CN206136374U - Integrated encapsulation of IC does not need external power supply's LED lamp pearl structure - Google Patents

Abstract

The utility model belongs to the technical field of IC chip package, especially, relate to integrated encapsulation of IC does not need external power supply's LED lamp pearl structure, including drive circuit and base plate structure drive circuit sets up structurally at the base plate, drive circuit includes the power, bridge rectifier, sampling regulator circuit and IC driver chip, the rectification is connected with bridge rectifier to the power, bridge rectifier and sampling adjustment circuit connection, the sampling regulator circuit is connected with IC driver chip, bridge rectifier ground connection, it carries out filtering to set up electric capacity C1 between bridge rectifier and sampling regulator circuit, electric capacity C1 other end ground connection, IC driver chip passes through the vdd port and is connected with electric capacity C2, electric capacity C2 other end ground connection. The beneficial effect of the utility model: through IC driver chip, come the electric current of regulation and control through LED, the LED luminous element part need not outside bias circuit, can directly use municipality's electric drive, a large amount of has saved outside components and parts, and the system uses extremely simply.

Description

IC integration packagings do not need the LED lamp bead structure of external power supply

Technical field

This utility model belongs to IC chip encapsulation technology field, more particularly to IC integration packagings do not need external power supply LED lamp bead structure.

Background technology

COB is the abbreviation of Chip On Board, i.e. chip on board device, and technical process is in substrate surface heat conduction first Epoxy resin (general with the epoxy resin for mixing Argent grain) covers silicon chip nest point, then silicon chip is rest directly upon into substrate table Face, is heat-treated to till silicon chip is securely fixed in substrate, directly builds between silicon chip and substrate followed in turn by the method for wire bond Vertical electrical connection.

Traditional LED lamp pearl COB products, need external constant-current source or constant pressure source, by alternating current after finished product light fixture is made Be converted to the DC source for driving LED luminous.LED can run into situations below while normal work：

1. operationally, conversion efficiency can directly affect the efficiency of whole lamp to power supply, and the power supply on market is most to be turned Efficiency is changed for 75-85%.

2. as current illumination market part light fixture is to the continuous diminution of volume, the reduction of price, the requirement of high conversion efficiency, Need non-isolated scheme, improve conversion efficiency, the volume of reduction gradually, meets the needs but product at different families, but adaptability It is poor, single specification wattage is only applicable to, when the LED lamp bead wattage of design is changed, need to more design and change ceramic substrate, cause The wasting of resources.

Utility model content

For the problems referred to above to be solved, for problem above, this utility model provides IC integration packagings and does not need external electricity The LED lamp bead structure in source, goes for various wattages, effectively solves because wattage difference causes the feelings of various ceramic substrates Condition, reaches rationally efficiently unified purpose.

The technical solution of the utility model：IC integration packagings do not need the LED lamp bead structure of external power supply, including drive electricity Road and board structure, the drive circuit is arranged on the board structure, and the drive circuit includes power supply, bridge rectifier Device, sampling adjustment circuit and IC driving chips, the power supply is connected rectification with bridge rectifier, the bridge rectifier with it is described Sampling adjustment circuit connection, the sampling adjustment circuit is connected with the IC driving chips, the bridge rectifier ground connection, described Arrange electric capacity C1 between bridge rectifier and the sampling adjustment circuit to be filtered, the electric capacity C1 other ends ground connection, the IC Driving chip is connected by Vdd terminal mouth with electric capacity C2, the electric capacity C2 other ends ground connection；

The sampling adjustment circuit includes sampling resistor R1, R2 and R3, adjusts resistance R4, switchs SW0, SW1, SW2, SW3 With non-essential resistance Rset, described sampling resistor R1, R2 and R3 series connection, sampling resistor R3 ground connection, the regulation resistance R4 with it is described Sampling resistor R1, R2 and R3 are in parallel, and sampling resistor R1, R2 and R3 series connection and the regulation resistance R4 drive with the IC Chip connects, and the IC driving chips are connected by Iset ports with non-essential resistance Rset, the non-essential resistance Rset other ends Ground connection, the IC driving chips are grounded by G ports, and the IC driving chips go side mouth connects with switch SW0, SW1, SW2, SW3 Connect.

