凹槽四周的空隙以使基板和管芯紧密贴合在一起。Wherein, the connection pad is connected to one or more grounding pins of the connector through interconnection leads formed on the front or back of the substrate and in each layer thereof, and the one or more grounding pins of the connector are The feet are electrically connected to the ground plane of the printed circuit board; the sensor core pins, the substrate conductive metal side strips and the connecting wires are packaged through the injection sealing structure, and the injection sealing material fills the gaps around the groove of the substrate to Make the substrate and die fit tightly together. 2.根据权利要求1所述半导体电容式指纹传感器的封装结构,其特征在于,所述传感器像素阵列面与所述凹槽式基板的开槽面平行。2 . The packaging structure of the semiconductor capacitive fingerprint sensor according to claim 1 , wherein the pixel array surface of the sensor is parallel to the grooved surface of the grooved substrate. 3 . 3.根据权利要求1所述的半导体电容式指纹传感器的封装结构,其特征在于,所述传感器管芯由一层或多层的硅基半导体制成;所述传感器管芯表面覆盖有一层保护涂层;所述保护涂层材料为无机材料或有机聚合物材料。3. The packaging structure of the semiconductor capacitive fingerprint sensor according to claim 1, wherein the sensor die is made of one or more layers of silicon-based semiconductors; the surface of the sensor die is covered with a layer of protection Coating; the protective coating material is an inorganic material or an organic polymer material. 4.根据权利要求3所述的半导体电容式指纹传感器的封装结构,其特征在于,所述无机材料为氮化硅、碳化硅、硅酸铝、钛酸钡、钛酸锶、氧化坦或无定形金刚石;所述有机聚合物材料为聚酰亚胺或聚四氟乙烯。4. The encapsulation structure of the semiconductor capacitive fingerprint sensor according to claim 3, wherein the inorganic material is silicon nitride, silicon carbide, aluminum silicate, barium titanate, strontium titanate, titanium oxide or inorganic material. Shaped diamond; the organic polymer material is polyimide or polytetrafluoroethylene. 5.根据权利要求1所述的半导体电容式指纹传感器的封装结构,其特征在于,所述接插件设置在所述凹槽式基板的背面,用于将所述基板和印制电路板之间进行电气连接。5. The packaging structure of the semiconductor capacitive fingerprint sensor according to claim 1, wherein the connector is arranged on the back side of the grooved substrate for connecting the substrate and the printed circuit board. Make electrical connections. 6.根据权利要求1所述的半导体电容式指纹传感器的封装结构,其特征在于,所述凹槽式基板的材料为树脂、塑料或陶瓷;所述注封结构的材料为环氧树脂或塑料等绝缘材料;所述注封结构是通过注胶技术、注模技术或集成电路模制技术之一形成。6. The packaging structure of the semiconductor capacitive fingerprint sensor according to claim 1, wherein the material of the recessed substrate is resin, plastic or pottery; the material of the injection sealing structure is epoxy resin or plastic and other insulating materials; the injection sealing structure is formed by one of glue injection technology, injection molding technology or integrated circuit molding technology. 7.根据权利要求1所述的半导体电容式指纹传感器的封装结构,其特征在于,所述连接导线采用几十微米直径的金属材质铝或金制成;通过所述连接导线将管芯正面较窄一侧的管脚电性连接至所述基板正面其中一侧或两侧开槽面的连接焊盘。7. The packaging structure of the semiconductor capacitive fingerprint sensor according to claim 1, wherein the connecting wire is made of metal material aluminum or gold with a diameter of tens of microns; The pins on the narrow side are electrically connected to the connection pads on one or both sides of the front surface of the substrate. 8.根据权利要求1-7任意一个所述半导体电容式指纹传感器的封装结构,其特征在于,所述基板为长方形,用于承载面状传感器管芯;所述长方形基板凹槽长宽尺寸大于面状传感器管芯的长宽尺寸,开槽深度高于面状传感器管芯的高度,并通过所述连接导线将管芯正面较窄一侧的管脚电气连接至基板正面其中两侧开槽面的连接焊盘。8. According to the packaging structure of any one of the semiconductor capacitive fingerprint sensors of claims 1-7, it is characterized in that the substrate is rectangular and is used to carry a planar sensor die; the length and width of the groove of the rectangular substrate are larger than The length and width dimensions of the planar sensor die, the depth of the slot is higher than the height of the planar sensor die, and the pins on the narrower side of the front of the die are electrically connected to the front of the substrate through the connecting wires, with slots on both sides Surface connection pads. 9.根据权利要求1-7任意一个所述的半导体电容式指纹传感器的封装结构,其特征在于,所述基板为条状,用于承载条状传感器管芯;所述条状基板凹槽长宽尺寸大于条状传感器管芯的长宽尺寸,开槽的深度高于条状传感器管芯的高度,并通过所述连接导线将管芯正面较窄两侧的管脚电气连接至基板正面其中两侧开槽面的连接焊盘。9. according to the package structure of semiconductor capacitive fingerprint sensor described in any one of claim 1-7, it is characterized in that, described substrate is strip-shaped, is used to carry strip-shaped sensor tube core; Described strip-shaped substrate groove is long The width dimension is greater than the length and width of the strip sensor die, the depth of the groove is higher than the height of the strip sensor die, and the pins on the narrower sides of the front of the die are electrically connected to the front of the substrate through the connecting wires. Connection pads on slotted sides on both sides. 10.根据权利要求9所述的半导体电容式指纹传感器的封装结构,其特征在于,所述接插件为连接盘栅格阵列或球栅阵列,由所述金属边条组成的连接焊盘通过形成于基板正面或背面且处于其各层中的互连引线和连接盘栅格阵列或球栅阵列的一个或多个接地管脚相连,所述连接盘栅格阵列或球栅阵列用于基板和印制电路板之间的电气连接,所述连接盘栅格阵列或球栅阵列的一个或多个接地管脚和印制电路板的地平面相连接。10. The packaging structure of the semiconductor capacitive fingerprint sensor according to claim 9, wherein the connector is a land grid array or a ball grid array, and the connection pads formed by the metal edge strips are formed by Interconnect leads on the front or back of the substrate and in layers thereof are connected to one or more ground pins of a land grid array or ball grid array for the substrate and An electrical connection between printed circuit boards, wherein one or more ground pins of the land grid array or ball grid array are connected to the ground plane of the printed circuit board.
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Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104036265A (en) * 2014-07-02 2014-09-10 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor and electronic device
CN104036264A (en) * 2014-07-02 2014-09-10 南昌欧菲生物识别技术有限公司 Method for manufacturing fingerprint recognition sensor, fingerprint recognition sensor and electronic device
CN104036263A (en) * 2014-07-02 2014-09-10 南昌欧菲生物识别技术有限公司 Fingerprint recognition detection device, terminal device and fingerprint recognition method
CN104050466A (en) * 2014-07-02 2014-09-17 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor, integration assembly and electronic device
CN104050465A (en) * 2014-07-02 2014-09-17 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor and electronic device
CN104050485A (en) * 2014-07-02 2014-09-17 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor, fingerprint recognition detection assembly and terminal equipment
CN104050464A (en) * 2014-07-02 2014-09-17 南昌欧菲生物识别技术有限公司 Method for manufacturing fingerprint recognition sensor, fingerprint recognition sensor and electronic device
CN104051366A (en) * 2014-07-01 2014-09-17 苏州晶方半导体科技股份有限公司 Packaging structure and packaging method for fingerprint recognition chip
CN104063693A (en) * 2014-07-02 2014-09-24 南昌欧菲生物识别技术有限公司 Fingerprint identification detection assembly and terminal device containing same
CN104077572A (en) * 2014-07-02 2014-10-01 南昌欧菲生物识别技术有限公司 Fingerprint recognition detection assembly and terminal device
CN104091154A (en) * 2014-07-02 2014-10-08 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor, integrated component and terminal device
CN104156714A (en) * 2014-08-26 2014-11-19 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor and electronic device
CN104217220A (en) * 2014-08-27 2014-12-17 深圳贝特莱电子科技有限公司 Embedded semiconductor fingerprint sensor
CN104239893A (en) * 2014-08-26 2014-12-24 南昌欧菲生物识别技术有限公司 Fingerprint identification detecting component and terminal device with fingerprint identification detecting function