The board structure includes substrate, circuit etching, LED luminescence chips rest area, driving chip rest area, element weldering Connect rest area, contact point, the built-in circuit etching of the substrate, the LED luminescence chips rest area, the driving chip are put Put area, the element to weld rest area, the contact point and be respectively provided with the substrate, in the LED luminescence chips rest area Multiple LED luminescence chips are placed, the driving chip rest area is placed with IC driving chips, and the power supply passes through bridge rectifier It is connected with the IC driving chips through circuit etching, conductive line road area, the unit is set outside the LED luminescence chips rest area Part welding rest area is multiple, and the periphery of each welding rest area arranges contact point, and the circuit etching connects the unit Part welds rest area, and the circuit etching collects area's connection ground wire.

It is respectively provided with silver coating on element welding rest area and the contact point, the silver coating is 0.1-0.5mm, institute The 10-18W that multiple LED luminescence chips are placed in LED luminescence chips rest area is stated, first device is placed in the element welding rest area Part, the components and parts are connected for multiple with the IC driving chips, and the substrate is ceramic substrate.

The size 30mm x30mm of the substrate, described sampling resistor R1, R2 and R3 are 2.0-4.0 megaohm, the regulation Resistance R4 is 10-20 kilo-ohm, and the non-essential resistance Rset is 80-200 kilo-ohm.

The beneficial effects of the utility model：It is reasonable in design, by IC driving chips, detect the exchange city of rectified 220v Piezoelectric voltage is regulating and controlling the electric current by LED so that by the electric current of LED in phase place and input voltage be consistent, realizes height Power factor and high efficiency.LED illuminator part can directly use city's electric drive without the need for external bias circuit, substantial amounts of to save External component, system application and its simple.

Description of the drawings

Fig. 1 is the circuit diagram of drive circuit of the present utility model.

Fig. 2 is board structure schematic diagram of the present utility model.

In figure, 1, substrate, 2, circuit etching, 3, LED luminescence chips rest area, 4, driving chip rest area, 5, element weldering Connect rest area, 6, contact point, 7, LED luminescence chips, 8, IC driving chips, 9, conducting line areas, 10, circuit etching collect area, 11st, power supply, 12, board structure, 13, bridge rectifier, 14, sampling adjustment circuit.

Specific embodiment

Specific embodiment of the present utility model is explained below in conjunction with the accompanying drawings.

IC integration packagings do not need the LED lamp bead structure of external power supply, including drive circuit and board structure, drive circuit Be arranged on board structure, drive circuit includes power supply, bridge rectifier, sampling adjustment circuit and IC driving chips, power supply with Bridge rectifier connects rectification, and bridge rectifier is connected with sampling adjustment circuit, and sampling adjustment circuit is connected with IC driving chips, Bridge rectifier is grounded, and arranges electric capacity C1 between bridge rectifier and sampling adjustment circuit and is filtered, electric capacity C1 other ends ground connection, IC driving chips are connected by Vdd terminal mouth with electric capacity C2, electric capacity C2 other ends ground connection,

Sampling adjustment circuit includes sampling resistor R1, R2 and R3, adjusts resistance R4, switch SW0, SW1, SW2, SW3 and outer Portion resistance Rset, sampling resistor R1, R2 and R3 series connection, sampling resistor R3 ground connection, adjusts resistance R4 and sampling resistor R1, R2 and R3 Parallel connection, sampling resistor R1, R2 and R3 series connection and regulation resistance R4 are connected with IC driving chips, and IC driving chips pass through Iset ends Mouth is connected with non-essential resistance Rset, and non-essential resistance Rset other ends ground connection, IC driving chips are grounded by G ports, and IC drives core Piece go side mouth is connected with switch SW0, SW1, SW2, SW3.