CN104615980A (en) * 2015-01-27 2015-05-13 华进半导体封装先导技术研发中心有限公司 Fingerprint identification device and manufacture method thereof
CN104615981A (en) * 2015-01-27 2015-05-13 华进半导体封装先导技术研发中心有限公司 Fingerprint identification module structure and manufacture method thereof
CN104657715A (en) * 2015-02-10 2015-05-27 柳州市金旭节能科技有限公司 Fingerprint detector
CN105224927A (en) * 2015-10-09 2016-01-06 广东欧珀移动通信有限公司 Electronic equipment, mobile device, fingerprint recognition sensing apparatus and manufacture method
CN105405771A (en) * 2014-09-11 2016-03-16 旭景科技股份有限公司 Method for mounting chip on printed circuit board
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CN105990269A (en) * 2015-03-06 2016-10-05 吴勇军 Fingerprint identification chip packaging structure and packaging method thereof
CN106250803A (en) * 2015-06-08 2016-12-21 指纹卡有限公司 There is the fingerprint acquisition apparatus of the non-uniform coating structure including binding agent
CN106339660A (en) * 2015-07-16 2017-01-18 上海箩箕技术有限公司 Optical fingerprint sensor
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WO2017070863A1 (en) * 2015-10-28 2017-05-04 Shanghai Oxi Technology Co., Ltd Fingerprint imaging system and method for forming the same
CN106657478A (en) * 2017-01-20 2017-05-10 广东欧珀移动通信有限公司 Fingerprint identification module and mobile terminal
CN106803079A (en) * 2017-01-20 2017-06-06 广东欧珀移动通信有限公司 Fingerprint module and mobile terminal
CN106816432A (en) * 2016-12-22 2017-06-09 创智能科技股份有限公司 Packaging structure with antistatic structure
CN106972007A (en) * 2016-12-23 2017-07-21 创智能科技股份有限公司 Fingerprint sensing and identifying device with antistatic structure
CN106980835A (en) * 2017-03-24 2017-07-25 维沃移动通信有限公司 A kind of fingerprint identification device and electronic equipment
WO2017206034A1 (en) * 2016-05-30 2017-12-07 深圳信炜科技有限公司 Biosensing chip and electronic device
CN107946288A (en) * 2016-10-12 2018-04-20 旭景科技股份有限公司 Sensing chip package with electrostatic discharge protection and manufacturing method thereof
CN109144311A (en) * 2018-07-26 2019-01-04 京东方科技集团股份有限公司 Display base plate, fingerprint identification method, touch control display apparatus
CN111816643A (en) * 2020-07-10 2020-10-23 山东砚鼎电子科技有限公司 Touch sensor
CN114154607A (en) * 2020-09-07 2022-03-08 Lg伊诺特有限公司 Circuit boards and smart cards for fingerprint identification

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1753178A (en) * 2004-09-22 2006-03-29 日月光半导体制造股份有限公司 Contact sensor packaging structure and manufacturing method thereof
US20080187191A1 (en) * 2007-01-02 2008-08-07 Chipmos Technologies Inc. Flim type package for fingerprint sensor
KR20120106629A (en) * 2011-03-16 2012-09-26 벌리더티 센서스 인코포레이티드 Packaging for fingerprint sensors and methods of manufacture
CN102844769A (en) * 2010-03-05 2012-12-26 奥森泰克公司 Integrally molded die and bezel structure for fingerprint sensors and the like
CN103038782A (en) * 2010-06-18 2013-04-10 奥森泰克公司 Finger sensor including encapsulating layer over sensing area and related methods
CN203799391U (en) * 2014-03-27 2014-08-27 成都费恩格尔微电子技术有限公司 Packaging structure of capacitive fingerprint sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1753178A (en) * 2004-09-22 2006-03-29 日月光半导体制造股份有限公司 Contact sensor packaging structure and manufacturing method thereof
US20080187191A1 (en) * 2007-01-02 2008-08-07 Chipmos Technologies Inc. Flim type package for fingerprint sensor
CN102844769A (en) * 2010-03-05 2012-12-26 奥森泰克公司 Integrally molded die and bezel structure for fingerprint sensors and the like
CN103038782A (en) * 2010-06-18 2013-04-10 奥森泰克公司 Finger sensor including encapsulating layer over sensing area and related methods
KR20120106629A (en) * 2011-03-16 2012-09-26 벌리더티 센서스 인코포레이티드 Packaging for fingerprint sensors and methods of manufacture
CN203799391U (en) * 2014-03-27 2014-08-27 成都费恩格尔微电子技术有限公司 Packaging structure of capacitive fingerprint sensor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
傅建中 等: "《微系统原理与技术》", 31 March 2005, 机械工业出版社 *
艾海荣 等: "《印刷材料》", 31 March 2009, 中国轻工业出版社 *

Cited By (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051366A (en) * 2014-07-01 2014-09-17 苏州晶方半导体科技股份有限公司 Packaging structure and packaging method for fingerprint recognition chip
CN104051366B (en) * 2014-07-01 2017-06-20 苏州晶方半导体科技股份有限公司 Fingerprint recognition chip-packaging structure and method for packing
KR101881040B1 (en) * 2014-07-01 2018-08-16 차이나 와퍼 레벨 씨에스피 씨오., 엘티디. Fingerprint recognition chip packaging structure and packaging method
US10133907B2 (en) 2014-07-01 2018-11-20 China Wafer Level Csp Co., Ltd. Fingerprint recognition chip packaging structure and packaging method
KR20170026537A (en) * 2014-07-01 2017-03-08 차이나 와퍼 레벨 씨에스피 씨오., 엘티디. Fingerprint recognition chip packaging structure and packaging method
CN104091154A (en) * 2014-07-02 2014-10-08 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor, integrated component and terminal device
CN104050466B (en) * 2014-07-02 2019-03-01 南昌欧菲生物识别技术有限公司 Fingerprint Identification sensor, integrated package and electronic device
CN104050485A (en) * 2014-07-02 2014-09-17 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor, fingerprint recognition detection assembly and terminal equipment
CN104063693A (en) * 2014-07-02 2014-09-24 南昌欧菲生物识别技术有限公司 Fingerprint identification detection assembly and terminal device containing same
CN104077572A (en) * 2014-07-02 2014-10-01 南昌欧菲生物识别技术有限公司 Fingerprint recognition detection assembly and terminal device
CN104050465A (en) * 2014-07-02 2014-09-17 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor and electronic device
CN104036264A (en) * 2014-07-02 2014-09-10 南昌欧菲生物识别技术有限公司 Method for manufacturing fingerprint recognition sensor, fingerprint recognition sensor and electronic device
CN104050465B (en) * 2014-07-02 2018-02-09 南昌欧菲生物识别技术有限公司 Fingerprint Identification sensor and electronic installation
CN104036264B (en) * 2014-07-02 2018-07-31 南昌欧菲生物识别技术有限公司 Manufacture method, fingerprint Identification sensor and the electronic device of fingerprint Identification sensor
CN104050464A (en) * 2014-07-02 2014-09-17 南昌欧菲生物识别技术有限公司 Method for manufacturing fingerprint recognition sensor, fingerprint recognition sensor and electronic device
CN104036265A (en) * 2014-07-02 2014-09-10 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor and electronic device
CN104050466A (en) * 2014-07-02 2014-09-17 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor, integration assembly and electronic device
CN104036263A (en) * 2014-07-02 2014-09-10 南昌欧菲生物识别技术有限公司 Fingerprint recognition detection device, terminal device and fingerprint recognition method
CN104239893A (en) * 2014-08-26 2014-12-24 南昌欧菲生物识别技术有限公司 Fingerprint identification detecting component and terminal device with fingerprint identification detecting function
CN104156714A (en) * 2014-08-26 2014-11-19 南昌欧菲生物识别技术有限公司 Fingerprint recognition sensor and electronic device
CN104217220A (en) * 2014-08-27 2014-12-17 深圳贝特莱电子科技有限公司 Embedded semiconductor fingerprint sensor
CN105405771A (en) * 2014-09-11 2016-03-16 旭景科技股份有限公司 Method for mounting chip on printed circuit board
CN105742253A (en) * 2014-12-10 2016-07-06 旭景科技股份有限公司 Printed circuit board assembly for mounting image sensor
CN104615980B (en) * 2015-01-27 2018-11-23 华进半导体封装先导技术研发中心有限公司 A kind of fingerprint identification device and preparation method thereof
CN104615981A (en) * 2015-01-27 2015-05-13 华进半导体封装先导技术研发中心有限公司 Fingerprint identification module structure and manufacture method thereof
CN104615980A (en) * 2015-01-27 2015-05-13 华进半导体封装先导技术研发中心有限公司 Fingerprint identification device and manufacture method thereof