Board structure includes that substrate, circuit etching, LED luminescence chips rest area, driving chip rest area, element welding are put Put area, contact point, the built-in circuit etching of substrate, LED luminescence chips rest area, driving chip rest area, element welding rest area, Contact point is arranged on substrate, and multiple LED luminescence chips are placed in LED luminescence chips rest area, and driving chip rest area is put IC driving chips are equipped with, power supply is connected through circuit etching by bridge rectifier with IC driving chips, LED luminescence chips are placed Conductive line road area is set outside area, and element welding rest area is multiple, and the periphery of each welding rest area arranges contact point, etching line Road communication member welding rest area, circuit etching collects area's connection ground wire.

Element to be welded and be respectively provided with silver coating on rest area and contact point, and silver coating is 0.1-0.5mm, and LED luminescence chips are put Put the 10-18W that multiple LED luminescence chips are placed in area, components and parts are placed in element welding rest area, components and parts for it is multiple with drive Dynamic chip connection, substrate is ceramic substrate.

The size 30mm x30mm of substrate, sampling resistor R1, R2 and R3 are 2.0-4.0 megaohm, and it is 10-20 to adjust resistance R4 Kilo-ohm, non-essential resistance Rset is 80-200 kilo-ohm.

Use example：Fig. 1 is the circuit diagram of drive circuit of the present utility model, and power supply is Jing after bridge rectifier rectification 220VAC civil powers are applied directly on IC driving chips, and sampling resistor R1, R2 and R3 sample to electric main.The electricity for sampling Pressure is processed through the judgement of IC internal circuits, opens corresponding switch SW0～SW3.By the electric current and electric current that switch SW0～SW3 I0～I3 is each corresponded to respectively, and I0 to I3 electric currents rise in step, consistent with 220V AC civil powers in phase place, is realized Up to 98% power factor.Luminescence chip is lighted in different phase, so as to greatly improve the efficiency of whole lamp.

All components and parts the external power supply used in traditional sense are designed in a plane with LED illuminator, LED illuminator is made up of multiple LED luminescence chips, the built-in circuit etching of ceramic substrate, the size 30mm x30mm of ceramic substrate, The size of circuit design, solves the problems, such as that to greatest extent electric current is put in transmitting procedure radiating LED luminescence chip placement regions It is 10-18W to put multiple LED luminescence chips, is adjusted according to the demand of client, can be accomplished according to the requirement maximum of client 18W, while the contact point that each the components and parts periphery placed in element welding rest area is specially designed,

Lamp bead, at any time to each component parameter, understands well the working condition of lamp bead, the amount of carrying out in ignition It is electric capacity and resistance to survey components and parts, and resistance bag expands sampling resistor and non-essential resistance, and sampling resistor R1, R2, R3 are 2.0-4.0 million Europe, it is 10-20 kilo-ohm to adjust resistance R4, and non-essential resistance Rset is 80-200 kilo-ohm, when can be worked according to LED luminescence chips, is connect The parameter that contact measures, adjustment determines that each components and parts reaches optimum condition.

IC integrated Packaging Technology flow processs

Mainly include die bond-baking-bonding wire-box dam glue-baking-encapsulation-baking-welding component

Each processing step：

1. die bond：Blue chip is horizontal structure, and die bond can use insulating cement according to client's actual demand small-power, larger High-power optional elargol or heat conductive silica gel.

2. toast：Usually 120 DEG C of 1.5hrs, can be adjusted baking time according to actually used material.

3. bonding wire：Using 99.99% gold thread.

4. a box dam glue：Control the speed of machine run and the time of plastic emitting, it is ensured that glue and substrate fully combine nothing Gap, it is impossible to encounter chip.

5. toast：According to using baking time is set without the characteristic of silica gel, usual silica gel baking is set to three-stage Baking, prevents from remaining bubble in glue.

6. encapsulate：Notice that operation maneuver and board device parameter are strictly controlled during encapsulation there should not be bubble, debris are produced.

7. toast：Baking time is designed according to actually used glue property.

8. welding component：Noting should not be excessive using tin cream, and device placing direction is correct, neatly.