CN104615981B (en) * 2015-01-27 2018-05-22 华进半导体封装先导技术研发中心有限公司 A kind of fingerprint recognition modular structure and preparation method thereof
CN104657715A (en) * 2015-02-10 2015-05-27 柳州市金旭节能科技有限公司 Fingerprint detector
CN105990269A (en) * 2015-03-06 2016-10-05 吴勇军 Fingerprint identification chip packaging structure and packaging method thereof
CN106250803B (en) * 2015-06-08 2019-03-05 指纹卡有限公司 Fingerprint acquisition apparatus with the non-uniform coating structure for including adhesive
CN106250803A (en) * 2015-06-08 2016-12-21 指纹卡有限公司 There is the fingerprint acquisition apparatus of the non-uniform coating structure including binding agent
CN106339660B (en) * 2015-07-16 2024-04-09 上海箩箕技术有限公司 Optical fingerprint sensor
CN106339660A (en) * 2015-07-16 2017-01-18 上海箩箕技术有限公司 Optical fingerprint sensor
CN106470527B (en) * 2015-08-21 2018-12-14 旭景科技股份有限公司 Printed circuit board structure for forming enhanced fingerprint identification module
CN106470527A (en) * 2015-08-21 2017-03-01 旭景科技股份有限公司 Printed circuit board structure for forming enhanced fingerprint identification module
CN105224927A (en) * 2015-10-09 2016-01-06 广东欧珀移动通信有限公司 Electronic equipment, mobile device, fingerprint recognition sensing apparatus and manufacture method
WO2017070863A1 (en) * 2015-10-28 2017-05-04 Shanghai Oxi Technology Co., Ltd Fingerprint imaging system and method for forming the same
CN105631421B (en) * 2015-12-25 2020-03-20 上海菲戈恩微电子科技有限公司 Mobile terminal with fingerprint sensor packaging structure
CN105631421A (en) * 2015-12-25 2016-06-01 成都费恩格尔微电子技术有限公司 Mobile terminal with fingerprint sensor packaging structure
CN105676953A (en) * 2015-12-25 2016-06-15 成都费恩格尔微电子技术有限公司 Mobile terminal with fingerprint sensor packaging structure and preparation method thereof
CN105676953B (en) * 2015-12-25 2020-03-20 上海菲戈恩微电子科技有限公司 Mobile terminal with fingerprint sensor packaging structure and preparation method thereof
EP3316180A4 (en) * 2016-05-30 2018-08-29 Shenzhen Xinwei Technology Co, Ltd. Biosensing chip and electronic device
WO2017206034A1 (en) * 2016-05-30 2017-12-07 深圳信炜科技有限公司 Biosensing chip and electronic device
CN107946288A (en) * 2016-10-12 2018-04-20 旭景科技股份有限公司 Sensing chip package with electrostatic discharge protection and manufacturing method thereof
CN106816432A (en) * 2016-12-22 2017-06-09 创智能科技股份有限公司 Packaging structure with antistatic structure
CN106972007A (en) * 2016-12-23 2017-07-21 创智能科技股份有限公司 Fingerprint sensing and identifying device with antistatic structure
CN106803079A (en) * 2017-01-20 2017-06-06 广东欧珀移动通信有限公司 Fingerprint module and mobile terminal
CN106657478A (en) * 2017-01-20 2017-05-10 广东欧珀移动通信有限公司 Fingerprint identification module and mobile terminal
CN106980835B (en) * 2017-03-24 2018-08-17 维沃移动通信有限公司 A kind of fingerprint identification device and electronic equipment
CN106980835A (en) * 2017-03-24 2017-07-25 维沃移动通信有限公司 A kind of fingerprint identification device and electronic equipment
CN109144311A (en) * 2018-07-26 2019-01-04 京东方科技集团股份有限公司 Display base plate, fingerprint identification method, touch control display apparatus
US11348356B2 (en) 2018-07-26 2022-05-31 Boe Technology Group Co., Ltd. Display substrate, fingerprint recognition method, and touch display device
CN109144311B (en) * 2018-07-26 2022-06-07 京东方科技集团股份有限公司 Display substrate, fingerprint identification method, and touch display device
CN111816643A (en) * 2020-07-10 2020-10-23 山东砚鼎电子科技有限公司 Touch sensor
CN114154607A (en) * 2020-09-07 2022-03-08 Lg伊诺特有限公司 Circuit boards and smart cards for fingerprint identification
CN114154607B (en) * 2020-09-07 2023-10-27 Lg伊诺特有限公司 Circuit board and smart card for fingerprint identification
US11900720B2 (en) 2020-09-07 2024-02-13 Lg Innotek Co., Ltd. Circuit board and smart card for fingerprint recognition including the same

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