Compared with prior art, the technical program designs the size on the basis of traditional COB encapsulation by independent research Ceramic substrate combine IC chip, the circuit of size and etched inside to the ceramic substrate is designed, and by IC core is driven Piece, detects electric current of the ac commercial power voltage of rectified 220v to regulate and control by LED so that by the electric current of LED in phase place It is consistent with input voltage, realizes High Power Factor and high efficiency.LED illuminator part, can without the need for external bias circuit City's electric drive is directly used, substantial amounts of to save external component, system application is extremely simple so that outside the light fixture of application end design Sight size is more lightening, and attractive in appearanceization, while making its applicable wattage wider, realizes a kind of masterplate and can be applicable to many money lamps Pearl, has saved production cost.

An example of the present utility model has been described in detail above, but the content be only it is of the present utility model compared with Good embodiment, it is impossible to be considered as limiting practical range of the present utility model.It is all to be made according to this utility model application range Impartial change and improvement etc., all should still belong within patent covering scope of the present utility model.

Claims (4)

1.IC integration packagings do not need the LED lamp bead structure of external power supply, it is characterised in that including drive circuit and board structure, The drive circuit is arranged on the board structure, and the drive circuit includes power supply, bridge rectifier, sampling adjustment circuit With IC driving chips, the power supply is connected rectification with bridge rectifier, and the bridge rectifier and the sampling adjustment circuit connect Connect, the sampling adjustment circuit be connected with the IC driving chips, and the bridge rectifier is grounded, the bridge rectifier and institute State setting electric capacity C1 between sampling adjustment circuit to be filtered, the electric capacity C1 other ends ground connection, the IC driving chips pass through Vdd Port is connected with electric capacity C2, the electric capacity C2 other ends ground connection；

The sampling adjustment circuit includes sampling resistor R1, R2 and R3, adjusts resistance R4, switch SW0, SW1, SW2, SW3 and outer Portion resistance Rset, sampling resistor R1, R2 and R3 series connection, sampling resistor R3 ground connection, the regulation resistance R4 and the sampling Resistance R1, R2 and R3 are in parallel, described sampling resistor R1, R2 and R3 series connection and the regulation resistance R4 with the IC driving chips Connection, the IC driving chips are connected by Iset ports with non-essential resistance Rset, the non-essential resistance Rset other ends ground connection, The IC driving chips are grounded by G ports, and the IC driving chips go side mouth is connected with switch SW0, SW1, SW2, SW3.

2. IC integration packagings according to claim 1 do not need the LED lamp bead structure of external power supply, it is characterised in that described Board structure includes that substrate, circuit etching, LED luminescence chips rest area, driving chip rest area, element weld rest area, connect Contact, the built-in circuit etching of the substrate, the LED luminescence chips rest area, the driving chip rest area, the unit Part welding rest area, the contact point are respectively provided with the substrate, and multiple LED are placed in the LED luminescence chips rest area Luminescence chip, the driving chip rest area is placed with IC driving chips, and the power supply is by bridge rectifier through etching line Road is connected with the driving chip, and conductive line road area is arranged outside the LED luminescence chips rest area, and the element welds rest area For multiple, the periphery of each welding rest area arranges contact point, and the circuit etching connects the element and welds rest area, The circuit etching collects area's connection ground wire.

3. IC integration packagings according to claim 2 do not need the LED lamp bead structure of external power supply, it is characterised in that described Element welds and silver coating is respectively provided with rest area and the contact point, and the silver coating is 0.1-0.5mm, and the LED lights core The 10-18W of multiple LED luminescence chips is placed in piece rest area, components and parts, the components and parts are placed in the element welding rest area It is connected with the IC driving chips for multiple, the substrate is ceramic substrate.

4. IC integration packagings according to claim 2 do not need the LED lamp bead structure of external power supply, it is characterised in that described Size 30mmx30mm of substrate, described sampling resistor R1, R2 and R3 are 2.0-4.0 megaohm, and the regulation resistance R4 is 10-20 Kilo-ohm, the non-essential resistance Rset is 80-200 kilo-ohm.